WO2019179446A1 - 指纹识别模组及其制备方法、显示面板以及显示装置 - Google Patents

指纹识别模组及其制备方法、显示面板以及显示装置 Download PDF

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Publication number
WO2019179446A1
WO2019179446A1 PCT/CN2019/078759 CN2019078759W WO2019179446A1 WO 2019179446 A1 WO2019179446 A1 WO 2019179446A1 CN 2019078759 W CN2019078759 W CN 2019078759W WO 2019179446 A1 WO2019179446 A1 WO 2019179446A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
groove
recognition module
substrate
fingerprint recognition
Prior art date
Application number
PCT/CN2019/078759
Other languages
English (en)
French (fr)
Inventor
聂军
蒋璐霞
韩文出
张子鹤
张金刚
马牙川
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/644,271 priority Critical patent/US11138407B2/en
Publication of WO2019179446A1 publication Critical patent/WO2019179446A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present application relates to the field of display technologies, and in particular, to a fingerprint recognition module, a preparation method thereof, a display panel, and a display device.
  • display devices are more and more widely used, and display devices generally include a display panel having a fingerprint recognition function.
  • the display panel with the fingerprint recognition function generally comprises a glass substrate and a fingerprint recognition module, the glass substrate has a through hole, the fingerprint recognition module is disposed in the through hole, and the fingerprint identification module generally comprises a laminated fingerprint identification integrated circuit. : Integrated Circuit (IC), acquisition device, and protection layer.
  • IC Integrated Circuit
  • the present application provides a fingerprint identification module, a preparation method thereof, a display panel, and a display device.
  • the technical solution is as follows:
  • a fingerprint identification module includes a substrate, an acquisition device, and a fingerprint identification circuit;
  • the substrate includes an opposite fingerprint collecting surface and a target surface, the target surface has a first groove, and the collecting device is located in the first groove;
  • the fingerprint identification circuit is electrically connected to the collection device, and is configured to collect, by using the collection device, information about a fingerprint of a side of the fingerprint collection surface.
  • the collecting device is located at a groove bottom of the first groove facing the fingerprint collecting surface.
  • a maximum distance between the groove bottom of the first groove facing the fingerprint collecting surface and the fingerprint collecting surface is less than or equal to a maximum distance of information that the collecting device can collect fingerprints.
  • the fingerprint identification circuit is located on the target surface.
  • the target surface has a second groove, and the fingerprint identification circuit is located in the second groove.
  • the fingerprint identification circuit is located in the first recess.
  • the orthographic projection of the fingerprint identification circuit on the fingerprint collection surface and the orthographic projection of the acquisition device on the fingerprint collection surface do not overlap.
  • the first groove includes a plurality of groove faces, and a joint of any two adjacent groove faces has a first chamfer.
  • the first chamfer is a circular chamfer.
  • the second groove includes a plurality of groove faces, and a joint of any two adjacent groove faces has a second chamfer.
  • the second chamfer is a circular chamfer.
  • the substrate has a thickness of 0.5 mm, and a maximum distance between the groove bottom of the first groove facing the fingerprint collecting surface and the fingerprint collecting surface is less than or equal to 0.3 mm.
  • the collecting device comprises a first electrode layer, a first insulating layer, a second electrode layer, a second insulating layer and an ink layer which are sequentially stacked in a direction away from the fingerprint collecting surface.
  • the substrate is a transparent substrate.
  • the collecting device is located at a bottom of the first groove facing the fingerprint collecting surface, and the first groove is oriented between the groove bottom of the fingerprint collecting surface and the fingerprint collecting surface
  • the maximum distance is less than or equal to the maximum distance that the acquisition device can collect the information of the fingerprint
  • the target surface further has a second groove, and the fingerprint identification circuit is located in the second groove;
  • the first groove includes a plurality of groove faces, wherein a joint of any two adjacent groove faces has a first chamfer, and the first chamfer is a circular chamfer;
  • the second groove includes a plurality of groove faces, wherein a joint of any two adjacent groove faces has a second chamfer, and the second chamfer is a circular chamfer;
  • the collecting device includes a first electrode layer, a first insulating layer, a second electrode layer, a second insulating layer, and an ink layer which are sequentially stacked in a direction away from the fingerprint collecting surface.
  • a method for preparing a fingerprint module comprising:
  • the substrate comprising an opposite fingerprint collecting surface and a target surface
  • the fingerprint identification circuit is electrically connected to the collection device, and the fingerprint identification circuit is configured to collect, by using the collection device, information of a fingerprint on a side of the fingerprint collection surface.
  • the method further includes:
  • the fingerprint recognition circuit is disposed on the target surface.
  • a display panel in another aspect, includes a fingerprint identification module, the fingerprint recognition module includes a substrate, an acquisition device, and a fingerprint identification circuit; the substrate includes an opposite fingerprint collection surface and a target surface.
  • the target surface has a first groove, and the collecting device is located in the first groove;
  • the fingerprint identification circuit is electrically connected to the collection device, and is configured to collect, by using the collection device, information about a fingerprint of a side of the fingerprint collection surface.
  • the substrate is a transparent substrate
  • the display panel comprises a transparent cover
  • the transparent substrate and the transparent cover are a single piece.
  • a display device including the above display panel.
  • the technical solution provided by the present application has the beneficial effects that since the collecting device is disposed in the first groove on the target surface in the substrate, and the target surface and the fingerprint collecting surface in contact with the external environment are oppositely disposed, the collecting can be avoided.
  • the device is in contact with the external environment, improving the dustproof and waterproof performance of the fingerprint recognition module.
  • FIG. 1 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an application scenario of the fingerprint identification module shown in FIG. 1 according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic bottom view of the fingerprint identification module shown in FIG. 3 according to an embodiment of the present application;
  • FIG. 5 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present disclosure.
  • FIG. 7 is a flowchart of a method for preparing a fingerprint identification module according to an embodiment of the present application.
  • FIG. 8 is a flowchart of a method for preparing another fingerprint identification module according to an embodiment of the present application.
  • FIG. 9 is a flowchart of a method for forming an acquisition device according to an embodiment of the present application.
  • the display panel with fingerprint recognition function is more and more widely used, and the display panel with fingerprint recognition function usually includes a glass substrate and a fingerprint recognition module.
