NO20075425L - Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt - Google Patents
Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjiktInfo
- Publication number
- NO20075425L NO20075425L NO20075425A NO20075425A NO20075425L NO 20075425 L NO20075425 L NO 20075425L NO 20075425 A NO20075425 A NO 20075425A NO 20075425 A NO20075425 A NO 20075425A NO 20075425 L NO20075425 L NO 20075425L
- Authority
- NO
- Norway
- Prior art keywords
- heat transfer
- transfer layer
- heat
- radiator
- heat generator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
- C01B32/21—After-treatment
- C01B32/22—Intercalation
- C01B32/225—Expansion; Exfoliation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Carbon And Carbon Compounds (AREA)
- Fixing For Electrophotography (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005100622A JP4299261B2 (ja) | 2005-03-31 | 2005-03-31 | 伝熱シート、放熱構造体および伝熱シートの使用方法 |
PCT/JP2006/304865 WO2006112211A1 (ja) | 2005-03-31 | 2006-03-13 | 伝熱シート、放熱構造体および伝熱シートの使用方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20075425L true NO20075425L (no) | 2007-10-25 |
Family
ID=37114943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20075425A NO20075425L (no) | 2005-03-31 | 2007-10-25 | Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090301697A1 (ko) |
EP (1) | EP1865552B1 (ko) |
JP (2) | JP4299261B2 (ko) |
KR (3) | KR101061805B1 (ko) |
NO (1) | NO20075425L (ko) |
TW (1) | TWI320844B (ko) |
WO (1) | WO2006112211A1 (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4299261B2 (ja) * | 2005-03-31 | 2009-07-22 | 東洋炭素株式会社 | 伝熱シート、放熱構造体および伝熱シートの使用方法 |
JP5069861B2 (ja) * | 2006-02-15 | 2012-11-07 | 株式会社カネカ | グラファイトフィルム、およびそれを用いた熱拡散フィルム、ならびにそれを用いた熱拡散方法。 |
JP2008199039A (ja) * | 2008-03-12 | 2008-08-28 | Toyo Tanso Kk | 放熱構造体および伝熱シートの使用方法 |
JP5818127B2 (ja) * | 2010-02-04 | 2015-11-18 | 株式会社リコー | 画像形成装置 |
TW201135429A (en) * | 2010-04-07 | 2011-10-16 | Hon Hai Prec Ind Co Ltd | Heat sink |
CN102130232A (zh) * | 2010-12-29 | 2011-07-20 | 深圳市火天光电科技有限公司 | 发光芯片封装及发光芯片的封装方法 |
JP2013118313A (ja) * | 2011-12-05 | 2013-06-13 | Dexerials Corp | 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法 |
JP5978457B2 (ja) * | 2012-03-19 | 2016-08-24 | パナソニックIpマネジメント株式会社 | 熱伝導体 |
CN102917574B (zh) * | 2012-10-24 | 2015-05-27 | 华为技术有限公司 | 导热垫、制造导热垫的方法、散热装置和电子设备 |
JP6043188B2 (ja) * | 2013-01-08 | 2016-12-14 | 株式会社カネカ | 層間熱接続部材および層間熱接続方法 |
WO2014115798A1 (ja) * | 2013-01-28 | 2014-07-31 | 株式会社村田製作所 | はんだバンプの形成方法およびはんだバンプ |
TWI601249B (zh) | 2013-05-22 | 2017-10-01 | Kaneka Corp | Cooling structure |
CN105579393B (zh) | 2013-09-26 | 2018-12-11 | 株式会社钟化 | 石墨片、其制造方法、配线用层叠板、石墨配线材料和配线板的制造方法 |
WO2015069438A1 (en) * | 2013-11-05 | 2015-05-14 | Graftech International Holdings Inc. | A graphite article |
US9706684B2 (en) | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Exfoliated graphite materials and composite materials and devices for thermal management |
