WO2013075593A1 - 触控感测装置及其制造方法 - Google Patents

触控感测装置及其制造方法 Download PDF

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Publication number
WO2013075593A1
WO2013075593A1 PCT/CN2012/084426 CN2012084426W WO2013075593A1 WO 2013075593 A1 WO2013075593 A1 WO 2013075593A1 CN 2012084426 W CN2012084426 W CN 2012084426W WO 2013075593 A1 WO2013075593 A1 WO 2013075593A1
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WO
WIPO (PCT)
Prior art keywords
bonding
mark
sensing device
printed circuit
circuit board
Prior art date
Application number
PCT/CN2012/084426
Other languages
English (en)
French (fr)
Inventor
陈家栋
黄萍萍
罗建兴
江耀诚
Original Assignee
宸鸿科技(厦门)有限公司
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Application filed by 宸鸿科技(厦门)有限公司 filed Critical 宸鸿科技(厦门)有限公司
Priority to JP2014540310A priority Critical patent/JP5940164B2/ja
Priority to EP12852049.1A priority patent/EP2784635A4/en
Publication of WO2013075593A1 publication Critical patent/WO2013075593A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H65/00—Apparatus or processes specially adapted to the manufacture of selector switches or parts thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
    • G06F3/0202—Constructional details or processes of manufacture of the input device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Definitions

  • the present invention relates to a touch sensing device and a method of fabricating the same, and more particularly to a touch sensing device having a bonding mark for alignment and a method of fabricating the same.
  • the bonding process of the touch panel and the flexible printed circuit board can usually be performed by, for example, a charge coupled component (Charge) Coupled Device (CCD) to capture the bonding marks provided on the touch panel and the flexible printed circuit board for alignment.
  • CCD charge coupled component Coupled Device
  • the touch sensing device of the single-panel touch panel is exemplified by a shadow layer (Mask Layer). It is directly disposed on the touch panel, so the charge-coupled component cannot be used for alignment between the touch panel and the flexible printed circuit board.
  • Figure 1 It is a schematic diagram of the engagement of the conventional touch sensing device, which is drawn in the form of an explosion map to facilitate the description of the positional relationship between the components of the touch sensing device.
  • the touch panel 120 has a front side that is oppositely disposed. 142 and the back surface 144, and a portion of the back surface 144 of the touch panel 120 is provided with a light shielding layer 122 as a light shielding area.
  • the light shielding layer 122 is disposed on the touch panel 120.
  • the edge area is used to shield and hide the conductive lines disposed around the touch panel 120.
  • the bonding mark 128 of the touch panel 120 is further disposed on the light shielding layer 122.
  • the flexible printed circuit board 130 has oppositely disposed joint faces 132 and non-joined faces 134, wherein the joint faces 132 It is a light shielding layer 122 facing the touch panel 120.
  • the bonding mark 138 of the flexible printed circuit board 130 is disposed on the bonding surface 132 and faces the bonding mark of the touch panel 120. 128.
  • the touch panel 120 and the flexible printed circuit board 130 are joined to each other by the adhesive 126.
  • the alignment of the touch panel 120 is to be performed from the front side 142 (direction 150) of the touch panel 120.
  • the bonding mark 138 between the 128 and the flexible printed circuit board 130 may be invisible to the naked eye or by a charge coupled device (CCD) due to the blocking of the light shielding layer 122.
  • CCD charge coupled device
  • the alignment is to be performed from the non-joining surface 134 (direction 140) of the flexible printed circuit board 130, the flexible printed circuit board 130
  • the material is usually translucent, and the current charge coupled device (CCD) cannot pass through the translucent material to distinguish the touch mark of the touch panel 120. Therefore, it can only be manually aligned by the naked eye and cannot be aligned by a charge coupled device (CCD).
  • the bonding mark of the touch sensing device of the present invention is The improved design of the marking position enables the alignment mark between the bonding mark of the touch panel and the bonding mark of the flexible printed circuit board to be aligned by the optical detecting device or the naked eye, thereby enhancing the alignment. Accuracy improves the reliability of the touch sensing device.
  • An embodiment of the present invention provides a touch sensing device including a touch panel including a first bonding mark, and a flexible printed circuit board having a bonding surface and a non-bonding surface that are engaged with the touch panel.
  • the flexible printed circuit board further includes a second bonding mark disposed on the non-joining surface, and the second bonding mark forms a one-way relationship with the first bonding mark.
  • the second bond mark is aligned with the side edge of the flexible printed circuit board.
  • first bonding mark and the second bonding mark are corresponding designs, and respectively adopt a paired design of symmetric mirroring.
  • the first bonding mark includes a first base and at least two first extensions, and One ends of the at least two first extensions are respectively connected to two adjacent sides of the first base;
  • the second engagement mark comprises a second base and at least two second extensions, and One ends of the at least two second extensions are respectively connected to two adjacent sides of the second base.
  • the at least two first extensions have the same width as the at least two second extensions;
  • the length of the at least two first extensions is greater than the length of the at least two second extensions such that a portion of the at least two first extensions are exposed outside of the flexible printed circuit board.
  • the other ends of the at least two second extending portions are respectively aligned with two adjacent side edges of the flexible printed circuit board.
  • first bonding mark and the second bonding mark have an L-shaped, T-shaped or cross-shaped shape.
  • a third bonding mark is further included on the bonding surface of the flexible printed circuit board to correspond to at least a portion of the second bonding mark.
  • the third bonding mark is stacked with the first bonding mark.
  • the touch panel further includes a light shielding area and a bonding area, the bonding area is disposed in the light shielding area, and the first bonding mark is disposed on the bonding area.
  • the touch panel further includes a terminal wire interface, the terminal wire interface is disposed at the joint area and spaced apart from the first joint mark, the flexible printed circuit board further comprises a telecom pin interface, and the telecommunication pin interface is disposed at the joint Surface, and electrically connected to the terminal wire interface.
  • Another embodiment of the present invention provides a method of manufacturing a touch sensing device, including: providing a touch panel and a flexible printed circuit board, wherein the touch panel includes a first bonding mark, and the flexible printed circuit board There is a joint surface and a non-joining surface for engaging the touch panel, and the flexible printed circuit board further includes a second joint mark disposed on the non-joining surface.
  • the bonding surface of the flexible printed circuit board is bonded to the touch panel according to the alignment between the first bonding mark and the second bonding mark.
  • the first bonding mark includes a first base and at least two first extensions, and One ends of the at least two first extensions are respectively connected to two adjacent sides of the first base;
  • the second engagement mark comprises a second base and at least two second extensions, and One ends of the at least two second extensions are respectively connected to two adjacent sides of the second base.
  • the at least two first extensions have the same width as the at least two second extensions;
  • the length of the at least two first extensions is greater than the length of the at least two second extensions such that the first engagement mark serves as a registration reference for the second engagement mark.
  • first bonding mark and the second bonding mark have an L-shaped, T-shaped or cross-shaped shape.
  • the first bonding mark is disposed on a bonding area in a light shielding area of the touch panel.
  • the touch sensing device of the present invention is designed to provide an optical sensing device for automatically aligning the touch panel and the flexible printed circuit board, in addition to being more convenient for the naked eye to be aligned. Effectively improve efficiency and reduce manpower requirements to save production costs. In addition, it can improve alignment accuracy and enhance the reliability of the bonding process to improve the production yield of the touch sensing device.
  • FIG. 1 is a schematic view of the engagement of a conventional touch sensing device.
  • FIG. 2 is a top view of an embodiment of a touch sensing device of the present invention.
  • Figure 3 is a partial enlarged view of a portion A of Figure 2.
  • FIG. 4 is a top view of a touch panel according to an embodiment of the present invention.
  • Figure 5 is a partial enlarged view of the joint area of Figure 4.
  • Figure 6a is a non-joined surface view of a flexible printed circuit board in accordance with an embodiment of the present invention.
  • Fig. 6b is a view showing a joint surface of a flexible printed circuit board according to an embodiment of the present invention.
  • Figure 7 is a partial enlarged view of Part B of Figure 6b.
  • FIG. 8 is a top plan view of another embodiment of a joint mark of the touch sensing device of the present invention.
  • the touch sensing device provided by the embodiment of the present invention can be used, for example, to directly connect a mask layer.
  • the single-touch panel, the dual-panel touch panel, the hybrid touch panel, and the like disposed on the touch panel are not limited herein.
  • the so-called dual-board touch panel includes a protective substrate. (Cover Lens) And a touch panel; the so-called single-board touch panel directly forms the touch sensing electrode on the protective substrate, thereby eliminating the touch substrate in the dual-plate touch panel.
  • the following embodiments will be exemplified by a single-panel touch panel.
  • FIG. 2 is a schematic top view of an embodiment of the touch sensing device of the present invention.
  • the touch sensing device 500 of the embodiment A touch panel 200 and a flexible printed circuit (FPC) 300 are included.
  • the touch panel 200 Including a first bonding mark 208
  • the flexible printed circuit board 300 has a bonding surface (not shown) and a non-bonding surface 304 bonded to the touch panel 200, and the flexible printed circuit board
  • the 300 further includes a second engagement mark 308.
  • the second bonding mark 308 is disposed on the non-joining surface 304 and the first bonding mark 208 Form a one-way relationship. More specifically, the second bonding mark 308 is disposed on the non-joining surface 304 in a state of being aligned with the side edges of the flexible printed circuit board 300.
  • the touch panel 200 further includes a visible area 204, a light shielding area 202 surrounding the visible area 204, and a joint area. (Bonding Area) 206 and a terminal wire interface 212.
  • the light shielding area 202 can be applied to the touch panel 200, for example, by applying a light shielding layer.
  • the substrate is formed, and the bonding region 206 is disposed in the light shielding region 202, and the so-called bonding region 206 is defined as the touch panel 200 for use with the flexible printed circuit board 300.
  • the first bond mark 208 and the terminating wire interface 212 are further disposed within the land 206.
  • the touch sensing device of the present embodiment is not affected by the light shielding area 202 on the touch panel 200.
  • the second bonding mark 308 disposed on the non-joining surface 304 of the flexible printed circuit board 300 is used to interact with the first bonding mark 208 disposed on the touch panel 200. Perform the alignment.
  • the shape and number of the first bonding mark 208 and the second bonding mark 308 are not limited by the embodiment of the present invention.
  • the number is the same as the design, and is symmetrically set by means of left and right mirroring, so as to ensure the alignment accuracy of the front, back, left and right positions.
  • the first bonding mark 208 And the second joint mark 308 can be designed into a shape such as a T shape or a cross shape.
  • FIG. 3 is a partial enlarged view of part A of FIG. 2 .
  • the optical detecting device can be transmitted through the process (for example, a Charge Coupled Device (CCD) or a naked eye is aligned from the perspective of the top view of FIG. 2 to utilize the originally disposed in the shading area 202.
  • the first joint mark 208 of the inner default position serves as the front, rear, left, and right alignment reference of the second joint mark 308.
  • the first bonding mark 208 and the second bonding mark 308 of the embodiment All are designed to be L-shaped, so the second bond mark 308 will overlap with a portion of the first bond mark 208.
  • touch panel 200 and the flexible printed circuit board 300 of the embodiment of the present invention are further disclosed below.
  • FIG. 4 is a top view of the touch panel 200 according to an embodiment of the present invention for revealing the touch panel 200
  • the back side design the so-called back side is the surface that is not touched by the user in actual use.
  • a grid-shaped terminal wire interface 212 is disposed in the junction area 206 for use as a touch panel. 200 external electrical connection interface.
  • the first bonding mark 208 of the paired design of the embodiment is symmetrically disposed on the terminal wire interface 212 in a left-right mirroring manner. The left and right outer sides are separated from the terminal wire interface 212 by a distance. Since the pair of first bonding marks 208 are in a left-right mirror relationship, the first bonding mark 208 disposed on the right side of the figure is L.
  • the first engagement mark 208 disposed on the left side of the figure is an inverted L type.
  • Figure 5 is a partial enlarged view of the land 206 of Figure 4.
  • the first bonding mark 208 has a first base 216 and at least two first extensions 214, 218.
  • the one ends of the two first extending portions 214 and 218 are respectively connected to the first base portion 216.
  • Two adjacent sides, and the other ends extend in different directions, respectively, to form a so-called L-shaped marking pattern.
  • the first extension 214 extends, for example, in a vertical direction
  • the first extension 218 For example, it extends in the horizontal direction
  • the formed first extensions 214, 218 have a width W1 and a length L1.
  • the bonding surface 302 of the flexible printed circuit board 300 according to an embodiment of the present invention is shown. And the top view of the non-joining surface 304.
  • the flexible printed circuit board 300 of the present embodiment can be made of, for example, a polymer translucent material.
  • the bonding surface 302 of the flexible printed circuit board 300 A telecommunications pin interface 312 is further disposed on the grid for electrically connecting the terminal wire interface 212 when the flexible printed circuit board 300 is bonded to the touch panel 200.
  • the telecommunications pin interface 312 may be formed of a transparent transparent material of a polymer transparent material, a metal layer or other familiar conductive materials.
  • the second bond mark is designed on the non-joining surface 304.
  • the 308 is also designed in pairs and is symmetrically placed in a mirrored manner. Further, the spacing between the pair of second bonding marks 308 is a pair of first bonding marks 208 corresponding to those shown in FIG. The spacing between them.
  • FIG. 7 is a partial enlarged view of Part B of Figure 6b.
  • the second bonding mark 308 A second base 316 and at least two second extensions 314, 318 are included.
  • the two ends of the two second extensions 314 and 318 are respectively connected to the second base 316.
  • Two adjacent sides, and the other ends extend in different directions, respectively, to form a so-called L-shaped marking pattern.
  • the second extension 314 extends, for example, in a vertical direction
  • the second extension 318 For example, extending in the horizontal direction.
  • the second extending portion 314 extending in the vertical direction is extended to be aligned with the side edge 324 of the flexible printed circuit board 300; and the left and right two second extending portions extending in the horizontal direction 318 extend to the side edges 326, 328 aligned with the flexible printed circuit board 300, respectively, and the second extensions 314, 318 are formed to have a width W2 and a length L2. .
  • the width W2 of the second extensions 314, 318 of the present embodiment is designed to be equal to the first extension shown in FIG.
  • the width W1 of 214, 218, and the length L1 of the first extensions 214, 218 is greater than the length L2 of the second extensions 314, 318 such that at the second base A portion of the first extensions 214, 218 can be bonded to the touch panel 200 on the flexible printed circuit board 300 under the condition that the shape of the 316 is equal to the shape of the first base 216. It is revealed outside the flexible printed circuit board 300 to achieve the purpose of providing a registration reference.
  • the second extension 314 of the second bonding mark 308 (vertically extending) and the first bonding mark 208 The first extension 214 (vertical extension) is a joint mark for the right and left alignment
  • the first extension 218 (horizontal extension) is the engagement mark for the up and down alignment.
  • a third bonding mark 408 is further disposed thereon.
  • the third bonding mark 408 is designed to correspond to the second bonding mark 308 on the non-bonding surface 304 of the flexible printed circuit board 300. At least part of it.
  • the shape, size and number of the third bonding marks 408 are not limited in the present invention, as long as the flexible printed circuit board 300 is bonded to the touch panel 200, the third bonding mark 408 It can be further used to align the first bonding mark 208 on the touch panel 200, which is generally used to further provide the alignment reference required for the naked eye to align.
  • the third bond mark 408 of the present embodiment is a second base 316 that is simply designed to correspond to the second bond mark 308.
  • the first bonding mark 208e and the second bonding mark 308e in this embodiment The shapes and numbers also correspond to each other, and the shape is, for example, designed as a double L-shape.
  • the first bonding mark 208e disposed on the touch panel 200 is provided in the embodiment. It is also possible to form a one-way relationship with the second bonding mark 308e provided on the non-contact surface 304 of the flexible printed circuit board 300 to achieve accurate alignment of the front, back, left, and right.
  • FIG. 8 can further provide a third bonding mark on the bonding surface (not shown) of the flexible printed circuit board 300. 408e, its design aspect is as described in the foregoing embodiment, and will not be further described herein. Therefore, when the flexible printed circuit board 300 is bonded to the touch panel 200, the pair is further provided at the first bonding mark 208e.
  • the alignment benchmark is as described in the foregoing embodiment, and will not be further described herein.
  • the embodiment of the present invention further provides a method for manufacturing a touch sensing device, which is based on, for example, the third, fifth, and seventh embodiments.
  • the embodiment of the figure illustrates the manufacturing method, and thus the detailed structure of the touch panel 200 and the flexible printed circuit board 300 will not be described again.
  • a touch panel 200 is provided.
  • a flexible printed circuit board 300 wherein the touch panel 200 includes a first bonding mark 208, and the flexible printed circuit board 300 has a bonding surface 302 that is engaged with the touch panel 200.
  • a non-bonding surface 304, and the flexible printed circuit board 300 further includes a second bonding mark 308 disposed on the non-engaging surface 304.
  • a one-bit process is performed from the perspective of the non-joining surface 304 of the flexible printed circuit board 300 to utilize the first bonding mark 208.
  • the present invention improves the design of the bonding marks on the touch panel and the flexible printed circuit board, and the flexible printed circuit board is bonded to the touch panel, which is convenient for the alignment with the naked eye.
  • the charge-coupled assembly can be used to perform a fully automated alignment process. More importantly, for the process of bonding the flexible printed circuit board to the touch panel having the light-shielding region, the bonding mark of the flexible printed circuit board of the present invention is more than the non-joining of the flexible printed circuit board. The face, therefore, is not obstructed by the light-shielding area in the alignment, and the charge-coupled component can still be utilized to automatically align the bonding marks disposed on the touch panel.
  • the present invention can improve the production efficiency, reduce the production cost, and enhance the reliability of the bonding process to improve the production yield of the touch sensing device.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)
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Abstract

本发明提供一种触控感测装置及其制造方法。上述触控感测装置包括一触控面板及一软性印刷电路板。其中，触控面板包括一第一接合标记；软性印刷电路板具有一与上述触控面板接合的接合面和一非接合面，上述软性印刷电路板更包括一第二接合标记，设置于上述非接合面，并且上述第二接合标记与上述第一接合标记形成一对位关系。

Description

触控感测装置及其制造方法 技术领域
本发明有关于一种触控感测装置及其制造方法，特别是有关于一种具有对位用的接合标记的触控感测装置及其制造方法。
背景技术
在习知触控感测装置制程中，触控面板和软性印刷电路板的接合过程通常可以藉由例如电荷耦合组件 (Charge Coupled Device ， CCD) 来抓取设置于触控面板和软性印刷电路板上的接合标记以进行对位。
然而，以单板触控面板的触控感测装置举例来讲，由于遮光层 (Mask Layer) 是直接设置于触控面板上，因此将无法使用电荷耦合组件来进行触控面板和软性印刷电路板之间的对位。请参考图 1 ，为习知触控感测装置的接合示意图，其是以爆炸图的方式来绘制，以便于说明触控感测装置的各组件之间的位置关系。如图 1 所示，触控面板 120 具有相对设置的正面 142 和背面 144 ，并且触控面板 120 的背面 144 的部分区域设置有遮光层 122 ，以做为一遮光区，通常遮光层 122 是设置于触控面板 120 的边缘区域，用来遮蔽与隐藏设置在触控面板 120 周边的导电线路。而触控面板 120 的接合标记 128 则是进一步设置在遮光层 122 上。
另外，软性印刷电路板 130 具有相对设置的接合面 132 和非接合面 134 ，其中接合面 132 是面对触控面板 120 的遮光层 122 。而软性印刷电路板 130 的接合标记 138 是设置于接合面 132 上，且面对触控面板 120 的接合标记 128 。此外，触控面板 120 与软性印刷电路板 130 再藉由黏胶 126 彼此接合。
如此一来，假设欲从触控面板 120 的正面 142( 方向 150) 进行对位，触控面板 120 的接合标记 128 和软性印刷电路板 130 的接合标记 138 会因为遮光层 122 阻挡而无法用肉眼或用电荷耦合组件 (CCD) 来进行对位。另外，若欲从软性印刷电路板 130 的非接合面 134( 方向 140) 进行对位，则因为软性印刷电路板 130 的材质通常为半透明，而目前的电荷耦合组件 (CCD) 无法穿过半透明材质来分辨出触控面板 120 的接合标记 128 ，因此亦只能用肉眼来进行手动对位，无法用电荷耦合组件 (CCD) 进行对位。
由此可见，习知若有需要在遮光层的位置进行对位接合的触控感测装置，其制程将因精确度不足而降低触控感测装置的可靠度。因此，有必要寻求一种新的触控感测装置的对位设计，以期改善或避免上述的问题。
发明内容
有鉴于此，本发明在触控感测装置的接合标记 (bonding mark) 上进行标记位置的改良设计，使得触控面板的接合标记及软性印刷电路板的接合标记之间具有对位关系，而得以简单透过光学检测装置或肉眼来加以对位，进而增强对位精准度而提升触控感测装置的可靠度。
本发明一实施例提供一种触控感测装置，包括一触控面板，包括一第一接合标记；一软性印刷电路板，具有一与上述触控面板接合的接合面和一非接合面，上述软性印刷电路板更包括一第二接合标记，设置于上述非接合面，并且上述第二接合标记与上述第一接合标记形成一对位关系。
进一步的，第二接合标记对齐软性印刷电路板的侧边边缘。
进一步的，第一接合标记和第二接合标记为相对应的设计，并且分别采用对称镜射的成对设计。
进一步的，第一接合标记包含一第一基部和至少二个第一延伸部，并且 所述 至少二个第一延伸部的一端分别连接第一基部的两相邻侧边；第二接合标记包含一第二基部和至少二个第二延伸部，并且 所述 至少二个第二延伸部的一端分别连接该第二基部的两相邻侧边。
进一步的， 所述 至少二个第一延伸部与 所述 至少二个第二延伸部具有相同的宽度；并且 所述 至少二个第一延伸部的长度大于 所述 至少二个第二延伸部的长度，使部分 所述 至少二个第一延伸部显露于软性印刷电路板之外。
进一步的， 所述 至少二个第二延伸部的另一端分别对齐于软性印刷电路板的两相邻侧边边缘。
进一步的，第一接合标记及第二接合标记为L型、T型或十字型的形状。
进一步的， 所述 触控感测装置 更包括一第三接合标记，设置于软性印刷电路板的接合面，以对应于第二接合标记的至少一部分。
进一步的，第三接合标记与第一接合标记形成迭置。
进一步的，触控面板进一步包括一遮光区与一接合区，接合区设置于遮光区，并且第一接合标记设置于接合区。