  • the glass substrate has a through hole, and the fingerprint recognition module is disposed in the through hole. Since the fingerprint recognition module is located in the through hole of the glass substrate, and there is a gap between the fingerprint recognition module and the display panel, dust of the external environment is easily entered into the gap and deposited on the collection device, so the dustproof and waterproof performance of the fingerprint recognition module Poor.
  • the acquisition device in the fingerprint recognition module is stacked on the fingerprint recognition IC and the acquisition device is formed on the fingerprint recognition IC, the acquisition device is likely to cause damage to the fingerprint recognition IC due to collision with the fingerprint recognition IC, thereby causing fingerprints.
  • the manufacturing yield of the identification module is low.
  • FIG. 1 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application.
  • the fingerprint recognition module may include: a substrate 10, an acquisition device 20, and a fingerprint recognition circuit 30.
  • the substrate 10 includes a fingerprint collection surface 11 and a target surface 12 disposed opposite to each other, and the target surface 12 has a first groove. 12A, the collecting device 20 is located in the first recess 12A; the fingerprint identifying circuit 30 is electrically connected to the collecting device 20 for collecting the information of the fingerprint on the side of the fingerprint collecting surface 11 by the collecting device 20.
  • the acquisition device is disposed in the first groove on the target surface of the substrate, and the target surface and the fingerprint collection surface in contact with the external environment are oppositely disposed. Therefore, the collection device can be prevented from coming into contact with the external environment, and the dustproof and waterproof performance of the fingerprint recognition module is improved.
  • FIG. 2 is a schematic diagram of an application scenario of the fingerprint identification module shown in FIG. 1 according to an embodiment of the present application.
  • the worker can press the finger 40 on the fingerprint collection surface 11 to capture the area corresponding to the device 20 (this area may be the acquisition device 20 on the fingerprint collection surface 11).
  • the orthographic projection area on the top not shown in Figure 2).
  • the fingerprint identification circuit 30 can be controlled to collect the information of the fingerprint on the finger 40 through the acquisition device 20 (currently various fingerprint collection technologies (such as capacitive fingerprint acquisition technology and ultrasonic fingerprint acquisition technology), and fingerprint acquisition devices.
  • the information of the fingerprint of the finger can be collected at a certain distance from the finger.
  • the acquisition device located on the other side of the substrate can collect the information of the fingerprint of the finger). It can be seen that in the process of collecting information of the fingerprint, the collecting device 20 does not need to be in contact with the external space on the finger side and the finger side, and the dustproof and waterproof performance is high.
  • FIG. 3 it is a schematic structural diagram of a fingerprint identification module provided by an embodiment of the present application, and some adjustments are made on the basis of the fingerprint identification module shown in FIG. 1 .
  • the fingerprint recognition circuit 30 can be disposed on the target surface 12. Setting the fingerprint identification circuit 30 on the target surface 12 can shorten the distance between the fingerprint recognition circuit and the acquisition device 20, and improve the transmission efficiency of the information of the fingerprint.
  • the fingerprint identification circuit 30 may also be disposed in an external device without being in contact with the substrate 11. For example, when the fingerprint recognition module is applied to the display device, the fingerprint recognition circuit 30 may be disposed in some components (such as a display) in the display device. On various substrates in the device).
  • the first groove 12A includes a plurality of groove faces (not shown in FIG. 3), and the connection of any two adjacent groove faces has a first chamfer 1A.
  • the chamfer is a transition structure that is placed at the junction of the two faces, which expands the angle between the joints of the two faces, making the transition at the joint smoother.
  • a trace may be set in the first groove, which can make the trace fit more closely with the groove surface of the first groove, thereby improving the durability of the trace.
  • the plurality of groove faces may include a bottom surface and at least one side surface of the first groove.
  • the bottom surface is usually a flat surface (the bottom surface can be various shapes such as an ellipse, a circle, a rectangle, etc.) to facilitate the setting of the collecting device, and the side surface can be a curved surface or a flat surface.
  • the joint between the bottom surface and the side surface may have a chamfer.
  • the joint between the plurality of planes may also have a chamfer.
  • the first chamfer 1A is a circular chamfer.
  • the arc chamfer can be thought of as a curved surface that is connected to the two groove faces.
  • the circular chamfering can disperse the stress between the two adjacent groove faces, so that the substrate 10 can be prevented from being broken at the first groove 12A due to excessive stress concentration.
  • the collecting device 20 is located at the bottom of the first groove 12A facing the fingerprint collecting surface 11 (not shown in FIG. 3 ), so that the distance between the collecting device and the fingerprint collecting surface can be shortened, and the collecting device can be used for fingerprint information. Collection.
  • the acquisition device usually has a maximum distance for collecting fingerprint information. If the distance between the fingerprint of the acquisition device and the finger is greater than the maximum distance of the information that can be collected, the acquisition device may be difficult to collect the information of the fingerprint. If the distance between the fingerprint of the collecting device and the finger is less than or equal to the maximum distance of the information capable of collecting the fingerprint, the collecting device can normally collect the information of the fingerprint. Therefore, the maximum distance between the groove bottom of the first groove 12A and the fingerprint collecting surface 11 (when the groove bottom is flat and parallel to the fingerprint collecting surface, the distance between the groove bottom and the fingerprint collecting surface) may be less than or equal to The acquisition device 20 is capable of acquiring the maximum distance of the fingerprint information so that the acquisition device 20 can normally collect the information of the fingerprint.
  • the thickness 111 of the substrate 10 may be 0.5 mm, and the distance 112 between the bottom surface of the first recess 12A (not shown in FIG. 3) and the fingerprint collection surface 11 may be less than or equal to 0.3 mm (eg, 0.23). (millimeter), and the collecting device 20 is in contact with the bottom surface of the first recess 12A.
  • the thickness of the substrate 10 may also be other thicknesses.
  • the thickness of the substrate 10 is 0.8 mm, and the distance between the bottom surface of the first recess 12A (not shown in FIG. 3) and the fingerprint collecting surface 11 may be other distances. As long as the acquisition device 20 located in the first groove can collect the information of the fingerprint on the side of the fingerprint collection surface.
