WO2013187298A1 - 放熱構造体 - Google Patents
放熱構造体 Download PDFInfo
- Publication number
- WO2013187298A1 WO2013187298A1 PCT/JP2013/065646 JP2013065646W WO2013187298A1 WO 2013187298 A1 WO2013187298 A1 WO 2013187298A1 JP 2013065646 W JP2013065646 W JP 2013065646W WO 2013187298 A1 WO2013187298 A1 WO 2013187298A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- resin composition
- cured product
- curable
- curable resin
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 239000011342 resin composition Substances 0.000 claims abstract description 85
- 239000011347 resin Substances 0.000 claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000011231 conductive filler Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 230000020169 heat generation Effects 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims description 22
- 229920001451 polypropylene glycol Polymers 0.000 claims description 12
- 230000008439 repair process Effects 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 229920000178 Acrylic resin Polymers 0.000 claims description 9
- 239000000047 product Substances 0.000 description 45
- 239000000203 mixture Substances 0.000 description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- -1 cyclic siloxane Chemical class 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 14
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 230000000737 periodic effect Effects 0.000 description 13
- 239000000945 filler Substances 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 239000004020 conductor Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 8
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000011049 filling Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910001035 Soft ferrite Inorganic materials 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- 238000004898 kneading Methods 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 239000011787 zinc oxide Substances 0.000 description 6
- 235000014692 zinc oxide Nutrition 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000012024 dehydrating agents Substances 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 5
- QEEPNARXASYKDD-UHFFFAOYSA-J tris(7,7-dimethyloctanoyloxy)stannyl 7,7-dimethyloctanoate Chemical compound [Sn+4].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O QEEPNARXASYKDD-UHFFFAOYSA-J 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910018125 Al-Si Inorganic materials 0.000 description 4
- 229910018520 Al—Si Inorganic materials 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- MHVJRKBZMUDEEV-UHFFFAOYSA-N (-)-ent-pimara-8(14),15-dien-19-oic acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CCC(C=C)(C)C=C1CC2 MHVJRKBZMUDEEV-UHFFFAOYSA-N 0.000 description 3
- BKUSIKGSPSFQAC-RRKCRQDMSA-N 2'-deoxyinosine-5'-diphosphate Chemical compound O1[C@H](CO[P@@](O)(=O)OP(O)(O)=O)[C@@H](O)C[C@@H]1N1C(NC=NC2=O)=C2N=C1 BKUSIKGSPSFQAC-RRKCRQDMSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910018605 Ni—Zn Inorganic materials 0.000 description 3
- 229920002367 Polyisobutene Polymers 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000003463 adsorbent Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000004927 clay Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 description 3
- 229960001545 hydrotalcite Drugs 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910000889 permalloy Inorganic materials 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910000702 sendust Inorganic materials 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910002058 ternary alloy Inorganic materials 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- XWJBRBSPAODJER-UHFFFAOYSA-N 1,7-octadiene Chemical compound C=CCCCCC=C XWJBRBSPAODJER-UHFFFAOYSA-N 0.000 description 2
- MXYATHGRPJZBNA-UHFFFAOYSA-N 4-epi-isopimaric acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CCC(C=C)(C)CC1=CC2 MXYATHGRPJZBNA-UHFFFAOYSA-N 0.000 description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 2
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000005909 Kieselgur Substances 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000010459 dolomite Substances 0.000 description 2
- 229910000514 dolomite Inorganic materials 0.000 description 2
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- MXYATHGRPJZBNA-KRFUXDQASA-N isopimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@@](C=C)(C)CC2=CC1 MXYATHGRPJZBNA-KRFUXDQASA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 2
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- MHVJRKBZMUDEEV-APQLOABGSA-N (+)-Pimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@](C=C)(C)C=C2CC1 MHVJRKBZMUDEEV-APQLOABGSA-N 0.000 description 1
- UXBFAGQTUAMQSX-PKUWUEBNSA-N (1R)-1,3-dimethyl-2-[2-(3-propan-2-ylphenyl)ethyl]cyclohexane-1-carboxylic acid Chemical compound CC(C)c1cccc(CCC2C(C)CCC[C@@]2(C)C(O)=O)c1 UXBFAGQTUAMQSX-PKUWUEBNSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- UZZYXZWSOWQPIS-UHFFFAOYSA-N 3-fluoro-5-(trifluoromethyl)benzaldehyde Chemical compound FC1=CC(C=O)=CC(C(F)(F)F)=C1 UZZYXZWSOWQPIS-UHFFFAOYSA-N 0.000 description 1
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920003026 Acene Polymers 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- QUUCYKKMFLJLFS-UHFFFAOYSA-N Dehydroabietan Natural products CC1(C)CCCC2(C)C3=CC=C(C(C)C)C=C3CCC21 QUUCYKKMFLJLFS-UHFFFAOYSA-N 0.000 description 1
- NFWKVWVWBFBAOV-UHFFFAOYSA-N Dehydroabietic acid Natural products OC(=O)C1(C)CCCC2(C)C3=CC=C(C(C)C)C=C3CCC21 NFWKVWVWBFBAOV-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- RWWVEQKPFPXLGL-ONCXSQPRSA-N L-Pimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC=C(C(C)C)C=C2CC1 RWWVEQKPFPXLGL-ONCXSQPRSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- RWWVEQKPFPXLGL-UHFFFAOYSA-N Levopimaric acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CC=C(C(C)C)C=C1CC2 RWWVEQKPFPXLGL-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 description 1
- WBWJXRJARNTNBL-UHFFFAOYSA-N [Fe].[Cr].[Co] Chemical compound [Fe].[Cr].[Co] WBWJXRJARNTNBL-UHFFFAOYSA-N 0.000 description 1
- URQWOSCGQKPJCM-UHFFFAOYSA-N [Mn].[Fe].[Ni] Chemical compound [Mn].[Fe].[Ni] URQWOSCGQKPJCM-UHFFFAOYSA-N 0.000 description 1
- OLXNZDBHNLWCNK-UHFFFAOYSA-N [Pb].[Sn].[Ag] Chemical compound [Pb].[Sn].[Ag] OLXNZDBHNLWCNK-UHFFFAOYSA-N 0.000 description 1
- NOKSMMGULAYSTD-UHFFFAOYSA-N [SiH4].N=C=O Chemical compound [SiH4].N=C=O NOKSMMGULAYSTD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052768 actinide Inorganic materials 0.000 description 1
- 150000001255 actinides Chemical class 0.000 description 1
- 229910052767 actinium Inorganic materials 0.000 description 1
- QQINRWTZWGJFDB-UHFFFAOYSA-N actinium atom Chemical compound [Ac] QQINRWTZWGJFDB-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 229910052795 boron group element Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- BEQNOZDXPONEMR-UHFFFAOYSA-N cadmium;oxotin Chemical compound [Cd].[Sn]=O BEQNOZDXPONEMR-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 1
- 238000001444 catalytic combustion detection Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- UTICYDQJEHVLJZ-UHFFFAOYSA-N copper manganese nickel Chemical compound [Mn].[Ni].[Cu] UTICYDQJEHVLJZ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- NFWKVWVWBFBAOV-MISYRCLQSA-N dehydroabietic acid Chemical compound OC(=O)[C@]1(C)CCC[C@]2(C)C3=CC=C(C(C)C)C=C3CC[C@H]21 NFWKVWVWBFBAOV-MISYRCLQSA-N 0.000 description 1
- 229940118781 dehydroabietic acid Drugs 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- UBCNJHBDCUBIPB-UHFFFAOYSA-N diethyl 2,5-dibromohexanedioate Chemical compound CCOC(=O)C(Br)CCC(Br)C(=O)OCC UBCNJHBDCUBIPB-UHFFFAOYSA-N 0.000 description 1
- XYYQWMDBQFSCPB-UHFFFAOYSA-N dimethoxymethylsilane Chemical class COC([SiH3])OC XYYQWMDBQFSCPB-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000005308 ferrimagnetism Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910001849 group 12 element Inorganic materials 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 229910021476 group 6 element Inorganic materials 0.000 description 1
- 229910021474 group 7 element Inorganic materials 0.000 description 1
- 229910021472 group 8 element Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- QHGSGZLLHBKSAH-UHFFFAOYSA-N hydridosilicon Chemical group [SiH] QHGSGZLLHBKSAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical group [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- RQAGEUFKLGHJPA-UHFFFAOYSA-N prop-2-enoylsilicon Chemical compound [Si]C(=O)C=C RQAGEUFKLGHJPA-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- MHVJRKBZMUDEEV-KRFUXDQASA-N sandaracopimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@@](C=C)(C)C=C2CC1 MHVJRKBZMUDEEV-KRFUXDQASA-N 0.000 description 1
- YZVSLDRKXBZOMY-KNOXWWKRSA-N sandaracopimaric acid Natural products CC(=C)[C@]1(C)CCC[C@]2(C)[C@H]3CC[C@](C)(C=C)C=C3CC[C@@H]12 YZVSLDRKXBZOMY-KNOXWWKRSA-N 0.000 description 1
- 229920006298 saran Polymers 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- SUBJHSREKVAVAR-UHFFFAOYSA-N sodium;methanol;methanolate Chemical compound [Na+].OC.[O-]C SUBJHSREKVAVAR-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229940075582 sorbic acid Drugs 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- GKLVYJBZJHMRIY-UHFFFAOYSA-N technetium atom Chemical compound [Tc] GKLVYJBZJHMRIY-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C73/00—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D
- B29C73/02—Repairing of articles made from plastics or substances in a plastic state, e.g. of articles shaped or produced by using techniques covered by this subclass or subclass B29D using liquid or paste-like material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/166—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Definitions
- the present invention relates to a heat dissipation structure in which a heat conductive curable resin composition is filled and cured in an electromagnetic wave shielding case on a substrate used in electronic equipment, precision equipment, and the like.
- electromagnetic waves from the outside are superimposed as noise on signals input to and output from electronic components (members that generate heat when driving electronic devices), or electromagnetic waves generated by the electronic components themselves are superimposed as noise on other signals. In order to prevent this, it is considered to shield electromagnetic waves entering and exiting the electronic component.
- an electromagnetic wave shielding case structure a structure in which a single or a plurality of electronic components mounted on a printed board is covered with a metal case from above is known.
- the electronic component is in a sealed state and there is no problem with the electromagnetic wave shielding characteristics, but the temperature of the electronic component is increased compared to other components because it is covered with air which is a defective conductor of heat. There was a problem that it was easy to deteriorate quickly or it was difficult to obtain characteristics. In particular, since the heat generation density of electronic components in recent years has increased, heat countermeasures are an indispensable element.
- Patent Documents 1 and 2 describe that a sealed space formed by a sheet metal case for electromagnetic wave shielding is filled with resin, and heat generation of electronic components mounted inside the case is performed. A technique for escaping to the outer surface of the case is disclosed.
- the disclosed heat conductive resin is a silicone-based resin, there has been a concern about contact failure of electronic components due to volatilization of a low molecular siloxane component or a cyclic siloxane component.