US9700968B2 (en) | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Apparatus and methods for processing exfoliated graphite materials |
EP3119172A4 (en) * | 2014-03-14 | 2017-11-15 | Kaneka Corporation | Electronic terminal device and method for assembling same |
CN107001048B (zh) | 2014-12-04 | 2019-09-27 | 株式会社钟化 | 高真空用层间热接合性石墨片 |
WO2016167307A1 (ja) | 2015-04-15 | 2016-10-20 | 株式会社カネカ | イオンビーム荷電変換装置の荷電変換膜 |
US11840013B2 (en) | 2018-02-27 | 2023-12-12 | Matthews International Corporation | Graphite materials and devices with surface micro-texturing |
WO2020003774A1 (ja) * | 2018-06-28 | 2020-01-02 | パナソニックIpマネジメント株式会社 | 電子装置およびその製造方法 |
JP7345088B2 (ja) * | 2019-02-08 | 2023-09-15 | パナソニックIpマネジメント株式会社 | 熱伝導シートおよびこれを用いた電子機器 |
KR102183485B1 (ko) * | 2020-07-30 | 2020-11-26 | 주식회사 엔티에스 | 폐흑연을 이용한 방열 시트의 제조 방법 |
JP7074270B1 (ja) | 2022-01-19 | 2022-05-24 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB991581A (en) * | 1962-03-21 | 1965-05-12 | High Temperature Materials Inc | Expanded pyrolytic graphite and process for producing the same |
US3414381A (en) * | 1966-04-04 | 1968-12-03 | Dow Chemical Co | Method for producing low density graphite structures |
JPS5580711A (en) * | 1978-12-02 | 1980-06-18 | Teruhisa Kondo | Production of flexible graphite product |
US4471837A (en) * | 1981-12-28 | 1984-09-18 | Aavid Engineering, Inc. | Graphite heat-sink mountings |
FR2583864B1 (fr) * | 1985-06-25 | 1989-04-07 | Inst Francais Du Petrole | Dispositif d'echange thermique du type echangeur a plaques perforees presentant une etancheite amelioree. |
WO1987007695A1 (fr) * | 1986-06-16 | 1987-12-17 | Le Carbone Lorraine | Contact thermique a fort coefficient de transfert et applications au refroidissement d'une structure soumise a un flux thermique intense |
JPH0288415A (ja) * | 1988-09-26 | 1990-03-28 | Hitachi Chem Co Ltd | 低密度黒鉛成形体 |
JPH0370754A (ja) * | 1989-08-09 | 1991-03-26 | Bando Chem Ind Ltd | 高熱伝導性ゴム組成物 |
US5405171A (en) * | 1989-10-26 | 1995-04-11 | Union Oil Company Of California | Dual gasket lined pipe connector |
JPH06134917A (ja) * | 1992-10-28 | 1994-05-17 | Taenaka Kogyo Kk | 膨張黒鉛ラミネートシート、膨張黒鉛シート複合材、その製造方法 |
US5270902A (en) * | 1992-12-16 | 1993-12-14 | International Business Machines Corporation | Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip |
JP2645800B2 (ja) * | 1993-12-14 | 1997-08-25 | 日本ピラー工業株式会社 | 膨張黒鉛製シール素材およびその製造方法ならびにガスケット用シート |
US5503717A (en) * | 1994-06-13 | 1996-04-02 | Kang; Feiyu | Method of manufacturing flexible graphite |
US5846459A (en) * | 1997-06-26 | 1998-12-08 | Ucar Carbon Technology Corporation | Method of forming a flexible graphite sheet with decreased anisotropy |
EP0971407B1 (en) * | 1997-10-14 | 2004-07-21 | Matsushita Electric Industrial Co., Ltd. | Thermal conductive unit and thermal connection structure using same |
DE19828789A1 (de) * | 1998-06-27 | 1999-12-30 | Sgl Technik Gmbh | Packungsgarn aus Graphit- und Plastikfolie |
JP2000169125A (ja) * | 1998-12-04 | 2000-06-20 | Matsushita Electric Ind Co Ltd | グラファイト材料およびその製造方法 |