  • the collecting device 20 may include a first electrode layer 21, a first insulating layer 22, a second electrode layer 23, and a second insulating layer which are sequentially stacked in a direction away from the fingerprint collecting surface 11 (not shown in FIG. 3). 24 and ink layer 25.
  • the ink layer 25 can be used for shading to prevent light outside the fingerprint collection surface from entering below the acquisition device 20.
  • the substrate 10 can be a transparent substrate.
  • the ink layer 25 can be used to mark the area of the collection device 20 on the fingerprint collection surface 11 so that the user can quickly find the collection when using the fingerprint recognition module.
  • the device 20 is in the area on the fingerprint collection surface 11, so that the information of the fingerprint can be quickly collected.
  • FIG. 4 is a bottom view of the fingerprint recognition module shown in FIG. 3, and FIG. 3 is also a schematic view of a section A-A of the fingerprint recognition module of FIG. 3 and 4, the fingerprint recognition circuit 30 can be connected to the first electrode layer 21 via the first signal line 211, and the fingerprint recognition circuit 30 can be connected to the second electrode layer 23 via the second signal line 231.
  • the first electrode layer 21 may include a plurality of signal receiving lines (also referred to as RX lines)
  • the second electrode layer 23 may include a plurality of signal transmitting lines (also referred to as TX lines), and the length direction of the RX lines and the TX lines The length directions can be perpendicular to each other.
  • the fingerprint identification circuit 30 is connected to the RX line through the first signal line L1, and acquires the sensing signal of the first electrode layer 21 from the RX line; the fingerprint identification circuit 30 can also be connected to the TX line through the second signal line L2, and to the TX line. Send the drive signal.
  • the area above the fingerprint recognition circuit 30 and the acquisition device 20 in FIG. 4 may be an effective display area of the display panel.
  • FIG. 5 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present disclosure.
  • the target surface 12 of the transparent substrate 10 may further have a second recess 12B, and the fingerprint recognition IC-30 may be disposed in the second recess 12B.
  • the second groove 12B includes a plurality of groove faces, and the connection of any two adjacent groove faces has a second chamfer 2A.
  • the second chamfer 2A may be a circular chamfer.
  • the superposition of the acquisition device 20 and the fingerprint recognition IC 30 can be avoided, and the fingerprint recognition circuit 30 is damaged when the acquisition device is formed on the fingerprint recognition circuit, thereby improving fingerprint recognition. Module manufacturing yield.
  • the fingerprint identification circuit may be a fingerprint identification IC, and the fingerprint recognition IC may be disposed on the substrate by a chip binding on a substrate (English: Chip On Glass, COG for short).
  • FIG. 6 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present application.
  • the fingerprint identification circuit 30 is located in the first recess 12A, that is, the fingerprint recognition circuit 30 and the acquisition device 20 are both in the first recess 12A. This can reduce the number of grooves and save manufacturing costs.
  • the orthographic projection of the fingerprint recognition circuit 30 on the acquisition surface (not shown in FIG. 6) and the orthographic projection of the acquisition device 20 on the fingerprint collection surface 11 (not shown in FIG. 6) do not overlap, that is, The positions of the fingerprint recognition circuit 30 and the acquisition device 20 in the first groove 12A do not overlap, so that the occurrence of the problem that the two affect each other when the fingerprint recognition circuit 30 and the acquisition device 20 are placed overlapping can be avoided.
  • FIG. 6 reference may be made to FIG. 3, and details are not described herein again.
  • FIG. 3 FIG. 4, FIG. 5, and FIG. 6, only the schematic connection of the fingerprint recognition circuit 30 and the first electrode layer 21 and the second electrode layer 23 is taken as an example.
  • the fingerprint identification circuit is connected to the first electrode layer 21 via a plurality of first signal lines 211, and the fingerprint recognition circuit 30 and the second electrode layer 23 are connected by a plurality of second signal lines 231.
  • the acquisition device is disposed in the first groove on the target surface of the substrate, and the target surface and the fingerprint collection surface in contact with the external environment are oppositely disposed. Therefore, the collection device can be prevented from coming into contact with the external environment, and the dustproof and waterproof performance of the fingerprint recognition module is improved.
  • FIG. 7 is a flowchart of a method for preparing a fingerprint identification module according to an embodiment of the present disclosure.
  • the method for preparing the fingerprint identification module can be used to prepare a fingerprint identification module as shown in any one of FIG. 1 or FIG. 3, such as As shown in FIG. 7, the method for preparing the fingerprint identification module may include:
  • step 501 a substrate is provided.
  • the substrate may include a fingerprint collection surface and a target surface disposed opposite to each other.
  • step 502 a first recess is formed on a target surface of the substrate.
  • step 503 an acquisition device is disposed in the first recess.
  • step 504 a fingerprint recognition IC is provided.
  • step 505 the fingerprint identification circuit is electrically coupled to the acquisition device.
  • the fingerprint identification circuit is configured to collect information about the fingerprint of the side of the fingerprint collection surface by the collection device.
  • the acquisition device is disposed in the first groove on the target surface of the substrate, and the target surface is The fingerprint collection surface that is in contact with the external environment is relatively arranged, so that the collection device can be prevented from coming into contact with the external environment, and the dustproof and waterproof performance of the fingerprint recognition module is improved.
  • FIG. 8 is a flowchart of a method for preparing a fingerprint identification module according to an embodiment of the present disclosure.
  • the method for preparing the fingerprint identification module can be used to prepare a fingerprint identification module as shown in FIG.
  • the method for preparing the fingerprint identification module may include:
  • step 601 a substrate is provided.
  • the substrate may include a fingerprint collection surface and a target surface disposed opposite to each other.
  • a first groove and a second groove are formed on the target surface of the substrate.
  • a first recess and a second recess may be formed on the target surface of the transparent substrate by chemical etching or machining.
  • first groove and the second groove may be formed in one step or may be formed in two steps, respectively.
  • first groove may be formed in step 602 and the second groove may be formed prior to step 605.
  • connection in the first groove formed in step 602 and any two adjacent groove faces in the second groove has a chamfer, and the chamfer may be a circular chamfer.
  • only the first groove may be formed without forming the second groove.
  • step 603 an acquisition device is disposed in the first recess on the target surface.
  • the collecting device and the fingerprint identifying circuit may be connected through a plurality of first signal lines and a plurality of second signal lines, and in the process of forming the collecting device in step 603, multiple first lines may be simultaneously formed.
