WO2018176545A1 - 显示模组及终端 - Google Patents

显示模组及终端 Download PDF

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Publication number
WO2018176545A1
WO2018176545A1 PCT/CN2017/082045 CN2017082045W WO2018176545A1 WO 2018176545 A1 WO2018176545 A1 WO 2018176545A1 CN 2017082045 W CN2017082045 W CN 2017082045W WO 2018176545 A1 WO2018176545 A1 WO 2018176545A1
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WO
WIPO (PCT)
Prior art keywords
pad
disposed
conductive portion
conductive
display module
Prior art date
Application number
PCT/CN2017/082045
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English (en)
French (fr)
Inventor
曹洪睿
秦杰辉
Original Assignee
武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/544,880 priority Critical patent/US20190101782A1/en
Publication of WO2018176545A1 publication Critical patent/WO2018176545A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/42—Arrangements for providing conduction through an insulating substrate

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display module and a terminal using the display module.
  • the existing display module 200 generally includes a display panel 201, a driver chip (Driver IC) 202, and a circuit board 205 that carries analog and digital signal transmission media.
  • the display module 200 currently applied to the terminal transmits the signal to the driving chip 202 on the display panel 201.
  • the display panel 201 includes a display area 2011 and a frame area 2012 disposed on one side of the display area 2011.
  • the driving chip 202 is disposed on the front side.
  • the frame area 2012 is fixed on the front surface of the array substrate 203, and the partial pins 2021 of the driving chip 202 are electrically connected to the signal traces in the display area 2011, and the pad group 204 is arranged on the side of the driving chip 202 away from the display area 2011.
  • the pad group 204 is also disposed on the front surface of the array substrate 203 and forms a bonding area 2013.
  • the other part of the driving chip 202 is electrically connected to the pad group 204, and the circuit board 205 is fixed to the binding area 2013 and bound.
  • the pad group 204 is passed to pass the signal to the driver chip 202 through the pad group 204.
  • the screen of the display module 200 is made relatively poor.
  • the technical problem to be solved by the present invention is to provide a display module and a terminal with a relatively large screen.
  • a display module including:
  • the array substrate includes oppositely disposed top and bottom surfaces and via holes penetrating the top surface to the bottom surface, the via holes being filled with a conductive material to form a conductive portion;
  • a driving chip disposed on the top surface, a portion of the driving chip is electrically connected to the conductive portion;
  • a pad group disposed on the bottom surface and facing the driving chip, the pad group being electrically connected to the conductive portion;
  • a flexible circuit board bonded to the set of pads.
  • the display module further includes a first pad, the first pad is disposed on the top surface and is connected to the conductive portion, and an area of the first pad is larger than a cross-sectional area of the via hole.
  • the pin is connected to the first pad.
  • the display module further includes a second pad, the second pad is disposed on the bottom surface and connected to the conductive portion, and an area of the second pad is larger than a cross-sectional area of the via hole.
  • the set of pads connects the second pads.
  • the first pad, the second pad, and the conductive portion are integrally formed.
  • the pad group is integrally formed with the conductive portion.
  • a first conductive paint layer covering the conductive portion is disposed on the top surface, the first conductive paint layer covers the conductive portion, and an area of the first conductive paint layer is larger than a cross section of the via hole The area is connected to the first conductive paint layer.
  • a second conductive paint layer covering the conductive portion is disposed on the bottom surface, the second conductive paint layer covers the conductive portion, and an area of the second conductive paint layer is larger than a cross-sectional area of the via hole
  • the pad set is coupled to the second conductive paint layer.
  • the pins are disposed on two sides of the body of the driving chip, the via holes are disposed away from the body, and the conductive portion is connected to an end portion of the pad group.
  • the pin is disposed at a bottom of the body of the driving chip, the via is disposed to the body, and the conductive portion is connected to a middle portion of the pad group.
  • a terminal comprising the display module of any of the above.
  • the present invention has the following beneficial effects:
  • the display module of the embodiment of the present invention has the driving chip and the pad group respectively disposed on opposite sides of the array substrate, and the pad group is disposed opposite to the driving chip, so
  • the display module can eliminate the binding area in the prior art, thereby reducing the width of the border area of the display module, so that The screen of the display module is relatively large, which is beneficial to realize the narrow bezel design of the terminal.