DE10003927A1 (de) * | 2000-01-29 | 2001-08-02 | Sgl Technik Gmbh | Verfahren zum Herstellen von expandierbaren Graphiteinlagerungsverbindungen unter Verwendung von Phosphorsäuren |
US6503626B1 (en) * | 2000-02-25 | 2003-01-07 | Graftech Inc. | Graphite-based heat sink |
US6482520B1 (en) * | 2000-02-25 | 2002-11-19 | Jing Wen Tzeng | Thermal management system |
JP2002088171A (ja) * | 2000-09-13 | 2002-03-27 | Polymatech Co Ltd | 熱伝導性シートおよびその製造方法ならびに放熱装置 |
JP2003008263A (ja) * | 2001-06-27 | 2003-01-10 | Sony Corp | 熱伝導部材および熱伝導部材を有する電子機器 |
KR100642923B1 (ko) * | 2002-06-18 | 2006-11-03 | 도요탄소 가부시키가이샤 | 가요성을 갖는 고순도 팽창 흑연시트와 그 제조방법, 및상기 시트를 이용한 카본 도가니의 내층 |
US6771502B2 (en) * | 2002-06-28 | 2004-08-03 | Advanced Energy Technology Inc. | Heat sink made from longer and shorter graphite sheets |
FR2849651B1 (fr) * | 2003-01-08 | 2008-02-15 | Carbone Lorraine Composants | Structures isolante comprenant des couches en particules de graphite expanse comprimees a des densites differentes, elements isolants thermiques realises a partir de ces structures |
JP4380226B2 (ja) * | 2003-06-06 | 2009-12-09 | パナソニック株式会社 | 熱伝導性シートとこれを用いた放熱構造体 |
DE10341255B4 (de) * | 2003-09-04 | 2005-06-16 | Sgl Carbon Ag | Wärmeleitplatten aus expandiertem Graphit sowie Verfahren zu ihrer Herstellung |
KR100529112B1 (ko) * | 2003-09-26 | 2005-11-15 | 삼성에스디아이 주식회사 | 다공성 열전달 시트를 갖는 디스플레이 장치 |
US20060070720A1 (en) * | 2004-09-17 | 2006-04-06 | Capp Joseph P | Heat riser |
JP4299261B2 (ja) * | 2005-03-31 | 2009-07-22 | 東洋炭素株式会社 | 伝熱シート、放熱構造体および伝熱シートの使用方法 |
-
2005
- 2005-03-31 JP JP2005100622A patent/JP4299261B2/ja active Active
-
2006
- 2006-03-13 US US11/886,738 patent/US20090301697A1/en not_active Abandoned
- 2006-03-13 KR KR1020097026420A patent/KR101061805B1/ko active IP Right Grant
- 2006-03-13 WO PCT/JP2006/304865 patent/WO2006112211A1/ja active Application Filing
- 2006-03-13 EP EP06715588.7A patent/EP1865552B1/en active Active
- 2006-03-13 KR KR1020077022193A patent/KR101068416B1/ko active IP Right Grant
- 2006-03-13 KR KR1020097026421A patent/KR101052752B1/ko active IP Right Grant
- 2006-03-15 TW TW095108723A patent/TWI320844B/zh active
-
2007
- 2007-10-25 NO NO20075425A patent/NO20075425L/no not_active Application Discontinuation
-
2008
- 2008-03-12 JP JP2008062246A patent/JP5114255B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20090301697A1 (en) | 2009-12-10 |
KR101068416B1 (ko) | 2011-09-29 |
EP1865552A4 (en) | 2008-07-02 |
EP1865552B1 (en) | 2022-06-15 |
JP5114255B2 (ja) | 2013-01-09 |
KR20100017859A (ko) | 2010-02-16 |
JP4299261B2 (ja) | 2009-07-22 |
KR20100017858A (ko) | 2010-02-16 |
KR101061805B1 (ko) | 2011-09-05 |
WO2006112211A1 (ja) | 2006-10-26 |
KR20070118099A (ko) | 2007-12-13 |
KR101052752B1 (ko) | 2011-07-29 |
JP2006286684A (ja) | 2006-10-19 |
JP2008153704A (ja) | 2008-07-03 |
TW200638018A (en) | 2006-11-01 |
EP1865552A1 (en) | 2007-12-12 |
TWI320844B (en) | 2010-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |