WO2020216301A1 - 输入输出组件和电子设备 - Google Patents

输入输出组件和电子设备 Download PDF

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Publication number
WO2020216301A1
WO2020216301A1 PCT/CN2020/086454 CN2020086454W WO2020216301A1 WO 2020216301 A1 WO2020216301 A1 WO 2020216301A1 CN 2020086454 W CN2020086454 W CN 2020086454W WO 2020216301 A1 WO2020216301 A1 WO 2020216301A1
Authority
WO
WIPO (PCT)
Prior art keywords
fingerprint identification
fingerprint
circuit board
identification module
electronic device
Prior art date
Application number
PCT/CN2020/086454
Other languages
English (en)
French (fr)
Inventor
张文真
杨乐
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020216301A1 publication Critical patent/WO2020216301A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Definitions

  • This application relates to the technical field of consumer electronics, and more specifically, to an input/output component and an electronic device.
  • an under-screen fingerprint solution has become a trend.
  • an existing mobile phone attaches the fingerprint identification module to the lower surface of the display screen, and uses the light transmission characteristics of the display screen to collect fingerprint images.
  • the display screen and the fingerprint recognition module are too close to each other to easily interfere, and the fingerprint recognition module is directly adhered to the lower surface of the display screen, which may damage the display screen during the assembly process and affect the display.
  • the stability of the screen is not conducive to subsequent maintenance of the fingerprint identification module and the display screen.
  • the embodiments of the present application provide an input and output component and an electronic device.
  • the input/output component of the embodiment of the present application includes a display screen and a fingerprint identification module.
  • the display screen includes an upper surface facing the user and a lower surface opposite to the upper surface.
  • the fingerprint recognition module includes a fingerprint recognition chip and
  • the fingerprint identification chip includes a sensing surface for detecting fingerprints and a bonding surface opposite to the sensing surface, the sensing surface and the lower surface are spaced apart, and the substrate includes a main body and Surrounding the peripheral portion of the main body, the thickness of the peripheral portion is smaller than the thickness of the main body, and the main body protrudes toward the fingerprint recognition chip relative to the peripheral portion.
  • the opposite carrying surface of the chip, and the bonding surface is attached to the carrying surface.
  • the electronic device of the embodiment of the present application includes a housing and an input-output assembly, the housing includes a middle frame, the input-output assembly includes a display screen and a fingerprint recognition module, and the display screen includes an upper surface facing the user and The upper surface is opposite to the lower surface, the fingerprint recognition module includes a fingerprint recognition chip and a substrate, and the fingerprint recognition chip includes a sensing surface for detecting fingerprints and a bonding surface opposite to the sensing surface.
  • the substrate includes a main body portion and a peripheral portion surrounding the main body portion, the peripheral portion having a thickness smaller than the thickness of the main body portion, and the main body portion is opposite to the
  • the peripheral edge portion protrudes toward the fingerprint identification chip
  • the main body portion includes a bearing surface opposite to the fingerprint identification chip
  • the bonding surface is attached to the bearing surface
  • the peripheral edge portion is arranged on the middle frame .
  • the peripheral edge of the substrate can be thinned, so that the thickness of the peripheral edge is smaller than the thickness of the main body.
  • the fingerprint recognition chip When the fingerprint recognition chip is installed on the main body, it can be mounted to the middle frame of the electronic device through the peripheral edge. .
  • the installation method of the fingerprint identification module is simple, and the display screen can be set apart from the fingerprint identification chip, which reduces interference between the display screen and the fingerprint identification module, facilitates subsequent maintenance of the fingerprint identification module, and increases the stability of electronic equipment.
  • FIG. 1 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present application.
  • Fig. 2 is an exploded schematic diagram of an electronic device according to an embodiment of the present application.
  • Fig. 3 is a schematic plan view of an electronic device according to an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of the electronic device of FIG. 3 along the direction IV-IV.
  • FIG. 5 is another exploded schematic diagram of the electronic device according to the embodiment of the present application.
  • Fig. 6 is an enlarged schematic diagram of the electronic device of Fig. 4 in part XI.
  • Fig. 7 is a schematic plan view of an input/output component of an embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional view of an input and output assembly according to an embodiment of the present application.
  • Fig. 9 is an enlarged schematic diagram of the input and output components of Fig. 7 in part VIII.
  • FIG. 10 is a three-dimensional schematic diagram of a fingerprint recognition module according to an embodiment of the present application.
  • FIG. 11 is an exploded schematic diagram of the fingerprint identification module of the embodiment of the present application.
  • FIG. 12 is a schematic cross-sectional view of a fingerprint recognition module according to an embodiment of the present application.
  • FIG. 13 is an enlarged schematic diagram of the fingerprint identification module of FIG. 12 in part XIII.
  • Electronic device 1000 input and output component 100, fingerprint recognition module 10, fingerprint recognition chip 11, sensing surface 112, bonding surface 114, substrate 12, main body 122, carrying surface 1222, peripheral edge 124, bottom surface 126, flexible circuit Board 13, through hole 132, peripheral circuit portion 134, lead 14, protective glue 15, first adhesive layer 16, second adhesive layer 17, display screen 20, upper surface 22, fingerprint sensing area 222, lower surface 24,
  • the cover plate 30 the housing 200, the middle frame 202, the installation through hole 2021, the step structure 2022, the first surface 2023, the second surface 2024, the groove 2025, and the battery 300.
  • the electronic device 1000 includes an input and output assembly 100 and a housing 200.
  • the input/output assembly 100 is provided in the housing 200.
  • the input/output assembly 100 is at least partially disposed in the housing 200.
  • the input and output assembly 100 includes a fingerprint identification module 10 and a display screen 20.
  • the display screen 20 includes an upper surface 22 facing the user and a lower surface 24 opposite to the upper surface 22, wherein the upper surface 22 can be used to display image information to the user.
  • the fingerprint identification module 10 and the lower surface 24 of the display screen 20 are arranged relatively spaced apart.
  • the fingerprint identification module 10 includes a fingerprint identification chip 11 and a substrate 12.
  • the fingerprint identification chip 11 includes a sensing surface 112 for detecting fingerprints and a bonding surface 114 opposite to the sensing surface 112.
  • the substrate 12 includes a main body 122 and a peripheral edge 124 surrounding the main body 122.