  • FIG. 1 is a schematic structural view of a display module in the background art.
  • FIG. 2 is a top plan view of an embodiment of a display module provided by the present invention.
  • FIG. 3 is a bottom view of the display module of FIG. 2.
  • Figure 4 is a cross-sectional view of one embodiment of the structure at IV-IV of Figure 2.
  • Figure 5 is an enlarged schematic view of an embodiment of the structure at V in Figure 4.
  • Figure 6 is a cross-sectional view of another embodiment of the structure of IV-IV of Figure 2.
  • Figure 7 is an enlarged schematic view of another embodiment of the structure at V in Figure 4.
  • Figure 8 is an enlarged schematic view of still another embodiment of the structure of Figure V in Figure 4.
  • Figure 9 is an enlarged schematic view of still another embodiment of the structure of Figure V in Figure 4.
  • FIG. 10 is a top plan view of another embodiment of a display module provided by the present invention.
  • Figure 11 is a bottom plan view of the display module of Figure 10.
  • Figure 12 is a cross-sectional view showing the structure at X-X in Figure 10.
  • Figure 13 is an enlarged schematic view showing the structure of XII in Figure 12.
  • the fixed connection may also be detachably connected or integrally connected; it may be a mechanical connection; it may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
  • an embodiment of the present invention provides a terminal, where the terminal includes a display module 100, and the display module 100 is configured to implement a display function.
  • the terminal can be a computer, a television, a tablet or a mobile phone.
  • the display module 100 includes an array substrate 1 , a driver chip (Driver IC) 2 , a pad group 3 , and a flexible printed circuit (FPC) 4 .
  • the array substrate 1 includes a top surface 11 and a bottom surface 12 opposite to each other and a through hole 13 penetrating the top surface 11 to the bottom surface 12 .
  • the via hole 13 is filled with a conductive material to form the conductive portion 14 .
  • the driving chip 2 includes a body 21 and a lead 22 connecting the body 21.
  • the driving chip 2 is disposed on the top surface 11 , and a portion of the pins 22 of the driving chip 2 are electrically connected to the conductive portion 14 .
  • the pad group 3 is disposed on the bottom surface 12 and faces the driving chip 2, and the pad group 3 is electrically connected to the conductive portion 14.
  • the flexible circuit board 4 is bonded to the pad group 3.
  • the display module 100 includes a display area 101 and a frame area 102 disposed on a side of the display area 101.
  • the array substrate 1 extends from the display area 101 to the bezel area 102, and the driving chip 2, the pad group 3, and the flexible circuit board 4 are all located in the bezel area 102. Another portion of the pins 22 of the driver chip 2 are electrically coupled to signal traces within the display area 101.
  • the display The module 100 can be a liquid crystal display module or an organic light emitting diode display module. As shown in FIG. 4 , when the display module 100 is a liquid crystal display module, the display module 100 further includes a backlight module 5 , a liquid crystal layer 6 , and a color filter substrate 7 .
  • the backlight module 5 is disposed on the bottom surface 12 and located in the display area 101.
  • the liquid crystal layer 6 is disposed on the top surface 11 and located in the display area 101.
  • the color filter substrate 7 is located on a side of the liquid crystal layer 6 away from the array substrate 1.
  • the display module 100 when the display module 100 is an OLED display module, the display module 100 further includes a luminescent layer 8 and a protective layer 9 , and the luminescent layer 8 is disposed on the top surface 11 .
  • the protective layer 9 is located on a side of the light-emitting layer 8 away from the array substrate 1 for protecting the light-emitting layer 8.
  • the display module 100 is disposed on the opposite sides of the array substrate 1 respectively, and the pad group 3 is facing the opposite side.
  • the display module 100 can be omitted, so that the binding area of the prior art can be omitted, thereby reducing the width of the frame area 102 of the display module 100, so that the screen of the display module 100 is It is relatively large and is beneficial to realize the narrow bezel design of the terminal.
  • the number of the pins 22 electrically connected to the flexible circuit board 4 is N, N ⁇ 2 and is an integer.
  • the number of the via holes 13 is M, and M is a positive integer.
  • M is greater than or equal to N
  • at least N of the via holes 13 are filled with a conductive material in a one-to-one correspondence to form at least N of the conductive portions 14, and the pins 22 are connected to the different one-to-one correspondingly.
  • Conductive portion 14 When M is smaller than N, a conductive material and an insulating material may be simultaneously filled in the via hole 13.
  • the filled insulating material forms a spacer, and the isolation portion blocks the filled conductive material to form a plurality of conductive portions. 14.
  • the number of the conductive portions 14 that are finally formed is greater than or equal to N, and the pins 22 can be connected to the different conductive portions 14 in a one-to-one correspondence.
  • the pad group 3 includes a plurality of pads 31 that are connected to the different conductive portions 14 in a one-to-one correspondence.
  • the flexible circuit board 4 includes a flexible substrate 41 and a plurality of connection pads 42 disposed on the flexible substrate 41.
  • the connection pads 42 are connected to the different conductive portions 14 in a one-to-one correspondence.
  • the conductive material may be copper, tin, silver, gold, or the like.
  • the display module 100 further includes a first pad 141.
  • the first pad 141 is disposed on the top surface 11 and connected to the conductive portion 14.
  • the area of the first pad 141 is larger than the cross-sectional area of the via hole 13 (the via hole 13 is perpendicular to the same Axis The area of the plane of the line), the pin 22 is connected to the first pad 141.
  • the via hole 13 having a small cross-sectional area may be disposed. Since the area of the first pad 141 is larger than the cross-sectional area of the via hole 13, the area of the first pad 141 is large, and the pin 22 can be easily connected to the first pad. 141 and the connection area is large, so that the electrical connection relationship between the pin 22 and the conductive portion 14 is reliable.
  • the number of the first pads 141 is equal to the number of the conductive portions 14.
  • the first pad 141 is integrally formed with the conductive portion 14 , so that the connection relationship between the first pad 141 and the conductive portion 14 is reliable, and the manufacturing process of the display module 100 can be simplified. The production cost of the display module 100 is reduced.
  • the pin 22 may be soldered to the first pad 141, or the pin 22 may be connected to the first pad 141 by a conductive paste, a conductive film, or the like.
  • the display module 100 includes a second pad 142 and a first pad 141 described in the above embodiment.
  • the second pad 142 is disposed on the bottom surface 12 and connected to the conductive portion 14.
  • the area of the second pad 142 is larger than the cross-sectional area of the via hole 13.
  • the pad group 3 is connected to the Second pad 142.
  • the area of the second pad 142 is larger than the cross-sectional area of the via hole 13, the area of the second pad 142 is large, and the pad group 3 can be easily connected. To the second pad 142 and the connection area is large, so that the electrical connection relationship between the pad group 3 and the conductive portion 14 is reliable.
  • the number of the second pads 142 is equal to the number of the conductive portions 14.
  • the first pad 141, the second pad 142, and the conductive portion 14 are integrally formed. At this time, the connection relationship between the first pad 141, the second pad 142, and the conductive portion 14 is reliable, and the manufacturing process of the display module 100 can be simplified, and the display module can be reduced. 100 production costs.
  • the pin 22 may be soldered to the first pad 141, or the pin 22 may be connected to the first pad 141 by a conductive paste, a conductive film, or the like.
  • the pad group 3 may be soldered to the second pad 142, or the pad group 3 may be connected to the second pad 142 by a conductive paste, a conductive film, or the like.
  • the pad group 3 is integrally formed with the conductive portion 14 such that the connection relationship between the pad group 3 and the conductive portion 14 is reliable, and The production cost of the display module 100 is reduced.
  • the display module 100 can also be provided with the first pad 141 described in the above embodiment.
  • a first conductive paint layer 143 covering the conductive portion 14 is disposed on the top surface 11.
  • the first conductive paint layer 143 covers the conductive portion 14, the area of the first conductive paint layer 143 is larger than the cross-sectional area of the via hole 13, and the pin 22 is connected to the first conductive paint layer 143.
  • the area of the first conductive paint layer 143 is large, the pin 22 can be easily connected to the first conductive paint layer 143 and the connection area is large, so that the pin 22 and the conductive The electrical connection relationship of the portion 14 is reliable.
  • the number of the first conductive paint layers 143 is equal to the number of the conductive portions 14.
  • a second conductive paint layer 144 covering the conductive portion 14 is disposed on the bottom surface 12, and the second conductive paint layer 144 covers the conductive portion 14.
  • the area of the second conductive paint layer 144 is larger than The cross-sectional area of the via 13 is described, and the pad group 3 is connected to the second conductive paint layer 144.
  • the area of the second conductive paint layer 144 is large, the pad group 3 can be easily connected to the second conductive paint layer 144 and the connection area is large, so that the pad group 3 and The electrical connection relationship of the conductive portion 14 is reliable.
  • the number of the second conductive paint layers 144 is equal to the number of the conductive portions 14.
  • the first conductive paint layer 143 and the second conductive paint layer 144 may be formed by coating.
  • the pins 22 of the driving chip 2 are disposed on two sides of the body 21 of the driving chip 2 .
  • the via hole 13 is disposed away from the body 21 .
  • the via hole 13 can be disposed opposite the end of the pin 22 away from the body 21 , thereby facilitating the implementation of the pin 22 and the conductive portion 14 .
  • the conductive portion 14 is connected to an end of the pad group 3 such that the pad group 3 can be disposed opposite the body 21 to further reduce the width of the bezel region 102.
  • the pin 22 of the driving chip 2 is disposed at the bottom of the body 21 of the driving chip 2 .
  • the driving chip 2 is a flip chip, and the pin 22 is a solder ball disposed under the body 21, and the solder ball is disposed on the body 21 and the array.
  • the via 13 is disposed opposite the body 21, and the conductive portion 14 is connected to a middle portion of the pad group 3.
  • the via hole 13 can be disposed opposite to the body 21, thereby saving space on the side of the driving chip 2, and further The width of the bezel area 102 of the display module 100 is reduced.
  • both ends of the conductive portion 14 of the embodiment may also be provided with pads having a larger area (refer to the first pad 141 and the second pad 142 described in the foregoing embodiments) or a conductive paint layer (refer to the foregoing implementation).
  • the first conductive paint layer 143 and the second conductive paint layer 144 are exemplified to ensure reliable connection between the conductive portion 14 and the lead 22 and the pad group 3.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
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  • Engineering & Computer Science (AREA)
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Abstract

一种显示模组（100），包括阵列基板（1）、驱动芯片（2）、焊盘组（3）以及柔性电路板（4）。阵列基板（1）包括相对设置的顶面（11）和底面（12）以及贯穿顶面（11）至底面（12）的过孔（13），过孔（13）内填充导电材料以形成导电部（14）。驱动芯片（2）设于顶面（11），驱动芯片（2）的部分引脚（22）电连接至导电部（14）。焊盘组（3）设于底面（12）且正对驱动芯片（2），焊盘组（3）电连接至导电部（14），柔性电路板（4）绑定至焊盘组（3）。显示模组（100）屏占比较大。

Description

显示模组及终端
本发明要求2017年3月28日递交的发明名称为“显示模组及终端”的申请号201710191131.6的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及显示技术领域，尤其涉及一种显示模组以及一种应用所述显示模组的终端。
背景技术
如图1所示，现有显示模组200通常包括显示面板201、驱动芯片(Driver IC)202以及电路板205，电路板205是承载模拟与数字信号传递媒介。目前应用于终端的显示模组200将信号传递至显示面板201上的驱动芯片202的方式是：显示面板201包括显示区2011和设于显示区2011一侧的边框区2012，驱动芯片202设于边框区2012内并固定在阵列基板203正面上，驱动芯片202部分引脚2021电连接至显示区2011内信号走线，在驱动芯片202的远离显示区2011的一侧排布焊盘组204，焊盘组204同样设置在阵列基板203正面上并形成绑定区(Boarder area)2013，驱动芯片202另一部分引脚2021电连接焊盘组204，电路板205固定至绑定区2013并绑定至焊盘组204，从而通过焊盘组204将信号传递至驱动芯片202。为了保证电路板205与焊盘组204接触良好，需要保证焊盘组204的焊盘长度足够，如此将导致绑定区2013占用较大面积，增加了显示面板201的边框区2012面积和比例，使得显示模组200的屏占比较差。
发明内容
本发明所要解决的技术问题在于提供一种屏占比较大的显示模组和终端。
为了实现上述目的，本发明实施方式采用如下技术方案：
一方面，提供一种显示模组，包括：
阵列基板，包括相对设置的顶面和底面以及贯穿所述顶面至所述底面的过孔，所述过孔内填充导电材料以形成导电部；
驱动芯片，设于所述顶面，所述驱动芯片的部分引脚电连接至所述导电部；
焊盘组，设于所述底面且正对所述驱动芯片，所述焊盘组电连接至所述导电部；以及
柔性电路板，绑定至所述焊盘组。
其中，所述显示模组还包括第一焊盘，所述第一焊盘设于所述顶面并连接所述导电部，所述第一焊盘的面积大于所述过孔的横截面积，所述引脚连接所述第一焊盘。
其中，所述显示模组还包括第二焊盘，所述第二焊盘设于所述底面并连接所述导电部，所述第二焊盘的面积大于所述过孔的横截面积，所述焊盘组连接所述第二焊盘。
其中，所述第一焊盘、所述第二焊盘以及所述导电部一体成型。
其中，所述焊盘组与所述导电部一体成型。
其中，在所述顶面设置覆盖所述导电部的第一导电油漆层，所述第一导电油漆层覆盖所述导电部，所述第一导电油漆层的面积大于所述过孔的横截面积，所述引脚连接至所述第一导电油漆层。
其中，在所述底面设置覆盖所述导电部的第二导电油漆层，所述第二导电油漆层覆盖所述导电部，所述第二导电油漆层的面积大于所述过孔的横截面积，所述焊盘组连接至所述第二导电油漆层。
其中，所述引脚设于所述驱动芯片的本体的两侧，所述过孔偏离所述本体设置，所述导电部连接至所述焊盘组的端部。
其中，所述引脚设于所述驱动芯片的本体的底部，所述过孔正对所述本体设置，所述导电部连接至所述焊盘组的中部。
另一方面，还提供一种终端，包括如上任一项所述的显示模组。
相较于现有技术，本发明具有以下有益效果：
本发明实施例所述显示模组将所述驱动芯片和所述焊盘组分别设于所述阵列基板的相对的两侧，且所述焊盘组正对所述驱动芯片设置，因此所述显示模组可省去现有技术中的绑定区，从而减小所述显示模组的边框区的宽度，使 得所述显示模组的屏占比较大，有利于实现所述终端的窄边框设计。
附图说明
为了更清楚地说明本发明的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是背景技术中的显示模组的结构示意图。
图2是本发明提供的显示模组的一种实施例的俯视图。
图3是图2所示显示模组的仰视图。
图4是图2中Ⅳ-Ⅳ处结构的一种实施例的剖视图。
图5是图4中Ⅴ处结构的一种实施例的放大示意图。
图6是图2中Ⅳ-Ⅳ处结构的另一种实施例的剖视图。
图7是图4中Ⅴ处结构的另一种实施例的放大示意图。
图8是图4中Ⅴ处结构的再一种实施例的放大示意图。
图9是图4中Ⅴ处结构的再另一种实施例的放大示意图。
图10是本发明提供的显示模组的另一种实施例的俯视图。
图11是图10所示显示模组的仰视图。
图12是图10中Ⅹ-Ⅹ处结构的剖视图。
图13是图12中Ⅻ处结构的放大示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
此外，以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明中所提到的方向用语，例如，“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等，仅是参考附加图式的方向，因此，使用 的方向用语是为了更好、更清楚地说明及理解本发明，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“设置在……上”应做广义理解，例如，可以是固定连接，也可以是可拆卸地连接，或者一体地连接；可以是机械连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
此外，在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语，其不仅是指独立的工序，在与其它工序无法明确区别时，只要能实现该工序所预期的作用则也包括在本用语中。另外，本说明书中用“～”表示的数值范围是指将“～”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中，结构相似或相同的单元用相同的标号表示。
请一并参阅图2至图6，本发明实施例提供一种终端，所述终端包括显示模组100，所述显示模组100用于实现显示功能。所述终端可以为电脑、电视、平板或手机等。
所述显示模组100包括阵列基板1、驱动芯片(Driver IC)2、焊盘组3以及柔性电路板(Flexible Printed Circuit，FPC)4。所述阵列基板1包括相对设置的顶面11和底面12以及贯穿所述顶面11至所述底面12的过孔13，所述过孔13内填充导电材料以形成导电部14。所述驱动芯片2包括本体21和连接所述本体21的引脚22。所述驱动芯片2设于所述顶面11，所述驱动芯片2的部分引脚22电连接至所述导电部14。所述焊盘组3设于所述底面12且正对所述驱动芯片2，所述焊盘组3电连接至所述导电部14。所述柔性电路板4绑定至所述焊盘组3。
所述显示模组100包括显示区101和设于所述显示区101侧边的边框区102。所述阵列基板1自所述显示区101延伸至所述边框区102，所述驱动芯片2、所述焊盘组3以及所述柔性电路板4均位于所述边框区102。所述驱动芯片2的另一部分引脚22电连接至所述显示区101内的信号走线。所述显示 模组100可以为液晶显示模组或有机发光二极管显示模组。如图4所示，所述显示模组100为液晶显示模组时，所述显示模组100还包括背光模组5、液晶层6以及彩膜基板7。所述背光模组5设于所述底面12且位于所述显示区101。所述液晶层6设于所述顶面11且位于所述显示区101。所述彩膜基板7位于所述液晶层6远离所述阵列基板1的一侧。如图6所示，所述显示模组100为有机发光二极管显示模组时，所述显示模组100还包括发光层8和保护层9，所述发光层8设于所述顶面11且位于所述显示区101，所述保护层9位于所述发光层8的远离所述阵列基板1的一侧，用于保护所述发光层8。
在本实施例中，由于所述显示模组100将所述驱动芯片2和所述焊盘组3分别设于所述阵列基板1的相对的两侧，且所述焊盘组3正对所述驱动芯片2设置，因此所述显示模组100可省去现有技术中的绑定区，从而减小所述显示模组100的边框区102的宽度，使得所述显示模组100的屏占比较大，有利于实现所述终端的窄边框设计。
可以理解的，电连接至所述柔性电路板4的所述引脚22的数量为N个，N≥2且为整数。所述过孔13的数量为M个，M为正整数。当M大于等于N时，至少N个所述过孔13内一一对应地填充导电材料，以形成至少N个所述导电部14，所述引脚22一一对应地连接至不同的所述导电部14。当M小于N时，可在所述过孔13内同时填充导电材料和绝缘材料，填充的所述绝缘材料形成隔离部，所述隔离部隔断填充的所述导电材料，以形成多个导电部14，使得最终成型的所述导电部14的数量大于等于N，所述引脚22能够一一对应地连接至不同的所述导电部14。
