WO2020156456A1 - 柔性电路板及制作方法、电子装置模组及电子装置 - Google Patents

柔性电路板及制作方法、电子装置模组及电子装置 Download PDF

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Publication number
WO2020156456A1
WO2020156456A1 PCT/CN2020/073850 CN2020073850W WO2020156456A1 WO 2020156456 A1 WO2020156456 A1 WO 2020156456A1 CN 2020073850 W CN2020073850 W CN 2020073850W WO 2020156456 A1 WO2020156456 A1 WO 2020156456A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
wiring
contact pads
sub
functional
Prior art date
Application number
PCT/CN2020/073850
Other languages
English (en)
French (fr)
Inventor
熊韧
汤强
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to JP2020561083A priority Critical patent/JP2022519959A/ja
Priority to US16/766,787 priority patent/US11412613B2/en
Priority to EP20748341.3A priority patent/EP3920670A4/en
Publication of WO2020156456A1 publication Critical patent/WO2020156456A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the embodiments of the present disclosure relate to a flexible circuit board and a manufacturing method thereof, an electronic device module, and an electronic device.
  • Flexible Printed Circuit is a highly reliable and flexible printed circuit board made of flexible film as a substrate.
  • Flexible circuit boards have the characteristics of high wiring density, light weight, thin thickness, and good flexibility, and are widely used in various electronic devices such as mobile phones, computers, and displays.
  • At least one embodiment of the present disclosure provides a flexible circuit board, which includes a main sub-circuit board and an adapter sub-circuit board.
  • the main body sub-circuit board includes a first switching end, a first wiring part, and a second wiring part, the first switching end includes a plurality of first contact pads, the first wiring part and the second wiring part
  • the wiring parts are spaced apart from each other and are electrically connected to the first set of first contact pads and the second set of first contact pads of the first transfer end;
  • the transfer sub-circuit board includes a second transfer end and a
  • the third wiring part of the functional wiring, the second switching end includes a plurality of second contact pads, and the third wiring part connects the first set of second contact pads and the second Group of second contact pads are electrically connected;
  • the adapter sub-circuit board is configured to electrically connect the first group of second contact pads and the second group of second contact pads of the second adapter terminal respectively The first group of first contact pads and the second group of first contact pads to the first adapt
  • the adapter sub-circuit board is mounted on the main body sub-circuit board so that the first wiring part, the third wiring part and the The second wiring part is sequentially electrically connected to obtain the first functional wiring.
  • the flexible circuit board provided by at least one embodiment of the present disclosure further includes a first control circuit combination structure, wherein the first control circuit combination structure is disposed on the main body sub-circuit board and is connected to the first wiring portion Connection, or the first control circuit combination structure is provided on the transfer sub-circuit board and is electrically connected to the third wiring part; the first control circuit combination structure is configured to route the first function The wire provides the first electrical signal or receives the first electrical signal from the first functional trace.
  • the main body sub-circuit board further includes a second function wiring, and the second function wiring is connected to the first control circuit provided on the main body sub-circuit board.
  • the circuit combination structure is electrically connected, and the first control circuit is further configured to provide a second electrical signal to the second functional wiring or receive a second electrical signal from the second functional wiring.
  • the main body sub-circuit board further includes a third functional wiring, and the third functional wiring is in contact with a third group of first contacts of the first switching end
  • the transfer sub-circuit board further includes a fourth wiring part electrically connected to the third group of second contact pads of the second switching end, and the third function The wire is electrically connected to the fourth set of the transfer sub-circuit board through the third set of first contact pads of the first transfer end and the third set of second contact pads of the second transfer end The wiring part.
  • the third functional trace is located between the first trace portion and the second trace portion, and the third group of first contacts Pads are located between the first contact pads of the first group and the first contact pads of the second group.
  • the main body sub-circuit board includes a first substrate, and a first wiring layer and a first insulating layer stacked on one side of the first substrate.
  • the first wiring layer includes the first wiring portion, the second wiring portion, the second functional wiring, and the first switching end, and multiple first contacts of the first switching end The pad is exposed by the first insulating layer.
  • the adapter sub-circuit board includes: a second substrate, a second wiring layer and a second insulating layer on the first side of the second substrate,
  • the second wiring layer includes the third wiring portion; a third wiring layer and a third insulating layer on the second side of the second substrate, and the third wiring layer includes the fourth The wiring portion and the second transition end, the multiple second contact pads of the second transition end are exposed by the third insulating layer, and both ends of the third wiring portion are connected to the The first set of second contact pads and the second set of second contact pads of the second transfer end are electrically connected; wherein, the second side is opposite to the first side.
  • the adapter sub-circuit board includes: a second substrate, a second wiring layer and a second insulating layer on the first side of the second substrate,
  • the second wiring layer includes the third wiring portion and the second transition end, a plurality of second contact pads of the second transition end are exposed by the second insulating layer;
  • the third set of second contact pads of the terminal are electrically connected; wherein, the second side is opposite to the first side.
  • the second side is closer to the main body sub-circuit board than the first side.
  • the adapter sub-circuit board further includes a shielding layer located between the second wiring layer and the third wiring layer.
  • the second transfer end of the transfer sub-circuit board is connected to the main sub-circuit board through anisotropic conductive glue, soldering material or a connector The first switching end.
  • At least one embodiment of the present disclosure provides an electronic device module including an electronic device substrate and any of the above-mentioned flexible circuit boards; wherein the electronic device substrate includes a first functional circuit structure, and the flexible circuit board has a first functional circuit structure. The wire is electrically connected to the first functional circuit structure.
  • the flexible circuit board further includes a second functional wiring
  • the first functional circuit structure includes a first signal transmission part and a second signal transmission part.
  • a functional wiring is electrically connected to the first signal transmission part
  • the second functional wiring is electrically connected to the second signal transmission part.
  • the electronic device substrate further includes a second functional circuit structure
  • the flexible circuit board further includes a third functional wiring, the third functional wiring electrical Connect the second functional circuit structure.
  • the first functional circuit structure is a touch circuit structure
  • the second functional circuit structure is a display circuit structure
  • the first signal transmission part is a touch drive circuit of the touch circuit
  • the second signal transmission part is a touch drive circuit of the touch circuit.
  • the first signal transmission part is a touch sensor circuit of the touch circuit
  • the second signal transmission part is a touch drive circuit of the touch circuit.
  • At least one embodiment of the present disclosure provides an electronic device including any of the above electronic device modules.
  • At least one embodiment of the present disclosure provides a method for manufacturing a flexible circuit board, including: providing a main body sub-circuit board, the main body sub-circuit board including a first switching end, a first wiring portion, and a second wiring portion, so The first transition end includes a plurality of first contact pads, and the first wiring portion and the second wiring portion are spaced apart from each other and are respectively connected to the first set of first contact pads and the first set of the first transition end.
  • the second set of first contact pads are electrically connected; a switching sub-circuit board is provided, and the switching sub-circuit board includes a second switching end and a third wiring part for wiring the first function, the second turning The terminal includes a plurality of second contact pads, and the third wiring part electrically connects the first set of second contact pads and the second set of second contact pads of the second transfer end; The first set of second contact pads and the second set of second contact pads of the terminal are electrically connected to the first set of first contact pads and the second set of first contact pads of the first transition terminal, respectively , Thereby installing the adapter sub-circuit board on the main body sub-circuit board.
  • the second transfer end of the transfer sub-circuit board is connected to the main sub-circuit by hot pressing, soldering, or a connector.
  • the first adapter end of the board is connected to the main sub-circuit by hot pressing, soldering, or a connector.
  • FIG. 1 is a schematic plan view of a flexible circuit board provided by some embodiments of the disclosure.
  • FIG. 2 is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by some embodiments of the present disclosure
  • 3A is a schematic plan view of the first side of the adaptor sub-circuit board of the flexible circuit board provided by some embodiments of the present disclosure
  • 3B is a schematic plan view of the second side of the adaptor sub-circuit board of the flexible circuit board provided by some embodiments of the present disclosure
  • 4A is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by other embodiments of the present disclosure.
  • 4B is a schematic plan view of the first side of the adapter sub-circuit board of the flexible circuit board provided by some other embodiments of the present disclosure
  • 5A is a schematic cross-sectional view of a main body sub-circuit board of a flexible circuit board provided by some embodiments of the present disclosure
  • 5B is a schematic cross-sectional view of another main body sub-circuit board of the flexible circuit board provided by some embodiments of the present disclosure.
  • 6A is a schematic cross-sectional view of an adapter sub-circuit board of a flexible circuit board provided by some embodiments of the disclosure.
  • 6B is a schematic cross-sectional view of another adapter circuit board of the flexible circuit board provided by some embodiments of the present disclosure.
  • FIG. 7 is a schematic plan view of an electronic device substrate provided by some embodiments of the disclosure.
  • FIG. 8 is a schematic diagram of an electronic device provided by some embodiments of the disclosure.
  • FIG. 9 is a manufacturing flow chart of a flexible circuit board provided by some embodiments of the disclosure.
  • Flexible circuit boards can usually integrate multiple signal traces to transmit different types of signals.
  • the wiring difficulty in the flexible circuit board will also increase. Big.
  • flexible circuit boards are often formed with multiple wiring layers, such as four or six wiring layers, etc., so as to facilitate the layout of multiple wirings, so that multiple wirings can be distributed on different layers , Thereby reducing the mutual interference between different types of wiring.
  • For signal crosstalk between different traces it is also necessary to form (electromagnetic signal) shielding layers between different traces, all of which increase the difficulty of manufacturing the flexible circuit board.
  • At least one embodiment of the present disclosure provides a flexible circuit board, which includes a main sub-circuit board and an adapter sub-circuit board.
  • the main body sub-circuit board includes a first switching end, a first wiring part and a second wiring part, the first switching end includes a plurality of first contact pads, the first wiring part and the second wiring part are spaced apart from each other And are respectively electrically connected to the first set of first contact pads and the second set of first contact pads of the first transfer end;
  • the transfer sub-circuit board includes a second transfer end and a third wiring for the first functional wiring Part, the second transfer end includes a plurality of second contact pads, and the third wiring part electrically connects the first set of second contact pads of the second transfer end and the second set of second contact pads;
  • the transfer sub-circuit board configuration To install by electrically connecting the first set of second contact pads and the second set of second contact pads of the second transfer end to the first set of first contact pads and the second set of first contact pads of the first transfer end, respectively To the
  • An electronic device template provided by at least one embodiment of the present disclosure includes an electronic device substrate and the above-mentioned flexible circuit board; the electronic device substrate includes a first functional circuit structure, and the first functional wiring of the flexible circuit board is electrically connected to the first functional circuit structure .
  • At least one embodiment of the present disclosure provides an electronic device including the above-mentioned electronic device module.
  • FIG. 1 is a schematic plan view of the flexible circuit board.
  • the flexible circuit board 10 includes a main sub-circuit board 100 and an adapter sub-circuit board 200.
  • the adapter sub-circuit board 200 can be mounted on the main sub-circuit board 100.
  • the main body sub-circuit board 100 includes a first switching end 101, a first wiring portion 102, and a second wiring portion 103.
  • the first switching end 101 includes a plurality of first contact pads, and these second A contact pad is divided into a plurality of groups according to needs, so as to be electrically connected to the wires transmitting different signals.
  • the first contact pads are arranged in one or more rows.
  • the first wiring portion 102 and the second wiring portion 103 are spaced apart from each other and are electrically connected to the first group of first contact pads 101A and the second group of first contact pads 101B of the first switching terminal 101, respectively.
  • the first wiring portion 102 includes a plurality of wirings, and one end of the plurality of wirings is electrically connected to the plurality of contact pads in the first group of first contact pads 101A included in the first switching terminal 101 in a one-to-one correspondence;
  • the second wiring portion 103 also includes a plurality of wirings, and one end of the plurality of wirings is electrically connected to the plurality of contact pads in the second group of first contact pads 101B in a one-to-one correspondence.
  • the figure only shows two wires included in the first wire portion 102 and two wires included in the second wire portion 103, the embodiments of the present disclosure are not limited thereto.
  • FIG. 3A is a schematic plan view of the first side of the adapter sub-circuit board 200 in some embodiments of the disclosure.
  • the transfer sub-circuit board 200 includes a second transfer end 201 and a third wiring portion 202.
  • the second transfer end 201 includes a plurality of second contact pads, and these second contact pads are divided according to needs. There are multiple groups, which are electrically connected to the wires transmitting different signals. For example, the second contact pads are arranged in a row.
  • the third wiring portion 202 electrically connects the first group of second contact pads 201A and the second group of second contact pads 201B of the second transfer terminal 201.
  • the third trace portion 202 includes a plurality of traces, and these traces are electrically connected to the plurality of contact pads included in the first group of second contact pads 201A at one end, and are electrically connected to the second group of second contact pads at the other end.
  • the multiple contact pads included in the two contact pads 201B are electrically connected in a one-to-one correspondence. Although only two wires included in the third wire portion 202 are shown in the figure, the embodiment of the present disclosure is not limited thereto.
  • the transfer sub-circuit board 200 is configured to be electrically connected to the first set of the first transfer terminal 101 by electrically connecting the first set of second contact pads 201A and the second set of second contact pads 201B of the second transfer terminal 201.
  • FIG. 1 For example, in the example shown in FIG.
  • the first wiring portion 102, the third wiring portion 202, and the second wiring portion 103 are sequentially electrically connected to obtain the first functional wiring, so that the electrical signal can be routed from the first
  • the wire portion 102 is transferred to the second wire portion 103 via the third wire portion 202, or may be transferred from the second wire portion 103 to the first wire portion 102 via the third wire portion 203.
  • FIG. 1 shows that the transfer sub-circuit board 200 passes through the first set of second contact pads 201A and the second set of second contact pads 201B and the first set of first contact pads 101A and the first set of the first transfer terminal 101.
  • the main body sub-circuit board 100 and the adapter sub-circuit board 200 may also be in a state to be connected, that is, separate
  • the main body sub-circuit board 100 and the adapter sub-circuit board 200 are also within the protection scope of the present disclosure.
  • the flexible circuit board 10 further includes a first control circuit combining structure 104, and the first control circuit combining structure 104 is disposed on the main sub-circuit board 100.
  • the first control circuit combining structure 104 includes a plurality of contact pads for mounting the first control circuit, and a part of the plurality of contact pads is electrically connected to the other ends of the plurality of wires included in the first part of the wires 102 in a one-to-one correspondence.
  • the first control circuit combined structure 104 is configured to provide a first electrical signal to the first functional wiring or receive a first electrical signal from the first functional wiring.
  • the first control circuit may be a driver IC chip.
  • packaging methods such as tape carrier package (TCP), chip on film (COF) packaging, and so on.
  • TCP tape carrier package
  • COF chip on film
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are soldered to the multiple contact pads of the flexible circuit board in a one-to-one correspondence (such as eutectic soldering), or through anisotropic conductive glue ( ACF)
  • ACF anisotropic conductive glue
  • One-to-one electrical connection, and at least the soldering part is protected by, for example, epoxy resin; in order to increase the bendability of the flexible circuit board in the TCP mode, a slit (Slit) can be formed in the package part.
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are directly crimped on the multiple contact pads of the flexible circuit board through ACF, so that the multiple pins of the driver IC chip and the flexible circuit
  • the multiple contact pads of the board are electrically connected in a one-to-one correspondence.
  • the size and arrangement of the contact pads on the flexible circuit board used to combine the driver IC chip can be adjusted according to different types of packaging or the driver IC chip to be packaged.
  • the contact pads can be arranged long Bars or arranged in rectangles.
  • the embodiment of the present disclosure does not limit the packaging method of the driver IC chip.
  • the main sub-circuit board 100 of the flexible circuit board 10 further includes a second functional wiring 105.
  • the second functional wiring 105 includes multiple wirings, and the first control circuit is combined with Another part of the contact pads in the structure 104 are electrically connected to the multiple wirings included in the second functional wiring 105 in a one-to-one correspondence.
  • the first control circuit in combination with the first control circuit mounted on the structure 104 is also configured to
  • the second functional wiring 105 provides a second electrical signal or receives a second electrical signal from the second functional wiring 105.
  • the main body sub-circuit board 100 further includes a third functional wiring 106, and the third functional wiring 106 includes a plurality of wirings and is connected to the first switching terminal 101.
  • the plurality of contact pads included in the third group of first contact pads 101C are electrically connected in a one-to-one correspondence.
  • the transfer sub-circuit board 200 further includes a fourth wiring portion 203, and the fourth wiring portion 203 includes a plurality of wirings, and is respectively connected to the third group of the second switching terminal 201
  • the multiple contact pads included in the contact pad 201C are electrically connected in a one-to-one correspondence, so that the third functional trace 106 passes through the third group of the first contact pad 101C of the first transition terminal 101 and the third group of the second transition terminal 201
  • the set of second contact pads 201C are electrically connected to the fourth wiring portion 203 of the transfer sub-circuit board 200.
  • FIG. 3B shows a schematic plan view of the second side of the adapter sub-circuit board 200.
  • the third wiring portion 202 and the fourth wiring portion 203 are respectively arranged on both sides of the adapter sub-circuit board 200. Therefore, the signal crosstalk between the third wiring portion 202 and the fourth wiring portion 203 can be avoided.
  • the adapter sub-circuit board 200 further includes a third adapter terminal 204, and the third adapter terminal 204 is opposite to the second adapter terminal 201.
  • the third transfer terminal 204 includes a plurality of contact pads, such as one-to-one electrical connection with a plurality of wires of the fourth wiring portion 203, for electrical connection with other electronic components, such as electrical connection to a system circuit board or The user terminal, etc., are not limited in the embodiment of the present disclosure.
  • the third functional wiring 106 on the main sub-circuit board 100 is located between the first wiring portion 102 and the second wiring portion 103, and the third group of first wiring
  • the contact pad 101C is located between the first group of first contact pads 101A and the second group of first contact pads 101B.
  • the third functional wiring 106 does not cross the first wiring portion 102 and the second wiring portion 103, thereby avoiding the formation of crossed wiring on the main sub-circuit board 100 itself, thereby avoiding or reducing different wiring.
  • the flexible circuit board 10 further includes a second control circuit combining structure 107, and the second control circuit combining structure 107 is disposed on the main sub-circuit board 100.
  • the second control circuit combining structure 107 includes a plurality of contact pads for mounting the second control circuit, and at least a part of the plurality of contact pads is electrically connected to one end of the third functional wiring 106 in a one-to-one correspondence.
  • the second control circuit combined structure 107 is configured to provide a third electrical signal to the third functional wiring 106 or receive a third electrical signal from the third functional wiring 106.
  • the third functional wiring 106 is divided into two parts, a part of the third functional wiring 106 is electrically connected between the second control circuit combination structure 107 and the third group of first contact pads 101C, and the third functional wiring 106 The other part is electrically connected between the second control circuit coupling structure 107 and a contact pad (described below) formed on one side edge of the main body sub-circuit board 100.
  • the second control circuit may also be a driver IC chip.
  • the first control circuit and the second control circuit are respectively used to implement different driving functions.
  • the method of coupling the driver IC chip to the flexible circuit board is, for example, tape carrier package (TCP), chip on film (COF) package, and the like.
  • the second control circuit bonding structure 108 includes a plurality of contact pads for connecting with the driving IC chip.
  • the size, arrangement, etc. of the contact pads can be adjusted according to different types of packaging methods or driver IC chips to be packaged, which are not specifically limited in the embodiments of the present disclosure.
  • the first control circuit combining structure 104 may also be formed on the transfer sub-circuit board 200.
  • the third wiring portion 202 is divided into two parts, a part of the third wiring portion 202 is electrically connected between the first control circuit coupling structure 104 and the first group of second contact pads 201A, the third wiring portion 202 The other part of is electrically connected between the first control circuit coupling structure 104 and the second set of second contact pads 201B.
  • the first wiring portion 102 and the second wiring portion 103 are respectively connected to the first group of first contact pads 101A and the second group of first contact pads 101B of the first transfer terminal 101 Electrically connected; on the transfer sub-circuit board 200, one end of each part of the third wiring portion 202 is electrically connected to the first control circuit combining structure 104, and the other end is electrically connected to the first group of first contact pads 101A or the second group of first The contact pad 101B is electrically connected.
  • the first wiring portion 102 and the second wiring portion 103 on the main sub-circuit board 100 are electrically connected to the first control circuit combination structure 104 on the transfer sub-circuit board 200, respectively.
  • the main sub-circuit board may have a single-layer structure with a single-layer wiring or a multi-layer structure with multiple wiring (for example, a double-layer structure with a double-layer wiring or a three-layer structure).
  • the three-layer structure of the wiring, etc. which is not limited in the embodiments of the present disclosure.
  • FIG. 5A shows a schematic cross-sectional view of a main body sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line A-A in FIG. 2.
  • the main body sub-circuit board 100 has a single-layer structure.
  • the main body sub-circuit board 100 includes a first substrate 1001 and a first wiring layer 1002 and a first insulating layer 1003 stacked on one side of the first substrate 1001.
  • the first wiring layer 1002 includes a first wiring portion 102, a second wiring portion 103, a second functional wiring 105, a first transition terminal 101, and other structures.
  • the first transition terminal 101 is exposed by the first insulating layer 1003 .
  • the first insulating layer 1003 serves as a protective layer to provide structural and electrical protection to the first wiring layer 1002.
  • the first insulating layer 1003 can be bonded to the first wiring layer 1002 through an adhesive layer (not shown in the figure).
  • FIG. 5B shows a schematic cross-sectional view of another main body sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line A-A in FIG. 2.
  • the main sub-circuit board 100 has a multi-layer structure.
  • the main sub-circuit board 100 has a two-layer structure as an example for description with reference to FIG. 5B, but the embodiment of the present disclosure does not limit this.
  • the main body sub-circuit board 100 includes a first substrate 1001, a first wiring layer 1002 and a first wiring layer 1002 and a first wiring layer 1002 that are located on the first side (upper side in the figure) of the first substrate 1001
  • the insulating layer 1003 further includes a second wiring layer 1004 and a second insulating layer 1005 that are located on the second side of the first substrate 1001 (shown as the lower side in the figure) and stacked.
  • the first insulating layer 1003 serves as a protective layer to provide structure and electrical protection to the first wiring layer 1002.
  • the first insulating layer 1003 can be bonded to the first wiring layer 1002 and the first wiring layer 1002 and the second wiring layer 1002 through an adhesive layer (not shown in the figure).
  • a substrate 1001; the second insulating layer 1005 is used as a protective layer to provide structure and electrical protection to the second wiring layer 1004.
  • the second insulating layer 1005 can be bonded to the second wiring through an adhesive layer (not shown in the figure) The layer 1004 and the first substrate 1001.
  • the first wiring portion 102, the second wiring portion 103, and the third functional wiring 106 are arranged crosswise in the first wiring layer 1002 and the second wiring layer 1004, that is, the first wiring layer 1002 and the second wiring layer 1004
  • the two wiring layers 1004 each have a first wiring portion 102, a second wiring portion 103, and a third functional wiring 106.
  • the first wiring portion 102 is adjacent to each other on the board surface of the main sub-circuit board 100.
  • the traces can be located on the first trace layer 1002 and the second trace layer 1004 respectively, which facilitates routing layout.
  • the second trace portion 103 and the third functional trace 106 can also be arranged similarly; for another example,
  • the first wiring layer 1002 includes a first wiring portion 102 and a second wiring portion 103
  • the second wiring layer 1004 includes a third functional wiring 106, that is, different wiring layers can be arranged differently. Function routing.
  • the embodiment of the present disclosure does not specifically limit the wiring layout on the main body sub-circuit board 100.
  • the plurality of first contact pads of the first transfer terminal 101 are exposed by the first insulating layer 1003.
  • an opening 1013 is formed in the first insulating layer 1003, and in the opening 1013, for example, the exposed portion of the first wiring layer 1002 corresponding to the first transfer terminal 101 may be subjected to surface treatment to form a pattern
  • the wiring layer 1004 and the opening 1013 of the first insulating layer 1003 form a switching end.
  • the via hole 1011 in the first substrate 1001 and the opening 1013 of the first insulating layer 1003 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1013 is relatively flat, which facilitates the formation of contact pads.
  • the main body sub-circuit board may also have a multi-layer structure such as a three-layer structure and a four-layer structure.
  • various parts of the wiring on the main sub-circuit board such as the first wiring part, the second wiring part, the second function wiring, and the third function wiring, may be arranged in a multilayer wiring layer.
  • the first wiring portion, the second wiring portion, the second functional wiring, and the third functional wiring are alternately arranged in multiple wiring layers, or are arranged in different wiring layers.