- Patent Document 5 discloses a heat conductive material comprising a curable acrylic resin having a crosslinkable functional group and a heat conductive filler.
- This thermal conductive material not only has high thermal conductivity, but also has fluidity before curing, so it has good adhesion to uneven objects unlike sheet-like or gel-like thermal conductive materials. It is possible to suppress the increase in contact thermal resistance due to peeling off during use or an air gap.
- Patent Document 6 discloses a curable silicone resin having improved peelability. However, since it is a silicone composition, there was a problem of volatilization of the low molecular siloxane component described above.
- Patent Document 7 discloses a technique related to a curable polyisobutylene-based resin whose main chain skeleton is polyisobutylene.
- the present invention is a thermal countermeasure that prevents the contact failure of electronic components due to low-molecular siloxane components, etc., and the risk of leakage outside the system during long-term use, as a heat countermeasure for electronic components installed in an electromagnetic shielding case on a substrate.
- An object of the present invention is to provide a heat dissipation structure filled and cured with a photocurable resin composition. It is another object of the present invention to provide a heat dissipation structure that can be applied to an electronic component having a large heat generation density. Furthermore, it aims at providing the simple repair method of an electronic device.
- a curable liquid resin (I) and a heat conductive filler (II) has a viscosity at 23 ° C. of 30 Pa ⁇ s to 3000 Pa ⁇ s, and has a heat conductivity of 0.5 W that can be cured by moisture or heating.
- a heat conductive curable resin composition of / (m ⁇ K) or more is filled in an electromagnetic wave shielding case on a substrate on which electronic components having a heat generation density of 0.2 W / cm 2 to 500 W / cm 2 are mounted.
- the present invention relates to a heat dissipation structure obtained by curing.
- the curable liquid resin (I) is preferably a curable acrylic resin and / or a curable polypropylene oxide resin. It is preferable that the cured product of the heat conductive curable resin composition is in contact with both the electromagnetic shielding case and the electronic component. It is preferable that the heat conductivity after hardening of a heat conductive curable resin composition is 0.5 W / (m * K) or more.
- the present invention also relates to a portable information terminal having the heat dissipation structure of the present invention.
- the present invention also relates to an electronic device having the heat dissipation structure of the present invention.
- the present invention also includes a heating element and / or a radiator, a curable liquid resin (I), and a thermally conductive filler (II), and has a viscosity at 23 ° C. of 30 Pa ⁇ s to 3000 Pa ⁇ s.
- An electronic device comprising a step of removing the cured product from a bonded body with a cured product of a thermally conductive curable resin composition having a thermal conductivity of 0.5 W / (m ⁇ K) or more that can be cured by moisture or heating
- a repair method The present invention relates to a method for repairing an electronic device, wherein the 180 degree peel strength of the cured product with respect to a SUS substrate is 0.05 N / 25 mm to 1.00 N / 25 mm.
- the heat conductive curable resin composition of the present invention is a liquid resin, not only can the inside of the electromagnetic wave shielding case be filled without any gaps, but also the resin composition to the outside of the system over time by curing. There is no fear of spillage.
- the heat dissipating structure of the present invention using this heat conductive curable resin composition can transmit the heat generated by the electronic component in the electromagnetic shielding case to the electromagnetic shielding case and the substrate, thereby suppressing the heat generation of the electronic component. This can greatly contribute to the suppression of performance deterioration of electronic components.
- the heat dissipating structure according to the present invention contains a curable liquid resin (I) and a heat conductive filler (II), and has a viscosity at 23 ° C. of 30 Pa ⁇ s to 3000 Pa ⁇ s.
- a thermally conductive curable resin composition having a curable thermal conductivity of 0.5 W / (m ⁇ K) or higher is mounted on a substrate on which electronic components having a heat generation density of 0.2 W / cm 2 to 500 W / cm 2 are mounted. It is characterized in that it is obtained by curing in a state filled in an electromagnetic wave shielding case.
- the curable liquid resin is curable by moisture or heating, and a liquid resin having a reactive group in the molecule and curable is preferable.
- Specific examples of the curable liquid resin include curable vinyl resins typified by curable acrylic resins and curable methacrylic resins, curable properties typified by curable polyethylene oxide resins and curable polypropylene oxide resins. Examples thereof include polyether resins and curable polyolefin resins typified by curable polyisobutylene resins.
- reactive functional groups such as epoxy groups, hydrolyzable silyl groups, vinyl groups, acryloyl groups, SiH groups, urethane groups, carbodiimide groups, combinations of carboxylic anhydride groups and amino groups, etc. are used as reactive groups. be able to.
- the curable liquid resin When the curable liquid resin is cured by a combination of two kinds of reactive groups, or a reaction between a reactive group and a curing catalyst, it is prepared as a two-part composition and then applied to a substrate or a heating element. Curability can be obtained by mixing the two liquids. In the case of a curable liquid resin having a hydrolyzable silyl group, it can be cured by reacting with moisture in the air, so that it can be a one-component room temperature curable composition.
- the crosslinking temperature is changed to a one-component curable composition or a two-component curable composition. It can also be cured by heating up to.
- a thermosetting composition when it is easy to heat the entire heat dissipation structure to some extent, it is preferable to use a thermosetting composition. When it is difficult to heat the heat dissipation structure, two-component curing is used. It is preferable to use a water-soluble composition or a moisture-curable composition, but it is not limited thereto.
- curable liquid resins curable acrylic resins or curable polypropylene oxide resins are used because they have few problems of contamination in electronic equipment due to low molecular weight siloxane, and are excellent in heat resistance, productivity, and workability. It is preferable to use it.
- the curable acrylic resin various known reactive acrylic resins can be used. Among these, it is preferable to use an acrylic oligomer having a reactive group at the molecular end.
- these curable acrylic resins a combination of a curable acrylic resin produced by living radical polymerization, particularly atom transfer radical polymerization, and a curing catalyst can be most preferably used.
- Kaneka XMAP manufactured by Kaneka Corporation is well known.
- the curable polypropylene oxide resin various known reactive polypropylene oxide resins can be used, and examples thereof include Kaneka MS polymer manufactured by Kaneka Corporation. These curable liquid resins may be used alone or in combination of two or more.
- graphite, aluminum oxide, magnesium oxide, titanium oxide, zinc oxide, boron nitride, aluminum nitride, silicon carbide, aluminum hydroxide, magnesium carbonate, crystalline silica, Mn-Zn series Soft ferrite, Ni-Zn soft ferrite, Fe-Al-Si ternary alloy (Sendust), carbonyl iron, and iron-nickel alloy (Permalloy) are more preferred, graphite, ⁇ -alumina, hexagonal boron nitride, nitriding
- Aluminum, aluminum hydroxide, Mn—Zn soft ferrite, Ni—Zn soft ferrite, Fe—Al—Si ternary alloy (Sendust), carbonyl iron, and iron nickel alloy (Permalloy) are even more preferable, spherical Graphite, round or spherical ⁇ -Alumina, spheroidized hexagonal boron nitride, aluminum
- reduced carbonyl iron powder is desirable.
- the reduced carbonyl iron powder is not a standard grade but a carbonyl iron powder classified into a reduced grade, and is characterized by a lower carbon and nitrogen content than the standard grade.
- thermally conductive fillers are improved in dispersibility with respect to the resin, so that silane coupling agents (vinyl silane, epoxy silane, (meth) acryl silane, isocyanate silane, chlorosilane, aminosilane, etc.) and titanate coupling are used.
- silane coupling agents vinyl silane, epoxy silane, (meth) acryl silane, isocyanate silane, chlorosilane, aminosilane, etc.
- titanate coupling are used.
- Agents alkoxy titanate, amino titanate, etc. or fatty acids (caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid, etc., sorbic acid, elaidic acid, oleic acid , Linoleic acid, linolenic acid, erucic acid and other unsaturated fatty acids) and resin acids (abietic acid, pimaric acid, levopimaric acid, neoapitic acid, parastrinic acid, dehydroabietic acid, isopimaric acid, sandaracopimaric acid, cormic acid, Secodehydroabietic acid The dihydroabietic acid) or the like, it is preferable that the surface has been treated.
- the amount of such a heat conductive filler used is that the volume ratio (%) of the heat conductive filler can be increased because the heat conductivity of the cured product obtained from the heat conductive curable resin composition can be increased. ) Is preferably 25% by volume or more of the total composition. If it is less than 25% by volume, the thermal conductivity tends to be insufficient. When a higher thermal conductivity is desired, the amount of the thermally conductive filler used is more preferably 30% by volume or more, more preferably 35% by volume or more, and 40% by volume in the total composition. The above is particularly preferable. Moreover, it is preferable that the volume ratio (%) of a heat conductive filler becomes 90 volume% or less in the whole composition. When it is more than 90% by volume, the viscosity of the thermally conductive curable resin composition before curing may be too high.
- the volume fraction (%) of the thermally conductive filler is calculated from the weight fraction and specific gravity of the resin component and the thermally conductive filler, and is obtained by the following equation.
- the thermally conductive filler is simply referred to as “filler”.
- Filler volume ratio (volume%) (filler weight ratio / filler specific gravity) ⁇ [(resin weight ratio / resin weight specific gravity) + (filler weight ratio / filler specific gravity)] ⁇ 100
- the resin component refers to all components excluding the thermally conductive filler.
- the particle size ratio between the heat conductive filler having a large particle size and the heat conductive filler having a small particle size is preferably about 100/5 to 100/20.
- thermally conductive filler not only a single thermally conductive filler, but also two or more different types can be used in combination.
- the heat conductive curable resin composition contains the curable liquid resin (I) and the heat conductive filler (II), and can be cured by moisture or heating.
- a curing catalyst for curing the curable liquid resin a heat aging inhibitor, a plasticizer, an extender, a thixotropic agent, a storage stabilizer, a dehydrating agent, a coupling agent, An ultraviolet absorber, a flame retardant, an electromagnetic wave absorber, a filler, a solvent, and the like may be added.
- various fillers other than the thermally conductive filler may be used as needed to the extent that the effects of the present invention are not hindered.
- Various fillers other than the heat conductive filler are not particularly limited, but wood powder, pulp, cotton chips, asbestos, glass fiber, carbon fiber, mica, walnut shell powder, rice husk powder, diatomaceous earth, white clay, silica (Fumed silica, precipitated silica, fused silica, dolomite, silicic anhydride, hydrous silicic acid, amorphous spherical silica, etc.), reinforcing filler such as carbon black; diatomaceous earth, calcined clay, clay, talc, Titanium oxide, bentonite, organic bentonite, ferric oxide, aluminum fine powder, flint powder, activated zinc white, zinc powder, zinc carbonate and shirasu balloon, glass microballoon, organic microballoon of phenol resin and vinyliden
- fillers precipitated silica, fumed silica, fused silica, dolomite, carbon black, titanium oxide, talc and the like are preferable. Some of these fillers have a slightly function as a heat conductive filler, and the composition, such as carbon fiber, various metal powders, various metal oxides, various organic fibers, Some synthesis methods, crystallinity, and crystal structures can be used as excellent heat conductive fillers.
