CN102598252B - 安装结构体及其制造方法和安装结构体的修理方法 - Google Patents

安装结构体及其制造方法和安装结构体的修理方法 Download PDF

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Publication number
CN102598252B
CN102598252B CN201180004357.1A CN201180004357A CN102598252B CN 102598252 B CN102598252 B CN 102598252B CN 201180004357 A CN201180004357 A CN 201180004357A CN 102598252 B CN102598252 B CN 102598252B
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resin
components
electronic devices
application
scaling powder
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CN102598252A (zh
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小和田弘枝
山口敦史
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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Abstract

本发明提供一种在电路基板1上以接合金属3安装电子元器件2的安装结构体，助焊剂4含有拥有羟基的化合物且残余在接合金属3的表面，涂敷树脂5含有10％～50％重量的异氰酸酯，涂敷树脂5与助焊剂4的反应物8形成在助焊剂4和涂敷树脂5的界面。即使不洗涤助焊剂4也能得到防水、防潮性能。通过使其到达助焊剂4的玻璃化转变温度以上的温度从而能容易地剥离涂敷树脂5。

Description

安装结构体及其制造方法和安装结构体的修理方法
技术领域
本发明涉及对安装于基底等的电子元器件以树脂组合物进行涂敷，提高了防水和防潮性能的安装结构体。
背景技术
为了提高电子元器件的可靠性，为了消除环境中的水分和尘埃等对电子元器件的影响的目的，还为了保护电子元器件不受到振动和冲击的影响的目的，对电子元器件及搭载该电子元器件的电路基板以树脂进行涂敷。
作为这种涂敷用树脂，需要其具有良好的耐热性、绝缘性、挠性、耐摩擦性、粘附性，单独或者结合使用丙烯酸树脂、聚氨酯树脂、聚烯烃树脂、硅树脂等。将上述树脂以溶液状均匀地涂布，在包含溶剂的情况下等挥发之后在接合结构物上固化，来获得所需要的涂敷树脂。
近年来，对于在汽车的特别是引擎室附近的电子控制部分所搭载的电路基板，要求能够耐150℃左右的高温，为了确保电路基板的防水性，因耐热性、气体阻隔性等使用环氧类树脂、聚氨酯类树脂、硅类树脂等树脂，特别考虑到成本而关注聚氨酯树脂。
作为以往的聚氨酯树脂，使用聚酯多元醇或聚丁二烯等作为主剂以在湿热环境下防止迁移(例如参照专利文献1)。
现有技术文献
专利文献
专利文献1：日本专利公开2009-67818号公报
发明内容
发明所要解决的技术问题
然而，在作为基底的电路基板上涂敷聚氨酯树脂时，若为了确保电子元器件的焊接性而使用的助焊剂残留在电路基板上，则因该助焊剂所包含的活性剂组分的胺或有机酸等会妨碍树脂的固化，会降低树脂的膜的固化度而无法体现膜强度。
另外，电路基板暴露在150℃左右的高温下的使用环境中，电路基板上残留的助焊剂中会产生裂痕，由于其会影响到涂敷膜，因此会导致涂敷树脂剥离。
