JPWO2015137257A1 - 電子端末機器及びその組立方法 - Google Patents
電子端末機器及びその組立方法 Download PDFInfo
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- JPWO2015137257A1 JPWO2015137257A1 JP2016507500A JP2016507500A JPWO2015137257A1 JP WO2015137257 A1 JPWO2015137257 A1 JP WO2015137257A1 JP 2016507500 A JP2016507500 A JP 2016507500A JP 2016507500 A JP2016507500 A JP 2016507500A JP WO2015137257 A1 JPWO2015137257 A1 JP WO2015137257A1
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- 239000003381 stabilizer Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- GKLVYJBZJHMRIY-UHFFFAOYSA-N technetium atom Chemical compound [Tc] GKLVYJBZJHMRIY-UHFFFAOYSA-N 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- QEEPNARXASYKDD-UHFFFAOYSA-J tris(7,7-dimethyloctanoyloxy)stannyl 7,7-dimethyloctanoate Chemical compound [Sn+4].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O QEEPNARXASYKDD-UHFFFAOYSA-J 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
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- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
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- H05K9/0007—Casings
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- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
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- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
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- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
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Abstract
Description
本発明の電子端末機器は、基板上に発熱電子部品を有する機器であれば特に限定されるものではない。電子端末機器は、例えば電子機器、精密機器、自動車部品などの用途に使用できる。特に、電子端末機器の中でも携帯電話機、スマートフォン、タブレット、ノートパソコン、デジタルカメラ、小型ゲーム端末、などの小型モバイル端末に好適である。
発熱電子部品は、電子端末機器の駆動時に発熱する電子部品であれば特に限定されるものではない。例えば、トランジスタ、集積回路(IC)、CPU、ダイオード、LED等の半導体素子、電子管、電気モーター、抵抗器、コンデンサ(キャパシタ)、コイル、リレー、圧電素子、振動子、スピーカー、ヒーター、各種電池、各種チップ部品等の電子部品が挙げられる。