进一步的，触控面板更包括一终端导线接口，终端导线接口设置于接合区且与第一接合标记相隔一距离，软性印刷电路板更包括一电信脚位接口，电信脚位接口设置于接合面，且电性连接终端导线接口。
本发明另一实施例提供一种触控感测装置的制造方法，包括：提供一触控面板及一软性印刷电路板，其中触控面板包括一第一接合标记，而软性印刷电路板具有一用来与触控面板接合的接合面和一非接合面，并且软性印刷电路板更包括一设置于非接合面的第二接合标记。接着，根据第一接合标记及第二接合标记之间的对位来将软性印刷电路板的接合面接合于触控面板。
进一步的，第一接合标记包含一第一基部和至少二个第一延伸部，并且 所述 至少二个第一延伸部的一端分别连接第一基部的两相邻侧边；第二接合标记包含一第二基部和至少二个第二延伸部，并且 所述 至少二个第二延伸部的一端分别连接第二基部的两相邻侧边。
进一步的， 所述 至少二个第一延伸部与 所述 至少二个第二延伸部具有相同的宽度；并且 所述 至少二个第一延伸部的长度大于 所述 至少二个第二延伸部的长度，使第一接合标记做为第二接合标记的对位基准。
进一步的，第一接合标记及第二接合标记为L型、T型或十字型的形状。
进一步的，第一接合标记设置于触控面板的一遮光区中的一接合区。
藉此，本发明的触控感测装置在制程上除了更方便让肉眼进行对位之外，更是设计用来提供给光学感测装置自动进行触控面板及软性印刷电路板的对位，有效提高效率、降低人力需求以节省生产成本，此外更可提高对位精确度、增强接合制程的可靠度而提升触控感测装置的生产良率。
附图说明
图 1 为习知触控感测装置的接合示意图。
图 2 为本发明的触控感测装置的实施例上视示意图。
图 3 为图 2 的 A 部分的局部放大图。
图 4 为本发明实施例的触控面板的上视图。
图 5 为图 4 的接合区的局部放大图。
图 6a 为本发明一实施例的软性印刷电路板的非接合面上视图。
图 6b 为本发明一实施例的软性印刷电路板的接合面上视图。
图 7 为图 6b 的 B 部分的局部放大图。
图 8 为本发明的触控感测装置的接合标记的另一实施例上视示意图。
具体实施方式
以下各实施例在图式或说明书描述中，相似或相同的部分皆使用相同的图号。且在图式中，实施例的形状或是厚度可扩大，并以简化或是方便标示。再者，图式中各组件将分别描述，而图中未绘示或描述的组件，为所属技术领域中具有通常知识者所知的形式。
本发明实施例所提供的触控感测装置可例如是搭配一种直接将一遮光层 (Mask Layer) 设置于触控面板上的单板触控面板、双板触控面板、混合式 (Hybrid) 触控面板等，在此并无加以限制。其中，所谓的双板触控面板即是包含一保护用基板 (Cover Lens) 及一触控基板；而所谓的单板触控面板即是将触控感测电极直接形成于保护用基板上，藉以省去双板触控面板中的触控基板。而为了方便说明，以下的实施例将皆以单板触控面板来进行举例说明。
请参考图 2 ，为本发明的触控感测装置的实施例上视示意图。如图所示，本实施例的触控感测装置 500 包含一触控面板 200 及一软性印刷电路板 ( Flexible Printing Circuit ， FPC)300 。其中，触控面板 200 包括一第一接合标记 208 ，软性印刷电路板 300 则具有一与触控面板 200 接合的接合面 ( 图未示 ) 及一非接合面 304 ，并且软性印刷电路板 300 更包括一第二接合标记 308 。其中，第二接合标记 308 是设置于非接合面 304 并与第一接合标记 208 形成一对位关系。更具体来讲，第二接合标记 308 是以对齐于软性印刷电路板 300 的侧边边缘的态样来设置于非接合面 304 上。
触控面板 200 更包括一可视区 204 、一环绕可视区 204 的遮光区 202 、一接合区 (Bonding Area)206 及一终端导线接口 212 。在实际设计上，遮光区 202 可例如是透过涂布一遮光层于触控面板 200 的基板所形成，并且接合区 206 是设置于遮光区 202 内，而所谓的接合区 206 是定义为触控面板 200 用来与软性印刷电路板 300 接合的区域。再者，第一接合标记 208 及终端导线接口 212 则是进一步设置于接合区 206 内。
承上所述，本实施例触控感测装置在制程上得以不受触控面板 200 上的遮光区 202 影响，而利用设置于软性印刷电路板 300 的非接合面 304 上的第二接合标记 308 来与设置于触控面板 200 上的第一接合标记 208 进行对位。其中，第一接合标记 208 及第二接合标记 308 的形状及数量并非为本发明实施例所限制。本说明书所揭露的实施例中的第一接合标记 208 及第二接合标记 308 的形状及数量是相互对应，形状是例如为 L 型，而数量则是采成对设计，并以左右镜射的方式来对称设置，藉以更能确保前、后、左、右位置的对位精确度。当然，除上述的 L 型之外，第一接合标记 208 及第二接合标记 308 更可设计为 T 型、十字型等形状。
请再参考图 3 ，为图 2 的 A 部分的局部放大图。由图 3 更可清楚看到，当软性印刷电路板 300 接合于触控面板 200 时，由于软性印刷电路板 300 的第二接合标记 208 是设计在非接合面 304 上，因此制程上可以透过光学检测装置 ( 如：电荷耦合组件 ( Charge Coupled Device ， CCD) 或肉眼来从图 2 的上视图的视角进行对位，以利用原本已设置于遮光区 202 内默认位置的第一接合标记 208 来做为第二接合标记 308 的前、后、左、右的对位基准。其中，由于本实施例的第一接合标记 208 及第二接合标记 308 皆是设计为 L 型，因此第二接合标记 308 会与部分的第一接合标记 208 形成重迭。
以下再分别针对本发明实施例的触控面板 200 及软性印刷电路板 300 做进一步的揭露说明。
