WO2019127161A1 - 触控显示屏及其制作方法以及显示设备 - Google Patents

触控显示屏及其制作方法以及显示设备 Download PDF

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Publication number
WO2019127161A1
WO2019127161A1 PCT/CN2017/119145 CN2017119145W WO2019127161A1 WO 2019127161 A1 WO2019127161 A1 WO 2019127161A1 CN 2017119145 W CN2017119145 W CN 2017119145W WO 2019127161 A1 WO2019127161 A1 WO 2019127161A1
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Prior art keywords
wiring layer
touch
layer
flip chip
display
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PCT/CN2017/119145
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English (en)
French (fr)
Inventor
朱剑磊
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深圳市柔宇科技有限公司
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780097397.2A priority Critical patent/CN111448539A/zh
Priority to PCT/CN2017/119145 priority patent/WO2019127161A1/zh
Publication of WO2019127161A1 publication Critical patent/WO2019127161A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to the field of flexible display technologies, and in particular, to a touch display screen, a method for fabricating the same, and a display device.
  • COF Chip On Flex
  • AMOLED Active Matrix/Organic Light Emitting Diode
  • the display panel is first bound to the COF, the touch panel is bound to the flexible circuit board, and the display panel is assembled with the touch panel, but the COF and the flexible circuit board interfere with each other to increase the assembly difficulty. .
  • Embodiments of the present invention provide a touch display screen and a display device having a narrow bezel.
  • the touch display screen of the present invention includes a display panel, a touch panel laminated on the display panel, a flexible circuit board, and a flip chip, the flip chip comprising a base layer and two opposite layers stacked on the base layer a first trace layer and a second trace layer on the surface;
  • the flip chip is fixed between the non-display area of the display panel and the edge area of the touch panel, and the first trace layer is electrically connected to the display panel, and the second trace layer
  • the flexible circuit board is electrically connected to the touch panel, and the flexible circuit board is fixed to an end of the first wiring layer away from the display panel and electrically connected to the first wiring layer.
  • the method for manufacturing a touch display screen according to the present invention includes
  • the display panel and the touch panel are pasted by an optical adhesive, and a gap is formed between the non-display area of the display panel and the edge area of the touch panel;
  • the present invention also provides a display device, including the touch display screen formed by the above touch screen display method.
  • the method for manufacturing the touch display screen according to the embodiment of the invention is that the touch panel and the display panel are pasted and fixed, and then the flip chip is bonded to the touch panel and the display panel to realize electrical connection, and only one binding is required.
  • the assembly is simple and the process steps are reduced compared to the prior art.
  • FIG. 1 is a schematic structural diagram of a touch display screen according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing the assembly of the display screen and the flip chip shown in FIG. 1;
  • Figure 3 is an enlarged plan view showing the internal structure of the display screen and the flip chip of Figure 2;
  • Figure 4 is an enlarged partial view of a portion of the cross section of the display screen and the flip chip shown in Figure 2;
  • Figure 5 is a schematic cross-sectional view of the flip chip shown in Figure 2;
  • FIG. 6 is a flow chart of a method of manufacturing a display screen of the present invention.
  • the embodiment of the present invention provides a touch display screen and a display device.
  • the touch display screen is a flexible screen including an organic light emitting diode.
  • the display device may be an in-vehicle device, a wearable device, or a portable terminal device.
  • the touch display screen of the embodiment includes a display panel 10 , a touch panel 20 and a flexible circuit board 40 stacked on the display panel 10 , and a cover provided with a driving device 35 .
  • a crystalline film 30 comprising a base layer 31 and a first wiring layer 32 and a second wiring layer 33 laminated on opposite surfaces of the base layer 31, wherein the driving device 35 is provided
  • the surface of the second wiring layer 32 is electrically connected to the first wiring layer 32 and the second wiring layer 33.
  • the touch panel 20 and the display panel 10 are stacked by an optical adhesive 25 .
  • the optical adhesive 25 has a certain thickness
  • the non-display area 101 of the display panel 10 and the touch panel are A certain gap is left between the edge regions 202 of 20.
  • one end of the flip chip 30 is inserted into a gap between the non-display area 101 of the display panel 10 and the edge area 202 of the touch panel 20.
  • the surface of one end of the first wiring layer 32 of the flip chip 30 is attached to the non-display area 101 of the display panel 10, and the surface of one end of the second wiring layer 33 of the flip chip 30 is touched.