  • the thickness of the peripheral portion 124 is smaller than the thickness of the main body portion 12, the main body portion 122 protrudes toward the fingerprint recognition chip 11 relative to the peripheral portion 124, and the main body portion 122 includes a bearing surface 1222 opposite to the fingerprint recognition chip 11.
  • the bonding surface 114 is attached to the bearing surface 1222.
  • the housing 200 includes a middle frame 202, and the second adhesive surface 124 is adhered to the middle frame 202.
  • the sensing surface 112 of the fingerprint identification chip 11 and the lower surface 24 of the display screen 20 are arranged relatively spaced apart.
  • the peripheral portion 124 of the substrate 12 can be thinned, so that the thickness of the peripheral portion 124 is smaller than that of the main body 122, and the fingerprint recognition chip 11 is arranged on In the case of the main body 122, it can be mounted to other components of the electronic device 1000 (for example, the middle frame 202) through the peripheral edge 124. In this way, the installation method of the fingerprint identification module 10 is simple.
  • the fingerprint identification module 10 is arranged relative to the lower surface 24 of the display screen 20 to realize under-screen fingerprint identification, and the display screen 20 and the fingerprint identification module 10 are arranged relatively spaced apart, which is beneficial to reduce the gap between the display screen 20 and the fingerprint identification module 10
  • the interference increases the stability of the input/output assembly 100 and the electronic device 1000. At the same time, the difficulty of disassembling the fingerprint identification module 10 is reduced, and subsequent maintenance of the fingerprint identification module 10 can be facilitated.
  • the input/output assembly 100 includes a cover plate 30 that is disposed on the upper surface 22 of the display screen 20.
  • the cover plate 30 may be a transparent cover plate 30.
  • the transparent cover 30 is, for example, transparent glass, sapphire, or PET explosion-proof film. In this way, the transparent cover plate 30 ensures the display effect of the display screen 20, while protecting the display screen 20 and increasing the reliability of the electronic device 1000.
  • the display screen 20 includes an OLED (Organic Light-Emitting Diode) display screen
  • the fingerprint recognition module 10 may be an optical fingerprint recognition module, an ultrasonic fingerprint recognition module, or other suitable under-screen Fingerprint identification module 10 of the fingerprint solution.
  • the optical fingerprint recognition module can take advantage of the light-transmitting characteristics of the OLED display screen to collect fingerprint images of the finger on the side of the upper surface 22 of the display screen 20 on the side of the lower surface 24 of the display screen 20, so as to realize fingerprint recognition under the screen.
  • the ultrasonic fingerprint recognition module can use the different penetration characteristics of ultrasonic waves to the display screen 20 and the finger.
  • the fingerprint information of the finger located on the upper surface 22 side of the display screen 20 can be collected on the side of the lower surface 24 of the display screen 20 to achieve Fingerprint recognition under the screen.
  • the first feature “on” or “under” the second feature may be in direct contact with the first and second features, or the first and second features may be indirectly through an intermediary. contact.
  • the "above”, “above” and “above” of the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the level of the first feature is higher than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the level of the first feature is smaller than the second feature.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 may be less than 2 mm.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 is too large, and the distance for the fingerprint identification module 10 to collect fingerprint images increases accordingly. It is helpful for the fingerprint identification module 10 to collect fingerprint images and increase the thickness of the electronic device 1000.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 can be less than 2mm, which can ensure that the fingerprint identification module can better collect finger fingerprint images.
  • the input and output assembly 100 can maintain a small thickness, which is beneficial to Miniaturized design of the electronic device 1000.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 may be less than 1 mm.
  • the upper surface 22 of the display screen 20 includes a fingerprint sensing area 222, and the fingerprint identification module 10 corresponds to the fingerprint sensing area 222 and the lower surface 24 of the display screen 20.
  • the fingerprint sensing area 222 is a part of the upper surface 22 of the display screen 20.
  • the fingerprint identification module 10 can collect fingerprint images.
  • the fingerprint identification module 10 does not collect fingerprint images.
  • the fingerprint sensing area 222 is not limited to being located at the position shown in the figure, but can be set at other positions on the upper surface 22 of the display screen 20 as required.
  • the fingerprint sensing area 222 may be the entire upper surface 22 of the display screen 20.
  • the fingerprint identification module 10 can collect fingerprint images.
  • the fingerprint identification module 10 is arranged at intervals relative to the lower surface 24 of the entire display screen 20.
  • the housing 200 includes a middle frame 202 that can provide support for electronic components in the electronic device 1000.
  • the fingerprint identification module 10 is arranged on the middle frame 202.
  • the middle frame 202 can support the fingerprint identification module 10, so that the fingerprint identification module 10 and the display screen 20 are arranged at intervals.
  • the lower surface 24 of the display screen 20 is attached to the middle frame 202, the middle frame 202 is formed with a mounting hole 2021, and the fingerprint identification module 10 is at least partially Housed in the installation through hole 2021.
  • the display screen 20 and the fingerprint identification module 10 are both installed on the middle frame 202, and the fingerprint identification module 10 is accommodated through the installation through hole 2021 to realize that the fingerprint identification module 10 can be set relative to the lower surface 24 of the display screen 20 to ensure fingerprint identification
  • the module 10 collects fingerprint image information.
  • the mounting through holes 2021 can also make full use of the thickness of the middle frame 202 to optimize the spatial configuration of the electronic device 1000.
  • a step structure 2022 is formed on the side of the mounting through hole 2021 away from the display screen 20, and the peripheral edge portion 124 is provided on the step structure 2022.
  • the peripheral edge portion 124 is thinned, so that the peripheral edge portion 124 cooperates with the step structure 2022 so that the fingerprint identification module 10 is stably installed in the installation through hole 2021, and at the same time, the surface of the middle frame 202 opposite to the display screen 20 It can be flush with the substrate 12, which facilitates other components of the electronic device 1000 to be mounted on the middle frame 202.
  • the fingerprint recognition module 10 includes a flexible circuit board 13, and the substrate 12 includes a reinforcing plate.
  • the flexible circuit board 13 is arranged on the carrying surface 1222.
  • the fingerprint identification chip 11 is electrically connected to the flexible circuit board 13.
  • the reinforcing plate may be made of a material with higher structural strength, such as a steel plate, a plastic plate, and the like.
  • the high strength of the steel plate can increase the structural strength of the fingerprint identification module 10 and improve the reliability of the fingerprint identification module 10.