  • step 603 can include the following five steps:
  • step 6031 a first electrode layer is formed in the first recess on the target surface.
  • a first electrode material layer may be formed on the target surface of the transparent substrate, and the first electrode material layer may cover the entire target surface, and then a layer is coated on the first electrode material layer.
  • the first photoresist is then exposed to the first photoresist using a mask to form the first photoresist into a fully exposed and non-exposed regions.
  • the first photoresist in the completely exposed region is removed by using a developing process, and the first photoresist in the non-exposed region is retained, and the corresponding region on the first electrode material layer of the completely exposed region is etched.
  • the first photoresist in the non-exposed area is peeled off, and the first electrode layer is formed in the first groove on the target surface, and the plurality of first signal lines are formed outside the first groove.
  • step 6032 a first insulating layer is formed on the first electrode layer.
  • step 6033 a second electrode layer is formed on the first insulating layer.
  • a second photoresist may be coated on the target surface of the transparent substrate, and a second electrode material layer is formed on the surface of the second photoresist, and the second photolithography layer is formed.
  • the glue and the second electrode material layer can cover the entire target surface, and then a third photoresist is coated on the second electrode material layer, and then the third photoresist is exposed by using a mask to make the third photolithography
  • the glue forms a fully exposed and non-exposed area.
  • the developing process is used to remove the third photoresist in the completely exposed region, and the third photoresist in the non-exposed region is retained, and the corresponding region on the second electrode material layer is completely etched in the completely exposed region.
  • the second photoresist, the glue and the third photoresist in the non-exposed area are formed to form a second electrode layer on the first insulating layer, and a plurality of second signal lines are formed outside the first recess.
  • step 6034 a second insulating layer is formed on the second electrode layer.
  • step 6035 an ink layer is formed on the second insulating layer.
  • step 604 a fingerprint identification circuit is provided.
  • the fingerprint identification circuit can be a fingerprint recognition IC.
  • step 605 the fingerprint recognition circuit is disposed in the second recess on the target surface, and the fingerprint identification circuit is electrically connected to the acquisition device.
  • the fingerprint identification circuit may be first placed in the second groove, and then the fingerprint recognition IC is connected to the plurality of first signal lines and the plurality of second signal lines.
  • the fingerprint recognition circuit can also be disposed in the first recess.
  • the acquisition device is disposed in the first groove on the target surface of the transparent substrate, and the target surface is The fingerprint collection surface that is in contact with the external environment is relatively disposed, so that the collection device can be prevented from coming into contact with the external environment, and the dustproof and waterproof performance of the fingerprint recognition module is improved.
  • the embodiment of the present application further provides a display panel, which may include the fingerprint recognition module shown in any of FIG. 1 to FIG.
  • the fingerprint identification module comprises a substrate, an acquisition device and a fingerprint identification circuit; the substrate comprises an opposite fingerprint collection surface and a target surface, the target surface has a first groove, the acquisition device is located in the first groove; the fingerprint identification circuit and the acquisition device
  • the electrical connection is used to collect information about the fingerprint of the side of the fingerprint collection surface by the collecting device.
  • the substrate is a transparent substrate
  • the display panel comprises a transparent cover plate for protecting the structure inside the display panel.
  • the transparent cover may be a transparent glass cover.
  • the display panel may further include a base substrate and a device disposed on the base substrate for realizing a display function.
  • the transparent cover can be integrated with the transparent substrate in the fingerprint recognition module, that is, the transparent substrate in the fingerprint recognition module can be multiplexed into a transparent cover in the display panel, thereby reducing the overall thickness of the display panel. The cost of the display panel.
  • the embodiment of the present application further provides a display device, which includes the above display panel.
  • the display device may be any product or component having a display function such as a liquid crystal panel, an electronic paper, an organic light emitting diode panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the embodiments of the fingerprint identification module, the embodiment of the method for preparing the fingerprint identification module, the embodiment of the display panel, and the embodiment of the display device are all referenced to each other in the embodiments of the present application.

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Abstract

提供了一种指纹识别模组及其制备方法、显示面板以及显示装置。所述指纹识别模组包括：基板（10）、采集器件（20）以及指纹识别电路（30）；基板（10）包括相对的指纹采集面（11）和目标面（12），目标面（12）上具有第一凹槽（12A），采集器件（20）位于第一凹槽（12A）内；指纹识别电路（30）与采集器件（20）电连接，用于通过采集器件（20）对指纹采集面（11）所在侧的指纹的信息进行采集。

Description

指纹识别模组及其制备方法、显示面板以及显示装置
本申请要求于2018年03月23日提交的、申请号为201810246038.5、申请名称为“指纹识别模组及其制备方法、显示面板以及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，特别涉及一种指纹识别模组及其制备方法、显示面板以及显示装置。
背景技术
随着科技的发展，显示装置的应用越来越广泛，且显示装置中通常包括具有指纹识别功能的显示面板。
具有指纹识别功能的显示面板通常包括玻璃基板和指纹识别模组，玻璃基板上具有通孔，指纹识别模组设置在该通孔内，且指纹识别模组通常包括层叠的指纹识别集成电路(英文：Integrated Circuit，简称：IC)、采集器件以及保护层。
发明内容
本申请提供了一种指纹识别模组及其制备方法、显示面板以及显示装置，所述技术方案如下：
一方面，提供一种指纹识别模组，所述指纹识别模组包括基板、采集器件以及指纹识别电路；
所述基板包括相对的指纹采集面和目标面，所述目标面上具有第一凹槽，所述采集器件位于所述第一凹槽内；
所述指纹识别电路与所述采集器件电连接，用于通过所述采集器件对所述指纹采集面所在侧的指纹的信息进行采集。
可选地，所述采集器件位于所述第一凹槽朝向所述指纹采集面方向的槽底。
可选地，所述第一凹槽朝向所述指纹采集面方向的槽底与所述指纹采集面 之间的最大距离小于或等于所述采集器件能够采集指纹的信息的最大距离。
可选地，所述指纹识别电路位于所述目标面。
可选地，所述目标面上具有第二凹槽，所述指纹识别电路位于所述第二凹槽内。
可选地，所述指纹识别电路位于所述第一凹槽内。
可选地，所述指纹识别电路在所述指纹采集面上的正投影和所述采集器件在所述指纹采集面上的正投影不重叠。
可选地，所述第一凹槽包括多个槽面，所述多个槽面中，任意两个相连的槽面的连接处具有第一倒角。
