KR20100017859A - 방열구조체 및 전열시트의 사용방법 - Google Patents
방열구조체 및 전열시트의 사용방법 Download PDFInfo
- Publication number
- KR20100017859A KR20100017859A KR1020097026421A KR20097026421A KR20100017859A KR 20100017859 A KR20100017859 A KR 20100017859A KR 1020097026421 A KR1020097026421 A KR 1020097026421A KR 20097026421 A KR20097026421 A KR 20097026421A KR 20100017859 A KR20100017859 A KR 20100017859A
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- South Korea
- Prior art keywords
- heat
- transfer sheet
- heat transfer
- bulk density
- sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
- C01B32/21—After-treatment
- C01B32/22—Intercalation
- C01B32/225—Expansion; Exfoliation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Carbon And Carbon Compounds (AREA)
- Paper (AREA)
- Fixing For Electrophotography (AREA)
Abstract
Description
Claims (8)
- 팽창흑연(膨脹黑鉛)을 소재로 하는 전열(傳熱)시트의 사용방법으로서,상기 전열시트를 발열체와 방열체 사이에 설치하여, 두께 방향으로부터 가하여지는 가압력이 2.0㎫ 이하의 조건으로 사용하는 것을 특징으로 하는 전열시트의 사용방법.
- 청구항 1에 있어서,상기 두께 방향의 가압력은, 1.5㎫ 이하인 것을 특징으로 하는 전열시트의 사용방법.
- 청구항 1 또는 청구항 2에 있어서,상기 전열시트는, 부피밀도가, 0.8Mg/㎥ 이상인 것을 특징으로 하는 전열시트의 사용방법.
- 발열체에 장착되어, 상기 발열체의 열을 방열하는 방열구조체로서,방열체와, 상기 방열체와 상기 발열체 사이에 설치되는 팽창흑연을 소재로 하는 전열시트로 이루어지며,상기 전열시트에 대하여, 두께 방향으로부터 2.0㎫ 이하의 가압력이 가하여지는 조건으로 사용하는 것임을 특징으로 하는 방열구조체.
- 청구항 4에 있어서,상기 전열시트에 대하여, 두께 방향으로부터 1.5㎫ 이하의 가압력이 가하여지는 조건으로 사용하는 것인 것을 특징으로 하는 방열구조체.
- 청구항 4 또는 청구항 5에 있어서,상기 전열시트는, 부피밀도가, 0.8Mg/㎥ 이상인 것을 특징으로 하는 방열구조체.
- 청구항 4 또는 청구항 5에 있어서,상기 전열시트와 상기 발열체 사이, 혹은 상기 전열시트와 상기 방열체 사이의, 적어도 일방(一方)에 설치되는 수지 필름을 구비하고 있는 것을 특징으로 하는 방열구조체.
- 청구항 7에 있어서,상기 수지 필름이, 상기 전열시트에 장착되어 있는 것을 특징으로 하는 방열구조체.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-100622 | 2005-03-31 | ||
JP2005100622A JP4299261B2 (ja) | 2005-03-31 | 2005-03-31 | 伝熱シート、放熱構造体および伝熱シートの使用方法 |
PCT/JP2006/304865 WO2006112211A1 (ja) | 2005-03-31 | 2006-03-13 | 伝熱シート、放熱構造体および伝熱シートの使用方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077022193A Division KR101068416B1 (ko) | 2005-03-31 | 2006-03-13 | 전열시트, 방열구조체 및 전열시트의 사용방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100017859A true KR20100017859A (ko) | 2010-02-16 |
KR101052752B1 KR101052752B1 (ko) | 2011-07-29 |
Family
ID=37114943
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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KR1020077022193A KR101068416B1 (ko) | 2005-03-31 | 2006-03-13 | 전열시트, 방열구조체 및 전열시트의 사용방법 |
KR1020097026421A KR101052752B1 (ko) | 2005-03-31 | 2006-03-13 | 방열구조체 및 전열시트의 사용방법 |
KR1020097026420A KR101061805B1 (ko) | 2005-03-31 | 2006-03-13 | 방열구조체 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020077022193A KR101068416B1 (ko) | 2005-03-31 | 2006-03-13 | 전열시트, 방열구조체 및 전열시트의 사용방법 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020097026420A KR101061805B1 (ko) | 2005-03-31 | 2006-03-13 | 방열구조체 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090301697A1 (ko) |
EP (1) | EP1865552B1 (ko) |
JP (2) | JP4299261B2 (ko) |
KR (3) | KR101068416B1 (ko) |
NO (1) | NO20075425L (ko) |
TW (1) | TWI320844B (ko) |
WO (1) | WO2006112211A1 (ko) |
Families Citing this family (23)
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JP4299261B2 (ja) * | 2005-03-31 | 2009-07-22 | 東洋炭素株式会社 | 伝熱シート、放熱構造体および伝熱シートの使用方法 |