  • the steel plate can be thinned at the peripheral portion 124 through an etching process. While the plastic plate increases the structural strength of the fingerprint identification module 10, it can reduce the weight of the fingerprint identification module 10 and reduce the manufacturing cost of the fingerprint identification module 10.
  • the plastic plate may form a thinner peripheral portion 124 around the main body portion 122 through an injection molding process.
  • the fingerprint identification chip 11 is electrically connected to an external circuit (not shown) through the flexible circuit board 13, so as to provide power to drive the fingerprint identification chip 11 to work and realize the transmission of fingerprint information.
  • fingerprint image information can be transmitted to an external circuit through the circuit board 13 for processing.
  • the flexible circuit board 13 and the fingerprint recognition chip 11 are arranged on the same side of the substrate 12.
  • the fingerprint recognition chip 11 and the flexible circuit board 13 are arranged on the carrying surface 1222 at intervals, that is, the flexible circuit board 13 avoiding the fingerprint identification chip 11 is arranged on the bearing surface 1222. In this way, the thickness of the fingerprint identification module 10 can be reduced, which is beneficial to the miniaturization design of the fingerprint identification module 10.
  • the size and shape of the mounting through hole 2021 are compatible with the size and shape of the fingerprint identification module 10.
  • the installation through hole 2021 can be closely matched with the fingerprint identification module 10, and the installation through hole 2021 can define the position of the fingerprint identification module 10, so that the fingerprint identification module 10 and the middle frame 202 are not easily moved relative to each other. Improve the reliability of the electronic device 1000.
  • the installation through holes 2021 can provide positioning for the installation of the fingerprint identification module 10, which facilitates the assembly of the electronic device 1000.
  • the mounting through hole 2021 includes a receiving portion for accommodating the fingerprint identification chip 11 and a wiring portion for arranging the transmission circuit of the fingerprint identification module 10, and a side of the receiving portion away from the display screen 20 is formed with Step structure 2022.
  • the step structure 2022 corresponds to the peripheral portion 124, and the flexible circuit board 13 for connecting the external circuit can be arranged along the wiring portion.
  • the wiring part can also be designed as a countersunk slot, and the slot is connected to the installation through hole 2021 on the side of the middle frame 202 opposite to the display screen 20. In this way, the opening area of the middle frame 202 is reduced, and the stability of the middle frame 202 is ensured.
  • the substrate 12 includes a bottom surface 126 opposite to the carrying surface 1222
  • the middle frame 202 includes a first surface 2023 facing the display screen 20 and a second surface opposite to the first surface 2023 2024
  • the mounting through hole 2021 penetrates the first surface 2023 and the second surface 2024 of the middle frame 202
  • the mounting through hole 2021 is formed with a step structure 2022 on the side close to the second surface 2024
  • the fingerprint recognition module 10 is accommodated in the mounting through hole
  • the bottom surface 126 is substantially flush with the second surface 2024.
  • the middle frame 202 can maintain the flatness of the second surface 2024, and other electronic components of the electronic device 1000 will not interfere with the fingerprint recognition module 10 in the structure when installed on the second surface 2024, which is beneficial to optimize the space of the electronic device 1000 Configuration.
  • the bottom surface 126 of the substrate 12 is located in the mounting through hole 2021 and the bottom surface 126 of the substrate 12 is spaced from the plane where the second surface 2024 is located.
  • the fingerprint identification module 10 when the fingerprint identification module 10 is installed, a gap is reserved between the bottom surface 126 of the substrate 12 and the plane where the second surface 2024 is located. Accordingly, other electronic components of the electronic device 1000 will not interact with the fingerprint when installed on the second surface 2024.
  • the contact of the module 10 helps to ensure the stability of the installation of the fingerprint identification module 10.
  • the flexible circuit board 13 is arranged on the supporting surface 1222 at intervals around the fingerprint identification chip 11.
  • the fingerprint identification chip 11 is spaced from the flexible circuit board 13, the flexible circuit board 13 is provided with a through hole 132, and the fingerprint identification chip 11 is located in the through hole 132 and is arranged on the carrying surface 1222.
  • the flexible circuit board 13 may also be arranged on the carrying surface 1222 around the fingerprint identification chip 11 in a semi-enclosed manner.
  • the flexible circuit board 13 may be arranged on the carrying surface 1222 at intervals around one side, two sides or three sides of the fingerprint identification chip 11.
  • the fingerprint recognition module 10 further includes a lead 14 connecting the fingerprint recognition chip 11 and the flexible circuit board 13,
  • the fingerprint identification chip 11 can be electrically connected to the flexible circuit board 13 through the lead 14.
  • the lead 14 may be a gold wire
  • the fingerprint identification module 10 may connect the fingerprint identification chip 11 and the flexible circuit board 13 through a wire bonding process to realize the packaging of the fingerprint identification chip 11.
  • the fingerprint identification module 10 includes a protective glue 15 between the fingerprint identification chip 11 and the circuit board 13 and coated with a lead 14.
  • the protective glue 15 connects the fingerprint identification chip 11 and the flexible circuit board 13 so that the relative position of the fingerprint identification chip 11 and the circuit board 13 is stable, and the structural stability of the fingerprint identification module 10 is increased.
  • the protective glue 15 coating the lead 14 can further ensure the stability of the lead 14 connection.
  • the fingerprint identification chip 11 is rectangular.
  • the protective glue 15 is not limited to cover the lead 14, but can be filled around the fingerprint identification chip 11.
  • the gap between the fingerprint identification chip 11 and the circuit board 13 ensures the stability of the fingerprint identification module 10.
  • the protective glue 14 is at least partially located in the through hole 132 and surrounds the fingerprint identification chip 11 to fill the gap between the fingerprint identification chip 11 and the circuit board 13.
  • the shape of the fingerprint identification chip 11 is not limited to a rectangle, but a circle, a square, an ellipse or other shapes can be selected according to actual conditions, which is not specifically limited here.
  • the fingerprint recognition module 10 includes a first adhesive layer 16, and the first adhesive layer 16 adheres the bonding surface 114 and the bearing surface 1222.
  • the fingerprint recognition chip 11 can be adhered to the bearing surface 1222 through the first adhesive layer 16.
  • the first adhesive layer 16 may be a double-sided adhesive tape, so that the fingerprint identification module 10 can be easily assembled.
  • the first adhesive layer 16 can also be formed by glue coating, which is not specifically limited here.
  • the flexible circuit board 13 may be adhered to the bearing surface 1222 through the first adhesive layer 16.
  • the fingerprint recognition module 10 includes a second adhesive layer 17, and the second adhesive layer 17 is disposed on the side of the peripheral portion 124 close to the bearing surface 1222.
  • the peripheral edge portion 124 may be adhered to the step structure 2022 through the second adhesive layer 17.
  • the second adhesive layer 17 may be a double-sided adhesive tape, so as to facilitate the assembly of the fingerprint identification module 10.
  • the second adhesive layer 17 may also be formed by glue coating, which is not specifically limited herein.
  • the flexible circuit board 13 is further provided with a peripheral circuit part 134 (for example, a capacitor, a resistor, etc.).
  • the flexible circuit board 13 can mount the peripheral circuit part 134 to the flexible circuit board 13 through Surface Mount Technology (SMT), and then attach the flexible circuit board 13 with circuit elements to the carrying surface 1222.
  • SMT Surface Mount Technology
  • the fingerprint recognition module 10 includes a protective layer (not shown) disposed on the side of the flexible circuit board 13 opposite to the substrate 12.
  • the sensing surface 112 includes a sensing area (not shown), and the orthographic projection of the protective layer 18 on the substrate 12 is outside the orthographic projection of the sensing area on the substrate 12.
  • the sensing area is an effective area for the fingerprint identification chip 11 to collect fingerprint images
  • the protective layer 18 is arranged to avoid the sensing area of the fingerprint identification chip 11 to ensure that the fingerprint identification module 10 can collect fingerprint image information.
  • the protective layer 18 can also protect the fingerprint identification module 10 from damage caused by external impact.
  • the protective layer 18 may partially cover the area on the sensing surface 122 outside the sensing area 1122. In this way, the protective layer 18 may separate the fingerprint identification chip 11 and the display screen 20 to maintain the sensitivity of the fingerprint identification chip 11.
  • the measuring surface 112 and the lower surface 24 of the display screen 20 are arranged relatively spaced apart, which can protect the fingerprint identification chip 11 to a certain extent.
  • the protective layer 18 may be protective foam. In this way, the protective foam can play a buffering effect, thereby realizing the protection of the fingerprint identification module 10.
  • the protective foam when the fingerprint identification module 10 is at least partially accommodated in the installation through hole 2021, the protective foam can be arranged in contact with the lower surface 24 of the display screen 20. At this time, the display screen 20 and the fingerprint chip 11 clamp the protective foam, and the display screen 20 and the flexible circuit board 13 clamp the protective foam. In this way, the structure of the input and output assembly 100 is made more compact, which is beneficial to optimize the spatial configuration of the electronic device 1000.
  • the fingerprint identification module 10 (for example, the fingerprint identification chip 11 of the fingerprint identification module 10) can be prevented from directly contacting the display screen 20 and damage the display screen 20 or the fingerprint identification chip 11.
  • the protective foam contacts the lower surface 24 of the display screen 20 for installation, the protective foam does not adhere to the lower surface 24 of the display screen 20, so that the fingerprint recognition module 10 can be easily disassembled. Separate from the display 20.
  • the substrate 12 may also be a printed circuit board (Printed Circuit Board, PCB) or a rigid-flex board, that is, the circuit board 13 may include a printed circuit board or a rigid-flex board.
  • the fingerprint identification chip 11 is electrically connected to the substrate 12.
  • the printed circuit board can realize the electrical connection of the fingerprint identification chip 11, and at the same time, the printed circuit board has a certain strength, which can increase the structural strength of the fingerprint identification module 10.
  • the printed circuit board can be etched to form the peripheral portion 124, the fingerprint identification chip 11 can be directly disposed on the bearing surface 1222 of the body portion 122, and the printed circuit board can be connected to an external circuit through a flexible circuit board to optimize the spatial configuration of the electronic device 1000.
  • the rigid-flex board combines a flexible circuit board and a printed circuit board.
  • the area corresponding to the fingerprint identification chip 11 can have a certain strength.
  • the electrical connection of the fingerprint identification chip 11 can be realized, and the fingerprint identification module 10 is added.
  • the structural strength of the fingerprint identification chip 11 may have a certain degree of flexibility outside the area corresponding to the fingerprint identification chip 11 to optimize the spatial configuration of the electronic device 1000.
  • the side of the middle frame 202 opposite to the display screen 20 can be used to install other electronic components of the electronic device 1000, such as a battery 300, a main board, an antenna, and a speaker.
  • a groove 2025 is opened on the side of the middle frame 202 opposite to the display screen 20, and the battery 300 is at least partially disposed in the groove 2025.
  • the mounting through hole 2021 penetrates the bottom of the groove 2025.
  • the second surface 2024 of the middle frame 202 is the bottom surface of the groove 2025.
  • the bottom surface 126 of the substrate 12 is flush with the bottom surface of the groove 2025, and the battery 300 can be closely combined with the bottom surface of the groove 2025, which is beneficial to the miniaturization of the electronic device 1000.
  • the bottom surface 126 of the substrate 12 is spaced from the bottom surface of the groove 2025, so that when the battery 300 is installed in the groove 2025, the bottom surface 126 of the substrate 12 is spaced from the battery 300 , The battery 300 and the fingerprint identification module 10 do not interfere with each other, ensuring the stability of the installation of the fingerprint identification module 10.
  • the housing 200 includes a back cover (not shown) provided on the side of the middle frame 202 opposite to the display screen 20.
  • the back cover cooperates with the middle frame 202 to form a receiving space (not shown), and other electronic components of the electronic device 1000 can be arranged in the receiving space. In this way, the back cover can protect the electronic components in the electronic device 1000.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
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Abstract

本申请公开了一种输入输出组件(100)。输入输出组件(100)包括指纹识别模组(10)和显示屏(20)。显示屏(20)包括朝向用户的上表面(22)和与上表面(22)相背的下表面(24)，指纹识别模组(10)包括指纹识别芯片(11)和基板(12)，指纹识别芯片(11)包括用于检测指纹的感测面(112)和与感测面(112)相背的贴合面(114)，感测面(112)与下表面(24)相对间隔设置，基板(12)包括主体部(122)和围绕主体部(122)的周缘部(124)，周缘部(124)的厚度小于主体部(122)的厚度，主体部(122)相对周缘部(124)向指纹识别芯片(11)突出，主体部(122)包括与指纹识别芯片(11)相对的承载面(1222)，贴合面(114)贴附在承载面(1222)上。本申请还公开了一种电子设备(1000)。

Description

输入输出组件和电子设备
优先权信息
本申请请求2019年04月25日向中国国家知识产权局提交的、申请号为201910340049.4的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及消费性电子技术领域，更具体而言，涉及一种输入输出组件和电子设备。
背景技术
相关技术中，为了提高手机的屏占比，屏下指纹方案已经成为一种趋势。为了固定指纹识别模组并降低厚度，现有的一种手机将指纹识别模组贴附在显示屏下表面，利用显示屏的透光特性采集指纹图像。然而，由于都是光学元件，显示屏与指纹识别模组之间过于贴近容易发生干涉，且将指纹识别模组直接粘附到显示屏的下表面，在组装过程中容易损伤显示屏，影响显示屏的稳定性。再有，如此设置也不利于指纹识别模组和显示屏后续的维修。
发明内容
本申请的实施方式提供了一种输入输出组件和电子设备。
本申请实施方式的输入输出组件包括显示屏和指纹识别模组，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面，所述指纹识别模组包括指纹识别芯片和基板，所述指纹识别芯片包括用于检测指纹的感测面和与所述感测面相背的贴合面，所述感测面与所述下表面相对间隔设置，所述基板包括主体部和围绕所述主体部的周缘部，所述周缘部的厚度小于所述主体部的厚度，所述主体部相对所述周缘部向所述指纹识别芯片突出，所述主体部包括与所述指纹识别芯片相对的承载面，所述贴合面贴附在所述承载面上。
本申请实施方式的电子设备包括壳体和输入输出组件，所述壳体包括中框，所述输入输出组件包括显示屏和指纹识别模组，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面，所述指纹识别模组包括指纹识别芯片和基板，所述指纹识别芯片包括用于检测指纹的感测面和与所述感测面相背的贴合面，所述感测面与所述下表面相对间隔设置，所述基板包括主体部和围绕所述主体部的周缘部，所述周缘部的厚度小于所述主体部的厚度，所述主体部相对所述周缘部向所述指纹识别芯片突出，所述主体部包括与所述指纹识别芯片相对的承载面，所述贴合面贴附在所述承载面上，所述周缘部设置在所述中框。
本申请实施方式的电子设备中，基板的周缘部可以通过减薄处理，从而周缘部的厚度小于主体部的厚度，指纹识别芯片设置在主体部时，可以通过周缘部安装到电子设备的中框。如此，指纹识别模组的安装方式简单，且显示屏可以与指纹识别芯片间隔设置，减少显示屏和指纹识别模组的干涉，有利于后续指纹识别模组的维修，增加电子设备的稳定性。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的电子设备的立体示意图。
图2是本申请实施方式的电子设备的分解示意图。
图3是本申请实施方式的电子设备的平面示意图。
图4是图3的电子设备沿IV-IV方向的剖面示意图。
图5是本申请实施方式的电子设备的另一分解示意图。
图6是图4的电子设备在XI部分的放大示意图。
图7是本申请实施方式的输入输出组件的平面示意图。
图8是本申请实施方式的输入输出组件的剖面示意图。
图9是图7的输入输出组件在VIII部分的放大示意图。
图10是本申请实施方式的指纹识别模组的立体示意图。
图11是本申请实施方式的指纹识别模组的分解示意图。
图12是本申请实施方式的指纹识别模组的剖面示意图。
图13是图12的指纹识别模组在XIII部分的放大示意图。
主要附图元件说明：
电子设备1000、输入输出组件100、指纹识别模组10、指纹识别芯片11、感测面112、贴合面114、基板12、主体部122、承载面1222、周缘部124、底面126、柔性电路板13、通孔132、外围电路部分134、引线14、保护胶15、第一粘合层16、第二粘合层17、显示屏20、上表面22、指纹感应区222、下表面24、盖板30、壳体200、中框202、安装通孔2021、台阶结构2022、第一表面2023、第二表面2024、凹槽2025、电池300。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
请参阅图1至图6，本申请实施方式的电子设备1000包括输入输出组件100和壳体200。输入输出组件100设置在壳体200。在一个例子中，输入输出组件100至少部分地设置在壳体200内。
请参阅图7至图9，输入输出组件100包括指纹识别模组10和显示屏20。显示屏20包括朝向用户的上表面22和与上表面22相背的下表面24，其中，上表面22可以用于向用户显示图像信息。指纹识别模组10与显示屏20的下表面24相对间隔设置。
请参阅图10至图13，指纹识别模组10包括指纹识别芯片11和基板12。指纹识别芯片11包括用于检测指纹的感测面112和与感测面112相背的贴合面114。基板12包括主体部122和围绕主体部122的周缘部124。周缘部124的厚度小于主体部12的厚度，主体部122相对周缘部124向指纹识别芯片11突出，主体部122包括与指纹识别芯片11相对的承载面1222。贴合面114贴附在承载面1222上。
