WO2020216300A1 - 输入输出组件和电子设备 - Google Patents

输入输出组件和电子设备 Download PDF

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Publication number
WO2020216300A1
WO2020216300A1 PCT/CN2020/086446 CN2020086446W WO2020216300A1 WO 2020216300 A1 WO2020216300 A1 WO 2020216300A1 CN 2020086446 W CN2020086446 W CN 2020086446W WO 2020216300 A1 WO2020216300 A1 WO 2020216300A1
Authority
WO
WIPO (PCT)
Prior art keywords
fingerprint identification
circuit board
adhesive layer
identification module
adhesive
Prior art date
Application number
PCT/CN2020/086446
Other languages
English (en)
French (fr)
Inventor
张文真
杨乐
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020216300A1 publication Critical patent/WO2020216300A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing

Definitions

  • This application relates to the technical field of consumer electronics, and more specifically, to an input/output component and an electronic device.
  • an under-screen fingerprint solution has become a trend.
  • an existing mobile phone attaches the fingerprint identification module to the lower surface of the display screen, and uses the light transmission characteristics of the display screen to collect fingerprint images.
  • the display screen and the fingerprint recognition module are too close to each other to easily interfere, and the fingerprint recognition module is directly adhered to the lower surface of the display screen, which may damage the display screen during the assembly process and affect the display.
  • the stability of the screen is not conducive to subsequent maintenance of the fingerprint identification module and the display screen.
  • the embodiments of the present application provide an input and output component and an electronic device.
  • the input and output component of the embodiment of the present application includes a display screen and a fingerprint recognition module.
  • the display screen includes an upper surface facing the user and a lower surface opposite to the upper surface.
  • the electronic device of the embodiment of the present application includes a housing and an input/output component.
  • the input/output component includes a display screen and a fingerprint recognition module.
  • the display screen includes an upper surface facing the user and a lower surface opposite to the upper surface. , The fingerprint identification module and the lower surface are relatively spaced apart.
  • the display screen and the fingerprint identification chip can be arranged at intervals, which can reduce the interference between the display screen and the fingerprint identification module, increase the stability of the electronic device, and at the same time, facilitate the display screen and the fingerprint identification module
  • the separation reduces the difficulty of disassembling the fingerprint identification module, which is beneficial to the subsequent maintenance of the fingerprint identification module.
  • FIG. 1 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present application.
  • Fig. 2 is an exploded schematic diagram of an electronic device according to an embodiment of the present application.
  • Fig. 3 is a schematic plan view of an electronic device according to an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of the electronic device of FIG. 3 along the direction IV-IV.
  • FIG. 5 is another exploded schematic diagram of the electronic device according to the embodiment of the present application.
  • Fig. 6 is a schematic plan view of an input/output component of an embodiment of the present application.
  • Fig. 7 is a schematic cross-sectional view of an input-output assembly according to an embodiment of the present application.
  • Fig. 8 is an enlarged schematic diagram of the input and output components of Fig. 7 in part VIII.
  • Fig. 9 is a three-dimensional schematic diagram of a fingerprint recognition module according to an embodiment of the present application.
  • FIG. 10 is an exploded schematic diagram of the fingerprint identification module of the embodiment of the present application.
  • FIG. 11 is a schematic cross-sectional view of a fingerprint identification module according to an embodiment of the present application.
  • FIG. 12 is an enlarged schematic diagram of the fingerprint identification module of FIG. 11 in the XII part.
  • Electronic device 1000 input and output component 100, fingerprint recognition module 10, fingerprint recognition chip 11, sensing surface 112, sensing area 1122, bonding surface 114, first adhesive layer 12, circuit board 13, through hole 132, Peripheral circuit part 134, lead 14, protective glue 15, reinforcing plate 16, second adhesive layer 17, protective layer 18, protective film 19, display screen 20, upper surface 22, fingerprint sensing area 222, lower surface 24, cover
  • the plate 30 the housing 200, the middle frame 202, the bearing surface 2020, the sink groove 2022, the groove 2024, and the battery 300.
  • the electronic device 1000 includes an input and output assembly 100 and a housing 200.
  • the input/output assembly 100 is provided in the housing 200.
  • the input/output assembly 100 is at least partially disposed in the housing 200.
  • the input/output assembly 100 includes a fingerprint identification module 10 and a display screen 20.
  • the display screen 20 includes an upper surface 22 facing the user and a lower surface 24 opposite to the upper surface 22, wherein the upper surface 22 can be used to display image information to the user.
  • the fingerprint identification module 10 and the lower surface 24 of the display screen 20 are arranged relatively spaced apart.
  • the fingerprint identification module 10 includes a fingerprint identification chip 11 and a first adhesive layer 12.
  • the fingerprint recognition chip 11 includes a sensing surface 112 for detecting fingerprints and a bonding surface 114 opposite to the sensing surface 112.
  • the first adhesive layer 12 includes a first adhesive surface 122 with adhesiveness and a second adhesive surface 124 opposite to the first adhesive surface 122, and the first adhesive surface 122 is adhered to the bonding surface 114.