可选地，所述第一倒角为圆弧倒角。
可选地，所述第二凹槽包括多个槽面，所述多个槽面中，任意两个相连的槽面的连接处具有第二倒角。
可选地，所述第二倒角为圆弧倒角。
可选地，所述基板的厚度为0.5毫米，所述第一凹槽朝向所述指纹采集面方向的槽底与所述指纹采集面的最大距离小于或等于0.3毫米。
可选地，所述采集器件包括沿远离所述指纹采集面的方向依次层叠的第一电极层、第一绝缘层、第二电极层、第二绝缘层以及油墨层。
可选地，所述基板为透明基板。
可选地，所述采集器件位于所述第一凹槽朝向所述指纹采集面方向的槽底，所述第一凹槽朝向所述指纹采集面方向的槽底与所述指纹采集面之间的最大距离小于或等于所述采集器件能够进行指纹的信息的采集的最大距离；
所述目标面上还具有第二凹槽，所述指纹识别电路位于所述第二凹槽内；
所述第一凹槽包括多个槽面，所述多个槽面中，任意两个相连的槽面的连接处具有第一倒角，所述第一倒角为圆弧倒角；
所述第二凹槽包括多个槽面，所述多个槽面中，任意两个相连的槽面的连接处具有第二倒角，所述第二倒角为圆弧倒角；
所述采集器件包括沿远离所述指纹采集面的方向依次层叠的第一电极层、第一绝缘层、第二电极层、第二绝缘层以及油墨层。
另一方面，提供一种指纹模组的制备方法，所述方法包括：
提供基板，所述基板包括相对的指纹采集面和目标面；
在所述基板的目标面上形成第一凹槽；
在所述第一凹槽内设置采集器件；
提供指纹识别电路；
将所述指纹识别电路与所述采集器件电连接，所述指纹识别电路用于通过所述采集器件对所述指纹采集面所在侧的指纹的信息进行采集。
可选地，所述方法还包括：
将所述指纹识别电路设置在所述目标面。
另一方面，提供一种显示面板，所述显示面板包括指纹识别模组，所述指纹识别模组包括基板、采集器件以及指纹识别电路；所述基板包括相对的指纹采集面和目标面，所述目标面上具有第一凹槽，所述采集器件位于所述第一凹槽内；
所述指纹识别电路与所述采集器件电连接，用于通过所述采集器件对所述指纹采集面所在侧的指纹的信息进行采集。
可选地，所述基板为透明基板，所述显示面板包括透明盖板，所述透明基板与所述透明盖板为一体件。
另一方面，提供一种显示装置，所述显示装置包括上述显示面板。
本申请提供的技术方案带来的有益效果是：由于采集器件设置在基板中目标面上的第一凹槽内，且该目标面和与外界环境接触的指纹采集面相对设置，因此可以避免采集器件与外界环境接触，提高了指纹识别模组的防尘防水性能。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
为了更清楚地说明本申请的实施例，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种指纹识别模组的结构示意图；
图2为本申请实施例提供的图1所示的指纹识别模组的应用场景示意图；
图3为本申请实施例提供的另一种指纹识别模组的结构示意图；
图4为本申请实施例提供的图3所示的指纹识别模组的仰视结构示意图；
图5为本申请实施例提供的另一种指纹识别模组的结构示意图；
图6为本申请实施例提供的另一种指纹识别模组的结构示意图；
图7为本申请实施例提供的一种指纹识别模组的制备方法流程图；
图8为本申请实施例提供的另一种指纹识别模组的制备方法流程图；
图9为本申请实施例提供的一种形成采集器件的方法流程图。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了使本申请的原理更加清楚，下面将结合附图对本申请作进一步地详细描述，显然，所描述的实施例仅仅是本申请一部份实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
具有指纹识别功能的显示面板的应用越来越广泛，且具有指纹识别功能的显示面板通常包括玻璃基板和指纹识别模组。玻璃基板上具有通孔，指纹识别模组设置在该通孔内。由于指纹识别模组位于玻璃基板的通孔内，且指纹识别模组与显示面板之间具有间隙，外界环境的灰尘容易进入该间隙沉积在采集器件上，因此指纹识别模组的防尘防水性能较差。
另外，由于指纹识别模组中的采集器件层叠设置在指纹识别IC上，且在指纹识别IC上形成采集器件的过程中，采集器件容易因碰撞指纹识别IC而使得指纹识别IC损坏，进而导致指纹识别模组的制造良率较低。
图1为本申请实施例提供的一种指纹识别模组的结构示意图。如图1所示，该指纹识别模组可以包括：基板10、采集器件20以及指纹识别电路30；基板10包括相对设置的指纹采集面11和目标面12，目标面12上具有第一凹槽12A，采集器件20位于第一凹槽12A内；指纹识别电路30与采集器件20电连接，用于通过采集器件20对指纹采集面11所在侧的指纹的信息进行采集。
综上所述，在本申请实施例提供的指纹识别模组中，由于采集器件设置在基板中目标面上的第一凹槽内，且该目标面和与外界环境接触的指纹采集面相 对设置，因此可以避免采集器件与外界环境接触，提高了指纹识别模组的防尘防水性能。
图2为本申请实施例提供的图1所示的指纹识别模组的应用场景示意图。如图2所示，在使用该指纹识别模组时，工作人员可以将其手指40的按压在指纹采集面11上采集器件20所对应的区域(该区域可以为采集器件20在指纹采集面11上的正投影区域，图2中未标出)。之后，可以控制指纹识别电路30通过采集器件20对手指40上的指纹的信息进行采集(目前的各种指纹采集技术中(如电容式指纹采集技术和超声波指纹采集技术等)，指纹的采集器件可以在与手指相隔一定距离的情况下，采集到手指的指纹的信息。因而位于基板另一侧的采集器件能够采集到手指的指纹的信息)。可以看出，在进行指纹的信息采集的过程中，采集器件20无需与手指以及手指一侧的外界空间接触，防尘防水性能较高。
如图3所示，其为本申请实施例提供的一种指纹识别模组的结构示意图，其在图1所示的指纹识别模组的基础上进行了一些调整。
可选地，指纹识别电路30可以设置在目标面12上。将指纹识别电路30设置在目标面12上能够缩短指纹识别电路与采集器件20之间的距离，提高指纹的信息的传输效率。此外，指纹识别电路30也可以不与基板11接触，设置在外部装置中，例如，该指纹识别模组应用于显示装置中时，指纹识别电路30可以设置在显示装置中的一些组件(例如显示装置中的各种基板上)上。
可选的，第一凹槽12A包括多个槽面(图3中未标出)，这多个槽面中，任意两个相连的槽面的连接处具有第一倒角1A。倒角是一种设置在两个面连接处的过渡结构，其能够扩大两个面连接处的夹角，使该连接处的过渡较为平缓。第一凹槽中后续可能会设置走线，该倒角能够使走线与第一凹槽的槽面更为贴合，提高了走线的耐用程度。
其中，这多个槽面可以包括第一凹槽的底面和至少一个侧面。底面通常为平面(该底面可以为各种形状，如椭圆形、圆形和矩形等)，以便于设置采集器件，侧面可以为曲面，也可以为平面。底面和侧面的连接处可以具有倒角。当侧面为多个平面时，这多个平面之间的连接处也可以具有倒角。
可选地，第一倒角1A为圆弧倒角。圆弧倒角可以认为是一个弧面，该弧面 分别与两个槽面连接。圆弧倒角能够分散两个相连的槽面之间的应力，从而可以避免基板10在第一凹槽12A处因应力过于集中而发生断裂。
可选地，采集器件20位于第一凹槽12A朝向指纹采集面11方向(图3中未标出)的槽底，如此能够缩短采集器件与指纹采集面之间距离，便于采集器件进行指纹信息的采集。
采集器件通常具有一个能够采集到指纹的信息的最大距离，若采集器件与手指的指纹之间的距离大于该能够采集到指纹的信息的最大距离，则采集器件可能难以正常进行指纹的信息的采集，若采集器件与手指的指纹之间的距离小于或等于该能够采集到指纹的信息的最大距离，则采集器件可以正常进行指纹的信息的采集。因此，第一凹槽12A的槽底与指纹采集面11之间的最大距离(当槽底为平面且与指纹采集面平行时，则槽底与指纹采集面之间的距离)可以小于或等于采集器件20能够采集指纹的信息的最大距离，以便于采集器件20能够正常的进行指纹的信息的采集。