  • the embodiments of the present disclosure do not specifically limit the number of wiring layers and the wiring arrangement of the main body sub-circuit board.
  • the bridge sub-circuit board may have a double-layer structure with double-layer wiring or a multilayer structure with more layers of wiring.
  • FIG. 6A shows a schematic cross-sectional view of an adapter sub-circuit board 200 according to some embodiments of the present disclosure, and the cross-sectional view is, for example, cut along B-B in FIG. 3.
  • the transfer daughter circuit board 200 includes a second substrate 2001, a second wiring layer 2002 and a second insulating layer 2003 on the first side (the upper side shown in the figure) of the second substrate 2001, The third wiring layer 2004 and the third insulating layer 2005 are located on the second side (the lower side shown in the figure) of the second substrate 2001.
  • the second insulating layer 2003 and the third insulating layer 2005 are used as protective layers to provide structural and electrical protection to the second wiring layer 2002 and the third wiring layer 2004.
  • the second insulating layer 2003 and the third insulating layer 2005 can They are respectively bonded to the second wiring layer 2002 and the third wiring layer 2004 through an adhesive layer (not shown in the figure).
  • the second wiring layer 2002 includes a third wiring portion 202; the third wiring layer 2004 includes a fourth wiring portion 203 and a second switching end 201, so that the third wiring portion 202 and the fourth wiring portion 203 is arranged in different wiring layers.
  • the plurality of second contact pads of the second transfer end 201 are exposed by the third insulating layer 2005, and the two ends of the third wiring portion 202 respectively pass through the openings to connect to the first set of second contact pads of the second transfer end 201.
  • 201A is electrically connected to the second group of second contact pads 201B.
  • the third wiring portion 202 is exposed and led out through the vias 2011 in the second substrate 2001 and the openings 2015 in the third insulating layer 2005, for example, a plurality of patterned contact pads are formed by surface treatment to form a transfer terminal.
  • the opening 2015 in the third insulating layer 2005 is formed at the position indicated by the dashed frame shown in FIG. 6A or at another suitable position, which is not limited in the embodiment of the present disclosure.
  • the via hole 2011 in the second substrate 2001 and the opening 2015 of the third insulating layer 2005 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1015 is relatively flat, which facilitates the formation of contact pads.
  • FIG. 6B shows a schematic cross-sectional view of another adapter circuit board according to some embodiments of the present disclosure.
  • the cross-sectional view is obtained by cutting along B-B in FIG. 3A, for example.
  • the transfer sub-circuit board includes a second substrate 2001, a second wiring layer 2002 and a second insulating layer 2003 on the first side of the second substrate 2001, and a second substrate 2001 on the second side.
  • the second wiring layer 2002 includes a third wiring portion 202 and a second transfer terminal 201.
  • a plurality of second contact pads of the second transfer terminal 201 are exposed by the second insulating layer 2003; the third wiring layer 2004 includes a first There are four wiring portions 203, and the fourth wiring portion 203 is electrically connected to the third group of second contact pads 201C of the second switching end 201 through the opening.
  • the fourth wiring portion 203 is exposed and led out through the vias 2011 in the second substrate 2001 and the openings 2013 in the second insulating layer 2003, for example, a plurality of patterned contact pads are formed by surface treatment to form a transfer terminal .
  • the opening 2013 in the second insulating layer 2003 is formed at the position indicated by the dashed frame shown in FIG. 6B or at another suitable position, which is not limited in the embodiment of the present disclosure.
  • the vias 2011 in the second substrate 2001 and the openings 2013 in the second insulating layer 2003 are arranged in a staggered manner. Therefore, during the manufacturing process, the positions of the openings 2013 are relatively flat, which facilitates the formation of contact pads.
  • the second side is relative to the first side.
  • the second side is closer to the main sub-circuit board 100 than the first side.
  • the transfer sub-circuit board 200 further includes a shielding layer 2006 located between the second wiring layer 2002 and the third wiring layer 2004.
  • the shielding layer 2006 is, for example, disposed on the first side or the second side of the second substrate 2001, and is insulated from the adjacent wiring layer by the fourth insulating layer 2007.
  • FIGS. 6A and 6B show that the shielding layer 2006 is disposed on the second side.
  • the second side of the second substrate 2001 is insulated from the third wiring layer 2004 by the fourth insulating layer 2007.
  • the shielding layer 2006 can prevent the traces located on both sides of the second substrate 2001 of the adapter sub-circuit board 200 from generating signal crosstalk.
  • the shielding layer 2006 and the fourth insulating layer 2007 have a hollow structure at a position corresponding to the transfer end.
  • the hollow structure is connected to the via hole 2011 to facilitate the lead out of the wiring and form the transfer end.
  • the second substrate 2001 also has another via 2021, and the shielding layer 2006 is electrically connected to the ground wire in the second wiring layer 2002 through the via 2021, so that the shielding layer 2006 is grounded, which can play a shielding role;
  • the fourth insulating layer 2007 has a via 2017, and the shielding layer 2006 is electrically connected to the ground wire in the third wiring layer 2004 through the via 2017, so that the shielding layer 2006 is grounded.
  • the transfer daughter circuit board 200 may also have more wiring layers, for example, a double-layer wiring layer is provided on the first side of the second substrate 2001. In this case, it is located on the second substrate 2001.
  • the wires on the first side of the above-mentioned double-layer wire layers can be alternately arranged or different wires can be arranged in different wire layers.
  • the adapter sub-circuit board 200 may also have a double-layer wiring layer on the second side of the second substrate 2001. In this case, the wiring on the second side of the second substrate 2001 may be on the above-mentioned double-layer wiring.
  • the layers are alternately arranged or different wirings are respectively arranged in different wiring layers.
  • the embodiment of the present disclosure does not specifically limit the number of wiring layers and the specific wiring form of the transfer sub-circuit board 200.
  • the first substrate 1001 and the second substrate 2001 are made of polyimide or polyester
  • each wiring layer can be made of copper, silver, aluminum and other metal materials or alloy materials
  • each insulation layer is made of polyimide or Insulating materials such as polyester
  • the shielding layer 2006 can be a metal material such as copper
  • the bonding layer is made of epoxy resin or polyethylene. The present disclosure does not specifically limit the material of each functional layer.
  • the second adapter end 201 of the adapter sub-circuit board 200 is connected to the first adapter end 101 of the main sub-circuit board 100 through anisotropic conductive glue, soldering material, or a connector.
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the adapter sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first transfer end 101 of the main sub-circuit board 100 is provided with a female connector
  • the second transfer end 201 of the transfer sub-circuit board 200 is provided with a male connector, so that the male connector and the female connector are mated to make
  • the adapter sub-circuit board 200 is connected to the main sub-circuit board 100.
  • the flexible circuit board provided by the embodiment of the present disclosure has a main body sub-circuit board and an adapter sub-circuit board.
  • the wires located on both sides of the main sub-circuit board are switched by the adapter sub-circuit board, which can avoid the wiring on the main sub-circuit board.
  • the upper crossover can prevent or reduce signal crosstalk, or can avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure.
  • the main sub-circuit board and the adapter sub-circuit board have a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the production of the main sub-circuit board and the adapter sub-circuit board. Difficulty.
  • FIG. 7 shows a schematic diagram of the electronic device module.
  • the electronic device module 1 includes an electronic device substrate 11 and any of the above-mentioned flexible circuit boards 10, and the electronic device substrate 11 includes a first functional circuit structure 20.
  • the first functional wiring (including the first wiring portion 102, the second wiring portion 103 and the third wiring portion 202) of the flexible circuit board 10 is electrically connected to the first functional circuit structure 20.
  • the flexible circuit board 10 further includes a second functional wiring 105
  • the first functional circuit structure 20 includes a first signal transmission portion 21 and a second signal transmission portion 22, and the first functional wiring is electrically connected to the second signal transmission portion.
  • a signal transmission part 21, and the second functional wiring 105 is electrically connected to the second signal transmission part 22.
  • the electronic device substrate 11 further includes a second functional circuit structure 23, and the flexible circuit board further includes a third functional wiring 106, and the third functional wiring 106 is electrically connected to the second functional circuit structure 23.
  • the electronic device substrate 11 is a substrate with a display function and a touch function.
  • the first functional circuit structure 20 is a touch circuit structure
  • the second functional circuit structure 23 is a display circuit structure.
  • the electronic device substrate 11 is a substrate with a display function and a fingerprint recognition function.
  • the first functional circuit structure 20 is a fingerprint recognition circuit structure.
  • the fingerprint recognition circuit structure is a capacitive fingerprint recognition circuit.
  • the second functional circuit structure 23 is a display circuit structure including detecting driving electrodes and detecting sensing electrodes that are arranged crosswise. In the following, description is made by taking the first functional circuit structure 20 as a touch circuit structure as an example.
  • the arrangement of the touch circuit structure on the electronic device substrate 11 may be a built-in type or an externally mounted type.
  • the form of the touch circuit structure may be capacitive, for example, a mutual capacitive touch circuit structure.
  • the mutual-capacitive touch circuit structure includes a plurality of first electrodes extending in a first direction and a plurality of second electrodes extending in a second direction (intersecting the first direction).
  • a detection capacitance will be formed, that is, the two sets of electrodes respectively constitute the two poles of the capacitance.
  • the capacitance change data of the touch circuit structure and the coordinates of each capacitance the coordinates of each touch point can be obtained.
  • the horizontal electrode is used as a touch drive circuit to send out excitation signals in turn
  • the vertical electrode is used as a touch sensing circuit to receive signals at the same time or sequentially, so that the capacitance value of the intersection of all horizontal and vertical electrodes can be obtained, that is, the entire touch
  • the capacitance of the two-dimensional plane of the structure Therefore, even if there are multiple touch points on the touch control structure, the true coordinates of each touch point can be determined.
  • the first signal transmission portion 21 includes touch drive traces electrically connected to the touch drive (Tx) circuit of the touch circuit, and the second signal transmission portion 22 includes touch sensors electrically connected to the touch circuit. (Rx)
  • the first control circuit 1041 is a touch drive IC, which can provide an excitation signal to the touch drive circuit through the touch drive trace, and can receive the sensing signal of the touch sensing circuit through the touch sensing trace, and can be based on the above The signal determines the touch position and responds.
  • the touch sensing circuit and the first control circuit combined structure 104 are closer, that is, the first control circuit 1041 mounted on it, that is, the touch driver IC is closer, so the sensing signal received by the touch sensing circuit
  • the transmission path to the touch drive IC is shorter, so the sensing signal is less likely to be interfered by the signal, so that the touch operation can be more accurate.
  • the touch driving wiring and the touch sensing wiring extend to the same side of the electronic device substrate 11 (the lower side in the figure), and are connected to the contact pad 211 and the contact pad 221 formed on the side. Electrically connect separately.
  • the first signal transmission part 21 may also include touch sensing traces electrically connected to the touch sensing (Rx) circuit of the touch circuit, and the second signal transmission part 22 may include electrical connections.
  • the touch drive circuit is directly electrically connected to the first control circuit combination structure 104, so the touch drive circuit and the first control circuit combination structure 104 Is closer to the first control circuit 1041, that is, the touch drive IC mounted on it. Therefore, in this embodiment, the touch drive signal in the touch drive circuit may be interfered by the signal Less sex.
  • the flexible circuit board 10 has a terminal 110 on one side (for example, the upper side in the figure), a plurality of contact pads are provided on the terminal 110, and the other end of the plurality of wirings included in the second wiring portion 103 is connected to the wiring.
  • Part of the contact pads in the terminal 110 are electrically connected in a one-to-one correspondence
  • the other ends of the multiple wiring lines included in the second functional wiring 105 are electrically connected in a one-to-one correspondence with another part of the contact pads in the terminal 110
  • the third functional wiring The other ends of the multiple traces included in 106 are electrically connected to another part of the contact pads in the terminal 110 in a one-to-one correspondence.
  • part of the contact pads electrically connected to the second wiring portion 103, the third functional wiring 106, and the second functional wiring 105 are arranged at intervals or continuously at the terminal 110, which is not specifically described in the embodiment of the present disclosure. limited.
  • the contact pads connected to them can be arranged continuously on the terminal 110; when the second wiring part 103.
  • the contact pads connected to them can be spaced apart at the terminal 110. At this time, for example, the spaced arrangement shown in FIG. 7 can be formed Multiple sets of contact pads.
