JPWO2007142273A1 - 高熱伝導で柔軟なシート - Google Patents
高熱伝導で柔軟なシート Download PDFInfo
- Publication number
- JPWO2007142273A1 JPWO2007142273A1 JP2008520607A JP2008520607A JPWO2007142273A1 JP WO2007142273 A1 JPWO2007142273 A1 JP WO2007142273A1 JP 2008520607 A JP2008520607 A JP 2008520607A JP 2008520607 A JP2008520607 A JP 2008520607A JP WO2007142273 A1 JPWO2007142273 A1 JP WO2007142273A1
- Authority
- JP
- Japan
- Prior art keywords
- graphite
- sheet
- layer
- elastic
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/046—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
3 発熱体
5 シート
7 放熱体
50、66 グラファイト層
52、68 弾性層
60 鋳型(モールド)
62 重し
64 ブロック
70 サブ・ブロック(シート)
72 エッチング後のシート
80 2枚の板
82 PGSシート
84 棒
86 2つの刃
88 シート・ブロック
90 未硬化の弾性材料
92 切断されたシート(ブロック)
94 シート
Claims (15)
- 高熱伝導で柔軟なシートであって、グラファイト層と弾性層が交互に積層され、グラファイト層の面方向の端部が弾性層の端部よりも突出しかつ弾性層の端部の少なくとも一部を覆うように曲がっている、シート。
- 前記グラファイト層の面方向の端部は、隣りの二つの弾性層の端部を覆うように広がっている、請求項1のシート。
- 前記弾性層は、前記グラファイト層と接着性のある樹脂材料からなる、請求項1または2のシート。
- 発熱体と、
放熱体と、
発熱体と放熱体の間に配置されたシートであって、グラファイト層と弾性層が交互に配置され、グラファイト層の面方向の端部は弾性層の端部よりも突出しかつ弾性層の端部の少なくとも一部を覆うように曲がっており、さらにグラファイト層の面方向の一方の端面は放熱体の表面に接し、その他方の端面は発熱体の表面に接する、熱伝導モジュール。 - さらに、前記発熱体と前記シートの間および前記放熱体と前記シートの間の少なくとも一方に充填材を有する、請求項4の熱伝導モジュール。
- 前記充填材は、シリコーンオイル、液体金属および放熱グリースからなるグループの中から選択された一つの材料からなる、請求項5の熱伝導モジュール。
- 前記グラファイト層の面方向の端部は、隣りの二つの前記弾性層の端部を覆うように広がっている、請求項4の熱伝導モジュール。
- 前記弾性層は、前記グラファイト層と接着性のある樹脂材料からなる、請求項5の熱伝導モジュール。
- 前記放熱体はICチップを含み、前記放熱体はヒートシンクを含む、請求項4または5の熱伝導モジュール。
- 高熱伝導で柔軟なシートの製造方法であって、
グラファイト層と弾性層を交互に積層して一つの積層ブロックを形成するステップと、
積層ブロックを積層方向に沿って切断して複数のサブ・ブロックを形成するステップを含み、
前記複数のサブ・ブロックを形成するステップは、サブ・ブロック中のグラファイト層の端部を弾性層の端部よりも突出させ同時に弾性層の端部の少なくとも一部を覆うように曲げることを含むことを特徴とする、製造方法。 - 高熱伝導で柔軟なシートの製造方法であって、
グラファイト層と弾性層を交互に積層して一つのブロックを形成するステップと、
ブロックを積層方向に沿って切断して複数のサブ・ブロックを形成するステップと、
サブ・ブロック中のグラファイト層の端部を弾性層の端部よりも突出させるステップと、
突出したグラファイト層の端部を弾性層の端部の少なくとも一部を覆うように曲げるステップと、を含む製造方法。 - 前記グラファイト層の端部を曲げるステップは、グラファイト層の端部を隣りの二つの弾性層の端部を覆うように広げるステップを含む、請求項11の製造方法。
- 高熱伝導で柔軟なシートの製造方法であって、
(a)複数のグラファイト・ブロックを準備するステップと、
(b)グラファイト・ブロックの一面の端部を中央部よりも突出させるステップと、
(c)グラファイト・ブロックの前記一面に弾性層を接合するステップと、
(d)弾性層に別のグラファイト・ブロックを接合し、当該グラファイト・ブロックの弾性層との接合面とは反対の面の端部を中央部よりも突出させるステップと、
ステップ(c)と(d)を予め決められたサイズの積層構造が得られるまで繰り返すステップと、を含む製造方法。 - 熱伝導モジュールの製造方法であって、
発熱体を準備するステップと、
発熱体に高熱伝導で柔軟なシートを接合するステップであって、当該シートは、グラファイト層と弾性層が交互に配置され、グラファイト層の発熱体の表面に接合する端面は弾性層の端面よりも突出しかつ弾性層の端面の少なくとも一部を覆うように曲がっているステップと、
前記シートに放熱体を接合するステップであって、グラファイト層の放熱体の表面に接合する端面は弾性層の端面よりも突出しかつ弾性層の端面の少なくとも一部を覆うように曲がっているステップと、を含む製造方法。 - さらに、前記発熱体と前記シートの間に充填材を注入するステップと、 前記放熱体と前記シートの間に充填材を注入するステップのいずれか一方または両方を実行する、請求項14の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008520607A JP4868547B2 (ja) | 2006-06-08 | 2007-06-06 | 熱伝導モジュールとその製造方法、並びに、高熱伝導で柔軟なシートの製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006160343 | 2006-06-08 | ||
JP2006160343 | 2006-06-08 | ||
PCT/JP2007/061481 WO2007142273A1 (ja) | 2006-06-08 | 2007-06-06 | 高熱伝導で柔軟なシート |
JP2008520607A JP4868547B2 (ja) | 2006-06-08 | 2007-06-06 | 熱伝導モジュールとその製造方法、並びに、高熱伝導で柔軟なシートの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007142273A1 true JPWO2007142273A1 (ja) | 2009-10-29 |
JP4868547B2 JP4868547B2 (ja) | 2012-02-01 |
Family
ID=38801520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008520607A Active JP4868547B2 (ja) | 2006-06-08 | 2007-06-06 | 熱伝導モジュールとその製造方法、並びに、高熱伝導で柔軟なシートの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9179579B2 (ja) |
EP (1) | EP2034520B1 (ja) |
JP (1) | JP4868547B2 (ja) |
CN (1) | CN101449374B (ja) |
WO (1) | WO2007142273A1 (ja) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101420802B1 (ko) * | 2008-01-17 | 2014-07-21 | 삼성전자주식회사 | 전자모듈용 방열구조체 및 이를 구비한 전자기기 |
DE202008017509U1 (de) * | 2008-11-04 | 2009-10-15 | Neuhaus, Peter | Kameraschutzgehäuse |
JP2012144415A (ja) * | 2010-12-21 | 2012-08-02 | Meijo Univ | グラフェン素材の製造方法及びグラフェン素材 |
JP5621698B2 (ja) * | 2011-04-08 | 2014-11-12 | 株式会社日本自動車部品総合研究所 | 発熱体モジュール及びその製造方法 |
KR101261918B1 (ko) * | 2011-06-13 | 2013-05-08 | 현대자동차주식회사 | 배터리 케이스용 복합소재 및 이의 제조방법 |