其中，壳体200包括中框202，第二粘合面124粘附在中框202上。指纹识别芯片11的感测面112与显示屏20的下表面24相对间隔设置。
本申请实施方式的指纹识别模组10、输入输出组件100和电子设备1000中，基板12的周缘部124可以通过减薄处理，从而周缘部124的厚度小于主体部122，指纹识别芯片11设置在主体部122时，可以通过周缘部124安装到电子设备1000的其他部件(例如中框202)。如此，指纹识别模组10的安装方式简单。
指纹识别模组10相对显示屏20的下表面24设置，可以实现屏下指纹识别，且显示屏20与指纹识别模组10相对间隔设置，有利于减少显示屏20与指纹识别模组10之间的干涉，增加输入输出组件100和电子设备1000的稳定性。同时，降低了指纹识别模组10的拆卸难度，可方便指纹识别模组10后续的维修。
在某些实施方式中，输入输出组件100包括盖板30，盖板30设置在显示屏20上表面22。
具体地，盖板30可以是透明盖板30。透明盖板30例如是透明玻璃、蓝宝石或PET防爆膜等。如此，透明的盖板30保证显示屏20的显示效果，同时可以保护显示屏20，增加电子设备1000的可靠性。
在某些实施方式中，显示屏20包括OLED(Organic Light-Emitting Diode，有机发光二 极管)显示屏，指纹识别模组10可以是光学指纹识别模组、超声波指纹识别模组或其他适用于屏下指纹方案的指纹识别模组10。光学指纹识别模组可以利用OLED显示屏的透光特性，在显示屏20下表面24的一侧采集位于显示屏20上表面22一侧的手指指纹图像，从而实现屏下指纹识别。超声波指纹识别模组可以利用超声波对于显示屏20和手指不同的穿透特性，同样地，可以在显示屏20下表面24的一侧采集位于显示屏20上表面22一侧的手指指纹信息，实现屏下指纹识别。
需要说明的是，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参阅图9，在某些实施方式中，指纹识别模组10与显示屏20的下表面24之间的距离可小于2mm。
可以理解，指纹识别模组10设置在显示屏20下方时，指纹识别模组10与显示屏20的下表面24之间的距离过大，指纹识别模组10采集指纹图像的距离相应增加，不利于指纹识别模组10采集指纹图像，且增加电子设备1000的厚度。指纹识别模组10与显示屏20的下表面24之间的距离可小于2mm可保证指纹识别模组可以较好地采集手指指纹图像，同时，输入输出组件100可以保持较小的厚度，有利于电子设备1000的小型化设计。
优选地，指纹识别模组10与显示屏20的下表面24之间的距离可小于1mm。
请参阅图7，在某些实施方式中，显示屏20的上表面22包括指纹感应区222，指纹识别模组10对应指纹感应区222与显示屏20的下表面24间隔设置。如图7所示，指纹感应区222为显示屏20上表面22的一部分，手指位于指纹感应区222时，指纹识别模组10可以采集指纹图像，手指位于指纹感应区222之外的区域时，指纹识别模组10不采集指纹图像。需要说明的是，指纹感应区222不限于位于图示所示的位置，而可以根据需要设置在显示屏20上表面22的其他位置。
当然，在其他实施方式中，指纹感应区222可以是显示屏20的整个上表面22，如此，手指位于显示屏20上表面22的任一位置时，指纹识别模组10均可以采集指纹图像。此时，指纹识别模组10相对整个显示屏20的下表面24间隔设置。
在某些实施方式中，壳体200包括中框202，中框202可为电子设备1000中的电子元件提供支撑。
具体地，指纹识别模组10设置在中框202上。中框202可以支撑指纹识别模组10， 实现指纹识别模组10和显示屏20间隔设置。
请参阅图4、图5和图6，在某些实施方式中，显示屏20的下表面24贴附在中框202上，中框202形成有安装通孔2021，指纹识别模组10至少部分收容于安装通孔2021内。
如此，显示屏20和指纹识别模组10均安装在中框202上，通过安装通孔2021收容指纹识别模组10可实现指纹识别模组10相对显示屏20下表面24进行设置，保证指纹识别模组10采集指纹图像信息。安装通孔2021还可以充分利用中框202的厚度，优化电子设备1000的空间配置。
如图6所示，在某些实施方式中，安装通孔2021远离显示屏20的一侧形成有台阶结构2022，周缘部124设置在台阶结构2022。
如此，周缘部124做减薄处理，从而周缘部124与台阶结构2022配合使得指纹识别模组10稳定地安装到安装通孔2021内，同时，中框202与显示屏20相背的一侧表面可以与基板12齐平，有利于电子设备1000的其他部件安装到中框202上。
请参阅图11，在某些实施方式中，指纹识别模组10包括柔性电路板13，基板12包括补强板。柔性电路板13设置在承载面1222上。指纹识别芯片11与柔性电路板13电性连接。
其中，柔性电路板13有利于优化电子设备1000的空间配置，补强板可以由结构强度较高的材料制成，补强板例如是钢板、塑料板等。钢板强度较高，可以增加指纹识别模组10的结构强度，提高指纹识别模组10的可靠性。钢板可以通过蚀刻工艺在周缘部124做减薄处理。塑料板增加指纹识别模组10结构强度的同时，可以减轻指纹识别模组10的重量，降低指纹识别模组10的制造成本。塑料板可以通过注塑工艺在主体部122的周围形成较薄的周缘部124。
如此，指纹识别芯片11通过柔性电路板13与外部电路(图未示)实现电连接，从而提供驱动指纹识别芯片11工作的电源，以及实现指纹信息的传输。例如，指纹图像信息可以通过电路板13传输至外部电路进行处理。
可以理解，柔性电路板13与指纹识别芯片11设置在基板12的同一侧，在图示的例子中，指纹识别芯片11与柔性电路板13相互间隔设置在承载面1222上，也即柔性电路板13避开指纹识别芯片11设置在承载面1222上。如此，可降低指纹识别模组10的厚度，有利于指纹识别模组10小型化设计。
在某些实施方式中，安装通孔2021的尺寸和形状与指纹识别模组10的尺寸和形状相适应。
如此，安装通孔2021可以与指纹识别模组10紧密配合，安装通孔2021可以限定指纹识别模组10的位置，使得指纹识别模组10与中框202不容易发生相对移动。提高电子设 备1000的可靠性。此外，指纹识别模组10安装到中框202时，安装通孔2021可以为指纹识别模组10的安装提供定位，方便电子设备1000的装配。
在某些实施方式中，安装通孔2021包括用于收容指纹识别芯片11的收容部分和用于布置指纹识别模组10的传输电路的走线部分，收容部分远离显示屏20的一侧形成有台阶结构2022。如此，台阶结构2022与周缘部124对应，用于连接外部电路的柔性电路板13可以沿走线部分布置。