因此，现在的情况是，在防水、防湿涂敷的情况下，用水和包含了热水、醇类溶剂、界面活性剂等的助焊剂洗涤剂来洗涤残留在电路基板上的助焊剂。
另外，在对制造工序中或在市场上出现的电子元器件的次品进行修理时，需要从电路基板上剥下涂敷树脂，但是无法容易地剥离粘附性大的聚氨酯树脂，存在需要简化工作，提高生产性的问题。
发明内容
本发明的目的在于，提供一种电子元器件能获得良好的防水、防湿性能，且电子元器件易于修理的安装结构体。
解决技术问题所采用的技术方案
本发明的安装结构体是在电路基板上以接合金属安装电子元器件的安装结构体，其特征在于，具有：含有10％～50％重量的异氰酸酯的涂敷树脂，该涂敷树脂覆盖所述电路基板、所述电子元器件、及所述接合金属；含有拥有羟基的化合物的助焊剂，该助焊剂残余在所述接合金属的表面；以及所述涂敷树脂与所述助焊剂的反应物，该反应物形成在所述助焊剂和所述涂敷树脂的界面。
另外，本发明的安装结构体的制造方法的特征在于，在电路基板上使用助焊剂并以接合金属安装电子元器件，利用含有10％～50％重量的异氰酸酯的涂敷树脂来覆盖所述电路基板、所述电子元器件、及所述接合金属，在所述涂敷树脂和含有拥有羟基的化合物的所述助焊剂的界面生成反应物。
另外，本发明的安装结构体的修理方法的特征在于，该安装结构体在电路基板上以接合金属安装电子元器件，以含有10％～50％重量的异氰酸酯的涂敷树脂来覆盖所述电路基板、所述电子元器件、及所述接合金属，在所述涂敷树脂和含有拥有羟基的化合物且残余在所述接合金属的表面上的助焊剂的界面形成有所述涂敷树脂与所述助焊剂的反应物，在交换该安装结构体的所述电子元器件时，使所述反应物到达所述助焊剂的玻璃化转变温度以上的温度以进行软化，剥离所述电子元器件周围的所述涂敷树脂，从所述电路基板上拆下所述电子元器件以进行交换。
发明效果
根据该结构，在电路基板和电路基板上的电子元器件及其接合部上涂布将主剂和固化剂混合后的涂敷用树脂。在刚涂布之后，涂敷用树脂中的主剂多元醇与固化剂的异氰酸酯不会立即完成反应，在末端还包含了未反应的异氰酸酯基。由于异氰酸酯基与焊料助焊剂中的羟基发生反应，以吸收了助焊剂的组分的状态完成固化，因而无需对助焊剂进行洗涤，因此可减少工作量，可提高生产性，降低成本。
还有，在电路基板上的电子元器件发生缺陷的情况下，通过将所述电子元器件及其周围升温到助焊剂的玻璃化点以上的温度，随着助焊剂组分的软化，与所述电子元器件的周围或所述电子元器件的侧面的所述助焊剂接触的地方的所述涂敷树脂的硬度下降，因此可以无损伤地容易地剥离周围的电子元器件，能减少修理中的工作量。
附图说明
图1是本发明的实施方式1的安装结构体的放大剖视图。
图2是同一实施方式的制造工序图。
图3是同一实施方式的安装结构体的涂敷剥离的说明图。
图4是本发明的实施方式2的安装结构体的放大剖视图。
具体实施方式
以下基于具体实施方式对本发明的安装结构体的制造方法及修理方法进行说明。
(实施方式1)
图1示出实施方式1的安装结构体。
在该安装结构体中，通过作为接合金属的焊料3将电子元器件2安装于电路基板1的布线图案1a。还有，通过利用所涂布的涂敷树脂5来覆盖电路基板1、电子元器件2、及焊料3，从而实现防水、防潮性能的目的。附着于焊料3的表面的助焊剂4是为了将电子元器件2良好地焊接到布线图案1a而使用后的残余物。
还有，在助焊剂4和涂敷树脂5的界面形成助焊剂4与涂敷树脂5的反应物8。此外，在该实施方式1中，不只在电子元器件的侧面，在电子元器件2的上表面也形成反应物8。
作为电子元器件2，在其为具有芯片级封装(CSP：Chip size package)或球栅阵列(BGA：Ball grid array)封装的半导体元器件的情况下是有用的。较多的情况下这些半导体元器件在一个基底上安装多个。另外，这些半导体元器件价格也很高。因此，需要能够容易地进行修理操作。另外，需要在这些电子元器件通电时防止由水引起的短路。