WO2012173145A1 (ja) * | 2011-06-14 | 2012-12-20 | 学校法人 名城大学 | グラフェン素材の製造方法、グラフェン素材及びグラフェン配線構造 |
JP5994100B2 (ja) * | 2011-09-07 | 2016-09-21 | パナソニックIpマネジメント株式会社 | 熱伝導シートの製造方法 |
CN103107147A (zh) * | 2012-04-06 | 2013-05-15 | 北京中石伟业科技股份有限公司 | 一种表面覆有石墨烯薄膜的散热器 |
JP2014003141A (ja) * | 2012-06-18 | 2014-01-09 | Shin Etsu Chem Co Ltd | 熱伝導性シート及び電子機器 |
CN102795617B (zh) * | 2012-07-24 | 2014-10-29 | 清华大学深圳研究生院 | 一种石墨块材料及其制备方法 |
CN102867793A (zh) * | 2012-08-14 | 2013-01-09 | 日月光半导体制造股份有限公司 | 热界面材料及半导体封装结构 |
JP6043188B2 (ja) * | 2013-01-08 | 2016-12-14 | 株式会社カネカ | 層間熱接続部材および層間熱接続方法 |
US9338927B2 (en) | 2013-05-02 | 2016-05-10 | Western Digital Technologies, Inc. | Thermal interface material pad and method of forming the same |
CN103533809B (zh) * | 2013-09-26 | 2016-03-30 | 天津沃尔提莫新材料技术有限公司 | 一种散热材料及其制作的散热器 |
US9976710B2 (en) | 2013-10-30 | 2018-05-22 | Lilibrand Llc | Flexible strip lighting apparatus and methods |
CN103685631A (zh) * | 2013-11-29 | 2014-03-26 | 陈棋伟 | 植绒手机壳 |
JP6236631B2 (ja) * | 2014-04-08 | 2017-11-29 | パナソニックIpマネジメント株式会社 | 熱伝導シートの製造方法 |
JP2016082155A (ja) * | 2014-10-21 | 2016-05-16 | 信越化学工業株式会社 | 放熱シート |
CN104400917A (zh) * | 2014-11-04 | 2015-03-11 | 广州橸赛精密机械有限公司 | 一种石墨片的切割工艺以及适应所述工艺的石墨片 |
US10006910B2 (en) | 2014-12-18 | 2018-06-26 | Agilome, Inc. | Chemically-sensitive field effect transistors, systems, and methods for manufacturing and using the same |
US9859394B2 (en) | 2014-12-18 | 2018-01-02 | Agilome, Inc. | Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids |
US9618474B2 (en) | 2014-12-18 | 2017-04-11 | Edico Genome, Inc. | Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids |
US10020300B2 (en) | 2014-12-18 | 2018-07-10 | Agilome, Inc. | Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids |
EP3235010A4 (en) | 2014-12-18 | 2018-08-29 | Agilome, Inc. | Chemically-sensitive field effect transistor |
US9857328B2 (en) | 2014-12-18 | 2018-01-02 | Agilome, Inc. | Chemically-sensitive field effect transistors, systems and methods for manufacturing and using the same |
US10028418B2 (en) | 2015-01-20 | 2018-07-17 | Microsoft Technology Licensing, Llc | Metal encased graphite layer heat pipe |
US10108017B2 (en) | 2015-01-20 | 2018-10-23 | Microsoft Technology Licensing, Llc | Carbon nanoparticle infused optical mount |
US10444515B2 (en) | 2015-01-20 | 2019-10-15 | Microsoft Technology Licensing, Llc | Convective optical mount structure |
US9545030B2 (en) * | 2015-01-20 | 2017-01-10 | Microsoft Technology Licensing, Llc | Flexible thermal conduit for an electronic device |
US9791704B2 (en) | 2015-01-20 | 2017-10-17 | Microsoft Technology Licensing, Llc | Bonded multi-layer graphite heat pipe |
WO2016166959A1 (ja) * | 2015-04-13 | 2016-10-20 | パナソニックIpマネジメント株式会社 | 熱伝導シートおよびその製造方法 |
US11060702B2 (en) | 2016-03-08 | 2021-07-13 | Ecosense Lighting Inc. | Lighting system with lens assembly |
US10653038B2 (en) * | 2016-04-14 | 2020-05-12 | Microsoft Technology Licensing, Llc | Heat spreader |
EP3459115A4 (en) | 2016-05-16 | 2020-04-08 | Agilome, Inc. | GRAPHEN-FET DEVICES, SYSTEMS AND METHODS FOR USE THEREOF FOR SEQUENCING NUCLEIC ACIDS |
US10182514B2 (en) | 2016-06-27 | 2019-01-15 | International Business Machines Corporation | Thermal interface material structures |
KR101892346B1 (ko) * | 2016-07-12 | 2018-08-27 | 강계수 | 그래핀을 함유한 발열비닐 및 그 발열비닐 제조방법 |
CN106497523A (zh) * | 2016-09-27 | 2017-03-15 | 清华大学深圳研究生院 | 一种石墨复合材料及其制备方法 |
JP6702286B2 (ja) * | 2016-12-19 | 2020-06-03 | 株式会社デンソー | 熱伝導装置 |
US11296057B2 (en) | 2017-01-27 | 2022-04-05 | EcoSense Lighting, Inc. | Lighting systems with high color rendering index and uniform planar illumination |
US20180328552A1 (en) | 2017-03-09 | 2018-11-15 | Lilibrand Llc | Fixtures and lighting accessories for lighting devices |
CN107454692A (zh) * | 2017-07-14 | 2017-12-08 | 成都三乙医疗科技有限公司 | 一种石墨烯加热片 |
JP6870538B2 (ja) * | 2017-08-30 | 2021-05-12 | トヨタ自動車株式会社 | 放熱シート |
CN107471754A (zh) * | 2017-09-13 | 2017-12-15 | 比赫电气(太仓)有限公司 | 一种可拆卸式耐腐蚀性散热片 |
WO2019213299A1 (en) | 2018-05-01 | 2019-11-07 | Lilibrand Llc | Lighting systems and devices with central silicone module |
CN112074949A (zh) * | 2018-06-28 | 2020-12-11 | 松下知识产权经营株式会社 | 电子装置及其制造方法 |
KR102214307B1 (ko) * | 2018-12-03 | 2021-02-09 | 에스케이씨 주식회사 | 배터리 셀 모듈 |
US11353200B2 (en) | 2018-12-17 | 2022-06-07 | Korrus, Inc. | Strip lighting system for direct input of high voltage driving power |
KR102268897B1 (ko) * | 2019-06-05 | 2021-06-25 | 에스케이씨 주식회사 | 복합 시트 및 이를 이용한 배터리 셀 모듈 |
US11037860B2 (en) | 2019-06-27 | 2021-06-15 | International Business Machines Corporation | Multi layer thermal interface material |
US11774190B2 (en) | 2020-04-14 | 2023-10-03 | International Business Machines Corporation | Pierced thermal interface constructions |
WO2022205079A1 (zh) * | 2021-03-31 | 2022-10-06 | 中国科学院深圳先进技术研究院 | 一种有机硅/石墨烯热界面材料的制备方法 |
KR102615186B1 (ko) * | 2023-02-17 | 2023-12-19 | 주식회사 크레토즈 | 플라스틱 기반 물품, 전자부품용 하우징, 전자기기 및 플라스틱 기반 물품의 제조방법 |
Family Cites Families (171)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4065593A (en) * | 1976-04-14 | 1977-12-27 | Hercules Incorporated | Solar energy absorber |
US4466483A (en) * | 1978-04-14 | 1984-08-21 | Whitfield Fred J | Methods and means for conducting heat from electronic components and the like |
US4252391A (en) * | 1979-06-19 | 1981-02-24 | Shin-Etsu Polymer Co., Ltd. | Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof |
US4369104A (en) * | 1979-10-22 | 1983-01-18 | Hitco | Continuous filament graphite composite electrodes |
US4449774A (en) * | 1981-02-05 | 1984-05-22 | Shin-Etsu Polymer Co., Ltd. | Electroconductive rubbery member and elastic connector therewith |
US4606962A (en) * | 1983-06-13 | 1986-08-19 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
US4888247A (en) * | 1986-08-27 | 1989-12-19 | General Electric Company | Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite |
US4849858A (en) * | 1986-10-20 | 1989-07-18 | Westinghouse Electric Corp. | Composite heat transfer means |
JPH01206575A (ja) * | 1988-02-15 | 1989-08-18 | Shin Etsu Polymer Co Ltd | 接着性熱融着形コネクタ |
US5052481A (en) * | 1988-05-26 | 1991-10-01 | International Business Machines Corporation | High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology |
US4915167A (en) * | 1988-08-05 | 1990-04-10 | Westinghouse Electric Corp. | Thermal coupling to enhance heat transfer |
DE68925403T2 (de) * | 1988-09-20 | 1996-05-30 | Nec Corp | Kühlungsstruktur für elektronische Bauelemente |
CA2037801C (en) * | 1990-04-16 | 2001-04-24 | Thomas E. Orlowski | Fibrillated pultruded electrical component |
US5026748A (en) * | 1990-05-07 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Thermally conductive adhesive |
US5111359A (en) * | 1991-04-17 | 1992-05-05 | E-Systems Inc. | Heat transfer device and method |
US5213877A (en) * | 1991-05-02 | 1993-05-25 | Mitsubishi Materials Corporation | Ceramic substrate used for fabricating electric or electronic circuit |
JPH05251121A (ja) * | 1991-12-18 | 1993-09-28 | Xerox Corp | 多層配線組立体 |
WO2004074210A1 (ja) * | 1992-07-03 | 2004-09-02 | Masanori Hirano | セラミックス-金属複合体およびその製造方法 |
US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
US6197859B1 (en) * | 1993-06-14 | 2001-03-06 | The Bergquist Company | Thermally conductive interface pads for electronic devices |
US5474458A (en) * | 1993-07-13 | 1995-12-12 | Fujitsu Limited | Interconnect carriers having high-density vertical connectors and methods for making the same |
JP3345986B2 (ja) * | 1993-10-15 | 2002-11-18 | 松下電器産業株式会社 | グラファイト熱伝導体およびそれを用いたコールドプレート |
US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
JP3075132B2 (ja) | 1995-03-06 | 2000-08-07 | 信越化学工業株式会社 | 放熱シート |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
WO1997041599A1 (en) * | 1996-04-29 | 1997-11-06 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
US5890915A (en) * | 1996-05-17 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Electrical and thermal conducting structure with resilient conducting paths |
US5695847A (en) * | 1996-07-10 | 1997-12-09 | Browne; James M. | Thermally conductive joining film |
JPH1056114A (ja) | 1996-08-08 | 1998-02-24 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US6033787A (en) * | 1996-08-22 | 2000-03-07 | Mitsubishi Materials Corporation | Ceramic circuit board with heat sink |
US5812374A (en) * | 1996-10-28 | 1998-09-22 | Shuff; Gregg Douglas | Electrical circuit cooling device |
US6110354A (en) * | 1996-11-01 | 2000-08-29 | University Of Washington | Microband electrode arrays |
US5900312A (en) * | 1996-11-08 | 1999-05-04 | W. L. Gore & Associates, Inc. | Integrated circuit chip package assembly |
US5796582A (en) * | 1996-11-21 | 1998-08-18 | Northern Telecom Limited | Printed circuit board and heat sink arrangement |
US5781412A (en) * | 1996-11-22 | 1998-07-14 | Parker-Hannifin Corporation | Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
US6048599A (en) * | 1997-01-17 | 2000-04-11 | 3M Innovative Properties Company | Susceptor composite material patterned in neat polymer |
US5944322A (en) * | 1997-02-11 | 1999-08-31 | Parker-Hannifin Corporation | Combination graphite foil and metal sealing gasket |
US5876831A (en) * | 1997-05-13 | 1999-03-02 | Lockheed Martin Corporation | High thermal conductivity plugs for structural panels |
JP3961092B2 (ja) * | 1997-06-03 | 2007-08-15 | 株式会社東芝 | 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法 |
JPH11302545A (ja) | 1998-02-18 | 1999-11-02 | Nippon Mitsubishi Oil Corp | シリコーンゴム複合物 |
US6034860A (en) * | 1998-06-10 | 2000-03-07 | Eaton Corporation | Circuit breaking contact with micro-contact interface |
US6097602A (en) * | 1998-06-23 | 2000-08-01 | Marian, Inc. | Integrated circuit package heat sink attachment |
CN1213476C (zh) * | 1998-06-24 | 2005-08-03 | 约翰逊·马太电子公司 | 具有纤维接合层的电子器件 |
US6297960B1 (en) * | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
US6084775A (en) * | 1998-12-09 | 2000-07-04 | International Business Machines Corporation | Heatsink and package structures with fusible release layer |
US6218730B1 (en) * | 1999-01-06 | 2001-04-17 | International Business Machines Corporation | Apparatus for controlling thermal interface gap distance |
US6750551B1 (en) * | 1999-12-28 | 2004-06-15 | Intel Corporation | Direct BGA attachment without solder reflow |
US6261699B1 (en) * | 1999-04-28 | 2001-07-17 | Allison Advanced Development Company | Fiber reinforced iron-cobalt composite material system |
US6367541B2 (en) * | 1999-05-06 | 2002-04-09 | Cool Options, Inc. | Conforming heat sink assembly |
JP2001024117A (ja) * | 1999-07-08 | 2001-01-26 | Yamaha Corp | 放熱用シート及びその製造方法 |
JP2001023530A (ja) | 1999-07-09 | 2001-01-26 | Matsushita Electric Ind Co Ltd | プラズマディスプレイ装置 |
US20010033476A1 (en) * | 1999-07-15 | 2001-10-25 | Dibene Joseph T. | Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating device |
US6947293B2 (en) * | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US6919009B2 (en) * | 1999-10-01 | 2005-07-19 | Nanoplex Technologies, Inc. | Method of manufacture of colloidal rod particles as nanobarcodes |
US6496373B1 (en) * | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
US6644395B1 (en) * | 1999-11-17 | 2003-11-11 | Parker-Hannifin Corporation | Thermal interface material having a zone-coated release linear |
US6411513B1 (en) * | 1999-12-10 | 2002-06-25 | Jacques Normand Bedard | Compliant thermal interface devices and method of making the devices |
US6570764B2 (en) * | 1999-12-29 | 2003-05-27 | Intel Corporation | Low thermal resistance interface for attachment of thermal materials to a processor die |
US6444921B1 (en) * | 2000-02-03 | 2002-09-03 | Fujitsu Limited | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
EP1205451A1 (en) * | 2000-03-07 | 2002-05-15 | Ibiden Co., Ltd. | Ceramic substrate for manufacture/inspection of semiconductor |
JP2002203932A (ja) * | 2000-10-31 | 2002-07-19 | Hitachi Ltd | 半導体パワー素子用放熱基板とその導体板及びヒートシンク材並びにロー材 |