  • the housing 200 includes a middle frame 202, and the second adhesive surface 124 is adhered to the middle frame 202.
  • the sensing surface 112 of the fingerprint identification chip 11 and the lower surface 24 of the display screen 20 are arranged relatively spaced apart.
  • the fingerprint identification module 10 can be adhered through the first adhesive layer 12, and the assembly method is simple.
  • the fingerprint identification module 10 is arranged relative to the lower surface 24 of the display screen 20 to realize under-screen fingerprint identification, and the display screen 20 and the fingerprint identification module 10 are arranged relatively spaced apart, which is beneficial to reduce the gap between the display screen 20 and the fingerprint identification module 10
  • the interference increases the stability of the input/output assembly 100 and the electronic device 1000.
  • the difficulty of disassembling the fingerprint identification module 10 is reduced, and subsequent maintenance of the fingerprint identification module 10 can be facilitated.
  • the middle frame 202 can support the fingerprint identification module 10 to realize the relative spacing of the fingerprint identification module 10 and the display screen 20.
  • the input/output assembly 100 includes a cover plate 30, and the cover plate 30 is disposed on the upper surface 22 of the display screen 20.
  • the cover plate 30 may be a transparent cover plate 30.
  • the transparent cover 30 is, for example, transparent glass, sapphire, or PET explosion-proof film. In this way, the transparent cover plate 30 ensures the display effect of the display screen 20, while protecting the display screen 20 and increasing the reliability of the electronic device 1000.
  • the display screen 20 includes an OLED (Organic Light-Emitting Diode) display screen
  • the fingerprint recognition module 10 may be an optical fingerprint recognition module, an ultrasonic fingerprint recognition module, or other suitable under-screen Fingerprint recognition module of fingerprint scheme.
  • the optical fingerprint recognition module can take advantage of the light-transmitting characteristics of the OLED display screen to collect fingerprint images of the finger on the side of the upper surface 22 of the display screen 20 on the side of the lower surface 24 of the display screen 20, so as to realize fingerprint recognition under the screen.
  • the ultrasonic fingerprint recognition module can use the different penetration characteristics of ultrasonic waves to the display screen 20 and the finger.
  • the fingerprint information of the finger located on the upper surface 22 side of the display screen 20 can be collected on the side of the lower surface 24 of the display screen 20 to achieve Fingerprint recognition under the screen.
  • the first feature “on” or “under” the second feature may be in direct contact with the first and second features, or the first and second features may be indirectly through an intermediary. contact.
  • the "above”, “above” and “above” of the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the level of the first feature is higher than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the level of the first feature is smaller than the second feature.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 may be less than 2 mm.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 is too large, and the distance for the fingerprint identification module 10 to collect fingerprint images increases accordingly. It is helpful for the fingerprint identification module 10 to collect fingerprint images and increases the size of the electronic device 1000.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 is less than 2 mm to ensure that the fingerprint identification module 10 can better collect fingerprint images of fingers.
  • the input and output components 100 can maintain a small thickness, which is beneficial to Miniaturized design of the electronic device 1000.
  • the distance between the fingerprint identification module 10 and the lower surface 24 of the display screen 20 may be less than 1 mm.
  • the upper surface 22 of the display screen 20 includes a fingerprint sensing area 222, and the fingerprint identification module 10 corresponds to the fingerprint sensing area 222 and the lower surface 24 of the display screen 20.
  • the fingerprint sensing area 222 is a part of the upper surface 22 of the display screen 20.
  • the fingerprint identification module 10 can collect fingerprint images.
  • the fingerprint identification module 10 does not collect fingerprint images.
  • the fingerprint sensing area 222 is not limited to being located at the position shown in the figure, but can be set at other positions on the upper surface 22 of the display screen 20 as required.
  • the fingerprint sensing area 222 may be the entire upper surface 22 of the display screen 20.
  • the fingerprint identification module 10 can collect fingerprint images.
  • the fingerprint identification module 10 is arranged at intervals relative to the lower surface 24 of the entire display screen 20.
  • the lower surface 24 of the display screen 20 is attached to the middle frame 202.
  • the middle frame 202 includes a bearing surface 2020 opposite to the display screen 20.
  • the bearing surface 2020 is provided with a sink 2022, and the fingerprint identification module 10 It is at least partially disposed in the sink 2022.
  • the middle frame 202 supports the display screen 20 and the fingerprint identification module 10 at the same time, and the fingerprint identification module 10 can be spaced apart from the lower surface 24 of the display screen 20 through the sink 2022 to ensure that the fingerprint identification module 10 collects fingerprint image information.
  • the sink 2022 can also make full use of the thickness of the middle frame 202 to optimize the spatial configuration of the electronic device 1000. Specifically, in an example, the second adhesive surface 124 of the first adhesive layer 12 is adhered to the bottom surface of the sink groove 2022.
  • the size and shape of the sink 2022 are compatible with the size and shape of the fingerprint identification module 10.