- the heat conductive curable resin composition has a viscosity before curing at 23 ° C. of 30 Pa ⁇ s or more, and has fluidity but a relatively high viscosity.
- the viscosity before curing is less than 30 Pa ⁇ s, the workability during application is deteriorated due to, for example, the cured product being washed away from the application site because the viscosity is low.
- the viscosity before curing is preferably 40 Pa ⁇ s or more, more preferably 50 Pa ⁇ s or more.
- the upper limit of the viscosity before curing is 3000 Pa ⁇ s or less, preferably 2000 Pa ⁇ s or less.
- the heat conductive curable resin composition has a thermal conductivity of 0.5 W / (m ⁇ K) or more.
- the heat conductive curable resin composition is required to have high heat conductivity because heat needs to be efficiently transferred to the outside.
- the thermal conductivity is preferably 0.7 W / (m ⁇ K) or more, more preferably 0.8 W / (m ⁇ K) or more, and further preferably 0.9 W / (m ⁇ K) or more.
- the thermal conductivity of the thermally conductive curable resin composition after curing is preferably 0.5 W / (m ⁇ K) or more. Since it is necessary to efficiently transmit heat to the outside, the thermal conductivity of the cured product is more preferably 0.7 W / (m ⁇ K) or more, and 0.8 W / (m ⁇ K) or more. More preferably, it is 0.9 W / (m ⁇ K) or more.
- cured material obtained by hardening a heat conductive curable resin composition exists in the plus / minus 20% of range of the heat conductivity of a heat conductive curable resin composition.
- the hardness of the cured product of the thermally conductive resin composition is preferably low so that thermal expansion and distortion at high temperatures can be absorbed.
- the hardness is preferably 10 or more and 99 or less, more preferably 10 or more and 95 or less, and more preferably 20 or more and 90 or less with an Asker C-type hardness meter. More preferably.
- the cured product of the heat conductive resin composition preferably has a 180 degree peel strength (peel rate of 300 mm / min) with respect to the SUS304 plate of 0.05 N / 25 mm or more, and 0.075 N / 25 mm or more. It is more preferable, and it is especially preferable that it is 0.10 N / 25mm or more. Further, it is preferably 1.00 N / 25 mm or less, more preferably 0.75 N / 25 mm or less, and particularly preferably 0.50 N / 25 mm or less.
- the peel strength of the cured product is less than 0.05 N / 25 mm, the adhesion with the electronic component or the electromagnetic wave shielding case is poor, and the contact thermal resistance may be increased to reduce the heat dissipation. Moreover, when peeling strength exceeds 1.00 N / 25mm, it cannot peel easily from an uneven
- substrate is measured as follows, for example. 1. A 200 ⁇ m thick thermally conductive curable resin composition is applied to a PET film having a length of 150 mm, a width of 20 mm, and a thickness of 25 ⁇ m, and bonded to a SUS304 plate by one reciprocating 2 kg roller. 2. Cured for one day at 23 ° C and 50% RH. 3. Using a universal tensile tester, the peel test is performed at a peel angle of 180 degrees and a tensile speed of 300 mm / min.
- the cured product is peeled off at the interface rather than by cohesive peeling.
- cohesive peeling there is a possibility that the cured product remains on both sides at the time of peeling, resulting in poor working efficiency. It can be judged by a peelability test that the cured product can be peeled at the interface. More specifically, for example, 5 g of a heat conductive curable resin composition is applied on a memory substrate (MV-DN333-A512M, manufactured by Buffalo), and after curing at 23 ° C.
- the cured product can be peeled at the interface. to decide.
- FIG. 1 One embodiment of the heat dissipation structure of the present invention is shown in FIG.
- the electronic component 13a and the electronic component 13b are fixed on the substrate 12, the electromagnetic shielding case 11 covering the electronic components 13a and 13b is installed on the substrate 12, and the cured product 14 in the electromagnetic shielding case 11 has a thermally conductive curable composition.
- the product is cured after filling.
- the heat generation density of the electronic component used in the present invention is 0.2 W / cm 2 to 500 W / cm 2 .
- An electronic component having a heat generation density of 0.2 W / cm 2 or more tends to generate heat up to a high temperature during driving, and the performance of the component tends to decrease.
- the electronic component is not particularly limited as long as it is a member that generates heat when the electronic device / precision device is driven.
- Heat density of electronic components is preferably 0.3 W / cm 2 or more, and more preferably 0.5 W / cm 2 or more. Further, it is preferably 300 W / cm 2 or less, more preferably 100W / cm 2 or less.
- the heat generation density refers to heat energy released from a unit area per unit time.
- Such electronic components include microprocessors such as CPUs and GPUs, DSPs (digital signal processors), power amplifiers, RF transceiver ICs, amplification ICs, signal processing ICs, LNAs, antenna devices, filter devices, crystal devices, Various chips for communication, wireless LAN, Bluetooth (registered trademark), memory devices, power management, vibration motors, various sensor devices such as illuminance, acceleration, geomagnetism, and pressure, gyroscopes, various processors, various modules such as LEDs, integrated circuits , Transistors, diodes, resistors, capacitors, inductors, and the like.
- the substrate There may be only one electronic component on the substrate, or a plurality of electronic components may be mounted on the substrate. Also, only one electronic component in the electromagnetic wave shielding case may be provided on the substrate, or a plurality of electronic components may be attached on the substrate. When a plurality of electronic components are mounted on the substrate, the heights of the electronic components from the substrate do not need to match. By placing an uncured thermally conductive curable resin composition and then curing it, it adheres even when the heights of the electronic components do not match, and efficiently generates heat from the electronic components as an electromagnetic shielding case or substrate Can tell.
- the temperature of the electronic component is preferably 130 ° C. or less, more preferably 120 ° C. or less, and still more preferably 111 ° C. or less from the viewpoint of setting the temperature to the heat resistant temperature or less. If the temperature exceeds 130 ° C., the function of the semiconductor element or the like forming the electronic component may become dull or malfunction.
- the heat-resistant temperature of the electronic component may be limited to 120 ° C. or lower.
- the temperature of the electronic component is preferably 0 ° C. or higher.
- the material of the electromagnetic shielding case is not particularly limited as long as it is a material that exhibits electromagnetic shielding performance by reflecting, conducting, or absorbing electromagnetic waves.
- metal materials, plastic materials, various magnetic materials, carbon materials, and the like can be used. Among these, metal materials can be suitably used from the viewpoints of electromagnetic shielding performance (high conductivity and magnetic permeability), material strength, workability, and cost.
- a metal material composed only of a metal element is suitable.
- a metal material composed of a single metal element for example, a periodic table group 1 element such as lithium, sodium, potassium, rubidium, and cesium; a periodic table group 2 element such as magnesium, calcium, strontium, and barium; scandium , Yttrium, lanthanoid elements (lanthanum, cerium, etc.), periodic table group 3 elements such as actinoid elements (actinium, etc.); periodic table group 4 elements, such as titanium, zirconium, hafnium; periodic table group 5, such as vanadium, niobium, tantalum, etc.
- Group 6 elements of the periodic table such as chromium, molybdenum and tungsten; Group 7 elements of the periodic table such as manganese, technetium and rhenium; Group 8 elements of the periodic table such as iron, ruthenium and osmium; Periodic table of cobalt, rhodium and iridium Group 9 element; periodic table 1 of nickel, palladium, platinum, etc.
- Group elements Periodic table 11 elements such as copper, silver and gold; Group 12 elements such as zinc, cadmium and mercury; Periodic group 13 elements such as aluminum, gallium, indium and thallium; Period such as tin and lead Table 14 group elements; periodic table 15 group elements such as antimony and bismuth.
- alloys include stainless steel, copper-nickel alloy, brass, nickel-chromium alloy, iron-nickel alloy, zinc-nickel alloy, gold-copper alloy, tin-lead alloy, silver-tin-lead alloy, nickel. -Chromium-iron alloy, copper-manganese-nickel alloy, nickel-manganese-iron alloy and the like.
- various metal compounds containing non-metal elements together with metal elements are not particularly limited as long as they are metal compounds capable of exhibiting electromagnetic wave shielding performance including the metal elements and alloys exemplified above.
- Metal sulfides metal oxides such as iron oxide, titanium oxide, tin oxide, indium oxide, and cadmium tin oxide, and metal composite oxides.
- metal oxides such as iron oxide, titanium oxide, tin oxide, indium oxide, and cadmium tin oxide, and metal composite oxides.
- gold, silver, aluminum, iron, copper, nickel, stainless steel, copper-beryllium alloy (beryllium copper), magnesium alloy, iron-nickel alloy, permalloy, and copper-nickel alloy are preferable, aluminum, Iron, copper, stainless steel, copper-beryllium alloy (beryllium copper), magnesium alloy, and iron-nickel alloy are particularly preferable.
- plastic material examples include conductive plastics such as polyacetylene, polypyrrole, polyacene, polyphenylene, polyaniline, and polythiophene.
- magnetic material examples include soft magnetic powder, various ferrites, and zinc oxide whiskers.
- a ferromagnetic material exhibiting ferromagnetism or ferrimagnetism is suitable. Specifically, for example, high permeability ferrite, pure iron, silicon atom-containing iron, nickel-iron alloy, iron-cobalt alloy, amorphous metal high permeability material, iron-aluminum-silicon alloy, iron-aluminum- Examples include silicon-nickel alloys and iron-chromium-cobalt alloys. Furthermore, carbon materials, such as a graphite, are mentioned.
- the electromagnetic shielding case is intended to prevent electromagnetic waves generated from electronic components on the substrate from flowing out.
- the structure of the electromagnetic shielding case is not particularly limited as long as it can exhibit electromagnetic shielding performance.
- an electromagnetic wave shielding case is installed on a ground layer on a substrate as shown in FIG. 1 and surrounds an electronic component that becomes an electromagnetic wave generation source.
- the electromagnetic shielding case and the ground layer on the substrate are joined together by solder or a conductive material.
- the electromagnetic shielding case may have holes or gaps as long as the electromagnetic shielding performance from low frequency to high frequency is not impaired.
- the electromagnetic shielding case may be a single body, for example, a type that can be separated into two or more, such as a bowl-shaped shielding case and a lid-shaped shielding cover.
- a bowl-shaped shielding case and a lid-shaped shielding cover In the former case, it is only necessary to inject a heat conductive curable resin composition from the hole of the electromagnetic shielding case. In the latter case, the heat conductive curable resin is installed in a state in which a bowl-shaped shield case is installed on the substrate. What is necessary is just to install a lid-shaped shield cover after apply
- the heat conductive resin in the electromagnetic shielding case is removed, or the cover shield cover is removed with the electromagnetic shielding case installed, and the thermal conductive resin is removed. By removing, the electronic device can be repaired.
- the electromagnetic shielding case is more preferable as it has higher thermal conductivity because the temperature distribution becomes more uniform and the heat generated by the electronic components in the electromagnetic shielding case can be effectively transmitted to the outside.
- the thermal conductivity of the electromagnetic shielding case is preferably 1 W / (m ⁇ K) or more, more preferably 3 W / (m ⁇ K) or more, and further preferably 5 W / (m ⁇ K) from the viewpoint of improving heat dissipation. ) Or more, and most preferably 10 W / (m ⁇ K) or more.
- the thermal conductivity of the electromagnetic shielding case is preferably 10000 W / (m ⁇ K) or less.
- a general liquid resin coating / injection method can be used as a method for filling the electromagnetic shielding case with the thermally conductive curable resin composition.
- known coating methods such as a spin coating method, a roll coating method, a dipping method, and a spray method can be exemplified.
- pour using a dispenser from containers such as a cartridge filled with a heat conductive curable resin composition, a tube, and a syringe, and can fill the inside of an electromagnetic wave shield case.
- the electromagnetic shielding case When filling, it is preferable that at least a part of the electromagnetic shielding case is placed on the substrate.
- the electromagnetic shielding case is of a type that can be separated into the upper part, such as a lid, the lid is closed after the thermally conductive curable resin composition is applied and injected to cover the electronic component with the lid removed.
- a heat conductive curable resin composition can be inject
- the thermally conductive curable resin composition filled in the electromagnetic shielding case is preferably in contact with both the electromagnetic shielding case and the electronic component after curing, and more preferably in contact with the substrate.
- the heat of the electronic component can be efficiently transmitted to the electromagnetic shielding case or the substrate.
- the shape of the cured product is not particularly limited, and examples thereof include a sheet shape, a tape shape, a strip shape, a disc shape, an annular shape, a block shape, and an indefinite shape.
- the portable information terminal and electronic device of the present invention have the heat dissipation structure of the present invention.
- the portable information terminal / electronic apparatus is not particularly limited as long as it is an apparatus having an electronic component covered with an electromagnetic wave shielding case and mounted on a substrate.
- Examples of the personal digital assistant (PDA) include an electronic notebook, PHS, mobile phone, smartphone, smart book, tablet terminal, digital media player, and digital audio player.
- Examples of electronic devices include supercomputers, mainframes, servers, minicomputers, workstations, personal computers, portables, plugs, game machines, smart TVs, laptops, notebook computers (CULV, tablet PCs, netbooks, Ultra- Mobile PC, smart book, Ultrabook), pocket computer, portable game machine, electronic dictionary, electronic book reader, portable data terminal, head mounted display and other devices, liquid crystal display, plasma display, surface conduction electron-emitting device display (SED) ), LED, organic EL, inorganic EL, liquid crystal projector, display device such as clock, ink jet printer (ink head), electrophotographic device (developing device, Image forming apparatus such as fixing device, heat roller, heat belt), semiconductor element, semiconductor package, semiconductor sealing case, semiconductor die bonding, CPU, memory, power transistor, power transistor case, semiconductor related parts, rigid wiring board, Flexible wiring boards, ceramic wiring boards, build-up wiring boards, wiring boards such as multilayer boards (the wiring board on the left includes printed wiring boards, etc.), vacuum processing equipment, semiconductor manufacturing equipment, display equipment manufacturing equipment, etc.
- heat insulation materials such as heat insulation materials, vacuum heat insulation materials, radiation heat insulation materials
- data recording equipment such as DVDs (optical pickups, laser generators, laser receivers), hard disk drives, cameras, video cameras, digital cameras, digital videos
- Image recording devices such as cameras, microscopes, CCDs, charging devices, Ion batteries, fuel cells, and a battery device such as a solar cell.
- the method for repairing an electronic device includes a heating element and / or a radiator, a curable liquid resin (I), and a thermally conductive filler (II), and has a viscosity at 23 ° C. of 30 Pa ⁇ s.
- the cured product is removed from the joined body with the cured product of the thermally conductive curable resin composition having a thermal conductivity of 0.5 W / (m ⁇ K) or more that is ⁇ 3000 Pa ⁇ s and can be cured by moisture or heating.
- a method of repairing an electronic device including a process, characterized in that a 180 degree peel strength of the cured product with respect to a SUS substrate is 0.05 N / 25 mm to 1.00 N / 25 mm.
- repair means an action called repair in a broad sense. That is, actions for inspection and parts replacement, and actions for reproduction are also included.
- the electronic device is not particularly limited as long as it has a heating element and / or a joined body of a heat radiating body and a heat conductive resin, and examples thereof include the above-described portable information terminal and electronic device.
- the heating element is not particularly limited, and for example, the above-described electronic component can be used.
- the heating element is preferably mounted on the substrate.
- the radiator is not particularly limited, and for example, the above-described electromagnetic shielding case can be used. It is preferable that the heat dissipating body is installed on the substrate on which the heat generating body is mounted so as to surround the heat generating body.
- the shape of the radiator is not particularly limited. In the case of a shape that can be separated into two or more, such as a case and a cover, it is preferable to remove only the cover because the heat conductive resin can be removed while the case portion is installed. In the case where the heat radiating body is an integral body, the heat conductive resin may be removed after the heat radiating body is removed from the substrate.
- the heat conductive curable resin composition that is a raw material of the heat conductive resin is not particularly limited as long as the above conditions are satisfied.
- the above-described heat conductive curable resin composition can be used.
- the 180 degree peel strength of the heat conductive resin with respect to the SUS substrate is within a certain range, it can be easily peeled from the joined body, and simple repair of the electronic device is possible.
- Toluene is added to this concentrate to dissolve the polymer, diatomaceous earth is added as a filter aid, aluminum silicate and hydrotalcite are added as adsorbents, and an oxygen-nitrogen mixed gas atmosphere (oxygen concentration 6%) is set to an internal temperature of 100.
- the mixture was heated and stirred at ° C.
- the solid content in the mixed solution was removed by filtration, and the filtrate was heated and stirred at an internal temperature of 100 ° C. under reduced pressure to remove volatile components.
- aluminum silicate, hydrotalcite, and a heat deterioration inhibitor were added as adsorbents to this concentrate, and the mixture was heated and stirred under reduced pressure (average temperature of about 175 ° C., reduced pressure of 10 Torr or less).
- a 1.2-fold equivalent NaOMe methanol solution was added to the hydroxyl group of the hydroxyl group-terminated polypropylene oxide to distill off the methanol, and allyl chloride was added to convert the terminal hydroxyl group into an allyl group. Unreacted allyl chloride was removed by vacuum devolatilization. After mixing and stirring 300 parts by weight of n-hexane and 300 parts by weight of water with respect to 100 parts by weight of the unpurified allyl group-terminated polypropylene oxide, water was removed by centrifugation, and the resulting hexane solution was further added.
- the mixture was cooled after completion of dehydration, and mixed with 2 parts by weight of a dehydrating agent (A171) and 4 parts by weight of a curing catalyst (tin neodecanoate, neodecanoic acid) to obtain a heat conductive curable resin composition.
- a dehydrating agent A171
- a curing catalyst titanium neodecanoate, neodecanoic acid
- the mixture was cooled after completion of dehydration, and mixed with 2 parts by weight of a dehydrating agent (A171) and 4 parts by weight of a curing catalyst (tin neodecanoate, neodecanoic acid) to obtain a heat conductive curable resin composition.
- a dehydrating agent A171
- a curing catalyst titanium neodecanoate, neodecanoic acid
- thermo conductivity of thermally conductive curable resin composition A heat conductive curable resin composition is wrapped in Saran Wrap (registered trademark), and a hot disk method thermal conductivity measuring device TPA-501 (manufactured by Kyoto Denshi Kogyo Co., Ltd.) is used. The thermal conductivity was measured by the method of sandwiching between.
- the thermally conductive curable resin composition was cured for one day under the conditions of 23 ° C. and 50% RH to obtain two disk-shaped samples having a thickness of 3 mm and a diameter of 20 mm.
- TPA-501 thermal conductivity measuring device
- thermocouple double wire TT-D-40-SLE manufactured by OMEGA ENGINEERING
- Electromagnetic shielding case SUS (0.3 mm thickness), 20 mm ⁇ 20 mm ⁇ 1.40 mm 12: Substrate: glass epoxy, 60 mm ⁇ 60 mm ⁇ 0.75 mm 13: Electronic component: Alumina heating element (heat generation amount 1 W, heat generation density 1 W / cm 2 ), 10 mm ⁇ 10 mm ⁇ 1.05 mm 14: Thermally conductive curable resin composition (or cured product) ⁇ : Thermocouple mounting position
- the heat conductive curable resin composition was applied so as to contact the electromagnetic shielding case, the substrate, and the electronic component. It can be seen that the temperature of the electromagnetic wave shielding case and the substrate is increased as the temperature is greatly decreased. This means that the heat generated by the electronic component is transmitted to the electromagnetic shielding case or the substrate. Also, as shown in Table 2, in Example 6 where the electronic component was applied only to the upper part of the electronic component and brought into contact with the electromagnetic wave shielding case, the temperature of the electronic component was greatly reduced and no heat was transferred to the substrate. It can be seen that heat can be transferred to and dissipated. On the other hand, in Comparative Example 2 containing no thermally conductive filler, not only the above effect was small, but also the resin flowed out of the electromagnetic shielding case because of its low viscosity.
- Resin (I-1) obtained in Synthesis Example 1 100 parts by weight, plasticizer (DIDP (manufactured by J-Plus)): 100 parts by weight, antioxidant (Irganox 1010 (manufactured by Ciba Japan)): 1 part by weight Part, heat conductive filler (AS-40 (alumina, manufactured by Showa Denko KK) / zinc oxide (manufactured by Sakai Chemical Industry Co., Ltd.)): After 1070/500 parts by weight were mixed well by stirring and kneading, a 5 L butterfly mixer was added. It was dehydrated under vacuum while being heated and kneaded.
- plasticizer DIDP (manufactured by J-Plus)
- antioxidant Irganox 1010 (manufactured by Ciba Japan)
- AS-40 heat conductive filler
- AS-40 alumina, manufactured by Showa Denko KK
- zinc oxide manufactured by Sakai Chemical Industry Co., Ltd.
- Example 9 Resin (I-1) obtained in Synthesis Example 1: 90 parts by weight, Resin (I-2) obtained in Synthesis Example 2: 10 parts by weight, Plasticizer (DIDP): 95 parts by weight, Antioxidant ( Irganox 1010): 1 part by weight, heat conductive filler (BF-083 (alumina hydroxide, manufactured by Nippon Light Metal Co., Ltd.) / Zinc oxide: 440/100 parts by weight, after thoroughly stirring and kneading, using a 5 L butterfly mixer Heat-kneaded and vacuum dehydrated, cooled after completion of dehydration, mixed with dehydrating agent (A171): 2 parts by weight, curing catalyst (tin neodecanoate U-50H): 4 parts by weight, heat conductive curability Table 3 shows the evaluation results.
- DIDP Plasticizer
- Antioxidant Irganox 1010
- heat conductive filler BF-083 (alumina hydroxide, manufactured by Nippon Light Metal Co., Ltd.)
- the thermally conductive curable resin composition was cured for one day under the conditions of 23 ° C. and 50% RH to obtain two disk-shaped samples having a thickness of 3 mm and a diameter of 20 mm.
- TPA-501 thermal conductivity measuring device
- thermally conductive curable resin composition (Hardness after curing of thermal conductive resin composition) The thermally conductive curable resin composition was cured at 23 ° C. and 50% RH for 1 day to produce a 20 ⁇ 20 ⁇ 6 mm cured product, and the hardness was measured with an Asker C-type hardness meter.
- a 200 ⁇ m heat conductive curable resin composition was applied to a PET film having a length of 150 mm, a width of 20 mm, and a thickness of 25 ⁇ m, and was bonded to a SUS304 plate by one reciprocating 2 kg roller. After curing for one day at 23 ° C. and 50% RH, a peel test was performed using a universal tensile tester at a peel angle of 180 degrees and a tensile speed of 300 mm / min to measure peel strength.
- thermoly conductive curable resin composition 5 g of the thermally conductive curable resin composition was applied on a memory substrate (MV-DN333-A512M, manufactured by Buffalo) and cured for one day under conditions of 23 ° C. and 50% RH, and then a heat shock tester (ES-56L). (Manufactured by Hitachi Appliances, Inc.), a heat shock test was performed by repeating the cycle of holding for 30 minutes in a temperature environment of ⁇ 40 ° C. and 85 ° C. for 100 minutes, and the adhesion of the cured product was evaluated according to the following criteria: . ⁇ : No peeling ⁇ : Partial peeling ⁇ : All peeling
- Electromagnetic shield case 12 Substrate 13 Electronic component 13a Electronic component a 13b Electronic component b 14 Thermally conductive curable resin composition (or cured product)
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
熱伝導性硬化性樹脂組成物の硬化物が電磁波シールドケースと電子部品の両者と接触していることが好ましい。
熱伝導性硬化性樹脂組成物の硬化後の熱伝導率が0.5W/(m・K)以上であることが好ましい。
本発明はまた、本発明の放熱構造体を有する電子機器に関する。
該硬化物のSUS基板に対する180度剥離強度が0.05N/25mm~1.00N/25mmであることを特徴とする電子機器の修理方法に関する。
該硬化物を除去した後、該発熱体および/または該放熱体と、該硬化物と同一または異なる熱伝導性樹脂組成物の硬化物を接合させる工程を含むことが好ましい。
硬化性液状樹脂は、湿気又は加熱によって硬化可能であり、分子内に反応性基を有し硬化性がある液状樹脂が好ましい。
硬化性液状樹脂の具体例としては、硬化性アクリル系樹脂や硬化性メタクリル系樹脂に代表される硬化性ビニル系樹脂、硬化性ポリエチレンオキサイド系樹脂や硬化性ポリプロピレンオキサイド系樹脂に代表される硬化性ポリエーテル系樹脂、硬化性ポリイソブチレン系樹脂に代表される硬化性ポリオレフィン系樹脂、等が挙げられる。
熱伝導性硬化性樹脂組成物に用いられる熱伝導性充填材としては、市販されている一般的な良熱伝導性充填材を用いることが出来る。なかでも、熱伝導率、入手性、絶縁性等の電気特性を付与可能、充填性、毒性等種々の観点から、グラファイト、ダイヤモンド等の炭素化合物;酸化アルミニウム、酸化マグネシウム、酸化ベリリウム、酸化チタン、酸化ジルコニウム、酸化亜鉛等の金属酸化物;窒化ホウ素、窒化アルミニウム、窒化ケイ素等の金属窒化物;炭化ホウ素、炭化アルミニウム、炭化ケイ素等の金属炭化物;水酸化アルミニウム、水酸化マグネシウム等の金属水酸化物;炭酸マグネシウム、炭酸カルシウム等の金属炭酸塩;結晶性シリカ:アクリロニトリル系ポリマー焼成物、フラン樹脂焼成物、クレゾール樹脂焼成物、ポリ塩化ビニル焼成物、砂糖の焼成物、木炭の焼成物等の有機性ポリマー焼成物;Znフェライトとの複合フェライト;Fe-Al-Si系三元合金;カルボニル鉄;鉄ニッケル合金;金属粉末等が好ましく挙げられる。
充填材容積率(容量%)=(充填材重量比率/充填材比重)÷[(樹脂分重量比率/樹脂分比重)+(充填材重量比率/充填材比重)]×100
ここで、樹脂分とは、熱伝導性充填材を除いた全成分を指す。
熱伝導性硬化性樹脂組成物は、硬化性液状樹脂(I)と熱伝導性充填材(II)とを含有し、湿気または加熱によって硬化可能である。上記2成分の他に必要に応じて、硬化性液状樹脂を硬化させるための硬化触媒、熱老化防止剤、可塑剤、増量剤、チクソ性付与剤、貯蔵安定剤、脱水剤、カップリング剤、紫外線吸収剤、難燃剤、電磁波吸収剤、充填剤、溶剤、等が添加されていても良い。
熱伝導性硬化性樹脂組成物は、23℃における硬化前の粘度が30Pa・s以上であり、流動性を有するが比較的高粘度である。硬化前の粘度が30Pa・s未満であると、粘度が低いために塗布箇所から硬化物が流失する等の理由で、塗布時の作業性が低下してしまう。硬化前の粘度は好ましくは40Pa・s以上、より好ましくは50Pa・s以上である。硬化前の粘度の上限値は、3000Pa・s以下であり、好ましくは2000Pa・s以下である。3000Pa・sを超えると、塗布や注入が困難となったり、塗布時に空気を巻き込んでしまい熱伝導性を低下させる一因となったりする場合がある。硬化前の粘度は、23℃雰囲気下でBH型粘度計を用いて2rpmの条件で測定した値を用いる。
熱伝導性硬化性樹脂組成物は、熱伝導率が0.5W/(m・K)以上である。熱伝導性硬化性樹脂組成物は、熱を効率的に外部に伝える必要があることから、熱伝導率が高いことが求められる。熱伝導率は、好ましくは0.7W/(m・K)以上、より好ましくは0.8W/(m・K)以上、さらに好ましくは0.9W/(m・K)以上である。このような高熱伝導性樹脂を用いることにより、電子部品が空気と接している場合と比較して、電子部品の熱を効率よく電磁波シールドケースや基板に逃がすことが可能となる。
熱伝導性硬化性樹脂組成物の硬化後の熱伝導率は0.5W/(m・K)以上であることが好ましい。熱を効率的に外部に伝える必要があることから、硬化物の熱伝導率が、0.7W/(m・K)以上であることがより好ましく、0.8W/(m・K)以上であることがさらに好ましく、0.9W/(m・K)以上であることが特に好ましい。このような高熱伝導性樹脂を用いることにより、電子部品が空気と接している場合と比較して、電子部品の熱を効率よく電磁波シールドケースや基板に逃がすことが可能となる。
熱伝導性樹脂組成物の硬化物の硬度は、高温時の熱膨張や歪みを吸収できるように低いことが好ましい。材料間の線膨張率差による剥離やクラックを防ぐため、硬度はアスカーC型硬度計で10以上99以下であることが好ましく、10以上95以下であることがより好ましく、20以上90以下であることがさらに好ましい。
本発明において、熱伝導性樹脂組成物の硬化物は、SUS304板に対する180度剥離強度(剥離速度300mm/min)が0.05N/25mm以上であることが好ましく、0.075N/25mm以上であることがより好ましく、0.10N/25mm以上であることが特に好ましい。また、1.00N/25mm以下であることが好ましく、0.75N/25mm以下であることがより好ましく、0.50N/25mm以下であることが特に好ましい。硬化物の剥離強度が0.05N/25mm未満の場合、電子部品や電磁波シールドケースとの密着力が悪く、接触熱抵抗が高くなって放熱性が低下するおそれがある。また、剥離強度が1.00N/25mmを超えると、特に凸凹状の電子部品や電磁波シールドケースから容易に剥離することができず、作業性が低下する傾向がある。
1.長さ150mm、幅20mm、厚さ25μmのPETフィルムに熱伝導性硬化性樹脂組成物を200μm塗布し、SUS304板に2kgローラー1往復により貼り合わせる。
2.23℃50%RH条件下で1日養生する。
3.万能引張試験機を用い、剥離角度180度、引張速度300mm/minで剥離試験を行う。
硬化物が界面剥離可能であることは、剥離性試験により判断することができる。より具体的には、例えば熱伝導性硬化性樹脂組成物をメモリー基板(MV-DN333-A512M、バッファロー社製)上に5g塗布し、23℃50%RH条件下で1日養生した後、5分間の剥離作業を行ったときの硬化物の残留状況が、○(硬化物の残留なし)の場合や△(一部、硬化物の残留あり)の場合、硬化物が界面剥離可能であると判断する。
本発明の放熱構造体の一形態を図1に示す。電子部品13a及び電子部品13bが基板12上に固定され、電子部品13a、13bを覆う電磁波シールドケース11が基板12に設置され、電磁波シールドケース内11の硬化物14は、熱伝導性硬化性組成物を充填後硬化させたものである。
本発明で用いられる電子部品の発熱密度は、0.2W/cm2~500W/cm2である。発熱密度が0.2W/cm2以上の電子部品は、駆動時に高温まで発熱し、部品の性能低下が発生し易い傾向にある。電子部品は、電子機器・精密機器駆動時に発熱する部材であれば特に限定されない。電子部品の発熱密度は、0.3W/cm2以上であることが好ましく、0.5W/cm2以上であることがより好ましい。また、300W/cm2以下であることが好ましく、100W/cm2以下であることがより好ましい。尚、発熱密度とは、単位時間に単位面積から放出される熱エネルギーのことを言う。
電磁波シールドケースの材料は、電磁波を反射、伝導、又は吸収することにより電磁波シールド性能を発揮する材料であれば特に限定されるものでない。例えば、金属材料やプラスチック材料、各種磁性材料、炭素材料などを用いることができる。中でも、電磁波シールド性能(導電性・透磁率が高い)、材料強度、加工性、価格の観点から金属材料を好適に用いることができる。
また、金属元素とともに非金属元素を含む各種金属系化合物としては、前記に例示の金属元素や合金を含む電磁波シールド性能を発揮できる金属系化合物であれば特に制限されず、例えば、硫化銅等の金属硫化物;酸化鉄、酸化チタン、酸化スズ、酸化インジウム、酸化カドミウムスズ等の金属酸化物や金属複合酸化物などが挙げられる。
上記金属材料の中でも、金、銀、アルミニウム、鉄、銅、ニッケル、ステンレス、銅-ベリリウム合金(ベリリウム銅)、マグネシウム合金、鉄-ニッケル合金、パーマロイ、及び、銅-ニッケル合金が好ましく、アルミニウム、鉄、銅、ステンレス、銅-ベリリウム合金(ベリリウム銅)、マグネシウム合金、及び、鉄-ニッケル合金が特に好ましい。
磁性材料としては、例えば、軟磁性粉、各種フェライト、酸化亜鉛ウイスカーなどが挙げられる。磁性材料としては、フェロ磁性やフェリ磁性を示す強磁性体が好適である。具体的には、例えば、高透磁率フェライト、純鉄、ケイ素原子含有鉄、ニッケル-鉄系合金、鉄-コバルト系合金、アモルファス金属高透磁率材料、鉄-アルミニウム-ケイ素合金、鉄-アルミニウム-ケイ素-ニッケル合金、鉄-クロム-コバルト合金などが挙げられる。
さらに、グラファイト等の炭素材料が挙げられる。
一般に、電磁波シールドケースは、図1のように基板上のグランド層に設置され、電磁波発生源となる電子部品を包囲している。一般的に電磁波シールドケースと基板上のグランド層は、半田または導電性材料等で接合されている。