所述焊盘组3包括多个焊盘31，所述多个焊盘31一一对应地连接至不同的所述导电部14。
所述柔性电路板4包括柔性基材41和设于所述柔性基材41上的多个连接焊盘42，所述连接焊盘42一一对应地连接至不同的所述导电部14。
所述导电材料可为铜、锡、银、金等。
作为一种可选实施例，请一并参阅图3和图5，所述显示模组100还包括第一焊盘141。所述第一焊盘141设于所述顶面11并连接所述导电部14，所述第一焊盘141的面积大于所述过孔13的横截面积(所述过孔13垂直于其轴 线的平面的面积)，所述引脚22连接所述第一焊盘141。
在本实施例中，为保证所述阵列基板1的结构强度，可设置较小横截面积的所述过孔13。由于所述第一焊盘141的面积大于所述过孔13的横截面积，因此所述第一焊盘141的面积较大，所述引脚22能够容易地连接至所述第一焊盘141且连接面积较大，从而使得所述引脚22与所述导电部14的电连接关系可靠。
所述第一焊盘141的数量等于所述导电部14的数量。
所述第一焊盘141与所述导电部14一体成型，使得所述第一焊盘141与所述导电部14之间的连接关系可靠，还可简化所述显示模组100的制作工艺，降低所述显示模组100的生产成本。
所述引脚22可焊接至所述第一焊盘141，或所述引脚22通过导电胶、导电薄膜等实现与所述第一焊盘141的连接。
作为另一种可选实施例，请参阅图7，所述显示模组100包括第二焊盘142和上述实施例中所述的第一焊盘141。所述第二焊盘142设于所述底面12并连接所述导电部14，所述第二焊盘142的面积大于所述过孔13的横截面积，所述焊盘组3连接所述第二焊盘142。
在本实施例中，由于所述第二焊盘142的面积大于所述过孔13的横截面积，因此所述第二焊盘142的面积较大，所述焊盘组3能够容易地连接至所述第二焊盘142且连接面积较大，从而使得所述焊盘组3与所述导电部14的电连接关系可靠。
所述第二焊盘142的数量等于所述导电部14的数量。
所述第一焊盘141、所述第二焊盘142以及所述导电部14一体成型。此时，所述第一焊盘141、所述第二焊盘142以及所述导电部14之间的连接关系可靠，还可简化所述显示模组100的制作工艺，降低所述显示模组100的生产成本。
所述引脚22可焊接至所述第一焊盘141，或所述引脚22通过导电胶、导电薄膜等实现与所述第一焊盘141的连接。所述焊盘组3可焊接至所述第二焊盘142，或所述焊盘组3通过导电胶、导电薄膜等实现与所述第二焊盘142的连接。
作为再一种可选实施例，请参阅图8，所述焊盘组3与所述导电部14一体成型，使得所述焊盘组3与所述导电部14之间的连接关系可靠，并降低所述显示模组100的生产成本。此时，所述显示模组100也可同时设有上述实施例中所述的第一焊盘141。
作为再另一种可选实施例，请参阅图9，在所述顶面11设置覆盖所述导电部14的第一导电油漆层143。所述第一导电油漆层143覆盖所述导电部14，所述第一导电油漆层143的面积大于所述过孔13的横截面积，所述引脚22连接至所述第一导电油漆层143。此时，所述第一导电油漆层143的面积较大，所述引脚22能够容易地连接至所述第一导电油漆层143且连接面积较大，使得所述引脚22与所述导电部14的电连接关系可靠。
所述第一导电油漆层143的数量等于所述导电部14的数量。
进一步地，在所述底面12设置覆盖所述导电部14的第二导电油漆层144，所述第二导电油漆层144覆盖所述导电部14，所述第二导电油漆层144的面积大于所述过孔13的横截面积，所述焊盘组3连接至所述第二导电油漆层144。此时，所述第二导电油漆层144的面积较大，所述焊盘组3能够容易地连接至所述第二导电油漆层144且连接面积较大，从而使得所述焊盘组3与所述导电部14的电连接关系可靠。
所述第二导电油漆层144的数量等于所述导电部14的数量。
可通过涂布的方式形成所述第一导电油漆层143和所述第二导电油漆层144。
作为一种可选实施例，请一并参阅图2至图9，所述驱动芯片2的所述引脚22设于所述驱动芯片2的本体21的两侧。所述过孔13偏离所述本体21设置，例如，所述过孔13可正对所述引脚22远离所述本体21的末端设置，从而方便实现所述引脚22与所述导电部14的连接关系。所述导电部14连接至所述焊盘组3的端部，从而使得所述焊盘组3可以正对所述本体21设置，以进一步缩小所述边框区102的宽度。
作为另一种可选实施例，请一并参阅图10至图13，所述驱动芯片2的所述引脚22设于所述驱动芯片2的本体21的底部。所述驱动芯片2为倒装芯片，所述引脚22为设于所述本体21下方的锡球，锡球设于所述本体21与所述阵 列基板1的所述顶面11之间。所述过孔13正对所述本体21设置，所述导电部14连接至所述焊盘组3的中部。