  • the terminal 110 is arranged in the wiring area 110A of the main sub-circuit board (that is, the oblique area under the terminal 110 in the figure).
  • the wiring area 110A area only has a wiring layer and a part of an insulating layer, but does not have a shielding layer. Therefore, the wiring area 110A has high transparency.
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 can be directly crimped together, for example, in
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 are electrically connected to each other through, for example, ACF, thereby connecting the first functional wiring on the flexible circuit board 10 to
  • the touch driving trace connected to the first signal transmission part 21 is electrically connected through the contact pad 211
  • the touch sensing trace connecting the second function trace on the flexible circuit board to the second signal transmission part 22 is electrically connected through the contact pad 221. Connection, thereby electrically connecting the first functional wiring and the second functional wiring of the flexible circuit board 10 with the touch circuit structure of the electronic device substrate 11.
  • the second functional circuit structure 23, that is, the display circuit structure, includes multiple data lines (and also gate lines, etc.), the multiple data lines are respectively electrically connected to the pixel units, and the multiple data lines extend to the electronic device substrate 11 On one side (the lower side in the figure), and is electrically connected to the contact pad 231 formed on the side.
  • the pixel unit includes a display driving circuit, for example, the display driving circuit includes a plurality of transistors, capacitors, and light emitting devices, for example, formed in various forms such as 2T1C, 3T1C, or 7T1C.
  • the second control circuit 1071 is a display driver IC, which can provide data signals for the display driver circuit, so that the light-emitting state of the light-emitting device can be controlled by the data line number provided by the display driver IC to achieve different display effects.
  • the pixel unit includes a switching element and a first electrode (pixel electrode) and a second electrode (common electrode) for controlling the deflection of liquid crystal, and the switching element is electrically connected to the first electrode.
  • the second functional circuit structure 23 that is, the display circuit structure, includes a plurality of data lines respectively connected to the pixel unit.
  • the second control circuit is a display driver IC, which can provide different data voltage signals to the pixel unit through the data lines. In this way, the twisting state of the liquid crystal is controlled to achieve different display effects.
  • the flexible circuit board is bonded to the electronic device substrate 11 by binding.
  • the flexible circuit board can be bent to the back of the electronic device substrate 11 and fixed after being bound to the electronic device substrate 11 , That is, installed on the non-display side of the electronic device substrate 11 to facilitate the large-screen design of the display screen.
  • the wiring parts on the main body sub-circuit board that are electrically connected to the touch drive circuit are switched through the transfer sub-circuit board, so that the main body The touch drive circuit and the display drive circuit on the sub-circuit board do not intersect, and the double-layer wiring layers of the transfer sub-circuit board are also shielded from each other, so it can avoid the signal crosstalk of the traces on both sides of the transfer sub-board
  • the main body sub-circuit board and the adapter sub-circuit board have simple structures and simple wiring layout, which is beneficial to simplify the manufacturing process.
  • FIG. 8 shows a schematic diagram of the electronic device.
  • the electronic device 2 includes any of the above-mentioned electronic device modules 1, and the electronic device module 1 includes an electronic device substrate 11 and a flexible circuit board 10.
  • the upper side of the electronic device substrate 11 shown in FIG. 8 is the display side, and the lower side is the non-display side; at this time, the flexible circuit board 10 is bent and placed on the non-display side of the electronic device substrate 11 after being bound.
  • the flexible circuit board 10 is bent and placed on the non-display side of the electronic device substrate 11 after being bound.
  • the electronic device 2 may be, for example, any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • the embodiment of the present disclosure does not specifically limit this.
  • At least one embodiment of the present disclosure provides a manufacturing method of a flexible circuit board. As shown in FIG. 9, the manufacturing method includes steps S101-S103.
  • Step S101 Provide the main body sub-circuit board.
  • the main body sub-circuit board 100 includes a first transfer end 101, a first wiring portion 102, and a second wiring portion 103.
  • the first transfer end 101 includes a plurality of first contact pads, and the first wiring portion 102 and the second wiring portion 103 are spaced apart from each other and are electrically connected to the first set of first contact pads 101A and the second set of first contact pads 101B of the first transfer terminal 101, respectively.
  • the main body sub-circuit board 100 is formed by sequentially forming a first wiring layer 1002 and a first insulating layer 1003 on the first substrate 1001.
  • the first substrate 1001 is made of polyimide or polyester
  • the first wiring layer 1002 is made of copper, silver, aluminum and other metal materials or alloy materials
  • the first insulating layer 1003 is also made of polyimide or polyester.
  • other materials for example, firstly, a copper metal layer is formed on the first substrate 1001 by sputtering, and then the copper metal layer is patterned to form the first wiring layer 1002, and then the first wiring layer 1002 is formed by coating.
  • a first insulating layer 1003 is formed thereon, and an opening is formed in the first insulating layer 1003 to form a structure such as a transfer terminal.
  • Step S102 Provide a transfer sub-circuit board.
  • the transfer sub-circuit board 200 includes a second transfer end 201 and a third wiring portion 202, the second transfer end 201 includes a plurality of second contact pads, and two ends of the third wiring portion 202 are connected to The first group of second contact pads 201A and the second group of second contact pads 201B of the second transfer terminal 201 are electrically connected.
  • the interposer circuit board 200 sequentially forms the second wiring layer 2002 and the second insulating layer 2003 on the first side of the second substrate 2001, and then sequentially forms the second wiring layer 2002 and the second insulating layer 2003 on the second side of the second substrate 2001.