電磁波シールドケース内に熱伝導性硬化性樹脂組成物を充填する方法としては、一般的な液状樹脂塗布・注入方法を用いることができる。例えば、スピンコート法、ロールコート法、ディッピング法、スプレー法等の公知の塗布方法を挙げることができる。また、熱伝導性硬化性樹脂組成物を充填したカートリッジやチューブ、シリンジ等の容器からディスペンサーを用いて塗布・注入し、電磁波シールドケース内を充填することができる。また、ディスペンサーを用いずにカートリッジやチューブ、シリンジ等の容器から直接塗布・注入することもできる。
硬化物の形状は特に限定されず、シート状、テープ状、短冊状、円盤状、円環状、ブロック状、不定形が例示される。
本発明の携帯情報端末及び電子機器は、本発明の放熱構造体を有する。
携帯情報端末・電子機器としては、電磁波シールドケースに覆われ、基板上に実装された電子部品を内部に有する機器であれば特に限定されるものではない。携帯情報端末(Personal Digital Assistant:PDA)としては、例えば、電子手帳、PHS、携帯電話、スマートフォン、スマートブック、タブレット端末、デジタルメディアプレイヤー、デジタルオーディオプレイヤー等が挙げられる。電子機器としては、例えば、スーパーコンピュータ、メインフレーム、サーバー、ミニコンピュータ、ワークステーション、パーソナルコンピュータ、ポータブル、プラグ、ゲーム機、スマートテレビ、ラップトップ、ノートパソコン(CULV、タブレットPC、ネットブック、Ultra-Mobile PC、スマートブック、Ultrabook)、ポケットコンピュータ、携帯型ゲーム機、電子辞書、電子ブックリーダー、ポータブルデータターミナル、ヘッドマウントディスプレイ等の機器、液晶ディスプレイ、プラズマディスプレイ、表面伝導型電子放出素子ディスプレイ(SED)、LED、有機EL、無機EL、液晶プロジェクタ、時計等の表示機器、インクジェットプリンタ(インクヘッド)、電子写真装置(現像装置、定着装置、ヒートローラ、ヒートベルト)等の画像形成装置、半導体素子、半導体パッケージ、半導体封止ケース、半導体ダイボンディング、CPU、メモリ、パワートランジスタ、パワートランジスタケース等の半導体関連部品、リジッド配線板、フレキシブル配線板、セラミック配線板、ビルドアップ配線板、多層基板等の配線基板(以上左記の配線板とは、プリント配線板なども含む)、真空処理装置、半導体製造装置、表示機器製造装置等の製造装置、断熱材、真空断熱材、輻射断熱材等の断熱装置、DVD(光ピックアップ、レーザー発生装置、レーザー受光装置)、ハードディスクドライブ等のデータ記録機器、カメラ、ビデオカメラ、デジタルカメラ、デジタルビデオカメラ、顕微鏡、CCD等の画像記録装置、充電装置、リチウムイオン電池、燃料電池、太陽電池等のバッテリー機器等が挙げられる。
本発明に係る電子機器の修理方法は、発熱体および/または放熱体と、硬化性液状樹脂(I)と熱伝導性充填材(II)とを含有し、23℃での粘度が30Pa・s~3000Pa・sであり、湿気または加熱によって硬化可能な熱伝導率0.5W/(m・K)以上の熱伝導性硬化性樹脂組成物の硬化物との接合体から該硬化物を除去する工程を含む電子機器の修理方法であって、該硬化物のSUS基板に対する180度剥離強度が0.05N/25mm~1.00N/25mmであることを特徴とする。
該硬化物を除去した後、該発熱体および/または該放熱体と、該硬化物と同一または異なる熱伝導性樹脂組成物の硬化物を接合させる工程を含んでもよい。
放熱体の形状は特に限定されない。ケースとカバーのように2つ以上に分離できる形状の場合は、カバーのみを外せばケース部分を設置したまま熱伝導性樹脂を除去することができるので好ましい。また、放熱体が一体物の場合、放熱体を基板からはずした後、熱伝導性樹脂を除去すればよい。
本発明によれば、熱伝導性樹脂のSUS基板に対する180度剥離強度が一定の範囲内にあるので、接合体から容易に剥離することができ、電子機器の簡便な修理が可能である。
窒素雰囲気下、250L反応機にCuBr(1.09kg)、アセトニトリル(11.4kg)、アクリル酸ブチル(26.0kg)及び2,5-ジブロモアジピン酸ジエチル(2.28kg)を加え、70℃~80℃で30分程度撹拌した。これにペンタメチルジエチレントリアミンを加え、反応を開始した。反応開始30分後から2時間かけて、アクリル酸ブチル(104kg)を連続的に追加した。反応途中ペンタメチルジエチレントリアミンを適宜添加し、内温70℃~90℃となるようにした。ここまでで使用したペンタメチルジエチレントリアミン総量は220gであった。反応開始から4時間後、80℃で減圧下、加熱攪拌することにより揮発分を除去した。これにアセトニトリル(45.7kg)、1,7-オクタジエン(14.0kg)及びペンタメチルジエチレントリアミン(439g)を添加して8時間撹拌を続けた。混合物を80℃で減圧下、加熱攪拌して揮発分を除去した。
更にこの濃縮物に吸着剤として珪酸アルミ、ハイドロタルサイト、熱劣化防止剤を加え、減圧下、加熱攪拌した(平均温度約175℃、減圧度10Torr以下)。更に吸着剤として珪酸アルミ、ハイドロタルサイトを追加し、酸化防止剤を加え、酸素窒素混合ガス雰囲気下(酸素濃度6%)、内温150℃で加熱攪拌した。
この濃縮物にトルエンを加え、重合体を溶解させた後、混合液中の固形分をろ過で除去し、ろ液を減圧下加熱攪拌して揮発分を除去し、アルケニル基を有する重合体を得た。
数平均分子量約2,000のポリオキシプロピレンジオールを開始剤とし、亜鉛ヘキサシアノコバルテートグライム錯体触媒にてプロピレンオキシドの重合を行い、数平均分子量25,500(送液システムとして東ソー社製HLC-8120GPCを用い、カラムは東ソー社製TSK-GEL Hタイプを用い、溶媒はTHFを用いて測定したポリスチレン換算値)のポリプロピレンオキシドを得た。続いて、この水酸基末端ポリプロピレンオキシドの水酸基に対して1.2倍当量のNaOMeメタノール溶液を添加してメタノールを留去し、更に塩化アリルを添加して末端の水酸基をアリル基に変換した。未反応の塩化アリルを減圧脱揮により除去した。得られた未精製のアリル基末端ポリプロピレンオキシド100重量部に対し、n-ヘキサン300重量部と、水300重量部を混合攪拌した後、遠心分離により水を除去し、得られたヘキサン溶液に更に水300重量部を混合攪拌し、再度遠心分離により水を除去した後、ヘキサンを減圧脱揮により除去した。以上により、末端がアリル基である数平均分子量約25,500の2官能ポリプロピレンオキシドを得た。
合成例1で得られた樹脂(I-1):90重量部、合成例2で得られた樹脂(I-2):10重量部、可塑剤(モノサイザーW-7010(DIC社製)):100重量部、酸化防止剤(Irganox1010):1重量部、表1記載の熱伝導性充填材を手混ぜで十分攪拌混練した後に、5Lバタフライミキサーを用いて加熱混練しながら真空に引き脱水した。脱水完了後に冷却し、脱水剤(A171):2重量部、硬化触媒(ネオデカン酸スズ、ネオデカン酸):各4重量部と混合し、熱伝導性硬化性樹脂組成物を得た。得られた熱伝導性硬化性樹脂組成物の粘度と熱伝導率を測定した後、図2及び図3に示す簡易モデルに熱伝導性硬化性樹脂組成物を充填し、温度と電磁波シールドケース内からの樹脂流出有無を評価した。また、硬化物の熱伝導率を測定した。結果を表1に示す。
熱伝導性硬化性樹脂組成物を用いずに実施例1と同様に評価を行った。評価結果を表1に示す。
合成例1で得られた樹脂(I-1):90重量部、合成例2で得られた樹脂(I-2):10重量部、可塑剤(モノサイザーW-7010(DIC社製)):100重量部、酸化防止剤(Irganox1010):1重量部、表2記載の熱伝導性充填材を手混ぜで十分攪拌混練した後に、5Lバタフライミキサーを用いて加熱混練しながら真空に引き脱水した。脱水完了後に冷却し、脱水剤(A171):2重量部、硬化触媒(ネオデカン酸スズ、ネオデカン酸):各4重量部と混合し、熱伝導性硬化性樹脂組成物を得た。得られた熱伝導性硬化性樹脂組成物の粘度と熱伝導率を測定した後、簡易モデルに熱伝導性硬化性樹脂組成物を図4または図5のように充填し、温度と電磁波シールドケース内からの樹脂流出有無を評価した。また、硬化物の熱伝導率を測定した。結果を表2に示す。
(熱伝導性硬化性樹脂組成物の粘度)
23℃50%RH条件下でBH型粘度計を用いて2rpmにて熱伝導性硬化性樹脂組成物の粘度を測定した。
熱伝導性硬化性樹脂組成物をサランラップ(登録商標)内に包み、ホットディスク法熱伝導率測定装置TPA-501(京都電子工業(株)製)を用い、4φサイズのセンサーを2個の試料で挟む方法にて、熱伝導率を測定した。
熱伝導性硬化性樹脂組成物を23℃50%RH条件下で1日養生し、厚み3mm、直径20mmの円盤状サンプルを2枚得た。ホットディスク法熱伝導率測定装置TPA-501(京都電子工業(株)製)を用い、4φサイズのセンサーを2枚の試料で挟む方法にて、硬化物の熱伝導率を測定した。
図2及び図3に示す簡易モデルを作製し、電子部品、基板、電磁波シールドケースの各モデルの温度をテフロン(登録商標)被覆極細熱電対ダブル線TT-D-40-SLE(オメガエンジニアリング社製)を用いて測定した。尚、温度は電子部品モデルを1時間発熱させた後の値である。
なお、図2~図5に示す簡易モデルの材質と寸法はすべて同じであり、以下のとおりである。
11:電磁波シールドケース・・・SUS(0.3mm厚み)製、20mm×20mm×1.40mm
12:基板・・・ガラスエポキシ製、60mm×60mm×0.75mm
13:電子部品・・・アルミナ発熱体(発熱量1W、発熱密度1W/cm2)、10mm×10mm×1.05mm
14:熱伝導性硬化性樹脂組成物(又は硬化物)
○印:熱電対取付位置
熱伝導性硬化性樹脂組成物を電磁波シールドケースに充填後、系外への流出有無を目視で評価した。
合成例1で得られた樹脂(I-1):100重量部、可塑剤(DIDP(ジェイプラス社製)):100重量部、酸化防止剤(Irganox1010(チバ・ジャパン社製)):1重量部、熱伝導性充填材(AS-40(アルミナ、昭和電工社製)/酸化亜鉛(堺化学工業社製)):1070/500重量部を手混ぜで十分攪拌混練した後に、5Lバタフライミキサーを用いて加熱混練しながら真空に引き脱水した。脱水完了後に冷却し、脱水剤(A171(東レダウコーニングシリコーン社製)):4重量部、硬化触媒(ネオデカン酸スズU-50H(日東化成工業社製)):4重量部と混合し、熱伝導性硬化性樹脂組成物を得た。評価結果を表3に示す。
合成例1で得られた樹脂(I-1):100重量部、可塑剤(DIDP):100重量部、酸化防止剤(Irganox1010):1重量部、熱伝導性充填材(BF-083(水酸化アルミナ、日本軽金属社製)/酸化亜鉛:500/450重量部を手混ぜで十分攪拌混練した後に、5Lバタフライミキサーを用いて加熱混練しながら真空に引き脱水した。脱水完了後に冷却し、脱水剤(A171)):4重量部、硬化触媒(ネオデカン酸スズU-50H):4重量部と混合し、熱伝導性硬化性樹脂組成物を得た。評価結果を表3に示す。
合成例1で得られた樹脂(I-1):90重量部、合成例2で得られた樹脂(I-2):10重量部、可塑剤(DIDP):95重量部、酸化防止剤(Irganox1010):1重量部、熱伝導性充填材(BF-083(水酸化アルミナ、日本軽金属社製)/酸化亜鉛:440/100重量部を手混ぜで十分攪拌混練した後に、5Lバタフライミキサーを用いて加熱混練しながら真空に引き脱水した。脱水完了後に冷却し、脱水剤(A171):2重量部、硬化触媒(ネオデカン酸スズU-50H):4重量部と混合し、熱伝導性硬化性樹脂組成物を得た。評価結果を表3に示す。
熱伝導性硬化性エラストマー(KE3467、信越化学工業社製)を用いて実施例と同様に評価を行った。評価結果を表3に示す。
熱伝導性硬化性エラストマー(SE4420、東レダウコーニングシリコーン社製)を用いて実施例と同様に評価を行った。評価結果を表3に示す。
(熱伝導性硬化性樹脂組成物の粘度)
23℃50%RH条件下でBS型粘度計を用いて2rpmにて熱伝導性硬化性樹脂組成物の粘度を測定した。
熱伝導性硬化性樹脂組成物を23℃50%RH条件下で1日養生し、厚み3mm、直径20mmの円盤状サンプルを2枚得た。ホットディスク法熱伝導率測定装置TPA-501(京都電子工業(株)製)を用い、4φサイズのセンサーを2枚の試料で挟む方法にて、硬化物の熱伝導率を測定した。
熱伝導性硬化性樹脂組成物を23℃50%RH条件下で1日養生し、20×20×6mmの硬化物を作製し、アスカーC型硬度計で硬度を測定した。
長さ150mm、幅20mm、厚さ25μmのPETフィルムに熱伝導性硬化性樹脂組成物を200μm塗布し、SUS304板に2kgローラー1往復により貼り合わせた。23℃50%RH条件下で1日養生した後、万能引張試験機を用い、剥離角度180度、引張速度300mm/minで剥離試験を行い、剥離強度を測定した。
熱伝導性硬化性樹脂組成物をメモリー基板(MV-DN333-A512M、バッファロー社製)上に5g塗布し、23℃50%RH条件下で1日養生した後、ヒートショック試験機(ES-56L、日立アプライアンス社製)を用いて、-40℃と85℃の温度環境下にそれぞれ30分保持させることを100サイクル繰り返してヒートショック試験を行い、硬化物の密着状況を以下の基準で評価した。
○:はがれ無し
△:一部はがれる
×:全て剥がれる