  • the edge region 202 of the panel 20 is in contact with each other; the first wiring layer 32 is electrically connected to the display panel 10, and the second wiring layer 33 is electrically connected to the touch panel 20, the flexible circuit board 35 is electrically connected to one end of the first wiring layer 32 away from the display panel 33.
  • the flip-chip film 30 with double-layer traces increases the area of the trace arrangement, and only needs to be connected with a flexible circuit board to realize electrical connection and driving of the touch panel and the display panel.
  • the display panel 10 includes a display area 102 and the non-display area 101 disposed around the display area.
  • the non-display area 101 is provided with a plurality of traces for providing electrical connection channels for devices in the display area.
  • the surface of the non-display area 101 is provided with a plurality of terminals 103 for electrically connecting with the first wiring layer 32.
  • the edge region 202 is provided with a terminal 203 facing the surface of the display panel 10 for electrically connecting with the second wiring layer 33.
  • the substrate 31 may be a flexible board, and the base layer 31 is provided with a through hole 311.
  • the first wiring layer 32 and the second wiring layer 33 are formed by processing a metal layer and each include a plurality of traces.
  • the traces on the first trace layer 32 are electrically connected to the traces or electrical components on the second trace layer 33 through the vias 311.
  • the surfaces of the first wiring layer 32 and the second wiring layer 33 are each provided with an encapsulation layer 34 for protecting the first wiring layer 32 and the second wiring layer 33.
  • the driving device 35 is a driving display panel driving circuit.
  • the driving device includes a touch driving chip that displays a driving chip and a touch panel.
  • the driving device 35 is embedded on the encapsulation layer and electrically connected to the first wiring layer 32 and the second wiring layer 33.
  • the specific first wiring layer 32 is connected to the driving device 35.
  • the through hole 311 provided in the substrate 31 is realized.
  • FIG. 3 is an enlarged schematic view of the internal structure of FIG. 2 .
  • one end portion of the first wiring layer 32 of the flip chip 30 is provided with a first bonding portion A
  • the second routing A second bonding portion B is disposed on the end portion of the layer 33 corresponding to the first bonding portion A, and the flip chip 30 passes through the first bonding portion A and the non-display area 101 of the display panel 10.
  • the flip-chip film 30 is fixedly connected to the edge region 202 of the touch panel 20 through the second bonding portion B.
  • the end surface end surface of the first wiring layer 32 on which the first bonding portion A is disposed is further provided with a first conductive terminal 321 .
  • the second wiring layer 33 is provided with a second conductive terminal 331 at the end of the second wiring layer 33.
  • the first wiring layer 32 is electrically connected to the display panel 10 through the first conductive terminal 321 .
  • the second wiring layer 33 is electrically connected to the touch panel 20 through the second conductive terminal 331 .
  • the first conductive terminals 321 are plural, which may be interposed with the first bonding portion A, or may be arranged side by side with the first bonding portion A, as long as the flip chip 30 and the display are provided.
  • the first conductive terminal 321 is ensured to be connected to the plurality of terminals 103.
  • the second conductive terminals 331 are plural, which may be interposed with the second bonding portion B, or may be arranged side by side with the second bonding portion B, as long as the flip chip 30 is attached to the display panel 10. Timing ensures that the second conductive terminal 331 is connected to the plurality of terminals 203.
  • the flip chip 30 is fixed to the display panel 10 and the touch panel 20
  • the first conductive terminals 321 are electrically connected to the plurality of terminals 103 of the non-display area 101 on the display panel 10 .
  • the second conductive terminal 331 is electrically connected to the terminal 203 of the edge region 202 to electrically connect the flip chip 30 to the display panel 10 and the touch panel 20 .
  • the other end connecting portion C of the first conductive terminal 321 is away from the first conductive terminal 321 , and the flexible circuit board 40 passes through the connecting portion C and the flip chip.
  • the film 30 is fixedly connected and electrically connected.
  • the flexible circuit board 40 is provided with a touch chip, and the touch chip is connected to the touch panel 20 through the flip chip 30. .
  • the touch display screen of the present invention can realize display driving and touch driving by using a flip chip with a first wiring layer 32 and a second wiring layer 33 to be connected with a flexible circuit board, compared with the prior art.
  • the flexible circuit board is saved, and the flip chip 30 is sandwiched between the display panel 10 and the touch panel 20, and the flexible circuit board is connected to the flip chip 30, thereby avoiding the lamination of the flip chip 30 and the circuit board to increase the process. Difficulty.