在一个示例性的例子中，基板10的厚度111可以为0.5毫米，第一凹槽12A的底面(图3中未标出)与指纹采集面11的距离112可以小于或等于0.3毫米(如0.23毫米)，且采集器件20与第一凹槽12A的底面接触。
此外，基板10的厚度还可以为其他厚度，如基板10的厚度为0.8毫米，第一凹槽12A的底面(图3中未标出)与指纹采集面11的距离112也可以为其他距离，只要保证位于第一凹槽内的采集器件20能够采集到指纹采集面所在侧的指纹的信息即可。
可选的，采集器件20可以包括沿远离指纹采集面11的方向(图3中未标出)依次层叠的第一电极层21、第一绝缘层22、第二电极层23、第二绝缘层24以及油墨层25。油墨层25可以用于遮光，避免指纹采集面外部的光线射入采集器件20的下方。
基板10可以为透明基板，当基板10为透明基板时，油墨层25可以用于标记采集器件20在指纹采集面11上的区域，使得用户在使用该指纹识别模组时，可以快速的找到采集器件20在指纹采集面11上的区域，从而可以快速的进行指纹的信息的采集。
图4为图3所示的指纹识别模组的仰视图，且图3也为图4中指纹识别模组的截面A-A的示意图。请结合图3和图4，指纹识别电路30可以通过第一信 号线211与第一电极层21连接，以及指纹识别电路30通过第二信号线231与第二电极层23连接。示例的，第一电极层21可以包括多根信号接收线(又称RX线)，第二电极层23可以包括多根信号发送线(又称TX线)，且RX线的长度方向和TX线的长度方向可以相互垂直。指纹识别电路30通过第一信号线L1与RX线连接，并从RX线获取第一电极层21的感应信号；指纹识别电路30还可以通过第二信号线L2与TX线连接，并向TX线发送驱动信号。该指纹识别模组应用于显示面板之后，图4中指纹识别电路30和采集器件20上方的区域可以为显示面板的有效显示区域。
图5为本申请实施例提供的另一种指纹识别模组的结构示意图。如图5所示，在图3的基础上，透明基板10的目标面12上还可以具有第二凹槽12B，指纹识别IC-30可以设置在第二凹槽12B内。
可选地，第二凹槽12B包括多个槽面，这多个槽面中，任意两个相连的槽面的连接处具有第二倒角2A。第二倒角2A可以为圆弧倒角。第二倒角2A的结构可以参考上述关于第一倒角1A的描述，在此不再赘述。
通过将采集器件20和指纹识别IC30在目标面12上分开设置，可以避免因采集器件20和指纹识别IC30叠加设置，在指纹识别电路上形成采集器件时造成指纹识别电路30损坏，提高了指纹识别模组的制造良率。
可选地,指纹识别电路可以为指纹识别IC，指纹识别IC可以通过芯片绑定在基板上(英文：Chip On Glass，简称：COG)的方式设置在基板上。
图5中其他标记的含义可以参考图3，在此不再赘述。
图6是本申请实施例提供的另一种指纹识别模组的结构示意图。在图6中,指纹识别电路30位于第一凹槽12A内,也即是指纹识别电路30和采集器件20均为第一凹槽12A内,如此能够减少凹槽的数量,节省制造成本。
可选地，指纹识别电路30在采集面上的正投影(图6中未示出)和采集器件20在指纹采集面11上的正投影(图6中未示出)不重叠,也即是指纹识别电路30和采集器件20在第一凹槽12A中的位置不重叠,如此能够避免重叠放置指纹识别电路30和采集器件20时,两者互相影响的问题的发生。图6中其他标记的含义可以参考图3，在此不再赘述。
图3、图4、图5和和图6中仅以指纹识别电路30和第一电极层21以及第二电极层23的示意性连接为例。指纹识别电路与第一电极层21通过多条第一 信号线211连接，且指纹识别电路30与第二电极层23通过多条第二信号线231连接。
综上所述，在本申请实施例提供的指纹识别模组中，由于采集器件设置在基板中目标面上的第一凹槽内，且该目标面和与外界环境接触的指纹采集面相对设置，因此可以避免采集器件与外界环境接触，提高了指纹识别模组的防尘防水性能。
图7为本申请实施例提供的一种指纹识别模组的制备方法流程图，该指纹识别模组的制备方法可以用于制备如图1或图3任一所示的指纹识别模组，如图7所示，该指纹识别模组的制备方法可以包括：
在步骤501中、提供基板。
其中，该基板可以包括相对设置的指纹采集面和目标面。
在步骤502中、在基板的目标面上形成第一凹槽。
在步骤503中、在第一凹槽内设置采集器件。
在步骤504中、提供指纹识别IC。
在步骤505中、将指纹识别电路与采集器件电连接。
其中，该指纹识别电路用于通过采集器件对指纹采集面所在侧的指纹的信息进行采集。
综上所述，在本申请实施例提供的指纹识别模组的制备方法所制备的指纹识别模组中，由于采集器件设置在基板中目标面上的第一凹槽内，且该目标面与和外界环境接触的指纹采集面相对设置，因此可以避免采集器件与外界环境接触，提高了指纹识别模组的防尘防水性能。
图8为本申请实施例提供的另一种指纹识别模组的制备方法流程图，该指纹识别模组的制备方法可以用于制备如图5所示的指纹识别模组，如图8所示，该指纹识别模组的制备方法可以包括：
在步骤601中、提供基板。
其中，该基板可以包括相对设置的指纹采集面和目标面。
在步骤602在、在基板的目标面上形成第一凹槽和第二凹槽。
在步骤602中可以通过化学刻蚀或机械加工的方法在透明基板的目标面上 形成第一凹槽和第二凹槽。
可选地，第一凹槽和第二凹槽可以在一个步骤中形成，也可以分别在两个步骤中形成。示例性的，第一凹槽可以在步骤602中形成，而第二凹槽可以在步骤605之前形成。
可选的，在步骤602中形成的第一凹槽内以及第二凹槽内任意两个相连的槽面的连接处具有倒角，且该倒角可以为圆弧倒角。
此外，在制造图6所示的指纹识别模组时，可以仅形成第一凹槽，而不形成第二凹槽。
在步骤603中、在目标面上的第一凹槽内设置采集器件。
在形成采集器件后，可以通过多条第一信号线和多条第二信号线将该采集器件和指纹识别电路连接，且在步骤603中形成采集器件的过程中，可以同时形成多条第一信号线和多条第二信号线。
如图9所示，步骤603可以包括下面5个步骤：
在步骤6031中、在目标面上的第一凹槽内形成第一电极层。
示例的，在步骤6031中可以先在透明基板的目标面上形成一层第一电极材质层，且该第一电极材质层可以覆盖整个目标面，然后在第一电极材质层上涂覆一层第一光刻胶，接着采用掩膜版对第一光刻胶进行曝光，使第一光刻胶形成完全曝光区和非曝光区。之后采用显影工艺进行处理，使完全曝光区的第一光刻胶被去除，非曝光区的第一光刻胶保留，对完全曝光区在第一电极材质层上的对应区域进行刻蚀，刻蚀完毕后剥离非曝光区的第一光刻胶，即可在目标面上的第一凹槽内形成第一电极层，以及在第一凹槽外形成多条第一信号线。
在步骤6032中、在第一电极层上形成第一绝缘层。
在步骤6033中、在第一绝缘层上形成第二电极层。
示例的，在步骤6033中可以先在透明基板的目标面上涂覆一层第二光刻胶，并在第二光刻胶的面形成一层第二电极材质层，且该第二光刻胶和第二电极材质层可以覆盖整个目标面，然后在第二电极材质层上涂覆一层第三光刻胶，接着采用掩膜版对第三光刻胶进行曝光，使第三光刻胶形成完全曝光区和非曝光区。之后采用显影工艺进行处理，使完全曝光区的第三光刻胶被去除，非曝光区的第三光刻胶保留，对完全曝光区在第二电极材质层上的对应区域进行刻蚀，刻蚀完毕后剥离第二光刻，胶以及非曝光区的第三光刻胶即可在第一绝缘层上 形成第二电极层，以及在第一凹槽外形成多条第二信号线。
在步骤6034中、在第二电极层上形成第二绝缘层。
在步骤6035中、在第二绝缘层上形成油墨层。
在步骤604中、提供指纹识别电路。
该指纹识别电路可以为指纹识别IC。
在步骤605中、将指纹识别电路设置在目标面上的第二凹槽内，并将指纹识别电路与采集器件电连接。