熱伝導性硬化性樹脂組成物をメモリー基板(MV-DN333-A512M、バッファロー社製)上に5g塗布し、23℃50%RH条件下で1日養生した後、5分間の剥離作業を行ったときの硬化物の残留状況を以下の基準で評価した。
○:硬化物の残留なし
△:一部、硬化物の残留あり
×:硬化物が剥離できず、大部分が残留
12 基板
13 電子部品
13a 電子部品a
13b 電子部品b
14 熱伝導性硬化性樹脂組成物(又は硬化物)
Claims (8)
- 硬化性液状樹脂(I)と熱伝導性充填材(II)とを含有し、23℃での粘度が30Pa・s~3000Pa・sであり、湿気または加熱によって硬化可能な熱伝導率0.5W/(m・K)以上の熱伝導性硬化性樹脂組成物を、発熱密度0.2W/cm2~500W/cm2の電子部品が実装された基板上の電磁波シールドケース内に充填した状態で硬化させて得られることを特徴とする放熱構造体。
- 硬化性液状樹脂(I)が、硬化性アクリル系樹脂および/または硬化性ポリプロピレンオキサイド系樹脂であることを特徴とする請求項1記載の放熱構造体。
- 熱伝導性硬化性樹脂組成物の硬化物が電磁波シールドケースと電子部品の両者と接触していることを特徴とする請求項1または2記載の放熱構造体。
- 熱伝導性硬化性樹脂組成物の硬化後の熱伝導率が0.5W/(m・K)以上であることを特徴とする請求項1~3のいずれか1項記載の放熱構造体。
- 請求項1~4のいずれか1項記載の放熱構造体を有する携帯情報端末。
- 請求項1~4のいずれか1項記載の放熱構造体を有する電子機器。
- 発熱体および/または放熱体と、硬化性液状樹脂(I)と熱伝導性充填材(II)とを含有し、23℃での粘度が30Pa・s~3000Pa・sであり、湿気または加熱によって硬化可能な熱伝導率0.5W/(m・K)以上の熱伝導性硬化性樹脂組成物の硬化物との接合体から該硬化物を除去する工程を含む電子機器の修理方法であって、
該硬化物のSUS基板に対する180度剥離強度が0.05N/25mm~1N/25mmであることを特徴とする電子機器の修理方法。 - 該硬化物を除去した後、該発熱体および/または該放熱体と、該硬化物と同一または異なる熱伝導性樹脂組成物の硬化物を接合させる工程を含む請求項7記載の電子機器の修理方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014521286A JP6268086B2 (ja) | 2012-06-15 | 2013-06-06 | 放熱構造体 |
CN201380031090.4A CN104350814B (zh) | 2012-06-15 | 2013-06-06 | 散热结构体、便携式信息终端、电子设备及电子设备的修理方法 |
EP13804707.1A EP2863725B1 (en) | 2012-06-15 | 2013-06-06 | Heat dissipation structure |
KR20157000677A KR20150023710A (ko) | 2012-06-15 | 2013-06-06 | 방열 구조체 |
US14/407,257 US10356946B2 (en) | 2012-06-15 | 2013-06-06 | Heat dissipation structure |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-135289 | 2012-06-15 | ||
JP2012135289 | 2012-06-15 | ||
JP2012-204951 | 2012-09-18 | ||
JP2012204951 | 2012-09-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013187298A1 true WO2013187298A1 (ja) | 2013-12-19 |
Family
ID=49758123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/065646 WO2013187298A1 (ja) | 2012-06-15 | 2013-06-06 | 放熱構造体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10356946B2 (ja) |
EP (1) | EP2863725B1 (ja) |
JP (1) | JP6268086B2 (ja) |
KR (1) | KR20150023710A (ja) |
CN (1) | CN104350814B (ja) |
TW (1) | TWI613288B (ja) |
WO (1) | WO2013187298A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105555013A (zh) * | 2014-10-23 | 2016-05-04 | 三星电子株式会社 | 制造印刷电路板组件的方法 |
CN105935009A (zh) * | 2014-03-14 | 2016-09-07 | 株式会社钟化 | 电子终端设备及其组装方法 |
US9575523B2 (en) | 2015-01-22 | 2017-02-21 | Microsoft Technology Licensing, Llc | Device sandwich structured composite housing |
WO2017175274A1 (ja) * | 2016-04-04 | 2017-10-12 | 株式会社日立製作所 | 封止構造体及びその製造方法 |
US20200152581A1 (en) * | 2016-12-26 | 2020-05-14 | Dexerials Corporation | Semiconductor device |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10157855B2 (en) * | 2015-06-03 | 2018-12-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor device including electric and magnetic field shielding |
KR101691797B1 (ko) * | 2015-06-03 | 2017-01-02 | 엘지전자 주식회사 | 이동 단말기 |
JP6834489B2 (ja) * | 2015-09-18 | 2021-02-24 | 東レ株式会社 | 電子機器筐体 |
WO2017131709A1 (en) * | 2016-01-28 | 2017-08-03 | Hewlett-Packard Development Company, L.P. | Three-dimensional (3d) printing with a detailing agent fluid and a liquid functional material |
CN105744724B (zh) * | 2016-03-17 | 2018-09-21 | 广东小天才科技有限公司 | 电子器件的散热结构、穿戴式电子设备及其散热方法 |
CN105811891A (zh) * | 2016-04-20 | 2016-07-27 | 佛山臻智微芯科技有限公司 | 减低移动通信多级功率放大器中带内噪声的结构和方法 |
JP6094714B1 (ja) * | 2016-06-30 | 2017-03-15 | 富士ゼロックス株式会社 | 露光装置 画像形成装置 露光装置の製造方法 |
CN107820359A (zh) * | 2016-09-14 | 2018-03-20 | 深圳市掌网科技股份有限公司 | 一种主pcba板 |
CN106572627A (zh) * | 2016-11-15 | 2017-04-19 | 努比亚技术有限公司 | 一种屏蔽罩及电路板 |
WO2018092529A1 (ja) * | 2016-11-16 | 2018-05-24 | 株式会社村田製作所 | 高周波モジュール |
CN106612610B (zh) * | 2016-12-05 | 2019-05-07 | 上海阿莱德实业股份有限公司 | 一种电路的屏蔽结构 |
US11121095B2 (en) * | 2016-12-21 | 2021-09-14 | Mitsubishi Electric Corporation | Semiconductor device having electromagnetic wave absorbing layer with heat dissipating vias |
CN106658948A (zh) * | 2017-01-06 | 2017-05-10 | 安徽鹏展电子科技有限公司 | 一种散热的柔性线路板及其表面涂料 |
JP6662319B2 (ja) * | 2017-02-03 | 2020-03-11 | オムロン株式会社 | 異常検出装置 |
KR20190051205A (ko) * | 2017-11-06 | 2019-05-15 | 주식회사 루멘스 | 엘이디 패키지 |
DE102018102989B4 (de) | 2018-02-09 | 2020-08-13 | Polytec Pt Gmbh | Akkumulator-Anordnung mit einem thermischen Kontakt- und Füllmaterial |
US20190357386A1 (en) * | 2018-05-16 | 2019-11-21 | GM Global Technology Operations LLC | Vascular polymeric assembly |
JP7265321B2 (ja) * | 2018-06-21 | 2023-04-26 | デクセリアルズ株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2020004840A (ja) * | 2018-06-28 | 2020-01-09 | アルパイン株式会社 | 電子ユニットおよびその製造方法 |
US10672703B2 (en) * | 2018-09-26 | 2020-06-02 | Nxp Usa, Inc. | Transistor with shield structure, packaged device, and method of fabrication |
EP3667873B1 (de) * | 2018-12-10 | 2022-03-23 | Wilo Se | Pumpenelektronik |
KR102304963B1 (ko) * | 2019-10-18 | 2021-09-27 | 엔트리움 주식회사 | 반도체 패키지 |
CN113133233A (zh) * | 2020-01-15 | 2021-07-16 | 浙江盘毂动力科技有限公司 | 一种绝缘导热灌封电气元件及其灌封方法 |
CN112497595A (zh) * | 2020-11-12 | 2021-03-16 | 西安紫光国芯半导体有限公司 | 一种柔性散热外壳的制备方法及其应用 |
TWI765791B (zh) * | 2021-07-30 | 2022-05-21 | 華碩電腦股份有限公司 | 印刷電路板與具有該印刷電路板之電子裝置 |
TWI813019B (zh) * | 2021-09-14 | 2023-08-21 | 南亞塑膠工業股份有限公司 | 樹脂材料及金屬基板 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0567893A (ja) | 1991-09-10 | 1993-03-19 | Mitsubishi Electric Corp | 回路基板の局部シールド方法 |
JP2001251088A (ja) | 2000-03-08 | 2001-09-14 | Kitagawa Ind Co Ltd | 電磁波シールド構造及び電磁波シールド方法 |
JP2003015839A (ja) | 2001-06-29 | 2003-01-17 | Minolta Co Ltd | データ受信装置、印刷システム、データ受信方法及びデータ受信プログラム |
JP2003027025A (ja) | 2001-07-17 | 2003-01-29 | Cemedine Co Ltd | 高密着性易剥離組成物及び易剥離装置 |
JP2006096986A (ja) | 2004-08-30 | 2006-04-13 | Dow Corning Toray Co Ltd | 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物 |
JP2010053331A (ja) | 2008-07-29 | 2010-03-11 | Kaneka Corp | 熱伝導材料 |
JP2010171030A (ja) * | 2008-12-22 | 2010-08-05 | Kaneka Corp | 放熱構造体 |
JP2010171129A (ja) * | 2009-01-21 | 2010-08-05 | Kaneka Corp | 放熱構造体 |