  • the present invention further provides a method for manufacturing a touch display screen, where the method includes
  • step S1 the display panel 10 and the touch panel 20 are pasted by the optical glue 25, and a gap 15 is formed between the non-display area 101 of the display panel 10 and the edge area 202 of the touch panel 20.
  • Step S2 inserting one end of the flip chip 30 into the gap 15 so that the first trace layer 32 of the flip chip 30 faces the non-display area 101, and the second trace layer of the flip chip 30
  • the edge of the gap between the flip chip 15 and the optical adhesive 25 is disposed at a distance from the end of the gap 15 to facilitate heat dissipation of the connection between the flip chip 30 and the touch screen display.
  • the first flexible circuit board 40 is fixed to one end of the first wiring layer 32 and electrically connected to the first wiring layer 32 and the second wiring layer 33, and then the flip chip is to be laminated. One end of 30 is inserted into the gap.
  • step S3 the flip chip 30 and the display panel 10 and the touch panel 20 are bonded to the first trace layer 32 and the non-display area 101 by the heat pressing method, and the second The trace layer 33 is fixed and electrically connected to the edge region 202.
  • the first bonding portion is disposed at one end of the first wiring layer 32
  • the second bonding portion is disposed at an end portion of the second wiring layer 33 corresponding to the first bonding portion.
  • the second wiring layer 33 is fixed to the edge region 202, and the first conductive terminal 321 is electrically connected to a plurality of terminals of the non-display area 101 on the display panel.
  • the second conductive terminal 331 is electrically connected to the terminal of the edge region 202.
  • the assembly of the touch display screen and the flip chip 30 can be achieved by this step.
  • the flexible circuit board is fixed to one end of the first wiring layer away from the display panel and the first wiring layer and the second wiring layer.
  • An electrical connection wherein a connection portion is first disposed at an end of the first layer trace layer 32 away from the display panel 10, and the flexible circuit board is soldered on the flip chip 30 through the connection portion and through the metal. The pads are electrically connected.