当然，在其他实施方式中，走线部分还可以设计成沉槽，沉槽在中框202与显示屏20相背的一侧连通安装通孔2021。如此，减少中框202的开孔面积，保证中框202的稳定性。
请参阅图6，在某些实施方式中，基板12包括与承载面1222相背的底面126，中框202包括朝向显示屏20的第一表面2023和与第一表面2023相背的第二表面2024，安装通孔2021贯穿中框202的第一表面2023和第二表面2024，安装通孔2021在靠近第二表面2024的一侧形成有台阶结构2022，指纹识别模组10收容于安装通孔2021时，底面126与第二表面2024基本齐平。
如此，中框202可以保持第二表面2024的平整，电子设备1000的其他电子元件安装到第二表面2024时不会与指纹识别模组10在结构上形成干涉，有利于优化电子装置1000的空间配置。
在替换的实施方式中，指纹识别模组10收容于安装通孔2021时，基板12的底面126位于安装通孔2021内且基板12的底面126与第二表面2024所在的平面间隔。
如此，指纹识别模组10安装时，基板12的底面126与第二表面2024所在的平面预留有间隙，相应地，电子设备1000的其他电子元件安装到第二表面2024时不会与指纹识别模组10接触，有利于保证指纹识别模组10安装的稳定性。
进一步地，如图11所示，在某些实施方式中，柔性电路板13围绕指纹识别芯片11间隔设置在承载面1222上。此时，指纹识别芯片11与柔性电路板13间隔，柔性电路板13开设有通孔132，指纹识别芯片11位于通孔132内并设置在承载面1222上。当然，在其他实施方式中，柔性电路板13还可以是呈半包围的形式围绕指纹识别芯片11间隔设置在承载面1222上。例如，柔性电路板13可以是围绕指纹识别芯片11的一条侧边、两条侧边或三边侧边间隔设置在承载面1222上。
在某些实施方式中，指纹识别模组10还包括连接指纹识别芯片11和柔性电路板13的引线14，
如此，指纹识别芯片11可以通过引线14与柔性电路板13实现电连接。具体地，引线14可以是金线，指纹识别模组10可以通过引线键合(wire bonding)工艺将指纹识别芯片11与柔性电路板13做电路连接，实现指纹识别芯片11的封装。
进一步地，在某些实施方式中，指纹识别模组10包括位于指纹识别芯片11与电路板13之间且涂覆引线14的保护胶15。
如此，保护胶15连接指纹识别芯片11和柔性电路板13，使得指纹识别芯片11与电路板13的相对位置稳定，增加指纹识别模组10结构的稳定性。保护胶15涂覆引线14可进一步保证引线14连接的稳定性。
在图11所示的实施方式中，指纹识别芯片11呈矩形，对于引线14连接在指纹识别芯片11一侧边的情况，保护胶15不限于覆盖引线14，而可围绕指纹识别芯片11填充在指纹识别芯片11与电路板13之间的间隙，保证指纹识别模组10的稳定性。
具体地，对于指纹识别芯片11位于通孔132的情况，保护胶14至少部分地位于通孔132内并围绕指纹识别芯片11以填充指纹识别芯片11与电路板13之间的间隙。
在其他实施方式中，指纹识别芯片11的形状不限于矩形，而可以根据实际情况选择圆形、方形、椭圆形或其他形状，在此不做具体限定。
在某些实施方式中，指纹识别模组10包括第一粘合层16，第一粘合层16粘合贴合面114和承载面1222。
如此，指纹识别芯片11可以通过第一粘合层16粘附到承载面1222上。在一个例子中，第一粘合层16可以是双面胶，如此，可方便指纹识别模组10装配。当然，在其他实施方式中，第一粘合层16还可以由胶水涂覆形成，在此不做具体限定。
当然，在某些实施方式中，柔性电路板13可以通过第一粘合层16粘附到承载面1222。
在某些实施方式中，指纹识别模组10包括第二粘合层17，第二粘合层17设置在周缘部124靠近承载面1222的一侧。
如此，周缘部124可以通过第二粘合层17粘附到台阶结构2022。在一个例子中，第二粘合层17可以是双面胶，如此，可方便指纹识别模组10装配。当然，在其他实施方式中，第二粘合层17还可以由胶水涂覆形成，在此不做具体限定。
在某些实施方式中，柔性电路板13还设置有外围电路部分134(例如电容、电阻等)。柔性电路板13可以通过表面贴装技术(Surface Mount Technology，SMT)将外围电路部分134贴装到柔性电路板13，然后再将带有电路元件的柔性电路板13贴附到承载面1222上。
在某些实施方式中，指纹识别模组10包括设置在柔性电路板13与基板12相背一侧的保护层(图未示)。感测面112包括感测区(图未示)，保护层18在基板12上的正投影位于感测区在基板12上的正投影之外。
需要说明的是，感测区为指纹识别芯片11采集指纹图像的有效区域，保护层18避开指纹识别芯片11的感测区设置，保证指纹识别模组10可以采集指纹图像信息。保护层18还可以保护指纹识别模组10，防止外力撞击造成指纹识别模组10损坏。
在一个例子中，保护层18可部分地覆盖感测面122上位于感测区1122之外区域，如此，保护层18可以隔开指纹识别芯片11和显示屏20以保持指纹识别芯片11的感测面112与显示屏20的下表面24相对间隔设置，能够在一定程度上保护指纹识别芯片11。
在某些实施方式中，保护层18可以是保护泡棉。如此，保护泡棉可以起到缓冲作用，从而实现对指纹识别模组10的保护。
在某些实施方式中，指纹识别模组10至少部分地收容于安装通孔2021时，保护泡棉可以接触显示屏20的下表面24进行设置。此时，显示屏20和指纹芯片11夹挤保护泡棉，以及显示屏20与柔性电路板13夹挤保护泡棉。如此，使得输入输出组件100的结构更加紧密，有利于优化电子装置1000的空间配置。同时，在保护泡棉的缓冲作用下，可以避免指纹识别模组10(例如指纹识别模组10的指纹识别芯片11)与显示屏20直接接触而造成显示屏20或指纹识别芯片11损坏。
具体地，保护泡棉接触显示屏20的下表面24进行设置时，保护泡棉不与显示屏20的下表面24进行粘合，以使指纹识别模组10拆卸时可以方便指纹识别模组10与显示屏20进行分离。
在某些实施方式中，基板12还可以是印刷电路板(Printed Circuit Board，PCB)或软硬结合板，也即是说，电路板13可以包括印刷电路板或软硬结合板。此时，指纹识别芯片11与基板12电性连接。
具体地，印刷电路板可以实现指纹识别芯片11的电性连接，同时，印刷电路板具有一定的强度，可以增加指纹识别模组10的结构强度。印刷电路板可以通过蚀刻形成周缘部124，指纹识别芯片11可以直接设置在本体部122的承载面1222上，而印刷电路板可以通过柔性电路板与外部电路连接以优化电子设备1000的空间配置。