图 4 为本发明实施例的触控面板 200 的上视图，用来揭示触控面板 200 的背面设计态样，所谓的背面也就是实际使用时非使用者所接触的表面。如图 4 所示，栅状的终端导线接口 212 是设置于接合区 206 内，用来做为触控面板 200 对外的电性连接接口。另外，本实施例成对设计的第一接合标记 208 则是以左右镜射的方式来对称设置于终端导线接口 212 的左右两外侧，并分别与终端导线接口 212 相隔一距离。而由于成对的第一接合标记 208 为左右镜射关系，因此设置于图右侧的第一接合标记 208 为 L 型，而设置于图左侧的第一接合标记 208 为反 L 型。
图 5 为图 4 的接合区 206 的局部放大图。如图 5 所示，第一接合标记 208 具有一第一基部 216 和至少两个第一延伸部 214 、 218 。其中，所述的两个第一延伸部 214 、 218 的一端分别连接第一基部 216 的两相邻侧边，且另一端分别沿不同方向延伸，以形成所谓的 L 型的标记态样。具体来说，第一延伸部 214 例如沿垂直方向延伸，而第一延伸部 218 例如沿水平方向延伸，并且所形成的第一延伸部 214 、 218 具有宽度 W1 和长度 L1 。
请同时参考图 6a 及图 6b ，分别为本发明一实施例的软性印刷电路板 300 的接合面 302 及非接合面 304 的上视图。本实施例的软性印刷电路板 300 可例如由高分子的半透明材质构成。如图 6a 所示，软性印刷电路板 300 的接合面 302 上进一步设置有栅状的一电信脚位接口 312 ，用以在软性印刷电路板 300 接合于触控面板 200 时，得以对应电性连接终端导线接口 212 。其中，电信脚位接口 312 可由高分子透明材料透明导电层、金属层或其他熟习的导电材料所构成。而如图 6b 所示，非接合面 304 上所设计的第二接合标记 308 同样为成对设计，并以左右镜射的方式来对称设置。此外，成对的第二接合标记 308 之间的间距是对应于图 4 所示的成对的第一接合标记 208 之间的间距。
请再参考图 7 ，为图 6b 的 B 部分的局部放大图。如图 7 所示，第二接合标记 308 包含一第二基部 316 和至少两个第二延伸部 314 、 318 。其中，所述的两个第二延伸部 314 、 318 的一端分别连接第二基部 316 的两相邻侧边，且另一端分别沿不同方向延伸，以形成所谓的 L 型的标记态样。具体来说，第二延伸部 314 例如沿垂直方向延伸，而第二延伸部分 318 例如沿水平方向延伸。其中，沿垂直方向延伸的第二延伸部 314 是延伸对齐于软性印刷电路板 300 的侧边边缘 324 ；而左右两个沿水平方向延伸的第二延伸部 318 则分别延伸至对齐于软性印刷电路板 300 的侧边边缘 326 、 328 ，并且所形成的第二延伸部 314 、 318 具有宽度 W2 及长度 L2 。
在设计上，本实施例的第二延伸部 314 、 318 的宽度 W2 是设计等于图 5 所示的第一延伸部分 214 、 218 的宽度 W1 ，并且第一延伸部 214 、 218 的长度 L1 是大于第二延伸部 314 、 318 的长度 L2 ，使得在第二基部 316 的形状大小等于第一基部 216 的形状大小的条件下，部分的第一延伸部 214 、 218 能在软性印刷电路板 300 接合于触控面板 200 时显露于软性印刷电路板 300 之外而达到提供对位基准的目的。具体来讲，第二接合标记 308 的第二延伸部 314( 垂直延伸 ) 与第一接合标记 208 的第一延伸部 214( 垂直延伸 ) 是做为左右对位的接合标记，而第二接合标记 308 的第二延伸部分 318( 水平延伸 ) 与第一接合标记 208 的第一延伸部分 218( 水平延伸 ) 是做为上下对位的接合标记。
此外，在本发明的一实施例中，可如图 6a 所示，选择性地在软性印刷电路板 300 的接合面 302 上进一步设置一第三接合标记 408 。其中，第三接合标记 408 是设计对应于软性印刷电路板 300 的非接合面 304 上的第二接合标记 308 的至少一部分。本发明并无加以限制第三接合标记 408 的形状、大小及数量，只要当软性印刷电路版 300 与触控面板 200 进行接合时，第三接合标记 408 可进一步用来对位于触控面板 200 的第一接合标记 208 即可，通常是用来进一步提供给肉眼对位时所需的对位基准。
本实施例的第三接合标记 408 是简单设计为对应于第二接合标记 308 的第二基部 316 的形状、大小及数量。因此，就接合后的整体触控感测装置 500 来看，第一接合标记 208 的第一基部 216 、第二接合标记 308 的第二基部 316 及第三接合标记 408 会完全重迭，并且在架构上，第三接合标记 408 与第一接合标记 208 会因而形成迭置。
再者，在本发明的另一实施例中，所谓的 L 型接合标记更可稍加变形，请参考图 8 ，为本发明触控感测装置的接合标记的另一实施例上视示意图。如图所示，本实施例中的第一接合标记 208e 及第二接合标记 308e 的形状及数量同样是相互对应，其形状是例如设计为双重 L 型。如此一来，在本实施例中，设置于触控面板 200 上的第一接合标记 208e 同样可以与设置于软性印刷电路板 300 的非贴合面 304 上的第二接合标记 308e 形成一对位关系，而达到前、后、左、右的精确对位。
另外，图 8 的实施例更可进一步于软性印刷电路板 300 的贴合面 ( 图未标示 ) 上设置一第三接合标记 408e ，其设计态样如前述实施例所述，在此不再加以赘述。藉以在软性印刷电路板 300 接合于触控面板 200 时，进一步提供对位于第一接合标记 208e 的对位基准。
本发明实施例进一步提供一种触控感测装置的制造方法，由于本实施例是例如基于第 3 、 5 及 7 图的实施例态样来进行制造方法的说明，因此有关触控面板 200 及软性印刷电路板 300 的详细架构就不再加以赘述。首先，提供一触控面板 200 及一软性印刷电路板 300 ，其中触控面板 200 包括一第一接合标记 208 ，而软性印刷电路板 300 具有一与触控面板 200 接合的接合面 302 和一非接合面 304 ，并且软性印刷电路板 300 更包括一设置于非接合面 304 的第二接合标记 308 。