  • the three wiring layer 2004 and the third insulating layer 2005 are formed.
  • the first substrate 2001 is made of polyimide or polyester
  • the second wiring layer 2002 and the third wiring layer 2004 are made of copper, silver, aluminum and other metal materials or alloy materials
  • the three insulating layer 2005 also uses materials such as polyimide or polyester.
  • the formation methods of the wiring layers and the insulating layers can be referred to the above-mentioned embodiments, and will not be repeated here.
  • the second transfer end 201 is formed on the first side of the transfer sub-circuit board 200.
  • openings may be formed in the second substrate 2001 and the third insulating layer 2005. ), so that the third wiring portion 202 can be exposed and led out through the vias 2011 in the second substrate 2001 and the openings 2015 in the third insulating layer 2005, and then a plurality of patterned contact pads are formed by surface treatment, for example, to form Transfer terminal.
  • forming the transfer sub-circuit board 200 further includes forming a shielding layer 2006 and a fourth insulating layer 2007 on the second side of the second substrate 2001.
  • the shielding layer 2006 may be suspended or configured to be electrically connected to the ground wire. Therefore, the shielding layer 2006 can prevent signal crosstalk from the double-layer wiring layer on the adapter sub-circuit board 200.
  • the shielding layer 2006 and the fourth insulating layer 2007 are formed with a hollow structure at a position corresponding to the via hole 2011 of the second substrate 2001, thereby leading out the third wiring portion 202.
  • Step S103 Mount the adapter sub-circuit board on the main sub-circuit board.
  • the first set of second contact pads 201A and the second set of second contact pads 201B of the second transfer end 201 are electrically connected to the first set of first contact pads 101A and 101A of the first transfer end 101, respectively.
  • the second side of the adapter sub-circuit board 200 is closer to the main sub-circuit board 100 than the first side, so that the second functional trace on the main sub-circuit board 100 and the adapter sub-circuit electrically connected to it are
  • the fourth wiring 203 on the board 200 is closer. Relatively speaking, this arrangement is more conducive to the wiring arrangement of the main sub-circuit board 100 and the transfer sub-circuit board 200.
  • the second transfer end 201 of the transfer sub-circuit board 200 can be connected to the first transfer end 101 of the main sub-circuit board 100 by hot pressing, soldering, or a connector.
  • a connector for example, in the hot pressing method, an anisotropic conductive adhesive is formed between the two transition ends, and then the transition ends are hot pressed to connect the two transition ends together with the anisotropic conductive adhesive .
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the adapter sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first transfer end 101 of the main sub-circuit board 100 is provided with a female connector
  • the second transfer end 201 of the transfer sub-circuit board 200 is provided with a male connector, so that the male connector and the female connector can be mated
  • the adapter sub-circuit board 200 is connected to the main sub-circuit board 100.
  • the manufacturing method of the flexible circuit board of the embodiment of the present disclosure provides a main body sub-circuit board and an adapter sub-circuit board, and the wiring located on both sides of the main sub-circuit board is switched through the adapter sub-circuit board.
  • This method can avoid Lines cross on the main sub-circuit board to prevent or reduce signal crosstalk, or to avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure; in addition, the main sub-circuit board and the switch provided by the manufacturing method
  • the connector circuit board has a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the difficulty of manufacturing the main sub-circuit board and the adapter sub-circuit board. The following points need to be explained:

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Abstract

一种柔性电路板及其制作方法、电子装置模组及电子装置。该柔性电路板(10)包括主体子电路板(100)和转接子电路板(200)。主体子电路板(100)包括第一转接端(101)、第一走线部分(102)和第二走线部分(103)，第一走线部分(102)和第二走线部分(103)彼此间隔开且分别与第一转接端(101)的第一组第一接触垫(101A)和第二组第一接触垫(101B)电连接；转接子电路板(200)包括第二转接端(201)和用于第一功能走线的第三走线部分(202)，第三走线部分(202)将第二转接端(201)的第一组第二接触垫(201A)和第二组第二接触垫(201B)电连接；转接子电路板(200)配置为通过将第二转接端(201)的第一组第二接触垫(201A)和第二组第二接触垫(201B)分别电连接到第一转接端(101)的第一组第一接触垫(101A)和第二组第一接触垫(101B)，而安装到主体子电路板(100)上。该柔性电路板(10)的走线布图简单，易于制作。

Description

柔性电路板及制作方法、电子装置模组及电子装置
本申请要求于2019年1月30日递交的中国专利申请第201910093325.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开的实施例涉及一种柔性电路板及其制作方法、电子装置模组及电子装置。
背景技术
柔性电路板(Flexible Printed Circuit，FPC)是以柔性薄膜为基材制成的一种具有高度可靠性、可挠性的印刷电路板。柔性电路板具有配线密度高、重量轻、厚度薄、弯折性好等特点，被广泛应用于手机、电脑以及显示器等各种电子设备中。
发明内容
本公开至少一实施例提供一种柔性电路板，包括主体子电路板和转接子电路板。主体子电路板包括第一转接端、第一走线部分和第二走线部分，所述第一转接端包括多个第一接触垫，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一转接端的第一组第一接触垫和第二组第一接触垫电连接；转接子电路板包括第二转接端和用于第一功能走线的第三走线部分，所述第二转接端包括多个第二接触垫，所述第三走线部分将所述第二转接端的第一组第二接触垫和第二组第二接触垫电连接；其中，所述转接子电路板配置为通过将所述第二转接端的所述第一组第二接触垫和所述第二组第二接触垫分别电连接到所述第一转接端的所述第一组第一接触垫和所述第二组第一接触垫，而安装到所述主体子电路板上。
例如，本公开至少一实施例提供的柔性电路板中，所述转接子电路板安装到所述主体子电路板，使得所述第一走线部分、所述第三走线部分和所述第二走线部分依次电连接以得到第一功能走线。
例如，本公开至少一实施例提供的柔性电路板还包括第一控制电路结合结构，其中，所述第一控制电路结合结构设置在所述主体子电路板上，与所述第一走线部分连接，或者所述第一控制电路结合结构设置在所述转接子电路板上，与所述第三走线部分电连接；所述第一控制电路结合结构配置为给所述第一功能走线提供第一电信号或从所述第一功能走线接收第一电信号。
例如，本公开至少一实施例提供的柔性电路板中，主体子电路板还包括第二功能走线，所述第二功能走线与设置在所述主体子电路板上的所述第一控制电路结合结构电连接，所述第一控制电路还配置为给所述第二功能走线提供第二电信号或从所述第二功能走线接收第二电信号。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板还包括第三功能走线，所述第三功能走线与所述第一转接端的第三组第一接触垫电连接，所述转接子电路板还包括第四走线部分，所述第四走线部分与所述第二转接端的第三组第二接触垫电连接，所述第三功能走线通过所述第一转接端的所述第三组第一接触垫和所述第二转接端的所述第三组第二接触垫电连接到所述转接子电路板的所述第四走线部分。
例如，本公开至少一实施例提供的柔性电路板中，所述第三功能走线位于所述第一走线部分和所述第二走线部分之间，且所述第三组第一接触垫位于所述第一组第一接触垫和所述第二组第一接触垫之间。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板包括第一基板以及位于所述第一基板一侧叠层的第一走线层和第一绝缘层，所述第一走线层包括所述第一走线部分、所述第二走线部分、所述第二功能走线和所述第一转接端，所述第一转接端的多个第一接触垫由所述第一绝缘层暴露。
例如，本公开至少一实施例提供的柔性电路板中，所述转接子电路板包括：第二基板，位于所述第二基板的第一侧的第二走线层和第二绝缘层，所述第二走线层包括所述第三走线部分；位于所述第二基板的第二侧的第三走线层和第三绝缘层，所述第三走线层包括所述第四走线部分和所述第二转接端，所述第二转接端的多个第二接触垫由所述第三绝缘层暴露，所述第三走线部分的两端分别通过开口与所述第二转接端的所述第一组第二接触垫和所述第二组第二接触垫电连接；其中，所述第二侧相对于所述第一侧。
例如，本公开至少一实施例提供的柔性电路板中，所述转接子电路板包 括：第二基板，位于所述第二基板的第一侧的第二走线层和第二绝缘层，所述第二走线层包括所述第三走线部分和所述第二转接端，所述第二转接端的多个第二接触垫由所述第二绝缘层暴露；位于所述第二基板的第二侧的第三走线层和第三绝缘层，所述第三走线层包括所述第四走线部分，所述第四走线部分通过开口与所述第二转接端的所述第三组第二接触垫电连接；其中，所述第二侧相对于所述第一侧。
例如，本公开至少一实施例提供的柔性电路板中，所述第二侧相对于所述第一侧更靠近主体子电路板。
例如，本公开至少一实施例提供的柔性电路板中，所述转接子电路板还包括位于所述第二走线层和所述第三走线层之间的屏蔽层。
例如，本公开至少一实施例提供的柔性电路板中，所述转接子电路板的所述第二转接端通过各向异性导电胶、焊接材料或者连接器连接到所述主体子电路板的所述第一转接端。
本公开至少一实施例提供一种电子装置模组，包括电子装置基板以及上述任一柔性电路板；其中，所述电子装置基板包括第一功能电路结构，所述柔性电路板的第一功能走线电连接所述第一功能电路结构。
例如，本公开至少一实施例提供的电子装置模组中，所述柔性电路板还包括第二功能走线，所述第一功能电路结构包括第一信号传输部分和第二信号传输部分，第一功能走线电连接所述第一信号传输部分，所述第二功能走线电连接所述第二信号传输部分。