  • the touch screen display method of the embodiment of the present invention is to first fix and fix the touch panel 20 and the display panel 10, and then bind the flip chip 30 to the touch panel 20 and the display panel 10 to achieve electrical connection. Only one binding is required to reduce the process steps, and the flexible circuit board is soldered to the end of the flip chip 30 away from the display panel 10, and only one flexible circuit board is required to drive the display and the touch, saving material. In fact, the touch flexible circuit board is saved in the method, and the overlap of the flip chip 30 when the display panel and the touch panel are assembled can be avoided to avoid affecting the quality of the bonding.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种触控显示屏，包括显示面板（10）、层叠于所述显示面板（10）上的触控面板（20）、柔性电路板（40）以及覆晶薄膜，所述覆晶薄膜包括基层（31）和层叠于所述基层（31）相对的两个表面上的第一走线层（32）和第二走线层（33）；所述覆晶薄膜固定于所述显示面板（10）的非显示区（101）与所述触控面板（20）的边缘区（202）之间，并且所述第一走线层（32）与所述显示面板（10）电连接，所述第二走线层（33）与所述触控面板（20）电连接，所述柔性电路板（40）固定于所述第一走线层（32）远离所述显示面板（10）的一端并与所述第一走线层（32）电连接。

Description

触控显示屏及其制作方法以及显示设备 技术领域
本发明涉及柔性显示技术领域，尤其涉及一种触控显示屏及其制作方法以及显示设备。
背景技术
随着显示技术发展，(Chip On Flex，COF)技术是运用软质附加电路板作封装芯片载体将芯片与软性基板电路接合的技术，在中小尺寸(Active Matrix/Organic Light Emitting Diode，AMOLED)触控显示屏开始大量应用，主要是将显示面板电连接于电路板上，对于传统应用来说，COF为单层结构，但是对于高精细度要求的AMOLED，单层COF所能承载的走线数量收到了限制，而且在制作过程中，显示面板与COF先绑定，触控面板与柔性电路板绑定，再将显示面板与触控面板组装，但是COF与柔性电路板互相干扰增加组装难。
发明内容
本发明实施例提供一种具有较窄边框的触控显示屏及显示设备。
本发明所述的触控显示屏，包括显示面板、层叠于所述显示面板上的触控面板、柔性电路板以及覆晶薄膜，所述覆晶薄膜包括基层和层叠于所述基层相对的两个表面上的第一走线层和第二走线层；
所述覆晶薄膜固定于所述显示面板的非显示区与所述触控面板的边缘区之间，并且所述第一走线层与所述显示面板电连接，所述第二走线层与所述触控面板电连接，所述柔性电路板固定于所述第一走线层远离所述显示面板的一端并与所述第一走线层电连接。
本发明所述的触控显示屏制作方法，包括，
将显示面板和触控面板通过光学胶贴合，并且使所述显示面板的非显示区 与所述触控面板的边缘区之间具有间隙；
将覆晶薄膜的一端插入所述间隙，使所述覆晶薄膜的第一走线层朝向所述非显示区，所述覆晶薄膜的第二走线层朝向所述边缘区；
通过热压方式绑定所述覆晶薄膜与显示面板和触控面板，使所述第一走线层与所述非显示区固定并电连接，所述第二走线层与所述边缘区固定并电连接。
本发明还提供一种显示设备，包括上述触控显示屏制作方法形成的触控显示屏。
发明实施例所述的触控显示屏制作方法是先将触控面板和显示面板粘贴固定，然后再将覆晶薄膜绑定于触控面板和显示面板上实现电连接，只需要一次绑定，组装简单且相较于现有技术减少工艺步骤。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例的触控显示屏的结构简图；
图2为图1所示的显示屏和覆晶薄膜组装的截面示意图；
图3为图2所示的显示屏和覆晶薄膜组装的内部结构截面的放大图；
图4为图2所示的显示屏和覆晶薄膜组装的截面的部分区域放大图；
图5为图2所示的覆晶薄膜的截面示意图；
图6本发明的显示屏制作方法流程图。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。