JP5069861B2 (ja) * | 2006-02-15 | 2012-11-07 | 株式会社カネカ | グラファイトフィルム、およびそれを用いた熱拡散フィルム、ならびにそれを用いた熱拡散方法。 |
JP2008199039A (ja) * | 2008-03-12 | 2008-08-28 | Toyo Tanso Kk | 放熱構造体および伝熱シートの使用方法 |
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TW201135429A (en) * | 2010-04-07 | 2011-10-16 | Hon Hai Prec Ind Co Ltd | Heat sink |
CN102130232A (zh) * | 2010-12-29 | 2011-07-20 | 深圳市火天光电科技有限公司 | 发光芯片封装及发光芯片的封装方法 |
JP2013118313A (ja) * | 2011-12-05 | 2013-06-13 | Dexerials Corp | 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法 |
JP5978457B2 (ja) * | 2012-03-19 | 2016-08-24 | パナソニックIpマネジメント株式会社 | 熱伝導体 |
CN102917574B (zh) * | 2012-10-24 | 2015-05-27 | 华为技术有限公司 | 导热垫、制造导热垫的方法、散热装置和电子设备 |
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WO2014188624A1 (ja) | 2013-05-22 | 2014-11-27 | 株式会社カネカ | 放熱構造体 |
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DK3066047T3 (da) * | 2013-11-05 | 2021-02-15 | Neograf Solutions Llc | Grafitgenstand |
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US9706684B2 (en) | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Exfoliated graphite materials and composite materials and devices for thermal management |
JPWO2015137257A1 (ja) * | 2014-03-14 | 2017-04-06 | 株式会社カネカ | 電子端末機器及びその組立方法 |
JP6635941B2 (ja) | 2014-12-04 | 2020-01-29 | 株式会社カネカ | 高真空用層間熱接合性グラファイトシート |
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WO2020162117A1 (ja) * | 2019-02-08 | 2020-08-13 | パナソニックIpマネジメント株式会社 | 熱伝導シートおよびこれを用いた電子機器 |
KR102183485B1 (ko) * | 2020-07-30 | 2020-11-26 | 주식회사 엔티에스 | 폐흑연을 이용한 방열 시트의 제조 방법 |
JP7074270B1 (ja) | 2022-01-19 | 2022-05-24 | 富士電機株式会社 | 半導体装置 |
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-
2005
- 2005-03-31 JP JP2005100622A patent/JP4299261B2/ja active Active
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2006
- 2006-03-13 EP EP06715588.7A patent/EP1865552B1/en active Active
- 2006-03-13 KR KR1020077022193A patent/KR101068416B1/ko active IP Right Grant
- 2006-03-13 US US11/886,738 patent/US20090301697A1/en not_active Abandoned
- 2006-03-13 WO PCT/JP2006/304865 patent/WO2006112211A1/ja active Application Filing
- 2006-03-13 KR KR1020097026421A patent/KR101052752B1/ko active IP Right Grant
- 2006-03-13 KR KR1020097026420A patent/KR101061805B1/ko active IP Right Grant
- 2006-03-15 TW TW095108723A patent/TWI320844B/zh active
-
2007
- 2007-10-25 NO NO20075425A patent/NO20075425L/no not_active Application Discontinuation
-
2008
- 2008-03-12 JP JP2008062246A patent/JP5114255B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP1865552A1 (en) | 2007-12-12 |
EP1865552A4 (en) | 2008-07-02 |
KR20100017858A (ko) | 2010-02-16 |
JP4299261B2 (ja) | 2009-07-22 |
KR101068416B1 (ko) | 2011-09-29 |
TW200638018A (en) | 2006-11-01 |
JP2008153704A (ja) | 2008-07-03 |
TWI320844B (en) | 2010-02-21 |
EP1865552B1 (en) | 2022-06-15 |
WO2006112211A1 (ja) | 2006-10-26 |
KR20070118099A (ko) | 2007-12-13 |
US20090301697A1 (en) | 2009-12-10 |
JP2006286684A (ja) | 2006-10-19 |
JP5114255B2 (ja) | 2013-01-09 |
NO20075425L (no) | 2007-10-25 |
KR101052752B1 (ko) | 2011-07-29 |
KR101061805B1 (ko) | 2011-09-05 |
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