例如，本公开至少一实施例提供的电子装置模组中，所述电子装置基板还包括第二功能电路结构，所述柔性电路板还包括第三功能走线，所述第三功能走线电连接所述第二功能电路结构。
例如，本公开至少一实施例提供的电子装置模组中，所述第一功能电路结构为触控电路结构，所述第二功能电路结构为显示电路结构。
例如，本公开至少一实施例提供的电子装置模组中，所述第一信号传输部分为所述触控电路的触控驱动电路，所述第二信号传输部分为所述触控电路的触控感应电路；或者所述第一信号传输部分为所述触控电路的触控感应电路，所述第二信号传输部分为所述触控电路的触控驱动电路。
本公开至少一实施例提供一种电子装置，包括上述任一的电子装置模组。
本公开至少一实施例提供一种柔性电路板的制作方法，包括：提供主体子电路板，所述主体子电路板包括第一转接端、第一走线部分和第二走线部分，所述第一转接端包括多个第一接触垫，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一转接端的第一组第一接触垫和第二组第一接触垫电连接；提供转接子电路板，所述转接子电路板包括第二转接端和用于第一功能走线的第三走线部分，所述第二转接端包括多个第二接触垫，所述第三走线部分将所述第二转接端的第一组第二接触垫和第二组第二接触垫电连接；将所述第二转接端的所述第一组第二接触垫和所述第二组第二接触垫分别电连接到所述第一转接端的所述第一组第一接触垫和所述第二组第一接触垫，从而将所述转接子电路板安装到所述主体子电路板上。
例如，本公开至少一实施例提供的制作方法中，通过热压的方式、焊接的方式或者通过连接器将所述转接子电路板的所述第二转接端连接到所述主体子电路板的所述第一转接端。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为本公开一些实施例提供的柔性电路板的平面示意图；
图2为本公开一些实施例提供的柔性电路板的主体子电路板的平面示意图；
图3A为本公开一些实施例提供的柔性电路板的转接子电路板的第一侧的平面示意图；
图3B为本公开一些实施例提供的柔性电路板的转接子电路板的第二侧的平面示意图；
图4A为本公开另一些实施例提供的柔性电路板的主体子电路板的平面示意图；
图4B为本公开另一些实施例提供的柔性电路板的转接子电路板的第一侧的平面示意图；
图5A为本公开一些实施例提供的柔性电路板的主体子电路板的截面示意图；
图5B为本公开一些实施例提供的柔性电路板的另一主体子电路板的截面示意图；
图6A为本公开一些实施例提供的柔性电路板的转接子电路板的截面示意图；
图6B为本公开一些实施例提供的柔性电路板的另一转接子电路板的截面示意图；
图7为本公开一些实施例提供的电子装置基板的平面示意图；
图8为本公开一些实施例提供的电子装置的示意图；
图9为本公开一些实施例提供的一种柔性电路板的制作流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
柔性电路板上通常可以集成多种信号走线，用于传递不同类型的信号。当柔性电路板上的信号走线的数量种类较多时，例如同时需要具有用于显示信号、触控信号、指纹识别信号等的多种信号走线时，柔性电路板中的布线难度也会增大。对此，柔性电路板往往形成为具有多层走线层，例如具有四层、六层走线层等，从而为多种走线的布置提供便利，使得多种走线可以分布在不同层上，从而降低不同种类的走线之间的相互干扰。但是，在制作具 有多层走线层的柔性电路板的过程中，还需要形成位于相邻走线层之间的绝缘层(以及相应的粘结层)，必要时，为了避免不同走线之间的信号串扰，还需要在不同的走线之间形成(电磁信号)屏蔽层，这些都增加了柔性电路板的制作难度。
本公开至少一实施例提供一种柔性电路板，包括主体子电路板和转接子电路板。主体子电路板包括第一转接端、第一走线部分和第二走线部分，第一转接端包括多个第一接触垫，第一走线部分和第二走线部分彼此间隔开且分别与第一转接端的第一组第一接触垫和第二组第一接触垫电连接；转接子电路板包括第二转接端和用于第一功能走线的第三走线部分，第二转接端包括多个第二接触垫，第三走线部分将第二转接端的第一组第二接触垫和第二组第二接触垫电连接；转接子电路板配置为通过将第二转接端的第一组第二接触垫和第二组第二接触垫分别电连接到第一转接端的第一组第一接触垫和第二组第一接触垫，而安装到主体子电路板上。
本公开至少一实施例提供的一种电子装置模板，包括电子装置基板以及上述柔性电路板；电子装置基板包括第一功能电路结构，柔性电路板的第一功能走线电连接第一功能电路结构。
本公开至少一实施例提供一种电子装置，包括上述电子装置模组。
下面通过几个具体的实施例对本公开的柔性电路板及其制作方法、电子装置模组及电子装置进行说明。
本公开一些实施例提供一种柔性电路板，图1为该柔性电路板的平面示意图。如图1所示，柔性电路板10包括主体子电路板100和转接子电路板200。转接子电路板200可安装到主体子电路板100上。
图2为本公开一些实施例中的主体子电路板100的平面示意图。如图2所示，主体子电路板100包括第一转接端101、第一走线部分102和第二走线部分103，第一转接端101包括多个第一接触垫，且这些第一接触垫根据需要划分为多组，以分别与传输不同信号的走线电连接，例如这些第一接触垫排列为一排或多排。第一走线部分102和第二走线部分103彼此间隔开且分别与第一转接端101的第一组第一接触垫101A和第二组第一接触垫101B电连接。例如，第一走线部分102包括多条走线，该多条走线的一端与第一转接端101包括的第一组第一接触垫101A中的多个接触垫一一对应电连接；第二走线部分103也包括多条走线，该多条走线的一端与第二组第一接触垫 101B中的多个接触垫一一对应电连接。虽然图中仅示出了第一走线部分102包括的两条走线以及第二走线部分103包括的两条走线，但是本公开的实施例不限于此。
图3A为本公开一些实施例中的转接子电路板200的第一侧的平面示意图。如图3A所示，转接子电路板200包括第二转接端201和第三走线部分202，第二转接端201包括多个第二接触垫，且这些第二接触垫根据需要划分为多组，以分别与传输不同信号的走线电连接，例如这些第二接触垫排列为一排。第三走线部分202将第二转接端201的第一组第二接触垫201A和第二组第二接触垫201B电连接。更具体地，第三走线部分202包括多条走线，这些走线在一端与第一组第二接触垫201A包括的多个接触垫一一对应电连接，在另一端与第二组第二接触垫201B包括的多个接触垫一一对应电连接。虽然图中仅示出了第三走线部分202包括的两条走线，但是本公开的实施例不限于此。
转接子电路板200配置为可通过将第二转接端201的第一组第二接触垫201A和第二组第二接触垫垫201B分别电连接到第一转接端101的第一组第一接触垫101A和所述第二组第一接触垫101B，从而可以将转接子电路板200安装到主体子电路板100上。例如在图3A示出的示例中，第一走线部分102、第三走线部分202和第二走线部分103依次电连接以得到第一功能走线，由此电信号可以从第一走线部分102经第三走线部分202被传输到第二走线部分103，或者可以从第二走线部分103经第三走线部分203被传输到第一走线部分102。
例如，图1示出了转接子电路板200通过第一组第二接触垫201A和第二组第二接触垫垫201B与第一转接端101的第一组第一接触垫101A和所述第二组第一接触垫101B的配合而安装到主体子电路板100上的情形，在一些实施例中，主体子电路板100和转接子电路板200也可以处于待连接状态，即单独的主体子电路板100和转接子电路板200也在本公开的保护范围之内。
例如，在一些实施例中，如图2所示，柔性电路板10还包括第一控制电路结合结构104，第一控制电路结合结构104设置在主体子电路板100上。例如，第一控制电路结合结构104包括多个接触垫，用于安装第一控制电路，该多个接触垫的一部分与第一部分走线102包括的多条走线的另一端一一对 应电连接。第一控制电路结合结构104配置为给第一功能走线提供第一电信号或从第一功能走线接收第一电信号。
例如，第一控制电路可以为驱动IC芯片。将驱动IC芯片结合到柔性电路板的方式(即封装方式)有多种，例如带载封装(Tape Carrier Package，TCP)、膜上芯片(Chip on Film,COF)封装等。在TCP方式中，柔性电路板包括多个接触垫，驱动IC芯片的多个引脚与柔性电路板的多个接触垫一一对应焊接(例如共晶焊)，或者通过各向异性导电胶(ACF)一一对应电连接，并且至少通过例如环氧树脂对焊接部分进行保护；为了增加TCP方式下柔性电路板的可弯折性，可以在封装部分形成狭缝(Slit)。在COF封装方式中，柔性电路板包括多个接触垫，驱动IC芯片的多个引脚通过ACF直接压接在柔性电路板的多个接触垫上，使得驱动IC芯片的多个引脚与柔性电路板的多个接触垫一一对应电连接。例如，柔性电路板上用于结合驱动IC芯片的接触垫的大小、排布方式等，可根据不同类型的封装方式或要封装的驱动IC芯片进行相应的调整，例如这些接触垫可以排列为长条形或排列为矩形。本公开的实施例对于驱动IC芯片的封装方式不作限定。
例如，在一些实施例中，如图2所示，柔性电路板10的主体子电路板100还包括第二功能走线105，第二功能走线105包括多条走线，第一控制电路结合结构104中的另一部分接触垫与第二功能走线105包括的多条走线一一对应地电连接，此时，第一控制电路结合结构104上安装的第一控制电路还配置为给第二功能走线105提供第二电信号或从第二功能走线105接收第二电信号。
例如，在一些实施例中，如图2所示，主体子电路板100还包括第三功能走线106，第三功能走线106包括多条走线，并分别与第一转接端101的第三组第一接触垫101C所包括的多个接触垫一一对应电连接。
例如，如图3B所示，转接子电路板200还包括第四走线部分203，第四走线部分203包括多条走线，并分别与第二转接端201的第三组第二接触垫201C包括的多个接触垫一一对应电连接，由此，第三功能走线106通过第一转接端101的第三组第一接触垫101C和第二转接端201的第三组第二接触垫201C电连接到转接子电路板200的第四走线部分203。例如，图3B示出的是转接子电路板200的第二侧的平面示意图，此时，第三走线部分202和第四走线部分203分别设置在转接子电路板200的两侧，从而可以避免第 三走线部分202和第四走线部分203的信号串扰。
例如，在一些实施例中，如图3A和图3B所示，转接子电路板200还包括第三转接端204，第三转接端204与第二转接端201相对。例如，第三转接端204包括多个接触垫，例如与第四走线部分203的多条走线一一对应电连接，用于与其他电子元件电连接，例如电连接于系统电路板或者用户端等，本公开的实施例对此不做限定。
例如，在一些实施例中，如图2所示，主体子电路板100上的第三功能走线106位于第一走线部分102和第二走线部分103之间，且第三组第一接触垫101C位于第一组第一接触垫101A和第二组第一接触垫101B之间。由此，第三功能走线106与第一走线部分102和第二走线部分103均不交叉，从而避免在主体子电路板100本身上形成交叉的走线，进而可以避免或减弱不同走线之间发生信号串扰，或者避免为防止信号串扰而增加额外的功能层，从而避免电路板结构复杂化；另外，该设计还可以简化主体子电路板100的走线布图，使主体子电路板的制作工艺变得简单。
例如，在一些实施例中，如图2所示，柔性电路板10还包括第二控制电路结合结构107，该第二控制电路结合结构107设置在主体子电路板100上。例如，第二控制电路结合结构107包括多个接触垫，用于安装第二控制电路，该多个接触垫的至少一部分与第三功能走线106的一端一一对应电连接。第二控制电路结合结构107配置为给第三功能走线106提供第三电信号或从第三功能走线106接收第三电信号。例如，第三功能走线106分为两部分，第三功能走线106的一部分电连接在第二控制电路结合结构107与第三组第一接触垫101C之间，第三功能走线106的另一部分电连接在第二控制电路结合结构107与形成于主体子电路板100一侧边缘的接触垫(如下所述)之间。
例如，第二控制电路也可以为驱动IC芯片。第一控制电路和第二控制电路分别用于实现不同的驱动功能。如上所述，该驱动IC芯片结合到柔性电路板的方式例如为带载封装(Tape Carrier Package，TCP)、膜上芯片(Chip on Film,COF)封装等。例如，第二控制电路结合结构108包括多个接触垫，以用于与驱动IC芯片连接。同样地，这些接触垫的大小、排布方式等，可根据不同类型的封装方式或要封装的驱动IC芯片进行相应的调整，本公开的实施例对此不作具体限定。
例如，如图4A和图4B所示，在一些实施例中，第一控制电路结合结构104还可以形成在转接子电路板200上。此时，第三走线部分202分为两部分，第三走线部分202的一部分电连接在第一控制电路结合结构104与第一组第二接触垫201A之间，第三走线部分202的另一部分电连接在第一控制电路结合结构104与第二组第二接触垫201B之间。此时，在主体子电路板100上，第一走线部分102和第二走线部分103分别与第一转接端101的第一组第一接触垫101A和第二组第一接触垫101B电连接；在转接子电路板200上，第三走线部分202每一部分的一端与第一控制电路结合结构104电连接，另一端与第一组第一接触垫101A或第二组第一接触垫101B电连接。由此，主体子电路板100上的第一走线部分102和第二走线部分103分别电连接至转接子电路板200上的第一控制电路结合结构104。
例如，在一些实施例中，主体子电路板可以为具有单层走线的单层结构或者具有多层走线的多层结构结构(例如为具有双层走线的双层结构或者具有三层走线的三层结构等)，本公开的实施例对此不做限定。
例如，图5A示出了本公开一些实施例提供的一种主体子电路板的截面示意图，该截面图例如是沿图2中的A-A线剖切得到的。在这些实施例中，主体子电路板100为单层结构。
如图5A所示，主体子电路板100包括第一基板1001以及位于第一基板1001一侧叠层的第一走线层1002和第一绝缘层1003。第一走线层1002包括第一走线部分102、第二走线部分103、第二功能走线105、第一转接端101等结构，第一转接端101由第一绝缘层1003暴露。例如，第一绝缘层1003作为保护层，对第一走线层1002提供结构以及电气保护，例如第一绝缘层1003可以通过粘结层(图中未示出)结合到第一走线层1002以及第一基板1001；第一绝缘层1003中形成有开口1013，在开口1013中例如可以对暴露的第一走线层1002中对应于第一转接端101的部分进行表面处理(例如镀覆焊锡层)，从而形成图案化的多个接触垫，对应地形成第一转接端101。
例如，图5B示出了本公开一些实施例提供的另一种主体子电路板的截面示意图，该截面图例如是沿图2中的A-A线剖切得到的。在这些实施例中，主体子电路板100为多层结构，下面参考图5B以主体子电路板100具有双层结构为例进行说明，但是本公开的实施例对此不作限制。
如图5B所示，该示例中，主体子电路板100包括第一基板1001、位于 第一基板1001第一侧(图中示出为上侧)且层叠的第一走线层1002和第一绝缘层1003，还包括位于第一基板1001第二侧(图中示出为下侧)且层叠的第二走线层1004和第二绝缘层1005。第一绝缘层1003作为保护层，对第一走线层1002提供结构以及电气保护，例如第一绝缘层1003可以通过粘结层(图中未示出)结合到第一走线层1002以及第一基板1001；第二绝缘层1005作为保护层，对第二走线层1004提供结构以及电气保护，例如第二绝缘层1005可以通过粘结层(图中未示出)结合到第二走线层1004以及第一基板1001。
例如，第一走线部分102、第二走线部分103和第三功能走线106在第一走线层1002和第二走线层1004中交叉排布，即第一走线层1002和第二走线层1004均具有第一走线部分102、第二走线部分103和第三功能走线106，例如第一走线部分102在主体子电路板100的板面上彼此相邻的两条走线可以分别位于第一走线层1002和第二走线层1004，由此便于走线布置，第二走线部分103和第三功能走线106也可以类似地设置；又例如，在一些示例中，第一走线层1002包括第一走线部分102和第二走线部分103，第二走线层1004包括第三功能走线106，即不同的走线层可分别布置不同的功能走线。本公开的实施例对主体子电路板100上的走线布图不作具体限定。