本发明实施例提供一种触控显示屏和显示设备，所述触控显示屏为包括有机发光二极管的柔性屏，所述显示设备可以是车载设备、可穿戴设备，也可以是便携式终端设备。
请参阅图1与图2，本实施例中所述触控显示屏，包括显示面板10、层叠 于所述显示面板10上的触控面板20和柔性电路板40以及设有驱动装置35的覆晶薄膜30，所述覆晶薄膜30包括基层31和层叠于所述基层31上相对的两个表面的第一走线层32和第二走线层33，所述驱动装置35设于所述第二走线层32表面与所述第一走线层32和第二走线层33电连接。
进一步的，触控面板20与显示面板10之间通过光学胶25相层叠，本实施例中，光学胶25具有一定厚度，并且在所述显示面板10的非显示区101与所述触控面板20的边缘区202之间留有一定空隙。进一步的，所述覆晶薄膜30的一端插接于所述显示面板10的非显示区101与所述触控面板20的边缘区202之间的空隙。具体的，覆晶薄膜30设有第一走线层32的一端的表面与所述显示面板10的非显示区101贴合，覆晶薄膜30第二走线层33的一端的表面与触控面板20的边缘区202相贴合；所述第一走线层32与所述显示面板10电连接，所述第二走线层33与所述触控面板20电连接，所述柔性电路板35电连接于所述第一走线层32远离所述显示面板33的一端。本实施例中采用双层走线的覆晶薄膜30增加走线布置的面积，只需要额外连接一个柔性电路板即可实现触控面板和显示面板的电连接及驱动。
本实施例中，所述显示面板10包括显示区102及围绕所述显示区设置的所述非显示区101。所述非显示区101内设有数条走线，用于为显示区内的器件提供电连接通道。如图4，所述非显示区101表面设有数个端子103，用于与第一走线层32电连接。所述边缘区202朝向所述显示面板10的表面设有端子203，用于与所述第二走线层33电连接。
所述基板31可以为柔性板，所述基层31设有通孔311，所述第一走线层32和第二走线层33为金属层加工形成且均包括多条走线。所述第一走线层32上的走线通过所述通孔311与所述第二走线层33上的走线或者电气元件电连接。所述第一走线层32和第二走线层33的表面均设有封装层34，用于保护所述第一走线层32和第二走线层33。所述驱动装置35为驱动显示面板驱动电路。其它实施方式中，所述驱动装置包括显示驱动芯片和触控面板的触控驱动芯片。所述驱动装置35嵌设于所述封装层上并与第一走线层32和第二走线层33电连接，具体的第一走线层32上与所述驱动装置35连接的线路通过设于所述基板31的通孔311实现。
请参阅图3，为图2的内部结构放大示意图，本实施例中，所述覆晶薄膜 30的第一走线层32的一端部设有第一贴合部A，所述第二走线层33上与所述第一贴合部A相对应的端部设有第二贴合部B，所述覆晶薄膜30通过第一贴合部A与所述显示面板10的非显示区101固定连接，所述覆晶薄膜30通过所述第二贴合部B与所述触控面板20的边缘区202固定连接。
一并参阅图4，所述第一走线层32设有第一贴合部A的端部端表面还设有第一导电端子321。所述第二走线层33设有第二贴合部的端部设有第二导电端子331，所述第一走线层32通过第一导电端子321与所述显示面板10电连接，所述第二走线层33通过第二导电端子331与所述触控面板20电连接。具体的，所述第一导电端子321为多个，其可以与所述第一贴合部A穿插设置，也可以与所述第一贴合部A并排设置，只要在覆晶薄膜30与显示面板10绑定时保证第一导电端子321与数个端子103连接即可。所述第二导电端子331为多个，其可以与所述第二贴合部B穿插设置，也可以与所述第二贴合部B并排设置，只要在覆晶薄膜30与显示面板10绑定时保证第二导电端子331与数个端子203连接即可。当所述覆晶薄膜30与所述显示面板10和触控面板20固定时，所述第一导电端子321与所述显示面板10上非显示区101的数个端子103电连接。第二导电端子331与所述边缘区202的端子203电连接，进而使所述覆晶薄膜30与所述显示面板10和触控面板20电连接。
如图2，本实施例中，所述第一走线层32上远离所述第一导电端子321的另一端连接部C，所述柔性电路板40通过所述连接部C与所述覆晶薄膜30固定连接并实现电连接。当所述驱动装置上未设有触控芯片时，所述柔性电路板40上设有触控芯片，所述触控芯片通过所述覆晶薄膜30与所述触控面板20连接。。
本发明所述的触控显示屏利用具有第一走线层32和第二走线层33的覆晶薄膜与一个柔性电路板连接即可实现显示驱动和触控驱动，相较于现有技术节省了一个柔性电路板，而且覆晶薄膜30夹持于显示面板10与触控面板20之间，柔性电路板连接于覆晶薄膜30上，避免了覆晶薄膜30与电路板层叠而增加工艺难度。
请参阅图2与图6，本发明还提供一种触控显示屏制作方法，所述方法包括，
步骤S1，将显示面板10和触控面板20通过光学胶25贴合，并且使所述 显示面板10的非显示区101与所述触控面板20的边缘区202之间具有间隙15。
步骤S2，将覆晶薄膜30的一端插入所述间隙15，使所述覆晶薄膜30的第一走线层32朝向所述非显示区101，所述覆晶薄膜30的第二走线层33朝向所述边缘区202；所述覆晶薄膜30固定于所述间隙15的端部与所述光学胶25间隔设置，便于覆晶薄膜30与触控显示屏连接位置的散热。本实施例中，包括，先柔性电路板40固定于所述第一走线层32的一端且与所述第一走线层32和第二走线层33电连接，再将将覆晶薄膜30的一端插入所述间隙。