JP2011044448A (ja) * | 2009-08-19 | 2011-03-03 | Kaneka Corp | 放熱構造体 |
JP2011187899A (ja) * | 2010-03-11 | 2011-09-22 | Kaneka Corp | 放熱構造体 |
JP2011236365A (ja) | 2010-05-12 | 2011-11-24 | Jsr Corp | 熱可塑性エラストマー組成物及び熱伝導性シート |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07249715A (ja) | 1994-03-14 | 1995-09-26 | Fujitsu Ltd | 半導体装置 |
AU2103895A (en) * | 1994-04-05 | 1995-10-23 | Olin Corporation | Cavity filled metal electronic package |
JP2000332169A (ja) | 1999-05-17 | 2000-11-30 | Toshiba Corp | 発熱体の放熱構造及びこれを有する電子機器 |
JP4146286B2 (ja) * | 2003-05-30 | 2008-09-10 | 株式会社ケーヒン | 電子回路基板の収容ケース |
JP4029822B2 (ja) * | 2003-10-27 | 2008-01-09 | 三菱電機株式会社 | 電子回路装置 |
WO2009131913A2 (en) * | 2008-04-21 | 2009-10-29 | Honeywell International Inc. | Thermal interconnect and interface materials, methods of production and uses thereof |
CN102604559A (zh) * | 2008-04-30 | 2012-07-25 | 日立化成工业株式会社 | 连接材料和半导体装置 |
JP5558182B2 (ja) * | 2009-05-27 | 2014-07-23 | 山洋電気株式会社 | 電気装置の放熱構造 |
CN102598252B (zh) * | 2010-06-15 | 2014-12-31 | 松下电器产业株式会社 | 安装结构体及其制造方法和安装结构体的修理方法 |
JP2012102301A (ja) * | 2010-11-13 | 2012-05-31 | Nitto Denko Corp | 気泡含有熱伝導性樹脂組成物層およびその製造方法、それを用いた感圧性接着テープ又はシート |
-
2013
- 2013-06-06 US US14/407,257 patent/US10356946B2/en active Active
- 2013-06-06 KR KR20157000677A patent/KR20150023710A/ko not_active Application Discontinuation
- 2013-06-06 CN CN201380031090.4A patent/CN104350814B/zh active Active
- 2013-06-06 WO PCT/JP2013/065646 patent/WO2013187298A1/ja active Application Filing
- 2013-06-06 EP EP13804707.1A patent/EP2863725B1/en active Active
- 2013-06-06 JP JP2014521286A patent/JP6268086B2/ja active Active
- 2013-06-14 TW TW102121234A patent/TWI613288B/zh active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0567893A (ja) | 1991-09-10 | 1993-03-19 | Mitsubishi Electric Corp | 回路基板の局部シールド方法 |
JP2001251088A (ja) | 2000-03-08 | 2001-09-14 | Kitagawa Ind Co Ltd | 電磁波シールド構造及び電磁波シールド方法 |
JP2003015839A (ja) | 2001-06-29 | 2003-01-17 | Minolta Co Ltd | データ受信装置、印刷システム、データ受信方法及びデータ受信プログラム |
JP2003027025A (ja) | 2001-07-17 | 2003-01-29 | Cemedine Co Ltd | 高密着性易剥離組成物及び易剥離装置 |
JP2006096986A (ja) | 2004-08-30 | 2006-04-13 | Dow Corning Toray Co Ltd | 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物 |
JP2010053331A (ja) | 2008-07-29 | 2010-03-11 | Kaneka Corp | 熱伝導材料 |
JP2010171030A (ja) * | 2008-12-22 | 2010-08-05 | Kaneka Corp | 放熱構造体 |
JP2010171129A (ja) * | 2009-01-21 | 2010-08-05 | Kaneka Corp | 放熱構造体 |
JP2011044448A (ja) * | 2009-08-19 | 2011-03-03 | Kaneka Corp | 放熱構造体 |
JP2011187899A (ja) * | 2010-03-11 | 2011-09-22 | Kaneka Corp | 放熱構造体 |
JP2011236365A (ja) | 2010-05-12 | 2011-11-24 | Jsr Corp | 熱可塑性エラストマー組成物及び熱伝導性シート |
Non-Patent Citations (1)
Title |
---|
See also references of EP2863725A4 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105935009A (zh) * | 2014-03-14 | 2016-09-07 | 株式会社钟化 | 电子终端设备及其组装方法 |
JPWO2015137257A1 (ja) * | 2014-03-14 | 2017-04-06 | 株式会社カネカ | 電子端末機器及びその組立方法 |
EP3119172A4 (en) * | 2014-03-14 | 2017-11-15 | Kaneka Corporation | Electronic terminal device and method for assembling same |
US10426041B2 (en) | 2014-10-23 | 2019-09-24 | Samsung Electronics Co., Ltd | Method of manufacturing printed-circuit board assembly |
CN105555013B (zh) * | 2014-10-23 | 2020-09-08 | 三星电子株式会社 | 制造印刷电路板组件的方法 |
CN105555013A (zh) * | 2014-10-23 | 2016-05-04 | 三星电子株式会社 | 制造印刷电路板组件的方法 |
US9575523B2 (en) | 2015-01-22 | 2017-02-21 | Microsoft Technology Licensing, Llc | Device sandwich structured composite housing |
US10162395B2 (en) | 2015-01-22 | 2018-12-25 | Microsoft Technology Licensing, Llc | Device sandwich structured composite housing |
JPWO2017175274A1 (ja) * | 2016-04-04 | 2018-11-08 | 株式会社日立製作所 | 封止構造体及びその製造方法 |
WO2017175274A1 (ja) * | 2016-04-04 | 2017-10-12 | 株式会社日立製作所 | 封止構造体及びその製造方法 |
US11244877B2 (en) | 2016-04-04 | 2022-02-08 | Hitachi, Ltd. | Sealing structure and manufacturing method thereof |
US20200152581A1 (en) * | 2016-12-26 | 2020-05-14 | Dexerials Corporation | Semiconductor device |
US11043461B2 (en) * | 2016-12-26 | 2021-06-22 | Dexerials Corporation | Semiconductor device having an electromagnetic wave absorbing thermal conductive sheet between a semiconductor element and a cooling member |
Also Published As
Publication number | Publication date |
---|---|
EP2863725A4 (en) | 2016-08-03 |
CN104350814B (zh) | 2017-10-13 |
TWI613288B (zh) | 2018-02-01 |
TW201410859A (zh) | 2014-03-16 |
JP6268086B2 (ja) | 2018-01-24 |
JPWO2013187298A1 (ja) | 2016-02-04 |
KR20150023710A (ko) | 2015-03-05 |
EP2863725B1 (en) | 2021-04-28 |
CN104350814A (zh) | 2015-02-11 |
US20150163958A1 (en) | 2015-06-11 |
EP2863725A1 (en) | 2015-04-22 |
US10356946B2 (en) | 2019-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6268086B2 (ja) | 放熱構造体 | |
WO2014080931A1 (ja) | 放熱構造体 | |
JP6251739B2 (ja) | 放熱構造体 | |
WO2015137257A1 (ja) | 電子端末機器及びその組立方法 | |
TWI752997B (zh) | 晶粒黏著膏及半導體裝置 | |
JP5390202B2 (ja) | 放熱構造体 | |
CN1373170A (zh) | 粘合剂及电气装置 | |
JPWO2015005220A1 (ja) | 導電性硬化物の製造方法及び導電性硬化物並びにパルス光硬化性組成物の硬化方法及びパルス光硬化性組成物 | |
JP2015019085A (ja) | 放熱構造体 | |
JP2010251377A (ja) | 電磁波吸収シート及びその製造方法 | |
JP2018021163A (ja) | 放熱用樹脂組成物、その硬化物、及びこれらの使用方法 | |
JP2018048276A (ja) | アンダーフィル材及びそれを用いた電子部品装置 | |
JP5390296B2 (ja) | 放熱構造体 | |
JP5917993B2 (ja) | 熱伝導性樹脂を含む接合体 | |
JP2009203261A (ja) | 熱伝導性材料及びこれを用いた放熱基板とその製造方法 | |
JP2010251378A (ja) | 電磁波吸収シートの製造方法 | |
JP2017084995A (ja) | 高電圧保護部材形成用樹脂組成物 | |
JP2014001254A (ja) | 熱伝導性材料 | |
JP2011222579A (ja) | 放熱構造体 | |
JP7142453B2 (ja) | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13804707 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2014521286 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14407257 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20157000677 Country of ref document: KR Kind code of ref document: A |