例如，第一转接端101的多个第一接触垫由第一绝缘层1003暴露。例如，类似地，第一绝缘层1003中形成有开口1013，在开口1013中例如可以对暴露的第一走线层1002中对应于第一转接端101的部分进行通过表面处理，从而形成图案化的多个接触垫，对应地形成第一转接端101；类似地，对于位于第二走线层1004中的走线，则可以通过穿过第一基板1001中的过孔1011、第二走线层1004和第一绝缘层1003的开口1013形成转接端。例如，第一基板1001中的过孔1011和第一绝缘层1003的开口1013错位设置，由此在制备工艺中，开口1013位置处较为平坦，易于接触垫的形成。
例如，在一些实施例中，主体子电路板也可以具有三层结构、四层结构等多层结构。此时，主体子电路板上的各部分走线，例如第一走线部分、第二走线部分、第二功能走线和第三功能走线可以在多层走线层中排布。例如，第一走线部分、第二走线部分、第二功能走线和第三功能走线在多层走线层中交替排布，或者分别在不同走线层中排布。本公开的实施例对主体子电路板的走线层的数量以及走线的排布不做具体限定。
类似地，桥接子电路板可以为具有双层走线的双层结构或具有更多层走线的多层结构。
例如，图6A示出了本公开一些实施例的一种转接子电路板200的截面示意图，该截面图例如是沿图3中的B-B剖切得到的。如图6A所示，转接子电路板200包括第二基板2001、位于第二基板2001的第一侧(图中示出为上侧)的第二走线层2002和第二绝缘层2003、位于第二基板2001的第二侧(图中示出为下侧)的第三走线层2004和第三绝缘层2005。同样，第二绝缘层2003和第三绝缘层2005作为保护层，对第二走线层2002和第三走线层2004提供结构以及电气保护，例如第二绝缘层2003和第三绝缘层2005可以通过粘结层(图中未示出)分别结合到第二走线层2002和第三走线层2004。
例如，第二走线层2002包括第三走线部分202；第三走线层2004包括第四走线部分203和第二转接端201，从而第三走线部分202和第四走线部分203设置在不同的走线层中。例如，第二转接端201的多个第二接触垫由第三绝缘层2005暴露，第三走线部分202的两端分别通过开口与第二转接端201的第一组第二接触垫201A和第二组第二接触垫201B电连接。例如，第三走线部分202通过第二基板2001中的过孔2011和第三绝缘层2005中的开口2015暴露并引出，例如通过表面处理形成图案化的多个接触垫，构成转接端。例如，第三绝缘层2005中的开口2015形成在图6A示出的虚线框标示的位置或者形成在其他合适的位置，本公开的实施例对此不做限定。例如，第二基板2001中的过孔2011和第三绝缘层2005的开口2015错位设置，由此在制备工艺中，开口1015位置处较为平坦，易于接触垫的形成。
例如，在另一示例中，图6B示出了本公开一些实施例的另一种转接子电路板的截面示意图，该截面图是例如沿图3A中的B-B剖切得到的。如图6B所示，转接子电路板包括第二基板2001，位于第二基板2001的第一侧的第二走线层2002和第二绝缘层2003以及位于第二基板2001的第二侧的第三走线层2004和第三绝缘层2005。第二走线层2002包括第三走线部分202和第二转接端201，第二转接端201的多个第二接触垫由第二绝缘层2003暴露；第三走线层2004包括第四走线部分203，第四走线部分203通过开口与第二转接端201的第三组第二接触垫201C电连接。例如，位于第四走线部分203通过第二基板2001中的过孔2011和第二绝缘层2003中的开口2013 暴露并引出，例如通过表面处理形成图案化的多个接触垫，构成转接端。例如，第二绝缘层2003中的开口2013形成在图6B示出的虚线框标示的位置或者形成在其他合适的位置，本公开的实施例对此不做限定。例如，第二基板2001中的过孔2011和第二绝缘层2003中的开口2013错位设置，由此在制备工艺中，开口2013位置处较为平坦，易于接触垫的形成。
例如，第二侧相对于第一侧，在将转接子电路板200安装到主体子电路板100时，第二侧相对于第一侧更靠近主体子电路板100。
例如，在图6A和图6B分别示出的转接子电路板200中，转接子电路板200还包括位于第二走线层2002和第三走线层2004之间的屏蔽层2006。屏蔽层2006例如设置在第二基板2001的第一侧或者第二侧，并通过第四绝缘层2007与相邻的走线层绝缘，例如图6A和图6B示出为屏蔽层2006设置在第二基板2001的第二侧，且通过第四绝缘层2007与第三走线层2004绝缘的情况。由此，屏蔽层2006可防止位于转接子电路板200的第二基板2001两侧的走线产生信号串扰。例如，屏蔽层2006以及第四绝缘层2007在对应于转接端的位置具有镂空结构，例如该镂空结构连通于过孔2011，以便于走线的引出并形成转接端。
例如，第二基板2001中还具有另一过孔2021，屏蔽层2006通过过孔2021与第二走线层2002中的接地线电连接，从而屏蔽层2006接地，可起到屏蔽作用；又例如，第四绝缘层2007中具有过孔2017，屏蔽层2006通过过孔2017与第三走线层2004中的接地线电连接，从而屏蔽层2006接地。
例如，在另一实施例中，转接子电路板200还可以具有更多层走线层，例如在第二基板2001的第一侧具有双层走线层，此时，位于第二基板2001的第一侧的各走线可以在上述双层走线层中交替排布或者不同的走线分别设置在不同的走线层中。例如，转接子电路板200还可以在第二基板2001的第二侧也具有双层走线层，此时，位于第二基板2001的第二侧的各走线可以在上述双层走线层中交替排布或者不同的走线分别设置在不同的走线层中。本公开的实施例对转接子电路板200的走线层数以及具体走线形式不作具体限定。
例如，第一基板1001和第二基板2001采用聚酰亚胺或者聚酯等材料，各走线层可以由铜、银、铝等金属材料或者合金材料制备，各绝缘层采用聚酰亚胺或者聚酯等绝缘材料，屏蔽层2006可以为铜等金属材料，粘结层采 用环氧树脂或聚乙烯等，本公开对各功能层的材料不作具体限定。
例如，在一些实施例中，转接子电路板200的第二转接端201通过各向异性导电胶、焊接材料或者连接器连接到主体子电路板100的第一转接端101。例如，连接器包括零插入力型(Zero Insertion Force，ZIF)连接器或者板对板型(Board to Board，BTB)连接器等，本公开的实施例对各转接端的连接方式不做具体限定。
例如，在一个示例中，采用板对板型连接器连接主体子电路板100和转接子电路板200。此时，该连接器包括相互配合的公连接器和母连接器。例如，主体子电路板100的第一转接端101设置母连接器，转接子电路板200的第二转接端201设置公连接器，从而通过公连接器和母连接器的插合使转接子电路板200与主体子电路板100连接。
本公开实施例提供的柔性电路板具有主体子电路板和转接子电路板，通过转接子电路板将位于主体子电路板两侧的走线转接，可以避免走线在主体子电路板上交叉，从而可以防止或减弱信号串扰，或者可以避免为防止信号串扰而增加额外的功能层，从而可以避免电路板结构复杂化。本公开的一些实施例中，主体子电路板和转接子电路板具有简单的单层或者双层结构，因此走线布图更简单，可降低主体子电路板和转接子电路板的制作难度。
本公开一些实施例提供一种电子装置模组，图7示出了该电子装置模组的示意图。如图7所示，电子装置模组1包括电子装置基板11以及上述任一的柔性电路板10，电子装置基板11包括第一功能电路结构20。柔性电路板10的第一功能走线(包括第一走线部分102、第二走线部分103和第三走线部分202)电连接第一功能电路结构20。
例如，在一些实施例中，柔性电路板10还包括第二功能走线105，第一功能电路结构20包括第一信号传输部分21和第二信号传输部分22，第一功能走线电连接第一信号传输部分21，第二功能走线105电连接第二信号传输部分22。
例如，在一些实施例中，电子装置基板11还包括第二功能电路结构23，柔性电路板还包括第三功能走线106，第三功能走线106电连接第二功能电路结构23。
例如，在一些实施例中，电子装置基板11为具有显示功能与触控功能的基板，此时，第一功能电路结构20为触控电路结构，第二功能电路结构 23为显示电路结构。在另一些实施例中，电子装置基板11为具有显示功能与指纹识别功能的基板，此时，第一功能电路结构20为指纹识别电路结构，例如该指纹识别电路结构为电容式指纹识别电路，包括交叉设置的检测驱动电极和检测感应电极，第二功能电路结构23为显示电路结构。下面以第一功能电路结构20为触控电路结构为例进行说明。
例如，触控电路结构在电子装置基板11上的设置方式可以是内置式，也可以是外挂式。触控电路结构的形式可以是电容式，例如为互电容式触控电路结构。例如，该互电容式触控电路结构包括沿第一方向延伸的多个第一电极与沿第二方向(与第一方向相交叉)延伸的多个第二电极，两组电极交叉的位置将会形成检测电容，也即这两组电极分别构成了电容的两极。当手指触摸到该触控电路结构时，手指会影响触摸点附近两个电极之间的耦合状态，从而改变了这两个电极之间的检测电容的电容量。根据触控电路结构电容变化量数据以及各个电容的坐标，可以得出每一个触摸点的坐标。在检测电容大小时，横向电极作为触控驱动电路依次发出激励信号，纵向电极作为触控感应电路同时或依次接收信号，这样可以得到所有横向和纵向电极交汇点的电容值大小，即整个触控结构的二维平面的电容大小。因此，触控结构上即使有多个触摸点，也能确定出每个触摸点的真实坐标。
例如，在上述情况下，第一信号传输部分21包括电连接触控电路的触控驱动(Tx)电路的触控驱动走线，第二信号传输部分22包括电连接触控电路的触控感应(Rx)电路的触控感应走线。此时，第一控制电路1041为触控驱动IC，可通过触控驱动走线为触控驱动电路提供激励信号，可通过触控感应走线接收触控感应电路的感应信号，并可基于上述信号判断触控位置并进行响应。例如，触控感应电路与第一控制电路结合结构104的距离更近，即与其上安装的第一控制电路1041，即触控驱动IC的距离更近，因此触控感应电路接受到的感应信号传输至触控驱动IC的路径更短，因此该感应信号受到信号干扰的可能性更小，从而可以使触控操作更加准确。例如，如图所示，触控驱动走线和触控感应走线延伸到电子装置基板11的同一侧(图中的下侧)，并且与在该侧边形成的接触垫211和接触垫221分别电连接。
例如，在本公开的其他实施例中，也可以是第一信号传输部分21包括电连接触控电路的触控感应(Rx)电路的触控感应走线，第二信号传输部分22包括电连接触控电路的触控驱动(Tx)电路的触控驱动走线，此时，触 控驱动电路直接电连接至第一控制电路结合结构104，因此触控驱动电路与第一控制电路结合结构104的距离更近，即与其上安装的第一控制电路1041，即触控驱动IC的距离更近，由此，在该实施例中，触控驱动电路中的触控驱动信号受到信号干扰的可能性更小。
例如，柔性电路板10在其一侧(例如图中的上侧)具有接线端110，接线端110上具有多个接触垫，第二走线部分103包括的多条走线的另一端与接线端110中的部分接触垫一一对应电连接，第二功能走线105包括的多条走线的另一端与接线端110中的另一部分接触垫一一对应电连接，而且第三功能走线106包括的多条走线的另一端与接线端110中的再一部分接触垫一一对应电连接。例如，分别电连接到第二走线部分103、第三功能走线106和第二功能走线105的部分接触垫在接线端110间隔设置或者连续设置，本公开的实施例对此不做具体限定。例如，当第二走线部分103、第三功能走线106和第二功能走线105中走线的数量较多时，与其相连的接触垫可以在接线端110连续布置；当第二走线部分103、第三功能走线106和第二功能走线105中走线的数量较少时，与其相连的接触垫可以在接线端110间隔布置，此时，例如可以形成图7所示的间隔设置的多组接触垫。
例如，接线端110设置在主体子电路板的接线区110A(即图中接线端110下方的斜线区域)，例如，接线区110A区只具有走线层和部分绝缘层，而不具有屏蔽层等结构，因此接线区110A具有较高的透明度，当柔性电路板10结合到电子装置基板11的过程中，可以实现清楚对位，以便于柔性电路板10和电子装置基板11的准确电连接。
例如，当将柔性电路板10结合到电子装置基板11时，可以将柔性电路板10侧边的接线端110的接触垫与电子装置基板11侧边的接触垫直接压接在一起，例如，在一些实施例中，将柔性电路板10侧边的接线端110的接触垫与电子装置基板11侧边的接触垫彼此通过例如ACF电连接，从而将柔性电路板10上的第一功能走线与第一信号传输部分21连接的触控驱动走线通过接触垫211电连接、将柔性电路板上的第二功能走线与第二信号传输部分22连接的触控感应走线通过接触垫221电连接，由此将柔性电路板10的第一功能走线和第二功能走线与电子装置基板11的触控电路结构电连接。
例如，第二功能电路结构23，即显示电路结构，包括多条数据线(以及还包括栅线等)，该多条数据线分别与像素单元电连接，多条数据线延伸到 电子装置基板11的一侧(图中的下侧)，并且与在该侧边形成的接触垫231电连接。对于有机发光二极管(OLED)显示基板的情形，像素单元包括显示驱动电路，例如显示驱动电路包括多个晶体管、电容以及发光器件等，例如形成为2T1C、3T1C或者7T1C等多种形式。例如，当将柔性电路板10结合到电子装置基板11时，柔性电路板10的接线端110上具有的多个接触垫，还将柔性电路板上的第三功能走线与第二功能电路结构23中的数据线通过接触垫231电连接，由此将柔性电路板10的第三功能走线与电子装置基板11的显示电路结构电连接。此时，第二控制电路1071为显示驱动IC，可为显示驱动电路提供数据信号，从而可通过显示驱动IC提供的数据线号控制发光器件的发光状态，实现不同的显示效果。
对于液晶显示(LCD)基板的情形，像素单元包括开关元件和用于控制液晶偏转的第一电极(像素电极)和第二电极(公共电极)，该开关元件与第一电极电连接。第二功能电路结构23，即显示电路结构，包括分别连接于像素单元的多条数据线，此时，第二控制电路为显示驱动IC，可通过数据线为像素单元提供不同的数据电压信号，从而控制液晶的扭转状态，实现不同的显示效果。
例如，柔性电路板通过绑定的方式结合在电子装置基板11上，在绑定时，柔性电路板可在绑定于电子装置基板11上之后被弯折到电子装置基板11的背面并被固定，即安装到电子装置基板11的非显示侧，以便于显示屏幕的大屏化设计。
在上述本公开的一些实施例中电子装置基板的柔性电路板中，通过转接子电路板将位于主体子电路板上分别与触控驱动电路电连接的走线部分转接，从而使得在主体子电路板上触控驱动电路与显示驱动电路不相交，并且转接子电路板的双层走线层之间也互相屏蔽，因此可以避免位于转接子电路板两侧的走线的信号串扰，同时，该主体子电路板与转接子电路板的结构简单，走线布图简单，有利于简化其制作工艺。
本公开至少一实施例提供一种电子装置，图8示出了该电子装置的示意图。如图8所示，电子装置2包括上述任一的电子装置模组1，该电子装置模组1包括电子装置基板11以及柔性电路板10。例如，图8中示出的电子装置基板11的上侧为显示侧，下侧为非显示侧；此时，柔性电路板10绑定之后被弯折放置于电子装置基板11的非显示侧，以便于实现显示屏幕的大 屏化设计。
该电子装置2例如可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件，本公开的实施例对此不作具体限定。
本公开至少一实施例提供一种柔性电路板的制作方法，如图9所示，该制作方法包括步骤S101-S103。
步骤S101：提供主体子电路板。
参照图2，主体子电路板100包括第一转接端101、第一走线部分102和第二走线部分103，第一转接端101包括多个第一接触垫，第一走线部分102和第二走线部分103彼此间隔开且分别与第一转接端101的第一组第一接触垫101A和第二组第一接触垫电连接101B。