US6844957B2 (en) * | 2000-11-29 | 2005-01-18 | International Business Machines Corporation | Three level stacked reflective display |
US6653730B2 (en) * | 2000-12-14 | 2003-11-25 | Intel Corporation | Electronic assembly with high capacity thermal interface |
US6600528B2 (en) * | 2000-12-19 | 2003-07-29 | International Business Machines Corporation | Integrated prism sheet for improved viewing angle in direct view color filterless liquid crystal displays |
EP1369928B1 (en) * | 2001-02-19 | 2010-01-27 | International Business Machines Corporation | Method for manufacturing a thin-film transistor structure |
EP1363325B1 (en) * | 2001-02-22 | 2013-02-20 | NGK Insulators, Ltd. | Member for electronic circuit, method for manufacturing the member |
KR20020074073A (ko) * | 2001-03-16 | 2002-09-28 | 엘지전자 주식회사 | 아이씨 방열구조 |
US7069645B2 (en) * | 2001-03-29 | 2006-07-04 | Ngk Insulators, Ltd. | Method for producing a circuit board |
US8382004B2 (en) * | 2001-04-04 | 2013-02-26 | Graftech International Holdings Inc. | Flexible graphite flooring heat spreader |
JP4459470B2 (ja) * | 2001-04-06 | 2010-04-28 | 信越化学工業株式会社 | 電子部品の放熱構造体及びそれに用いる放熱シート |
US6651736B2 (en) * | 2001-06-28 | 2003-11-25 | Intel Corporation | Short carbon fiber enhanced thermal grease |
US7013555B2 (en) * | 2001-08-31 | 2006-03-21 | Cool Shield, Inc. | Method of applying phase change thermal interface materials |
US6794723B2 (en) * | 2001-09-12 | 2004-09-21 | Ngk Insulators, Ltd. | Matrix type piezoelectric/electrostrictive device and manufacturing method thereof |
US6657296B2 (en) * | 2001-09-25 | 2003-12-02 | Siliconware Precision Industries Co., Ltd. | Semicondctor package |
JP2003138354A (ja) * | 2001-10-29 | 2003-05-14 | Mitsubishi Heavy Ind Ltd | 金属基複合材料 |
US7270885B1 (en) * | 2001-11-14 | 2007-09-18 | Marlene Rossing, legal representative | Method for brazing ceramic-containing bodies, and articles made thereby |
JP2003168882A (ja) * | 2001-11-30 | 2003-06-13 | Sony Corp | 熱伝導性シート |
US6751099B2 (en) * | 2001-12-20 | 2004-06-15 | Intel Corporation | Coated heat spreaders |
US6946190B2 (en) * | 2002-02-06 | 2005-09-20 | Parker-Hannifin Corporation | Thermal management materials |
US6767765B2 (en) * | 2002-03-27 | 2004-07-27 | Intel Corporation | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
US7108055B2 (en) * | 2002-03-29 | 2006-09-19 | Advanced Energy Technology Inc. | Optimized heat sink using high thermal conducting base and low thermal conducting fins |
US7128979B2 (en) * | 2002-04-19 | 2006-10-31 | Mitsubishi Materials Corporation | Circuit board, method of producing same, and power module |
US7023699B2 (en) * | 2002-06-10 | 2006-04-04 | Visteon Global Technologies, Inc. | Liquid cooled metal thermal stack for high-power dies |
US6757170B2 (en) * | 2002-07-26 | 2004-06-29 | Intel Corporation | Heat sink and package surface design |
WO2004015768A1 (ja) * | 2002-08-09 | 2004-02-19 | Sekisui Chemical Co., Ltd. | 放熱用部材及び接続構造体 |
DE10240508A1 (de) * | 2002-09-03 | 2004-03-11 | Schott Glas | Verfahren zur Herstellung eines Geätzten Optischen Faserbündels sowie verbessertes Geätztes Optisches Faserbündel |
JP4324704B2 (ja) * | 2002-09-13 | 2009-09-02 | Dowaメタルテック株式会社 | 金属−セラミックス複合部材の製造装置、製造用鋳型、並びに製造方法 |
US6836408B2 (en) * | 2002-09-19 | 2004-12-28 | Sun Microsystems, Inc. | Method and apparatus for force transfer via bare die package |
JP3935037B2 (ja) * | 2002-09-30 | 2007-06-20 | Dowaホールディングス株式会社 | アルミニウム−セラミックス接合基板の製造方法 |
US6956739B2 (en) * | 2002-10-29 | 2005-10-18 | Parker-Hannifin Corporation | High temperature stable thermal interface material |
US7210227B2 (en) * | 2002-11-26 | 2007-05-01 | Intel Corporation | Decreasing thermal contact resistance at a material interface |
JP3934565B2 (ja) * | 2003-02-21 | 2007-06-20 | 富士通株式会社 | 半導体装置 |
JP2004253736A (ja) * | 2003-02-21 | 2004-09-09 | Ngk Insulators Ltd | ヒートスプレッダモジュール |
WO2004075291A1 (ja) * | 2003-02-24 | 2004-09-02 | Fujitsu Limited | 電子部品と放熱部材および、それらを使用した半導体装置の製造方法 |
JP4014528B2 (ja) * | 2003-03-28 | 2007-11-28 | 日本碍子株式会社 | ヒートスプレッダモジュールの製造方法及びヒートスプレッダモジュール |
US6992891B2 (en) * | 2003-04-02 | 2006-01-31 | Intel Corporation | Metal ball attachment of heat dissipation devices |
US7013965B2 (en) * | 2003-04-29 | 2006-03-21 | General Electric Company | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
US7112472B2 (en) * | 2003-06-25 | 2006-09-26 | Intel Corporation | Methods of fabricating a composite carbon nanotube thermal interface device |
US7168484B2 (en) * | 2003-06-30 | 2007-01-30 | Intel Corporation | Thermal interface apparatus, systems, and methods |
TWI257543B (en) * | 2003-07-02 | 2006-07-01 | Delta Electronics Inc | Equalizing temperature device |
US7052763B2 (en) * | 2003-08-05 | 2006-05-30 | Xerox Corporation | Multi-element connector |
TWI286372B (en) * | 2003-08-13 | 2007-09-01 | Phoenix Prec Technology Corp | Semiconductor package substrate with protective metal layer on pads formed thereon and method for fabricating the same |
US7494635B2 (en) * | 2003-08-21 | 2009-02-24 | Saint-Gobain Ceramics & Plastics, Inc. | Boron nitride agglomerated powder |
US7063127B2 (en) * | 2003-09-18 | 2006-06-20 | International Business Machines Corporation | Method and apparatus for chip-cooling |
US20050061496A1 (en) * | 2003-09-24 | 2005-03-24 | Matabayas James Christopher | Thermal interface material with aligned carbon nanotubes |
KR101051197B1 (ko) * | 2003-09-29 | 2011-07-21 | 니혼도꾸슈도교 가부시키가이샤 | 박막 전자부품용 세라믹 기판 및 그 제조방법 및 이것을사용한 박막 전자부품 |
US7019971B2 (en) * | 2003-09-30 | 2006-03-28 | Intel Corporation | Thermal management systems for micro-components |
US20050072563A1 (en) * | 2003-10-03 | 2005-04-07 | Wang Chin Wen | Heat sink structure |
US7180745B2 (en) * | 2003-10-10 | 2007-02-20 | Delphi Technologies, Inc. | Flip chip heat sink package and method |
US20050092478A1 (en) * | 2003-10-30 | 2005-05-05 | Visteon Global Technologies, Inc. | Metal foam heat sink |
US20060035413A1 (en) * | 2004-01-13 | 2006-02-16 | Cookson Electronics, Inc. | Thermal protection for electronic components during processing |
US20050151555A1 (en) * | 2004-01-13 | 2005-07-14 | Cookson Electronics, Inc. | Cooling devices and methods of using them |
JP2005228954A (ja) * | 2004-02-13 | 2005-08-25 | Fujitsu Ltd | 熱伝導機構、放熱システムおよび通信装置 |
JP4138689B2 (ja) * | 2004-03-30 | 2008-08-27 | 株式会社東芝 | インターフェイスモジュール付lsiパッケージ及びlsiパッケージ |
KR101108454B1 (ko) * | 2004-04-05 | 2012-01-31 | 미쓰비시 마테리알 가부시키가이샤 | Al/AlN 접합체, 전력 모듈용 기판 및 전력 모듈, 그리고 Al/AlN 접합체의 제조 방법 |
WO2005117917A2 (en) * | 2004-04-07 | 2005-12-15 | Thermonix Llc | Thermal management system and computer arrangement |
US7254036B2 (en) * | 2004-04-09 | 2007-08-07 | Netlist, Inc. | High density memory module using stacked printed circuit boards |
CN100345472C (zh) * | 2004-04-10 | 2007-10-24 | 清华大学 | 一种热界面材料及其制造方法 |
US6977818B1 (en) * | 2004-05-10 | 2005-12-20 | Apple Computer, Inc. | Heat dissipating device for an integrated circuit chip |
US20050255304A1 (en) * | 2004-05-14 | 2005-11-17 | Damon Brink | Aligned nanostructure thermal interface material |
WO2006012838A2 (de) * | 2004-07-30 | 2006-02-09 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung von halbleiterchips in dünnfilmtechnik und halbleiterchip in dünnfilmtechnik |
JP2006054356A (ja) * | 2004-08-13 | 2006-02-23 | Agilent Technol Inc | 熱伝導部材 |
JP4086822B2 (ja) * | 2004-08-19 | 2008-05-14 | 富士通株式会社 | 熱伝導構造体及び熱伝導構造体の製造方法 |
JP4628040B2 (ja) * | 2004-08-20 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体素子を備えた表示装置の製造方法 |
TWI251917B (en) * | 2004-09-02 | 2006-03-21 | Advanced Semiconductor Eng | Chip package for fixing heat spreader and method for packaging the same |
US20060053345A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Thin module system and method |
US20060048932A1 (en) * | 2004-09-09 | 2006-03-09 | Brandon Rubenstein | Configurable heat sink |
US20060065387A1 (en) * | 2004-09-28 | 2006-03-30 | General Electric Company | Electronic assemblies and methods of making the same |
US7654311B2 (en) * | 2004-10-20 | 2010-02-02 | University Of Maryland | Thermal management of systems having localized regions of elevated heat flux |
US7290596B2 (en) * | 2004-10-20 | 2007-11-06 | University Of Maryland | Thermal management of systems having localized regions of elevated heat flux |
TWM268738U (en) * | 2004-12-21 | 2005-06-21 | Cleavage Entpr Co Ltd | Heat dissipation structure for a heat generating device |
US7219713B2 (en) * | 2005-01-18 | 2007-05-22 | International Business Machines Corporation | Heterogeneous thermal interface for cooling |
US7443685B2 (en) * | 2005-02-03 | 2008-10-28 | Fujitsu Limited | Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly |
CN100337981C (zh) * | 2005-03-24 | 2007-09-19 | 清华大学 | 热界面材料及其制造方法 |
US20060225874A1 (en) * | 2005-04-11 | 2006-10-12 | Shives Gary D | Sandwiched thermal article |
CN100404242C (zh) * | 2005-04-14 | 2008-07-23 | 清华大学 | 热界面材料及其制造方法 |
US20060250780A1 (en) * | 2005-05-06 | 2006-11-09 | Staktek Group L.P. | System component interposer |
US7355855B2 (en) * | 2005-06-14 | 2008-04-08 | International Business Machines Corporation | Compliant thermal interface structure utilizing spring elements |
US7362582B2 (en) * | 2005-06-14 | 2008-04-22 | International Business Machines Corporation | Cooling structure using rigid movable elements |
WO2007024229A1 (en) * | 2005-08-25 | 2007-03-01 | Carrier Corporation | Heat exchanger for thermoelectric applications |
US7442050B1 (en) * | 2005-08-29 | 2008-10-28 | Netlist, Inc. | Circuit card with flexible connection for memory module with heat spreader |
US20070062676A1 (en) * | 2005-09-20 | 2007-03-22 | Grand Power Sources Inc. | Heat sink module |
US7303005B2 (en) * | 2005-11-04 | 2007-12-04 | Graftech International Holdings Inc. | Heat spreaders with vias |
US7626123B2 (en) * | 2005-12-12 | 2009-12-01 | Raytheon Sarcos, Llc | Electrical microfilament to circuit interface |
US7342306B2 (en) * | 2005-12-22 | 2008-03-11 | International Business Machines Corporation | High performance reworkable heatsink and packaging structure with solder release layer |
US20070178255A1 (en) * | 2006-01-31 | 2007-08-02 | Farrow Timothy S | Apparatus, system, and method for thermal conduction interfacing |
US20070175621A1 (en) * | 2006-01-31 | 2007-08-02 | Cooligy, Inc. | Re-workable metallic TIM for efficient heat exchange |
US7289326B2 (en) * | 2006-02-02 | 2007-10-30 | Sun Microsystems, Inc. | Direct contact cooling liquid embedded package for a central processor unit |
US7651938B2 (en) * | 2006-06-07 | 2010-01-26 | Advanced Micro Devices, Inc. | Void reduction in indium thermal interface material |
US20070295496A1 (en) * | 2006-06-23 | 2007-12-27 | Hall David R | Diamond Composite Heat Spreader |
US20080040920A1 (en) * | 2006-08-18 | 2008-02-21 | Honeywell International, Inc. | Printed wiring board having multiple instersitial resistors of different electrical resistance values and method of making the same |
KR100818273B1 (ko) * | 2006-09-04 | 2008-04-01 | 삼성전자주식회사 | 기판 사이의 온도 차이를 줄이는 방법 및 이를 이용한 유체반응 장치 |
US7719121B2 (en) * | 2006-10-17 | 2010-05-18 | Tessera, Inc. | Microelectronic packages and methods therefor |
WO2008054759A2 (en) * | 2006-10-31 | 2008-05-08 | U Mass Dartmouth - Central | Fabric based laminar composite and method for manufacture thereof |
US20080128897A1 (en) * | 2006-12-05 | 2008-06-05 | Tong Wa Chao | Heat spreader for a multi-chip package |
US20080218972A1 (en) * | 2007-03-06 | 2008-09-11 | Ioan Sauciuc | Cooling device, system containing same, and cooling method |
JP4648351B2 (ja) * | 2007-03-30 | 2011-03-09 | 住友ベークライト株式会社 | 伝熱シートおよび放熱構造体 |
KR101476313B1 (ko) * | 2007-04-24 | 2014-12-24 | 세람테크 게엠베하 | 금속화된 컴포넌트를 생성하기 위한 방법, 그에 대응하는 컴포넌트, 및 금속화 동안에 상기 컴포넌트를 지지하기 위한 기판 |
US8334592B2 (en) * | 2007-09-11 | 2012-12-18 | Dow Corning Corporation | Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