此外，对电路基板1的种类没有特别的限定，例如使用由玻璃纤维和耐热性树脂构成的基底等。通常使用在浸渍了环氧树脂等的玻璃布上印刷铜箔的布线的电路基板。
该安装结构体可通过图2的工序制造。
在图2(a)中，以分配器等对电子元器件2的安装位置的布线图案1a提供焊糊6。焊糊6是将焊料3的粒子混入助焊剂4而制成的。
然后，在焊糊6上放置电子元器件2并通过回流炉，如图2(b)所示，通过焊糊6中的焊料3，电子元器件2以焊料3接合于布线图案1a，其表面附着有助焊剂4。另外，在电子元器件2的上表面2a也通过表面张力的作用扩散并附着有一部分熔融助焊剂。
在焊料3的表面的利用涂敷树脂5进行的一般的涂敷处理时，附着在焊料3的表面和电子元器件2的上表面2a的残余的助焊剂4通过洗涤工序完全去除后，再实行涂敷树脂5的涂布工序，但是在该实施方式1中，如图2(c)所示，实施在助焊剂4上涂布涂敷树脂5来覆盖电路基板1、电子元器件2、及焊料3的工序，从而无需进行以往的助焊剂洗涤工序。
对于不进行助焊剂洗涤工序也可起到实现防水、防潮性能的目的的作用的所述反应物8，使用以下组分，作为助焊剂4和涂敷树脂5。
涂敷树脂5包含主剂和固化剂。
涂敷树脂5的固化剂的树脂，优选为通过加热而固化的类型，也可以是通过空气中的湿气而固化的类型。固化剂的树脂的固化温度虽然没有特别的限制，但从避免对电路基板上的焊料3的不良影响的观点出发，希望固化性树脂可在比150℃低的温度下进行固化。也就是说，在使树脂组合物固化时，希望将150℃以下的温度选择作为固化温度。
在涂敷树脂5的主剂中，作为多元醇组分，可使用有2个以上羟基的聚丁二烯或聚异戊二烯，也可使用在它们的双键部分添加了氢的聚烯烃。使用这种多元醇的话，所得到的聚氨酯成为良好的弹性体(橡胶弹性体)，紧贴在电路基板或电气元器件、电子元器件上保持耐热性的同时还能发挥良好的绝缘性。有2个以上羟基的上述多元醇的分子量(数均)优选为700～8000的范围，更优选为1000～5000的范围，最优选为1500～4000的范围。
然后，在涂敷树脂5的固化剂中，作为拥有异氰酸酯基的化合物，可用甲苯-2，4-二异氰酸酯(TDI)、二苯基甲烷二异氰酸酯(MDI)、苯二亚甲基二异氰酸酯(XDI)等芳香族系异氰酸酯、六亚甲基二异氰酸酯(HMDI)等脂肪族系异氰酸酯、异佛尔酮二异氰酸酯(IPDI)等脂环式异氰酸酯等公知的化合物作为主要组分来构成。这些物质可以单独使用也可以以2种以上的混合物来使用。其中，优选为二苯基甲烷二异氰酸酯和异佛尔酮二异氰酸酯。这些物质价格低廉，由于是液体状因此容易操作，挥发性低因此安全性高。
涂敷树脂5中，根据需要也可以添加多种添加剂。添加剂可适当含有固化用催化剂、泡沫稳定剂、乳化剂、磷化合物和卤素化合物等阻燃剂、抗氧化剂、防老化剂、紫外线吸收剂、增塑剂、滑石、粘土、碳酸钙、石英粉、氧化铝、炭黑、氧化钛、氧化铁等填充材料、染料、及颜料的添加剂。
涂敷树脂的固化剂的异氰酸酯的量如果过少，则由于无法与助焊剂4充分进行反应，从而助焊剂4与膜的界面的粘附性下降。由此，无法获得可确保防水、防潮性的膜厚。另外，异氰酸酯的量如果过多，则树脂组合物中交联密度过高使得电子元器件与基底的粘附性下降，降低了作为涂敷剂的确保防水、防潮性的功能。为了稳定地与助焊剂4进行反应，为了平衡地获得涂敷剂的确保防水、绝缘功能的效果，将异氰酸酯的量相对于主剂设为10％～50％重量是有效的。
助焊剂4只要含有拥有羟基的化合物即可，对其他组分没有特别的限制。
例如作为助焊剂的主要组分，可以使用松香、合成树脂等树脂系、有机酸、有机卤素化合物、及胺、酰胺类等有机系等现有的公知物质。另外，也可以包含磷酸、磷酸铵盐、有机羧酸(例如硬脂酸、己二酸、水杨酸等)、乳酸、谷氨酸、脂肪酸酰胺、尿素、乙二胺、脂肪族胺等活化剂、邻苯二甲酸酯(例如邻苯二甲酸二丁酯、邻苯二甲酸二辛酯等)、羧酸的酯(例如己二酸二丁酯、马来酸二辛酯等)、磷酸酯(例如磷酸三辛酯、磷酸三苯酯、磷酸三甲苯酯等)那样的增塑剂、乙二醇、二乙二醇单丁醚、三乙二醇单甲醚、乙二醇苯醚、聚乙二醇、二丙二醇、脂肪族酒精等溶剂、固化蓖麻油等蜡类、微细二氧化硅粉末等粘度调整剂、受阻酚类等或受阻胺类等抗氧化剂、及硅系消泡剂等。