在本实施例中，由于所述引脚22设于所述本体21的底部，因此所述过孔13可正对所述本体21设置，从而节约了所述驱动芯片2侧边的空间，进一步缩小了所述显示模组100的所述边框区102的宽度。
进一步地，本实施例所述导电部14的两端同样可设置面积较大的焊盘(参考前述实施例所述第一焊盘141和第二焊盘142)或导电油漆层(参考前述实施例所述第一导电油漆层143和第二导电油漆层144)，从而保证所述导电部14与所述引脚22和所述焊盘组3之间的连接可靠。
以上对本发明实施例进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种显示模组，其中，包括：
    阵列基板，包括相对设置的顶面和底面以及贯穿所述顶面至所述底面的过孔，所述过孔内填充导电材料以形成导电部；
    驱动芯片，设于所述顶面，所述驱动芯片的部分引脚电连接至所述导电部；
    焊盘组，设于所述底面且正对所述驱动芯片，所述焊盘组电连接至所述导电部；以及
    柔性电路板，绑定至所述焊盘组。
  2. 如权利要求1所述的显示模组，其中，所述显示模组还包括第一焊盘，所述第一焊盘设于所述顶面并连接所述导电部，所述第一焊盘的面积大于所述过孔的横截面积，所述引脚连接所述第一焊盘。
  3. 如权利要求2所述的显示模组，其中，所述显示模组还包括第二焊盘，所述第二焊盘设于所述底面并连接所述导电部，所述第二焊盘的面积大于所述过孔的横截面积，所述焊盘组连接所述第二焊盘。
  4. 如权利要求3所述的显示模组，其中，所述第一焊盘、所述第二焊盘以及所述导电部一体成型。
  5. 如权利要求1所述的显示模组，其中，所述焊盘组与所述导电部一体成型。
  6. 如权利要求1所述的显示模组，其中，在所述顶面设置覆盖所述导电部的第一导电油漆层，所述第一导电油漆层覆盖所述导电部，所述第一导电油漆层的面积大于所述过孔的横截面积，所述引脚连接至所述第一导电油漆层。
  7. 如权利要求6所述的显示模组，其中，在所述底面设置覆盖所述导电部的第二导电油漆层，所述第二导电油漆层覆盖所述导电部，所述第二导电油漆层的面积大于所述过孔的横截面积，所述焊盘组连接至所述第二导电油漆层。
  8. 如权利要求1所述的显示模组，其中，所述引脚设于所述驱动芯片的本体的两侧，所述过孔偏离所述本体设置，所述导电部连接至所述焊盘组的端部。
  9. 如权利要求4所述的显示模组，其中，所述引脚设于所述驱动芯片的本体的两侧，所述过孔偏离所述本体设置，所述导电部连接至所述焊盘组的端部。
  10. 如权利要求1所述的显示模组，其中，所述引脚设于所述驱动芯片的本体的底部，所述过孔正对所述本体设置，所述导电部连接至所述焊盘组的中部。
  11. 一种终端，其中，包括显示模组，所述显示模组包括：
    阵列基板，包括相对设置的顶面和底面以及贯穿所述顶面至所述底面的过孔，所述过孔内填充导电材料以形成导电部；
    驱动芯片，设于所述顶面，所述驱动芯片的部分引脚电连接至所述导电部；
    焊盘组，设于所述底面且正对所述驱动芯片，所述焊盘组电连接至所述导电部；以及
    柔性电路板，绑定至所述焊盘组。
  12. 如权利要求11所述的终端，其中，所述显示模组还包括第一焊盘，所述第一焊盘设于所述顶面并连接所述导电部，所述第一焊盘的面积大于所述过孔的横截面积，所述引脚连接所述第一焊盘。
  13. 如权利要求12所述的终端，其中，所述显示模组还包括第二焊盘，所述第二焊盘设于所述底面并连接所述导电部，所述第二焊盘的面积大于所述过孔的横截面积，所述焊盘组连接所述第二焊盘。
  14. 如权利要求13所述的终端，其中，所述第一焊盘、所述第二焊盘以及所述导电部一体成型。
  15. 如权利要求11所述的终端，其中，所述焊盘组与所述导电部一体成型。
  16. 如权利要求11所述的终端，其中，在所述顶面设置覆盖所述导电部的第一导电油漆层，所述第一导电油漆层覆盖所述导电部，所述第一导电油漆层的面积大于所述过孔的横截面积，所述引脚连接至所述第一导电油漆层。
  17. 如权利要求16所述的终端，其中，在所述底面设置覆盖所述导电部的第二导电油漆层，所述第二导电油漆层覆盖所述导电部，所述第二导电油漆层的面积大于所述过孔的横截面积，所述焊盘组连接至所述第二导电油漆层。
  18. 如权利要求11所述的终端，其中，所述引脚设于所述驱动芯片的本体的两侧，所述过孔偏离所述本体设置，所述导电部连接至所述焊盘组的端部。
  19. 如权利要求14所述的终端，其中，所述引脚设于所述驱动芯片的本 体的两侧，所述过孔偏离所述本体设置，所述导电部连接至所述焊盘组的端部。
  20. 如权利要求11所述的终端，其中，所述引脚设于所述驱动芯片的本体的底部，所述过孔正对所述本体设置，所述导电部连接至所述焊盘组的中部。
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