US7847191B2 (en) * | 2007-11-06 | 2010-12-07 | Xerox Corporation | Electrical component, manufacturing system and method |
KR20100074083A (ko) * | 2007-11-08 | 2010-07-01 | 닛토덴코 가부시키가이샤 | 점착 시트 및 그것을 사용한 반도체 장치의 제조 방법 |
US7396494B1 (en) * | 2007-11-27 | 2008-07-08 | International Business Machines Corporation | Oriented graphite film, methods of manufacture thereof and articles comprising the same |
US8076773B2 (en) * | 2007-12-26 | 2011-12-13 | The Bergquist Company | Thermal interface with non-tacky surface |
US7514290B1 (en) * | 2008-04-24 | 2009-04-07 | International Business Machines Corporation | Chip-to-wafer integration technology for three-dimensional chip stacking |
US7995081B2 (en) * | 2008-06-25 | 2011-08-09 | Palo Alto Research Center Incorporated | Anisotropically conductive backside addressable imaging belt for use with contact electrography |
CN102171378A (zh) * | 2008-08-05 | 2011-08-31 | 固利吉股份有限公司 | 用于光学和电子器件的热管理的键合金属和陶瓷板 |
US20100040796A1 (en) * | 2008-08-13 | 2010-02-18 | San-Teng Chueh | Heat-dissipating structure and manufacturing method thereof |
CN101668383B (zh) * | 2008-09-03 | 2013-03-06 | 富葵精密组件(深圳)有限公司 | 电路板以及电路板封装结构 |
US20100149756A1 (en) * | 2008-12-16 | 2010-06-17 | David Rowcliffe | Heat spreader |
US7961469B2 (en) * | 2009-03-31 | 2011-06-14 | Apple Inc. | Method and apparatus for distributing a thermal interface material |
US8225704B2 (en) * | 2010-01-16 | 2012-07-24 | Nanoridge Materials, Inc. | Armor with transformed nanotube material |
-
2007
- 2007-06-06 WO PCT/JP2007/061481 patent/WO2007142273A1/ja active Search and Examination
- 2007-06-06 EP EP07767055A patent/EP2034520B1/en active Active
- 2007-06-06 JP JP2008520607A patent/JP4868547B2/ja active Active
- 2007-06-06 US US12/303,804 patent/US9179579B2/en active Active
- 2007-06-06 CN CN2007800184060A patent/CN101449374B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
EP2034520A4 (en) | 2010-11-03 |
JP4868547B2 (ja) | 2012-02-01 |
WO2007142273A1 (ja) | 2007-12-13 |
EP2034520A1 (en) | 2009-03-11 |
CN101449374B (zh) | 2011-11-09 |
CN101449374A (zh) | 2009-06-03 |
EP2034520B1 (en) | 2013-04-03 |
US9179579B2 (en) | 2015-11-03 |
US20110198067A1 (en) | 2011-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4868547B2 (ja) | 熱伝導モジュールとその製造方法、並びに、高熱伝導で柔軟なシートの製造方法 | |
JP2003168882A (ja) | 熱伝導性シート | |
TWI670464B (zh) | 熱傳導片、熱傳導片之製造方法、散熱構件及半導體裝置 | |
JP5249505B2 (ja) | サーマルビアを有するヒートスプレッダ | |
JP5662565B2 (ja) | 圧接型半導体装置及びその製造方法 | |
JP4504401B2 (ja) | 半導体パッケージ | |
JP2005536872A (ja) | 長短グラファイトシートから製造されたヒートシンク | |
JP2012119597A (ja) | 半導体装置及びその製造方法 | |
JP2008066374A (ja) | 放熱性基板およびその製造方法ならびにこれを用いたパワーモジュール | |
JP6217884B2 (ja) | 半導体装置とその製造方法 | |
JP2010192591A (ja) | 電力用半導体装置とその製造方法 | |
JP2004356625A (ja) | 半導体装置及びその製造方法 | |
JP2006261505A (ja) | 絶縁伝熱シート | |
JP2006332305A (ja) | 熱伝導性シートの製造方法 | |
CN111615746A (zh) | 电力电子模块及制造电力电子模块的方法 | |
JP2021100006A (ja) | 半導体パッケージ | |
JP5018195B2 (ja) | 放熱装置 | |
JP2020061482A (ja) | 放熱構造 | |
CN212305941U (zh) | 具有导热装置的电路结构 | |
JP7279522B2 (ja) | 熱伝導シート及び熱伝導シート製造方法 | |
JP2002198473A (ja) | 熱伝導材 | |
JP2004281676A (ja) | 放熱板及び放熱板の製造方法 | |
JP7442043B2 (ja) | 熱伝導シートおよびこれを用いた電子機器 | |
WO2010098028A1 (ja) | 発熱体の冷却構造、発熱体の冷却装置、冷却装置を備える電子機器、及び、冷却装置の製造方法 | |
JP5925052B2 (ja) | 半導体装置および半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110906 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110927 |
|
RD12 | Notification of acceptance of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7432 Effective date: 20110927 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20110929 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111025 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
RD14 | Notification of resignation of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7434 Effective date: 20111026 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111111 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4868547 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141125 Year of fee payment: 3 |