助焊剂4如前所述，在电路基板上安装电子元器件时，与焊料3一同被提供，在回流后如上所述配置在所安装的电子元器件的接合部周围、上表面及侧面。
对于涂敷树脂5，例如对于二液型的喷射装置将主剂和固化剂分别按规定量比例引入混合部分，对两者进行充分混合。在混合部混合时开始进行反应，从混合部送至喷嘴部分，从喷嘴部分的前端涂布到电路基板1和电子元器件2上。之后，使树脂组合物固化，得到涂敷后的安装结构体。涂敷树脂5调制为将主剂和固化剂混合之后的粘度在10mPa·s以上，在10Pa·s以下。
以喷射装置涂布的涂敷树脂5与电路基板1上的电子元器件2的上表面接触的地点优选为与电路基板1的上表面接触的地方的膜厚的5～50％左右的膜厚。而且，与电路基板1的上表面接触的地方优选为与所述电子元器件的侧面接触的地方的膜厚的5～30倍的膜厚。
在电路基板1上涂布涂敷树脂5的主剂和固化剂时，若电子元器件2的接合部周围的助焊剂4接触拥有异氰酸酯基的化合物，则助焊剂4所含的羟基就和异氰酸酯基发生反应生成氨基甲酸酯键的反应物8。羟基与异氰酸酯基的反应根据异氰酸酯的种类在常温下也会发生，另外通过加热可促进反应，因此反应率较高，未反应的羟基的残余量只有很少一点。然后，因为氨基甲酸酯键的吸水性极小，与异氰酸酯基反应的助焊剂和树脂相溶而稳定，保证了涂敷树脂膜的粘附性，确保了绝缘性。
还有，在所述混合之后，室温(25℃)下在1个小时之内涂布涂敷树脂5。过了1一个小时再涂布的情况下，无法获得良好的反应物8。由于在将涂敷树脂5混合之后若升温到比室温更高则会促进反应，因此可涂布时间进一步缩短。
将多个电子元器件2通过焊料安装到电路基板1，利用树脂组合物对表面进行涂敷之后，在一部分电子元器件2发现缺陷的情况下，需要只拆下有该缺陷的电子元器件。这种情况下，在助焊剂4和涂敷树脂5的界面形成反应物8的实施方式1的安装结构体的情况下，如下所述进行比以往简单的修理工作。
图3示出了修理工序的涂敷膜的剥离工序。
在该剥离工序中，将电子元器件2加热到助焊剂4的玻璃化转变温度以上，以切割用夹具7切割并去除与电子元器件2的周围或电子元器件的侧面的助焊剂4接触的地方的涂敷树脂5。与助焊剂发生反应的涂敷树脂5通过加热而软化，因此能容易地去掉，能简单地修理有缺陷的安装结构体。
具体来说，去掉涂敷树脂5的情况下的电子元器件2的加热温度优选为40℃以上200℃以下，更优选为80℃以上190℃以下。在比40℃低的温度下助焊剂4无法软化因此难以剥离。另外，加热到190℃以上的话在涂敷树脂5去除之前焊料3就已熔解，会引起焊料溢料(solder flash)，可能会发生接合不良。
在电子元器件2的周围的助焊剂4的残余部分使用作为切割用夹具7的刮铲等插入缺口9，通过切割电子元器件2的周围，从而可将与软化的助焊剂4成为一体的涂敷树脂5从电路基板1的界面部分剥下。
助焊剂4在焊料接合时在电子元器件2的周围、电子元器件2的上部及侧面扩散，因此在电子元器件2的周围插入缺口9就能容易地进行剥离。
剥离涂敷树脂5之后，加热到焊料3的熔融温度以上的250℃就能容易地从电路基板1上拆下电子元器件2。
列举实施例和比较例1、2，进行更详细的说明。
(实施例)
(i)涂敷用树脂组合物的调制
涂敷树脂5使用二液性聚氨酯树脂(日本三悠制造SU-3001(商品名称))。主剂的多元醇和固化剂的异氰酸酯的混合比例使用主剂∶固化剂＝100∶30的比例。
所使用的焊糊6使用包含焊料金属和助焊剂的物质，焊料金属使用Sn-3Ag-0.5Cu的组成的物质，助焊剂使用含有高沸点溶剂、松香、活化剂、及触变性材料等的物质。
(ii)向基底安装电子元器件