步骤S3，通过热压方式绑定所述覆晶薄膜30与显示面板10和触控面板20，使所述第一走线层32与所述非显示区101固定并电连接，所述第二走线层33与所述边缘区202固定并电连接。具体的，包括在第一走线层32的一端部设置第一贴合部，在所述第二走线层33上与所述第一贴合部相对应的端部设置第二贴合部，然后再通过热压方式绑定所述覆晶薄膜30与显示面板10和触控面板20，通过第一贴合部使所述第一走线,32与所述非显示区101固定，通过第二贴合部所述第二走线层33与所述边缘区202固定，所述第一导电端子321与所述显示面板上非显示区101的数个端子电连接。第二导电端子331与所述边缘区202的端子电连接。通过此步骤一次即可实现触控显示屏与覆晶薄膜30的组装。
在其它实施方式中，在上述步骤3完成后，再将柔性电路板固定于所述第一走线层的远离所述显示面板的一端且与所述第一走线层和第二走线层电连接，其中，先在所述第一层走线层32远离所述显示面板10的端部设置连接部，主要通过焊接方式使柔性电路板通过连接部焊接在覆晶薄膜30上并通过金属焊盘实现电连接。
本发明实施例所述的触控显示屏制作方法是先将触控面板20和显示面板10粘贴固定，然后再将覆晶薄膜30绑定于触控面板20和显示面板10上实现电连接，只需要一次绑定，减少工艺步骤，而柔性电路板是焊接于覆晶薄膜30远离显示面板10的端部，而且只需要一个柔性电路板可以实现显示和触控的驱动，节省了材料。实际上，本方法中节省了一个触控柔性电路板，还可以避免在显示面板和触控面板组装时与覆晶薄膜30重叠，避免影响贴合的质量。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技 术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (12)

  1. 一种触控显示屏，其特征在于，包括显示面板、层叠于所述显示面板上的触控面板、柔性电路板以及覆晶薄膜，所述覆晶薄膜包括基层和层叠于所述基层相对的两个表面上的第一走线层和第二走线层；
    所述覆晶薄膜固定于所述显示面板的非显示区与所述触控面板的边缘区之间，并且所述第一走线层与所述显示面板电连接，所述第二走线层与所述触控面板电连接，所述柔性电路板固定于所述第一走线层远离所述显示面板的一端并与所述第一走线层电连接。
  2. 如权利要求1所述触控显示屏，其特征在于，所述覆晶薄膜的第一走线层的一端部设有第一贴合部，所述第二走线层上与所述第一贴合部相对应的端部设有第二贴合部，所述覆晶薄膜通过第一贴合部与所述显示面板的非显示区固定连接，所述覆晶薄膜通过所述第二贴合部与所述触控面板的边缘区固定连接。
  3. 如权利要求2所述触控显示屏，其特征在于，所述第一走线层设有第一贴合部的端部还设有第一导电端子，所述第二走线层的设有第二贴合的端部还设有第二导电端子，所述第一走线层通过第一导电端子与所述显示面板电连接，所述第二走线层通过第二导电端子与所述触控面板电连接。
  4. 如权利要求3所述触控显示屏，其特征在于，所述第一走线层上远离所述第一导电端子的另一端连接部，所述柔性电路板通过所述连接部与所述覆晶薄膜固定连接并实现电连接。
  5. 如权利要求1-4任一项所述触控显示屏，其特征在于，所述基层设有通孔，所述第一走线层上的走线通过所述通孔与所述第二走线层上的走线或者电气元件电连接。
  6. 如权利要求5所述触控显示屏，其特征在于，所述第二走线层上设有驱动装置，所述驱动装置设于所述第二走线层表面与所述第一走线层和第二走线层电连接，所述触控面板的触控芯片设于所述柔性电路板上，或者集成于所述驱动装置上。
  7. 一种触控显示屏制作方法，其特征在于，包括，
    将显示面板和触控面板通过光学胶贴合，并且使所述显示面板的非显示区 与所述触控面板的边缘区之间具有间隙；
    将覆晶薄膜的一端插入所述间隙，使所述覆晶薄膜的第一走线层朝向所述非显示区，所述覆晶薄膜的第二走线层朝向所述边缘区；
    通过热压方式绑定所述覆晶薄膜与显示面板和触控面板，使所述第一走线层与所述非显示区固定并电连接，所述第二走线层与所述边缘区固定并电连接。
  8. 如权利要求7所述触控显示屏制作方法，其特征在于，在步骤“将覆晶薄膜的一端插入所述间隙”中，包括，先将柔性电路板固定于所述第一走线层的一端且与所述第一走线层和第二走线层电连接，再将将覆晶薄膜的一端插入所述间隙。
  9. 如权利要求7所述触控显示屏制作方法，其特征在于，所述步骤“通过热压方式绑定所述覆晶薄膜与显示面板和触控面板，使所述第一走线层与所述非显示区固定并电连接，所述第二走线层与所述边缘区固定并电连接”包括在第一走线层的一端部设置第一贴合部，在所述第二走线层上与所述第一贴合部相对应的端部设置第二贴合部，然后再通过热压方式绑定所述覆晶薄膜与显示面板和触控面板，通过第一贴合部使所述第一走线层与所述非显示区固定，通过第二贴合部所述第二走线层与所述边缘区固定。
  10. 如权利要求7所述触控显示屏制作方法，其特征在于，还包括步骤，在所述第一层走线层远离所述显示面板的端部设置连接部，将柔性电路板与所述连接部固定并与所述第一走线层电连接。
  11. 如权利要求7所述触控显示屏制作方法，其特征在于，所述覆晶薄膜固定于所述间隙的端部与所述光学胶间隔设置。
  12. 一种显示设备，其特征在于，包括权利要求7-11任一项触控显示屏制作方法形成的触控显示屏。
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