接着，从软性印刷电路板 300 的非接合面 304 的视角进行一对位制程，以利用第一接合标记 208 来做为第二接合标记 308 的对位基准。由于本实施例的第一接合标记 208 的第一延伸部 214 、 218 的长度是分别大于第二接合标记 308 的第二延伸部 314 、 318 ，因此第二接合标记 308 将与部分的第一接合标记 208 重迭，并得以形成对位关系。
最后，根据第一接合标记 208 及第二接合标记 308 之间的对位来进行一接合制程，用以将软性印刷电路板 300 的接合面 302 接合于触控面板 200 。
综上所述，本发明透过触控面板和软性印刷电路板上的接合标记的设计改良，在软性印刷电路板接合于触控面板的制程上，不仅可以方便利用肉眼来进行对位，更可利用电荷耦合组件来进行全自动的对位接合制程。更重要的是，对于将软性印刷电路板接合于具有遮光区的触控面板的制程上，更可因本发明的软性印刷电路板的接合标记是设置于软性印刷电路板的非接合面上，因此对位上不会受到遮光区的阻碍，而仍可利用电荷耦合组件来自动对位于设置在触控面板上的接合标记。整体而言，本发明可以提高生产效率、降低生产成本及增强接合制程的可靠性而提升触控感测装置的生产良率。
虽然本发明已以较佳实施例揭露如上，然其并非用以限定本发明，任何所属技术领域中具有通常知识者，在不脱离本发明的精神和范围内，当可作更动与润饰，因此本发明的保护范围当视后附的申请专利范围所界定者为准。

Claims (16)

  1. 一种触控感测装置，其特征在于，包括：
    一触控面板，包括一第一接合标记；以及
    一软性印刷电路板，具有一与该触控面板接合的接合面和一非接合面，该软性印刷电路板更包括一第二接合标记，设置于该非接合面，并且该第二接合标记与该第一接合标记形成一对位关系。
  2. 如权利要求 1 所述的触控感测装置，其特征在于，该第二接合标记对齐该软性印刷电路板的侧边边缘。
  3. 如权利要求 1 所述的触控感测装置，其特征在于，该第一接合标记和该第二接合标记为相对应的设计，并且分别采用对称镜射的成对设计。
  4. 如权利要求 1 所述的触控感测装置，其特征在于，该第一接合标记包含一第一基部和至少二个第一延伸部，并且该至少二个第一延伸部的一端分别连接该第一基部的两相邻侧边；该第二接合标记包含一第二基部和至少二个第二延伸部，并且该至少二个第二延伸部的一端分别连接该第二基部的两相邻侧边。
  5. 如权利要求 4 所述的触控感测装置，其特征在于，该至少二个第一延伸部与该至少二个第二延伸部具有相同的宽度；并且该至少二个第一延伸部的长度大于该至少二个第二延伸部的长度，使部分该至少二个第一延伸部显露于该软性印刷电路板之外。
  6. 如权利要求 4 所述的触控感测装置，其特征在于，该至少二个第二延伸部的另一端分别对齐于该软性印刷电路板的两相邻侧边边缘。
  7. 如权利要求 1 所述的触控感测装置，其特征在于，该第一接合标记及该第二接合标记为 L 型、 T 型或十字型的形状。
  8. 如权利要求 4 所述的触控感测装置，其特征在于，更包括：
    一第三接合标记，设置于该软性印刷电路板的该接合面，以对应于该第二接合标记的至少一部分。
  9. 如权利要求 8 所述的触控感测装置，其特征在于，该第三接合标记与该第一接合标记形成迭置。
  10. 如权利要求 1 所述的触控感测装置，其特征在于，该触控面板进一步包括：
    一遮光区；
    一接合区，设置于该遮光区，并且该第一接合标记设置于该接合区。
  11. 如权利要求 10 所述的触控感测装置，其特征在于，该触控面板更包括一终端导线接口，该终端导线接口设置于该接合区且与该第一接合标记相隔一距离，该软性印刷电路板更包括一电信脚位接口，该电信脚位接口设置于该接合面，且电性连接该终端导线接口。
  12. 一种触控感测装置的制造方法，其特征在于，包括步骤：
    提供一触控面板及一软性印刷电路板，其中该触控面板包括一第一接合标记，该软性印刷电路板具有一用来与该触控面板接合的接合面和一非接合面，并且该软性印刷电路板更包括一设置于该非接合面的第二接合标记；以及
    根据该第一接合标记及该第二接合标记之间的对位来将该软性印刷电路板的该接合面接合于该触控面板。
  13. 如权利要求 12 所述的触控感测装置的制造方法，其特征在于，该第一接合标记包含一第一基部和至少二个第一延伸部，并且该至少二个第一延伸部的一端分别连接该第一基部的两相邻侧边；该第二接合标记包含一第二基部和至少二个第二延伸部，并且该至少二个第二延伸部的一端分别连接该第二基部的两相邻侧边。
  14. 如权利要求 13 所述的触控感测装置的制造方法，其特征在于，该至少二个第一延伸部与该至少二个第二延伸部具有相同的宽度；并且该至少二个第一延伸部的长度大于该至少二个第二延伸部的长度，使该第一接合标记做为该第二接合标记的对位基准。
  15. 如权利要求 12 所述的触控感测装置的制造方法，其特征在于，该第一接合标记及该第二接合标记为 L 型、 T 型或十字型的形状。
  16. 如权利要求 12 所述的触控感测装置的制造方法，其特征在于，该第一接合标记设置于该触控面板的一遮光区中的一接合区。
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CN103135826A (zh) 2013-06-05
CN105138172A (zh) 2015-12-09
KR20130059279A (ko) 2013-06-05
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EP2784635A4 (en) 2016-01-20
CN106406594A (zh) 2017-02-15
CN106406594B (zh) 2019-07-16
TW201322077A (zh) 2013-06-01
TWI585622B (zh) 2017-06-01
KR101463306B1 (ko) 2014-11-18
CN105094447A (zh) 2015-11-25
JP5940164B2 (ja) 2016-06-29
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