使用规定的印刷机、安装机、及回流炉，在浸渍了环氧树脂的玻璃布上印刷有铜箔的FR-5相当类型的电路基板上，接合10mm角的CSP(Chipsize package：芯片级封装)的电子元器件。该CSP以0.5mm的焊盘间距(焊料凸点的中心间的距离)具备焊料凸点(熔点220℃)，还具备金属的导线部分。
(iii)涂敷工序
从二液注型的喷射装置向电路基板1和安装于电路基板1上的电子元器件2涂布上述规定的树脂组合物。
接着，将给予了树脂组合物的电路基板1和电子元器件2的接合物放入设定为100℃的炉中，以100℃加热5分钟使树脂固化，得到涂敷后的接合物。
(比较例1，比较例2)
在安装了电子元器件2的电路基板2上以100μm的膜厚涂布有机硅树脂，以固化所需的温度和时间进行固化，制成比较例1的样本。
另外，将同样条件下制成的电路基板1用洗涤液洗涤，去除助焊剂4之后涂敷上述聚氨酯树脂后，同样在100℃下干燥5分钟，制成比较例2的样本。
(评价)
按以下要点评价涂敷的固化状态。
首先，关于实施例和比较例1、比较例2的样本，以戴上棉手套的手指触摸树脂表面，通过调查树脂是否附着在手套上来调查固化的进行程度。
结果如下述的表1所示。
在表1中，○记号表示未发现附着有树脂，×记号表示发现附着有树脂。
〔表1〕
  实施例   比较例1
  使用树脂   聚氨酯树脂   有机硅树脂
  固化温度[℃]   100   150
  固化时间[分钟]   5   60
  手指触摸感   ○   ×
如表1所示，在比较例1中，存在有助焊剂的接合部中在经过规定的固化处理后在棉手套上附着有树脂。为了进行确认，以100℃固化一个昼夜之后，同样对手指触摸感进行确认，发现附着有树脂。从而，可认为由于助焊剂4的存在导致对固化产生妨碍，树脂的固化是不充分的。对此，实施例和比较例2中未发现在棉手套上附着有树脂。从而，即便助焊剂存在也能充分进行固化。
再按以下要点对涂敷膜的修理时的剥离性和电子元器件的修理操作的便捷性进行评价。
首先，将实施例和比较例2的样本放置于通用的上下热风式的返工机，将由树脂组合物的固化物涂覆后的接合体的接合部进行加热至180℃。在接合部达到180℃时，如图3所示，对电子元器件1的周围的助焊剂残余部分4使用切割用夹具7插入缺口9，切割电子元器件的周围，剥下涂敷树脂5，调查涂敷树脂的残余程度。结果如下述的表2所示。
〔表2〕
  实施例   比较例2
  使用树脂   聚氨酯树脂   聚氨酯树脂
  固化温度[℃]   100   100
  固化时间[分钟]   5   5
  助焊剂   未洗涤   洗涤
  手指触摸干燥   ○   ○
  剥离后残余面积/mm2   4/144   125/144
  拆下元器件   ○   ×
  综合判定   ○   ×
表中的数字中，分母表示切割的树脂的面积，分子表示剥下后涂敷膜残留的面积。进一步加热到焊料3的熔融温度以上即250℃，利用具有能提起橡胶制的约200g左右的物体的吸力的吸嘴(φ8mm)，尝试从电路基板1上拆下电子元器件。其结果如下述的表2所示。在表2中，○记号表示能将电子元器件从电路基板上拆下，×记号表示不能将电子元器件从电路基板上拆下。
在实施例和比较例2中调查涂敷膜修理时的剥离性。如表2那样，在比较例2中电路基板与树脂的粘附性过高难以剥开，树脂残余较多，与此不同的是，在实施例中通过加热从而树脂从电路基板界面剥开变得容易，因此几乎没有发现树脂的残余。另外，如表2所示，在实施例中，用吸嘴很弱的吸力就可从电路基板拆下电子元器件，但在比较例2中，无法从电路基板上拆下电子元器件。从而，若对助焊剂上涂布的涂敷膜进行加热，则电路基板界面的助焊剂就软化而容易剥离，能简单地进行电子元器件的修理。
(实施方式2)
图4示出实施方式2的安装结构体。