電磁シールド部材とは、電磁波を反射・伝導・吸収することにより電磁波シールド性能を発揮する部材をいう。電磁シールド部材の材料としては、電磁波を反射・伝導・吸収することにより電磁波シールド性能を発揮する材料であれば特に限定するものでない。例えば、金属材料やプラスチック材料、各種磁性材料などを用いることができ、金属材料を好適に用いることができる。
熱伝導性硬化性液状樹脂には、硬化性液状樹脂と、熱伝導性フィラーとを少なくとも含有する樹脂組成物が用いられる。これらの他に必要に応じて、硬化性液状樹脂を硬化させるための硬化触媒、熱老化防止剤、可塑剤、増量剤、チクソ性付与剤、貯蔵安定剤、脱水剤、カップリング剤、紫外線吸収剤、難燃剤、電磁波吸収剤、充填剤、溶剤、等が添加されていても良い。
硬化性液状樹脂は、分子内に反応性基を有し硬化性がある液状樹脂が好ましい。硬化性液状樹脂の具体例としては、硬化性アクリル系樹脂や硬化性メタクリル系樹脂、硬化性ポリプロピレンオキサイド系樹脂に代表される硬化性ポリエーテル系樹脂、硬化性ポリイソブチレン系樹脂に代表される硬化性ポリオレフィン系樹脂、等が挙げられる。反応性基としては、エポキシ基、加水分解性シリル基、ビニル基、アクリロイル基、SiH基、ウレタン基、カルボジイミド基、無水カルボン酸基とアミノ基との組合せ、等各種の反応性官能基を用いることができる。
熱伝導性硬化性液状樹脂および熱伝導性硬化物に用いられる熱伝導性フィラーとしては、熱伝導率、入手性、絶縁性や充填性、毒性、等種々の観点から性や電磁波吸収性等の電気特性を付与可能、充填性、毒性、等種々の観点から、グラファイト、ダイヤモンド、等の炭素化合物;酸化アルミニウム、酸化マグネシウム、酸化ベリリウム、酸化チタン、酸化ジルコニウム、酸化亜鉛等の金属酸化物;窒化ホウ素、窒化アルミニウム、窒化ケイ素等の金属窒化物;炭化ホウ素、炭化アルミニウム、炭化ケイ素等の金属炭化物;水酸化アルミニウム、水酸化マグネシウム等の金属水酸化物;炭酸マグネシウム、炭酸カルシウム等の金属炭酸塩;結晶性シリカ:アクリロニトリル系ポリマー焼成物、フラン樹脂焼成物、クレゾール樹脂焼成物、ポリ塩化ビニル焼成物、砂糖の焼成物、木炭の焼成物等の有機性ポリマー焼成物;Znフェライトとの複合フェライト;Fe−Al−Si系三元合金;金属粉末、等が好ましく挙げられる。
ここで、樹脂分とは、熱伝導性フィラーを除いた全成分を指す。
本発明の熱伝導性硬化性液状樹脂の硬化物とは、前記電磁シールド部材と前記電子端末機器用基板との間に、かつ前記発熱電子部品に接触するように、熱伝導性硬化性液状樹脂が充填されて、硬化したものである。
本発明の高熱伝導性樹脂フィルムは、前記電磁シールド部材の上面に接触し若しくは該上面に対向して配置され、前記熱伝導性硬化性液状樹脂によって吸い上げられた熱を拡散するためのフィルムである。
グラファイトフィルムは、場合によっては粉落ちが発生し、機器内を汚染する可能性がある。また、グラファイトフィルムは導電性を示すために、電子機器基板の短絡を招く恐れもある。このような理由から、グラファイトフィルムは、保護フィルムと貼り合わせて用いる方が好ましい。
グラファイトフィルムを含む高熱伝導樹脂フィルムで拡散された熱は、放熱体に粘着材、接着剤などの接着層により貼り付けて用いるのが好ましい。本発明において接着層として用いられる粘着材または接着剤の材質は、アクリル系、シリコーン系、エポキシ系またはポリイミド系の樹脂である。このような粘着材および接着剤は熱伝導率が悪いので、接着層は基本的に薄いほうがよい。
本発明で好ましく用いられるグラファイトフィルムの第一の製造方法は、グラファイト粉末をシート状に押し固めたグラファイトフィルムである。グラファイト粉末がフィルム状に成型されるためには粉末がフレーク状、あるいは鱗片状になっている必要がある。この様なグラファイト粉末の製造のための最も一般的な方法がエキスパンド(膨張黒鉛)法と呼ばれる方法である。これはグラファイトを硫酸などの酸に浸漬し、グラファイト層間化合物を作製し、しかる後にこれを熱処理、発泡させてグラファイト層間を剥離するものである。剥離後、グラファイト粉末を洗浄して酸を除去し薄膜のグラファイト粉末を得る。この様な方法で得られたグラファイト粉末をさらに圧延ロール成型してフィルム状のグラファイトを得る。この様な手法で得られた、膨張黒鉛を用いて作製されたグラファイトフィルムは柔軟性に富み、熱伝導性に違法性を有する、すなわちフィルムの面方向に高い熱伝導性を有するので本発明の目的に好ましく用いられる。