软硬结合板结合了柔性电路板和印刷电路板，在指纹识别芯片11对应的区域可以具有一定的强度，同样地，可以实现指纹识别芯片11的电性连接，同时，增加指纹识别模组10的结构强度；在指纹识别芯片11对应的区域之外可以具有一定的挠性以优化电子设备1000的空间配置。
在某些实施方式中，中框202与显示屏20相背的一侧可以用于安装电子设备1000的其他电子元件，例如，电池300、主板、天线和扬声器等。在图示的例子中，中框202与显示屏20相背的一侧开设有凹槽2025，电池300至少部分地设置在凹槽2025。
具体地，如图5所示，安装通孔2021贯穿凹槽2025的底部。此时，中框202的第二表面2024为凹槽2025的底部表面。
如此，指纹识别模组10收容于安装通孔2021时，基板12的底面126与凹槽2025的底部表面齐平，电池300可以与凹槽2025的底部平面紧密结合，有利于电子设备1000的 小型化设计。或者指纹识别模组10收容于安装通孔2021时，基板12的底面126与凹槽2025的底部表面所在的平面间隔，从而电池300安装到凹槽2025时，基板12的底面126与电池300间隔，电池300与指纹识别模组10互不干涉，保证指纹识别模组10安装的稳定性。
进一步地，壳体200包括设置在中框202与显示屏20相背一侧的后盖(图未示)。后盖与中框202配合形成收容空间(图未示)，电子设备1000的其他电子元件可以设置在收容空间内。如此，后盖可以保护电子设备1000内的电子元件。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种输入输出组件，其特征在于，包括显示屏和指纹识别模组，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面，所述指纹识别模组包括：
    指纹识别芯片，所述指纹识别芯片包括用于检测指纹的感测面和与所述感测面相背的贴合面，所述感测面与所述下表面相对间隔设置；和
    基板，所述基板包括主体部和围绕所述主体部的周缘部，所述周缘部的厚度小于所述主体部的厚度，所述主体部相对所述周缘部向所述指纹识别芯片突出，所述主体部包括与所述指纹识别芯片相对的承载面，所述贴合面贴附在所述承载面上。
  2. 根据权利要求1所述的输入输出组件，其特征在于，所述指纹识别模组包括柔性电路板，所述基板包括补强板，所述柔性电路板设置在所述承载面上，所述指纹识别芯片与所述柔性电路板电性连接。
  3. 根据权利要求2所述的输入输出组件，其特征在于，所述指纹识别模组还包括：
    连接所述指纹识别芯片和所述柔性电路板的引线；和
    位于所述指纹识别芯片与所述柔性电路板之间且涂覆所述引线的保护胶。
  4. 根据权利要求2所述的输入输出组件，其特征在于，所述指纹识别模组包括设置在所述柔性电路板与所述基板相背一侧的保护层，所述感测面包括感测区，所述保护层在所述基板上的正投影位于所述感测区在所述基板上的正投影之外。
  5. 根据权利要求1所述的输入输出组件，其特征在于，所述基板包括印刷电路板或软硬结合板，所述指纹识别芯片与所述基板电性连接。
  6. 根据权利要求1所述的输入输出组件，其特征在于，所述指纹识别模组包括第一粘合层，所述第一粘合层粘合所述贴合面和所述承载面。
  7. 根据权利要求1所述的输入输出组件，其特征在于，所述指纹识别模组包括第二粘合层，所述第二粘合层设置在所述周缘部靠近所述承载面的一侧。
  8. 根据权利要求1所述的输入输出组件，其特征在于，所述指纹识别模组与所述下表面之间的距离小于1mm。
  9. 一种电子设备，其特征在于，包括壳体和输入输出组件，所述壳体包括中框，所述输入输出组件包括显示屏和指纹识别模组，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面，所述指纹识别模组包括：
    指纹识别芯片，所述指纹识别芯片包括用于检测指纹的感测面和与所述感测面相背的贴合面，所述感测面与所述下表面相对间隔设置；和
    基板，所述基板包括主体部和围绕所述主体部的周缘部，所述周缘部的厚度小于所述主体部的厚度，所述主体部相对所述周缘部向所述指纹识别芯片突出，所述主体部包括与所述指纹识别芯片相对的承载面，所述贴合面贴附在所述承载面上，所述周缘部设置在所述中框。
  10. 根据权利要求9所述的电子设备，其特征在于，所述指纹识别模组包括柔性电路板，所述基板包括补强板，所述柔性电路板设置在所述承载面上，所述指纹识别芯片与所述柔性电路板电性连接。
  11. 根据权利要求10所述的电子设备，其特征在于，所述指纹识别模组还包括：
    连接所述指纹识别芯片和所述柔性电路板的引线；和
    位于所述指纹识别芯片与所述柔性电路板之间且涂覆所述引线的保护胶。
  12. 根据权利要求10所述的电子设备，其特征在于，所述指纹识别模组包括设置在所述柔性电路板与所述基板相背一侧的保护层，所述感测面包括感测区，所述保护层在所述基板上的正投影位于所述感测区在所述基板上的正投影之外。
  13. 根据权利要求9所述的电子设备，其特征在于，所述基板包括印刷电路板或软硬结合板，所述指纹识别芯片与所述基板电性连接。
  14. 根据权利要求9所述的电子设备，其特征在于，所述指纹识别模组包括第一粘合层，所述第一粘合层粘合所述贴合面和所述承载面。
  15. 根据权利要求9所述的电子设备，其特征在于，所述指纹识别模组包括第二粘合层，所述第二粘合层设置在所述周缘部靠近所述承载面的一侧。
  16. 根据权利要求9所述的电子设备，其特征在于，所述指纹识别模组与所述下表面之间的距离小于1mm。
  17. 根据权利要求9所述的电子设备，其特征在于，所述中框形成有安装通孔，所述安装通孔远离所述显示屏的一侧形成有台阶结构；
    所述指纹识别模组至少部分收容于所述安装通孔内，所述周缘部设置在所述台阶结构。
  18. 根据权利要求17所述的电子设备，其特征在于，所述安装通孔的形状和尺寸与所述指纹识别模组的形状和尺寸相适应。
  19. 根据权利要求17所述的电子设备，其特征在于，所述安装通孔包括用于收容所述指纹识别芯片的收容部分和用于布置所述指纹识别模组的传输电路的走线部分，所述收容部分远离所述显示屏的一侧形成有所述台阶结构。
  20. 根据权利要求17所述的电子设备，其特征在于，所述基板包括与所述承载面相背的底面，所述中框包括朝向所述显示屏的第一表面和与所述第一表面相背的第二表面，所述安装通孔贯穿所述第一表面和所述第二表面，所述指纹识别模组收容于所述安装通孔时，所述底面与所述第二表面齐平。
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