在实施方式1中，由于使用回流炉进行焊料接合，因此是在电子元器件2的上表面2a也形成反应物8的情况，如图4那样，即使是不向电子元器件2的上表面润湿助焊剂4从而未在电子元器件2的上表面生成反应物8的状态，作为助焊剂4和涂敷树脂5也使用实施方式1中的物质，即使在利用涂敷树脂5来覆盖电路基板1、电子元器件2、及焊料3的情况下，与以往相比也能便于修理。
工业上的实用性
本发明的涂敷用树脂组合物适合用于水分与电路基板直接接触的可能性高的安装领域，特别是在电子元器件表面安装于基底的安装结构体中是有用的。本发明适合用于电子元器件有缺陷时进行修理操作的安装领域，能提高生产性。
附图标记说明
1......电路基板
2......电子元器件
2a......电子元器件的上表面
3......焊料(接合金属)
4......助焊剂
5......涂敷树脂
6......焊糊
7......切割用夹具
8......反应物
9......缺口

Claims (11)

1.一种安装结构体，是在电路基板上以接合金属安装电子元器件的安装结构体，该安装结构体的特征在于，具有：
含有10％～50％重量的异氰酸酯的涂敷树脂，该涂敷树脂覆盖所述电路基板、所述电子元器件、及所述接合金属；
含有拥有羟基的化合物的助焊剂，该助焊剂残余在所述接合金属的表面；以及
所述涂敷树脂与所述助焊剂的反应物，该反应物形成在所述助焊剂和所述涂敷树脂的界面。
2.如权利要求1所述的安装结构体，其特征在于，
在所述电子元器件的上表面和侧面也配置所述助焊剂。
3.如权利要求1或2所述的安装结构体，其特征在于，
与所述电子元器件的上表面接触的地方的所述涂敷树脂的膜厚是与所述电路基板的上表面接触的地方的所述涂敷树脂的膜厚的5～50％。
4.如权利要求1或2所述的安装结构体，其特征在于，
与所述电路基板的上表面接触的地方的所述涂敷树脂的膜厚是与所述电子元器件的侧面接触的地方的所述涂敷树脂的膜厚的5～30倍的膜厚。
5.如权利要求3所述的安装结构体，其特征在于，
与所述电路基板的上表面接触的地方的所述涂敷树脂的膜厚是与所述电子元器件的侧面接触的地方的所述涂敷树脂的膜厚的5～30倍的膜厚。
6.如权利要求1所述的安装结构体，其特征在于，
所述反应物是在所述助焊剂的玻璃化转变温度以上的温度软化的材料。
7.一种安装结构体的制造方法，其特征在于，
在电路基板上使用助焊剂并以接合金属安装电子元器件，
利用含有10％～50％重量的异氰酸酯的涂敷树脂来覆盖所述电路基板、所述电子元器件、及所述接合金属，
在所述涂敷树脂和含有拥有羟基的化合物的所述助焊剂的界面生成反应物。
8.如权利要求7所述的安装结构体的制造方法，其特征在于，
所述涂敷树脂中，将主剂和固化剂混合后的粘度在10mPa·s以上10Pa·s以下，在所述混合后的1小时以内涂布该涂敷树脂。
9.如权利要求7所述的安装结构体的制造方法，其特征在于，
所述反应物是在所述助焊剂的玻璃化转变温度以上的温度软化的材料。
10.一种安装结构体的修理方法，其特征在于，
该安装结构体在电路基板上以接合金属安装电子元器件，利用含有10％～50％重量的异氰酸酯的涂敷树脂来覆盖所述电路基板、所述电子元器件、及所述接合金属，在所述涂敷树脂和含有拥有羟基的化合物且残余在所述接合金属的表面上的助焊剂的界面形成所述涂敷树脂与所述助焊剂的反应物，
在交换该安装结构体的所述电子元器件时，
使所述反应物到达所述助焊剂的玻璃化转变温度以上的温度以进行软化，剥离所述电子元器件周围的所述涂敷树脂，
从所述电路基板上拆下所述电子元器件并进行交换。
11.如权利要求10所述的安装结构体的修理方法，其特征在于，
在与所述电子元器件的周围或所述电子元器件的侧面的所述助焊剂接触的地方的所述涂敷树脂处形成缺口，剥离所述涂敷树脂。
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Granted publication date: 20141231