示例的，在步骤605中可以首先将指纹识别电路放置在第二凹槽内，然后将指纹识别IC与多条第一信号线以及多条第二信号线连接。在制造图6所示的指纹识别模组时，可以将指纹识别电路也设置在第一凹槽内。
综上所述，在本申请实施例提供的指纹识别模组的制备方法所制备的指纹识别模组中，由于采集器件设置在透明基板中目标面上的第一凹槽内，且该目标面与和外界环境接触的指纹采集面相对设置，因此可以避免采集器件与外界环境接触，提高了指纹识别模组的防尘防水性能。
本申请实施例还提供了的一种显示面板，该显示面板可以包括图1至图3任一所示的指纹识别模组。该指纹识别模组包括基板、采集器件以及指纹识别电路；基板包括相对的指纹采集面和目标面，目标面上具有第一凹槽，采集器件位于第一凹槽内；指纹识别电路与采集器件电连接，用于通过采集器件对指纹采集面所在侧的指纹的信息进行采集。
可选地，基板为透明基板，显示面板包括透明盖板，该透明盖板用于保护显示面板内部的结构，示例性的，透明盖板可以为透明玻璃盖板。此外，显示面板还可以包括衬底基板以及设置在衬底基板上的用于实现显示功能的器件。
透明盖板可以与指纹识别模组中的透明基板为一体件，也即是指纹识别模组中的透明基板可以复用为显示面板中的透明盖板，如此能减小显示面板的整体厚度降低显示面板的成本。
本申请实施例还提供了一种显示装置，该显示装置包括上述显示面板。且该显示装置可以为：液晶面板、电子纸、有机发光二极管面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的 产品或部件。
本申请实施例提供的指纹识别模组实施例、指纹识别模组的制备方法实施例、显示面板的实施例以及显示装置的实施例均可以互相参考，本申请实施例对此不做限定。
本领域技术人员在考虑说明书及实践这里公开的申请后，将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未申请的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本申请的真正范围和精神由权利要求指出。
应当理解的是，本申请并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。

Claims (20)

  1. 一种指纹识别模组，所述指纹识别模组包括基板(10)、采集器件(20)以及指纹识别电路(30)；
    所述基板(10)包括相对的指纹采集面(11)和目标面(12)，所述目标面(12)上具有第一凹槽(12A)，所述采集器件(20)位于所述第一凹槽内(12A)；
    所述指纹识别电路(30)与所述采集器件(20)电连接，用于通过所述采集器件(20)对所述指纹采集面(11)所在侧的指纹的信息进行采集。
  2. 根据权利要求1所述的指纹识别模组，其中，所述采集器件(20)位于所述第一凹槽(12A)朝向所述指纹采集面(11)方向上的槽底。
  3. 根据权利要求2所述的指纹识别模组，其中，所述第一凹槽(12A)朝向所述指纹采集面(11)方向的槽底与所述指纹采集面(11)之间的最大距离小于或等于所述采集器件(20)能够采集指纹的信息的最大距离。
  4. 根据权利要求1所述的指纹识别模组，其中，所述指纹识别电路(30)位于所述目标面(12)上。
  5. 根据权利要求1所述的指纹识别模组，其中，所述目标面(12)上具有第二凹槽(12B)，所述指纹识别电路(30)位于所述第二凹槽(12B)内。
  6. 根据权利要求1所述的指纹识别模组，其中，所述指纹识别电路(30)位于所述第一凹槽(12A)内。
  7. 根据权利要求6所述的指纹识别模组，其中，所述指纹识别电路(30)在所述指纹采集面(11)上的正投影和所述采集器件(20)在所述指纹采集面(11)上的正投影不重叠。
  8. 根据权利要求1所述的指纹识别模组，其中，所述第一凹槽(12A)包括多个槽面，所述多个槽面中，任意两个相连的槽面的连接处具有第一倒角 (1A)。
  9. 根据权利要求8所述的指纹识别模组，其中，所述第一倒角(1A)为圆弧倒角。
  10. 根据权利要求5所述的指纹识别模组，其中，所述第二凹槽(12B)包括多个槽面，所述多个槽面中，任意两个相连的槽面的连接处具有第二倒角(2A)。
  11. 根据权利要求10所述的指纹识别模组，其中，所述第二倒角(2A)为圆弧倒角。
  12. 根据权利要求3所述的指纹识别模组，其中，所述基板(10)的厚度为0.5毫米，所述第一凹槽(12A)朝向所述指纹采集面(11)方向的槽底与所述指纹采集面(11)的最大距离小于或等于0.3毫米。
  13. 根据权利要求1所述的指纹识别模组，其中，所述采集器件(20)包括沿远离所述指纹采集面(11)的方向依次层叠的第一电极层(21)、第一绝缘层(22)、第二电极层(23)、第二绝缘层(24)以及油墨层(25)。
  14. 根据权利要求1所述的指纹识别模组，其中，所述基板(10)为透明基板。
  15. 根据权利要求1所述的指纹识别模组，其中，所述采集器件(20)位于所述第一凹槽(12A)朝向所述指纹采集面(11)方向的槽底，所述第一凹槽(12A)朝向所述指纹采集面(11)方向的槽底与所述指纹采集面(11)之间的最大距离小于或等于所述采集器件(20)能够进行指纹的信息的采集的最大距离；
    所述目标面(12)上还具有第二凹槽(12B)，所述指纹识别电路(30)位于所述第二凹槽(12B)内；
    所述第一凹槽(12A)包括多个槽面，所述多个槽面中，任意两个相连的槽 面的连接处具有第一倒角(1A)，所述第一倒角(1A)为圆弧倒角；
    所述第二凹槽(12B)包括多个槽面，所述多个槽面中，任意两个相连的槽面的连接处具有第二倒角(2A)，所述第二倒角(2A)为圆弧倒角；
    所述采集器件(20)包括沿远离所述指纹采集面(11)的方向依次层叠的第一电极层(21)、第一绝缘层(22)、第二电极层(23)、第二绝缘层(24)以及油墨层(25)。
  16. 一种指纹模组的制备方法，所述方法包括：
    提供基板(10)，所述基板(10)包括相对的指纹采集面(11)和目标面(12)；
    在所述基板(10)的目标面(12)上形成第一凹槽(12A)；
    在所述第一凹槽(12A)内设置采集器件(20)；
    提供指纹识别电路(30)；
    将所述指纹识别电路(30)与所述采集器件(20)电连接，所述指纹识别电路(30)用于通过所述采集器件(20)对所述指纹采集面(11)所在侧的指纹的信息进行采集。
  17. 根据权利要求16所述的方法，在提供指纹识别电路(30)之后，所述方法还包括：
    将所述指纹识别电路(30)设置在所述目标面(12)。
  18. 一种显示面板，所述显示面板包括指纹识别模组，所述指纹识别模组包括基板(10)、采集器件(20)以及指纹识别电路(30)；所述基板(10)包括相对的指纹采集面(11)和目标面(12)，所述目标面(12)上具有第一凹槽(12A)，所述采集器件(20)位于所述第一凹槽(12A)内；
    所述指纹识别电路(30)与所述采集器件(20)电连接，用于通过所述采集器件(20)对所述指纹采集面(11)所在侧的指纹的信息进行采集。
  19. 根据权利要求18所述的显示面板，其中，所述基板(10)为透明基板，所述显示面板包括透明盖板，所述透明基板与所述透明盖板为一体件。
  20. 一种显示装置，所述显示装置包括权利要求18或19所述的显示面板。
PCT/CN2019/078759 2018-03-23 2019-03-19 指纹识别模组及其制备方法、显示面板以及显示装置 WO2019179446A1 (zh)

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