例如，参照图5A，主体子电路板100通过依次在第一基板1001上形成第一走线层1002以及第一绝缘层1003形成。例如，第一基板1001采用聚酰亚胺或者聚酯等材料，第一走线层1002采用铜、银、铝等金属材料或者合金材料，第一绝缘层1003也采用聚酰亚胺或者聚酯等材料。例如，首先在第一基板1001上采用溅射等方法形成一层铜金属层，其次对铜金属层进行构图以形成第一走线层1002，然后采用涂覆等方式在第一走线层1002上形成第一绝缘层1003，并在第一绝缘层1003中形成开口以形成转接端等结构。
步骤S102：提供转接子电路板。
参照图3A，转接子电路板200包括第二转接端201和第三走线部分202，第二转接端201包括多个第二接触垫，第三走线部分202的两端分别与第二转接端201的第一组第二接触垫201A和第二组第二接触垫201B电连接。
例如，参照图6A，转接子电路板200通过在第二基板2001的第一侧依次形成第二走线层2002和第二绝缘层2003，然后在第二基板2001的第二侧依次形成第三走线层2004以及第三绝缘层2005而形成。例如，第一基板2001采用聚酰亚胺或者聚酯等材料，第二走线层2002和第三走线层2004采用铜、银、铝等金属材料或者合金材料，第二绝缘层2003和第三绝缘层2005也采用聚酰亚胺或者聚酯等材料。各走线层以及各绝缘层的形成方式可参见上述实施例，在此不再赘述。
例如，在图6A的示例中，第二转接端201形成于转接子电路板200的 第一侧，此时，可在第二基板2001和第三绝缘层2005中形成开口(或过孔)，使得第三走线部分202可通过第二基板2001中的过孔2011和第三绝缘层2005中的开口2015暴露并引出，然后例如通过表面处理形成图案化的多个接触垫，以构成转接端。
例如，参照图6A，在一些实施例中，形成转接子电路板200还包括在第二基板2001的第二侧形成屏蔽层2006以及第四绝缘层2007。例如，屏蔽层2006例如悬空，或配置为可与接地线电连接。由此，屏蔽层2006可防止转接子电路板200上的双层走线层发生信号串扰。例如，屏蔽层2006和第四绝缘层2007在对应于第二基板2001的过孔2011的位置形成有镂空结构，从而引出第三走线部分202。
步骤S103：将转接子电路板安装到主体子电路板上。
参照图1，将第二转接端201的第一组第二接触垫201A和第二组第二接触垫201B分别电连接到第一转接端101的第一组第一接触垫101A和第二组第一接触垫101B，从而将转接子电路板200安装到主体子电路板100上，并且将第一走线部分102、第三走线部分103和第二走线部分202依次电连接以得到第一功能走线。在安装时，转接子电路板200的第二侧相对于第一侧更靠近主体子电路板100，从而主体子电路板100上的第二功能走线与和其电连接的转接子电路板200上的第四走线203更靠近，相对来说，该设置更有利于主体子电路板100以及转接子电路板200的走线布置。
例如，可以通过热压的方式、焊接的方式或者通过连接器将转接子电路板200的第二转接端201连接到主体子电路板100的第一转接端101。例如，在热压的方式中，在两个转接端之间形成各向异性导电胶，然后对转接端进行热压操作，以利用各向异性导电胶将两个转接端连接在一起。例如，连接器包括零插入力型(Zero Insertion Force，ZIF)连接器或者板对板型(Board to Board，BTB)连接器等，本公开的实施例对连接方式不做具体限定。
例如，在一个示例中，采用板对板型连接器连接主体子电路板100和转接子电路板200。此时，该连接器包括相互配合的公连接器和母连接器。例如，主体子电路板100的第一转接端101设置母连接器，转接子电路板200的第二转接端201设置公连接器，从而可以通过公连接器和母连接器的插合使转接子电路板200与主体子电路板100连接。
本公开实施例的柔性电路板的制作方法提供了主体子电路板和转接子 电路板，并通过转接子电路板将位于主体子电路板两侧的走线转接，该方法可以避免走线在主体子电路板上交叉，防止或减弱信号串扰，或者避免为防止信号串扰而增加额外的功能层，从而可以避免电路板结构复杂化；另外，该制作方法提供的主体子电路板和转接子电路板具有简单的单层或者双层结构，因此走线布图更简单，可以降低主体子电路板和转接子电路板的制作难度。还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”或者可以存在中间元件。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (20)

  1. 一种柔性电路板，包括：
    主体子电路板，包括第一转接端、第一走线部分和第二走线部分，所述第一转接端包括多个第一接触垫，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一转接端的第一组第一接触垫和第二组第一接触垫电连接；
    转接子电路板，包括第二转接端和用于第一功能走线的第三走线部分，所述第二转接端包括多个第二接触垫，所述第三走线部分将所述第二转接端的第一组第二接触垫和第二组第二接触垫电连接；
    其中，所述转接子电路板配置为通过将所述第二转接端的所述第一组第二接触垫和所述第二组第二接触垫分别电连接到所述第一转接端的所述第一组第一接触垫和所述第二组第一接触垫，而安装到所述主体子电路板上。
  2. 根据权利要求1所述的柔性电路板，其中，所述转接子电路板安装到所述主体子电路板，使得所述第一走线部分、所述第三走线部分和所述第二走线部分依次电连接以得到所述第一功能走线。
  3. 根据权利要求1或2所述的柔性电路板，还包括第一控制电路结合结构，
    其中，所述第一控制电路结合结构设置在所述主体子电路板上，与所述第一走线部分电连接，或者所述第一控制电路结合结构设置在所述转接子电路板上，与所述第三走线部分电连接；
    所述第一控制电路结合结构配置为给所述第一功能走线提供第一电信号或从所述第一功能走线接收第一电信号。
  4. 根据权利要求3所述的柔性电路板，其中，所述主体子电路板还包括第二功能走线，
    所述第二功能走线与设置在所述主体子电路板上的所述第一控制电路结合结构电连接，所述第一控制电路结合结构还配置为给所述第二功能走线提供第二电信号或从所述第二功能走线接收第二电信号。
  5. 根据权利要求4所述的柔性电路板，其中，所述主体子电路板还包括第三功能走线，所述第三功能走线与所述第一转接端的第三组第一接触垫电连接，
    所述转接子电路板还包括第四走线部分，所述第四走线部分与所述第二转接端的第三组第二接触垫电连接，
    所述第三功能走线通过所述第一转接端的所述第三组第一接触垫和所述第二转接端的所述第三组第二接触垫电连接到所述转接子电路板的所述第四走线部分。
  6. 根据权利要求5所述的柔性电路板，其中，所述第三功能走线位于所述第一走线部分和所述第二走线部分之间，且所述第三组第一接触垫位于所述第一组第一接触垫和所述第二组第一接触垫之间。
  7. 根据权利要求1-6任一所述的柔性电路板，其中，所述主体子电路板包括第一基板以及位于所述第一基板一侧叠层的第一走线层和第一绝缘层，
    所述第一走线层包括所述第一走线部分、所述第二走线部分、所述第二功能走线和所述第一转接端，所述第一转接端的多个第一接触垫由所述第一绝缘层暴露。
  8. 根据权利要求5所述的柔性电路板，其中，所述转接子电路板包括：
    第二基板，
    位于所述第二基板的第一侧的第二走线层和第二绝缘层，所述第二走线层包括所述第三走线部分；
    位于所述第二基板的第二侧的第三走线层和第三绝缘层，所述第三走线层包括所述第四走线部分和所述第二转接端，所述第二转接端的多个第二接触垫由所述第三绝缘层暴露，所述第三走线部分的两端分别通过开口与所述第二转接端的所述第一组第二接触垫和所述第二组第二接触垫电连接；
    其中，所述第二侧相对于所述第一侧。
  9. 根据权利要求5所述的柔性电路板，其中，所述转接子电路板包括：
    第二基板，
    位于所述第二基板的第一侧的第二走线层和第二绝缘层，所述第二走线层包括所述第三走线部分和所述第二转接端，所述第二转接端的多个第二接触垫由所述第二绝缘层暴露；
    位于所述第二基板的第二侧的第三走线层和第三绝缘层，所述第三走线层包括所述第四走线部分，所述第四走线部分通过开口与所述第二转接端的所述第三组第二接触垫电连接；
    其中，所述第二侧相对于所述第一侧。
  10. 根据权利要求8或9所述的柔性电路板，其中，所述第二侧相对于所述第一侧更靠近主体子电路板。
  11. 根据权利要求8或9所述的柔性电路板，其中，所述转接子电路板还包括位于所述第二走线层和所述第三走线层之间的屏蔽层。
  12. 根据权利要求1-11任一所述的柔性电路板，其中，所述转接子电路板的所述第二转接端通过各向异性导电胶、焊接材料或者连接器连接到所述主体子电路板的所述第一转接端。
  13. 一种电子装置模组，包括电子装置基板以及权利要求1-12任一所述的柔性电路板；
    其中，所述电子装置基板包括第一功能电路结构，所述柔性电路板的第一功能走线电连接所述第一功能电路结构。
  14. 根据权利要求13所述的电子装置模组，其中，所述柔性电路板还包括第二功能走线，
    所述第一功能电路结构包括第一信号传输部分和第二信号传输部分，第一功能走线电连接所述第一信号传输部分，所述第二功能走线电连接所述第二信号传输部分。
  15. 根据权利要求14所述的电子装置模组，其中，所述电子装置基板还包括第二功能电路结构，所述柔性电路板还包括第三功能走线，所述第三功能走线电连接所述第二功能电路结构。
  16. 根据权利要求14或15所述的电子装置模组，其中，所述第一功能电路结构为触控电路结构，所述第二功能电路结构为显示电路结构。
  17. 根据权利要求16所述的电子装置模组，其中，所述第一信号传输部分为所述触控电路的触控驱动电路，所述第二信号传输部分为所述触控电路的触控感应电路；或者
    所述第一信号传输部分为所述触控电路的触控感应电路，所述第二信号传输部分为所述触控电路的触控驱动电路。
  18. 一种电子装置，包括权利要求13-17任一所述的电子装置模组。
  19. 一种柔性电路板的制作方法，包括：
    提供主体子电路板，所述主体子电路板包括第一转接端、第一走线部分和第二走线部分，所述第一转接端包括多个第一接触垫，所述第一走线部分 和所述第二走线部分彼此间隔开且分别与所述第一转接端的第一组第一接触垫和第二组第一接触垫电连接；
    提供转接子电路板，所述转接子电路板包括第二转接端和用于第一功能走线的第三走线部分，所述第二转接端包括多个第二接触垫，所述第三走线部分将所述第二转接端的第一组第二接触垫和第二组第二接触垫电连接；
    将所述第二转接端的所述第一组第二接触垫和所述第二组第二接触垫分别电连接到所述第一转接端的所述第一组第一接触垫和所述第二组第一接触垫，从而将所述转接子电路板安装到所述主体子电路板上。
  20. 根据权利要求19所述的制作方法，其中，通过热压的方式、焊接的方式或者通过连接器将所述转接子电路板的所述第二转接端连接到所述主体子电路板的所述第一转接端。
PCT/CN2020/073850 2019-01-30 2020-01-22 柔性电路板及制作方法、电子装置模组及电子装置 WO2020156456A1 (zh)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7265443B2 (ja) * 2019-07-31 2023-04-26 日本航空電子工業株式会社 配線板組立体
CN111511098B (zh) * 2020-06-10 2021-08-20 京东方科技集团股份有限公司 一种柔性线路板fpc及显示装置
CN112053661B (zh) 2020-09-28 2023-04-11 京东方科技集团股份有限公司 像素电路、像素驱动方法、显示面板和显示装置
WO2022134116A1 (zh) * 2020-12-26 2022-06-30 京东方科技集团股份有限公司 柔性电路板、触控显示模组及触控显示装置
CN114690928A (zh) * 2020-12-30 2022-07-01 京东方科技集团股份有限公司 一种触控显示装置
CN113488577A (zh) * 2021-06-25 2021-10-08 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020131258A1 (en) * 2001-03-14 2002-09-19 Murata Manufacturing Co., Ltd. Mounting structure for module substrates
US20090244871A1 (en) * 2008-03-28 2009-10-01 Saint Light Technology Corp Structured light-emitting module for lighting apparatus
CN105632382A (zh) * 2016-01-04 2016-06-01 京东方科技集团股份有限公司 显示装置及其检测绑定区域绑定情况的方法
CN105960091A (zh) * 2015-03-09 2016-09-21 阿尔卑斯电气株式会社 布线基板、布线基板的连接构造以及布线基板的连接方法
CN207410590U (zh) * 2017-09-11 2018-05-25 广东欧珀移动通信有限公司 电路连接结构及终端

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01319993A (ja) * 1988-06-22 1989-12-26 Furukawa Electric Co Ltd:The プリント回路基板の接続方法
US6817870B1 (en) * 2003-06-12 2004-11-16 Nortel Networks Limited Technique for interconnecting multilayer circuit boards
CN102113425B (zh) * 2008-08-29 2013-05-08 揖斐电株式会社 刚挠性电路板以及电子设备
JP5160687B2 (ja) * 2009-08-25 2013-03-13 シャープ株式会社 表示パネル、表示装置及びその製造方法
CN102176757B (zh) * 2011-01-25 2013-11-06 信利光电股份有限公司 一种摄像头功能测试板
TW201413514A (zh) * 2012-09-24 2014-04-01 Wintek Corp 觸控面板
KR102382004B1 (ko) * 2015-06-18 2022-03-31 삼성에스디아이 주식회사 연성인쇄회로기판
JP2018017976A (ja) * 2016-07-29 2018-02-01 株式会社ジャパンディスプレイ 表示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020131258A1 (en) * 2001-03-14 2002-09-19 Murata Manufacturing Co., Ltd. Mounting structure for module substrates
US20090244871A1 (en) * 2008-03-28 2009-10-01 Saint Light Technology Corp Structured light-emitting module for lighting apparatus
CN105960091A (zh) * 2015-03-09 2016-09-21 阿尔卑斯电气株式会社 布线基板、布线基板的连接构造以及布线基板的连接方法
CN105632382A (zh) * 2016-01-04 2016-06-01 京东方科技集团股份有限公司 显示装置及其检测绑定区域绑定情况的方法
CN207410590U (zh) * 2017-09-11 2018-05-25 广东欧珀移动通信有限公司 电路连接结构及终端

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3920670A4

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