窒素雰囲気下、250L反応機にCuBr(1.09kg)、アセトニトリル(11.4kg)、アクリル酸ブチル(26.0kg)及び2,5−ジブロモアジピン酸ジエチル(2.28kg)を加え、70〜80℃で30分程度撹拌した。これにペンタメチルジエチレントリアミンを加え、反応を開始した。反応開始30分後から2時間かけて、アクリル酸ブチル(104kg)を連続的に追加した。反応途中ペンタメチルジエチレントリアミンを適宜添加し、内温70℃〜90℃となるようにした。ここまでで使用したペンタメチルジエチレントリアミン総量は220gであった。反応開始から4時間後、80℃で減圧下、加熱攪拌することにより揮発分を除去した。これにアセトニトリル(45.7kg)、1,7−オクタジエン(14.0kg)、ペンタメチルジエチレントリアミン(439g)を添加して8時間撹拌を続けた。混合物を80℃で減圧下、加熱攪拌して揮発分を除去した。
数平均分子量約2,000のポリオキシプロピレンジオールを開始剤とし、亜鉛ヘキサシアノコバルテートグライム錯体触媒にてプロピレンオキシドの重合を行い、数平均分子量25,500(送液システムとして東ソー製HLC−8120GPCを用い、カラムは東ソー製TSK−GEL Hタイプを用い、溶媒はTHFを用いて測定したポリスチレン換算値)のポリプロピレンオキシドを得た。続いて、この水酸基末端ポリプロピレンオキシドの水酸基に対して1.2倍当量のNaOMeメタノール溶液を添加してメタノールを留去し、さらに塩化アリルを添加して末端の水酸基をアリル基に変換した。未反応の塩化アリルを減圧脱揮により除去した。得られた未精製のアリル基末端ポリプロピレンオキシド100重量部に対し、n−ヘキサン300重量部と、水300重量部を混合攪拌した後、遠心分離により水を除去し、得られたヘキサン溶液にさらに水300重量部を混合攪拌し、再度遠心分離により水を除去した後、ヘキサンを減圧脱揮により除去した。以上により、末端がアリル基である数平均分子量約25,500の2官能ポリプロピレンオキシドを得た。
合成例1で得られた樹脂(I−1):90重量部、合成例2で得られた樹脂(I−2):10重量部、可塑剤(モノサイザーW−7010:DIC株式会社製):100重量部、酸化防止剤(Irganox1010):1重量部、前記熱伝導性フィラーを手混ぜで十分攪拌混練した後に、5Lバタフライミキサーを用いて加熱混練しながら真空に引き脱水した。脱水完了後に冷却し、脱水剤(A171):2重量部、硬化触媒(ネオデカン酸スズ、ネオデカン酸):各4重量部を混合し、熱伝導性硬化性液状樹脂を得た。
熱伝導性硬化性液状樹脂をサランラップ(サランラップは登録商標である)内に包み、ホットディスク法熱伝導率測定装置TPA−501(京都電子工業(株)製)を用い、4φサイズのセンサーを2個の試料で挟む方法にて、熱伝導率を測定した。
熱伝導性硬化性液状樹脂を硬化させ、ミニダンベルを作成し、JIS K 6251を参考に引張弾性率を測定した。
高熱伝導樹脂フィルムとして、グラファイトフィルムを使用した。グラファイトフィルムの厚みとして、40μmのものと、25μmのものを用意した。
面方向の熱拡散率は、光交流法による熱拡散率測定装置(アルバック理工(株)社製LaserPit)を用いて、グラファイトフィルムを4mm×40mmのサンプル形状に切り取り、20℃の雰囲気下、10Hzにおいて測定した。
λ=α×d×Cp (2)
から算出することができる。式(2)において、λは熱伝導率を、αは熱拡散率を、dは密度を、Cpは比熱容量をそれぞれ表わす。
図9に示すように電子端末機器としてNEC社製の携帯電話機(スマートフォンNC−06C)19を用い、放熱実験を行った。
スマートフォン19の筺体の一部11aを外して基板14を露出させ、基板上の電磁シールド部材12a,12bの上面12dを外し、熱伝導性硬化性液状樹脂16を充填し硬化させ、電磁シールド部材bの上面12dを施蓋し、筺体11aの内側及び/又は電磁シールド部材の上面12dに高熱伝導樹脂フィルムを配置した。
スマートフォン19に電源を入れる前の発熱電子部品13a の温度を測定した。この温度はスマートフォン19の周辺温度と推定することができる。
図2は、基板14上において、電磁シールド部材の内部に熱伝導性硬化性液状樹脂を充填しないで、スマートフォン19の筺体11aの、電磁シールド部材の上面12dに対向する部位に、高熱伝導性樹脂フィルム15aを貼り付けたのみの状態を示す断面図である。
図3に示すように、基板14上において、発熱電子部品13a,13bを囲う電磁シールド部材の上面12dを外した状態で、電磁シールド部材12a,12bと基板14との間に、かつ発熱電子部品13a,13bに接触するように、熱伝導性硬化性液状樹脂16を充填して硬化させ、電磁シールド部材の上面12dを施蓋した。高熱伝導性樹脂フィルムは、スマートフォン19の筺体にも、電磁シールド部材の上面12dにも配置しなかった。
比較例1は熱伝導性硬化性液状樹脂を使用していない構造、比較例2は高熱伝導性樹脂フィルムを使用していない構造である。実施例1〜5は熱伝導性硬化性液状樹脂を使用し、発熱電子部品の熱を電磁シールド部材経由の後に、高熱伝導樹脂フィルムまで伝達している構造である。
11b:電子端末機器の筺体
12a:電磁シールド部材
12b:電磁シールド部材
13a:発熱電子部品
13b:発熱電子部品
14:基板
15a,15b,15c:高熱伝導樹脂フィルム
16:熱伝導性硬化性樹脂
○:熱電対にて温度を測定した部位
Claims (9)
- (a)発熱電子部品と、前記発熱電子部品に近接して、かつ前記発熱電子部品を少なくともその上面から覆うようにして取りつけられた電磁シールド部材とを少なくとも片面に備える電子端末機器用基板であって、前記電磁シールド部材と前記電子端末機器用基板との間に、かつ前記発熱電子部品に接触するように、熱伝導性硬化性液状樹脂が充填されて硬化した、電子端末機器用基板と、
(b)前記電磁シールド部材の上面に接触し若しくは該上面に対向して配置され、前記熱伝導性硬化性液状樹脂によって吸い上げられた熱を拡散するための高熱伝導性樹脂フィルムとを含む、電子端末機器。 - 前記高熱伝導性樹脂フィルムが、熱伝導性に異方性を持つグラファイトフィルムである、請求項1に記載の電子端末機器。
- 前記熱伝導性硬化性液状樹脂が湿気または熱により硬化する熱伝導性硬化性液状樹脂である、請求項1に記載の電子端末機器。
- 前記電磁シールド部材は、発熱電子部品の側壁を囲んでいる、請求項1に記載の電子端末機器。
- 前記発熱電子部品は、演算素子、通信制御素子、記憶素子の少なくとも1つを含む、請求項1に記載の電子端末機器。
- 前記熱伝導性硬化性液状樹脂が、硬化性アクリル系樹脂及び/又は硬化性ポリプロピレンオキサイド系樹脂と、熱伝導性フィラーとを含有する熱伝導性硬化性液状樹脂であって、熱伝導率が0.5W/mK以上である、請求項1に記載の電子端末機器。
- 前記高熱伝導性樹脂フィルムの面に沿う方向の熱伝導率が300W/mK以上、好ましくは600W/mK以上、さらに好ましくは1000W/mK以上であって、厚みが350μm以下、好ましくは100μm以下、さらに好ましくは50μm以下である、請求項1に記載の電子端末機器。
- 前記高熱伝導性樹脂フィルムの面に沿う方向の熱伝導率が300W/mK以上、好ましくは600W/mK以上、さらに好ましくは1000W/mK以上であって、厚みが350μm以下、好ましくは100μm以下、さらに好ましくは50μm以下である、請求項2に記載の電子端末機器。
- (a)発熱電子部品と、前記発熱電子部品に近接して、かつ前記発熱電子部品を少なくともその上面から覆うようにして取りつけられた電磁シールド部材とを少なくとも片面に有する電子端末機器用基板に対して、かつ前記電磁シールド部材と前記電子端末機器用基板との間に、熱伝導性硬化性液状樹脂を、前記発熱電子部品に接触するように充填して、硬化させ、
(b)前記電磁シールド部材の上面に接触し若しくは対向するように、前記熱伝導性硬化性液状樹脂によって吸い上げられた熱を拡散するための高熱伝導性樹脂フィルムを配置することにより、電子端末機器を組み立てる、方法。
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