  • the sink slot 2022 can be closely matched with the fingerprint identification module 10, and the sink slot 2022 can define the position of the fingerprint identification module 10, so that the fingerprint identification module 10 and the middle frame 202 are not easily moved relative to each other. Improve the reliability of the electronic device 1000.
  • the sink 2022 can provide positioning for the installation of the fingerprint identification module 10, which facilitates the assembly of the electronic device 1000.
  • the lower surface 24 of the display screen 20 is attached to the supporting surface 2020.
  • the bearing surface 2020 can be used to support the display screen 20.
  • the depth of the sink groove 2022 is not less than the thickness of the fingerprint identification module 10.
  • the fingerprint identification module 10 can be completely accommodated in the sink 2022 and arranged opposite to the lower surface 24 of the display screen 20.
  • the first adhesive layer 12 may be a double-sided tape.
  • the first adhesive surface 122 of the first adhesive layer 12 may be adhered to the bonding surface of the fingerprint identification chip 11. 114, and a protective film 19 is provided on the second adhesive surface 124 of the first adhesive layer 12 to maintain the adhesion of the second adhesive surface 124. Then, when the fingerprint identification module 10 is installed on the middle frame 202, the protective film 19 can be removed, and the fingerprint identification module 10 can be attached to the sink groove 2022 through the second adhesive surface 124. In this way, the installation of the fingerprint identification module 10 can be facilitated.
  • the fingerprint recognition module 10 includes a circuit board 13.
  • the circuit board 13 is adhered to the first adhesive surface 122.
  • the circuit board 13 is electrically connected to the fingerprint identification chip 11.
  • the fingerprint identification chip 11 is electrically connected to an external circuit (not shown) through the circuit board 13, so as to provide power to drive the fingerprint identification chip 11 to work and realize the transmission of fingerprint information.
  • fingerprint image information can be transmitted to an external circuit through the circuit board 13 for processing.
  • the circuit board 13 and the fingerprint identification chip 11 are arranged on the same side of the first adhesive layer 12.
  • the fingerprint identification chip 11 and the circuit board 13 are arranged on the first adhesive surface 122 at intervals. That is, the circuit board 13 is arranged on the first adhesive surface 122 avoiding the fingerprint identification chip 11. In this way, the thickness of the fingerprint identification module 10 can be reduced, which is beneficial to the miniaturization design of the fingerprint identification module 10.
  • the circuit board 13 is arranged on the first adhesive surface 122 at intervals around the fingerprint identification chip 11. At this time, the circuit board 13 is provided with a through hole 132, and the fingerprint identification chip 11 is located in the through hole 132 and is disposed on the first adhesive surface 122.
  • the fingerprint recognition module 10 further includes a lead 14 connecting the fingerprint recognition chip 11 and the circuit board 13.
  • the fingerprint identification chip 11 can be electrically connected to the circuit board 13 through the lead 14.
  • the lead 14 may be a gold wire
  • the fingerprint identification module 10 may connect the fingerprint identification chip 11 and the circuit board 13 through a wire bonding process to realize the packaging of the fingerprint identification chip 11.
  • the fingerprint identification module 10 includes a protective glue 15 between the fingerprint identification chip 11 and the circuit board 13 and coated with a lead 14.
  • the protective glue 15 connects the fingerprint identification chip 11 and the circuit board 13 so that the relative position of the fingerprint identification chip 11 and the circuit board 13 is stable, and the structural stability of the fingerprint identification module 10 is increased.
  • the protective glue 15 coating the lead 14 can further ensure the stability of the lead 14 connection.
  • the fingerprint identification chip 11 is rectangular.
  • the protective glue 15 is not limited to cover the lead 14, but can be filled around the fingerprint identification chip 11.
  • the gap between the fingerprint identification chip 11 and the circuit board 13 ensures the stability of the fingerprint identification module 10.
  • the protective glue 14 is at least partially located in the through hole 132 and surrounds the fingerprint identification chip 11 to fill the gap between the fingerprint identification chip 11 and the circuit board 13.
  • the shape of the fingerprint identification chip 11 is not limited to a rectangle, but a circle, a square, an ellipse or other shapes can be selected according to actual conditions, which is not specifically limited here.
  • the circuit board 13 includes a flexible circuit board.
  • the fingerprint recognition module 10 includes a reinforcing plate 16 and a second adhesive layer 17.
  • the reinforcing plate 16 is adhered to the side of the flexible circuit board opposite to the first adhesive layer 12 through the second adhesive layer 17.
  • the orthographic projections of the reinforcing plate 16 and the second adhesive layer 17 on the first adhesive layer 12 are substantially the same and are outside the orthographic projection of the fingerprint recognition chip 11 on the first adhesive layer 12.
  • the reinforcing plate 16 and the fingerprint recognition chip 11 are arranged on the same side of the first adhesive layer 12, and the orthographic projections of the reinforcing plate 16 and the second adhesive layer 17 on the first adhesive layer 12 are basically the same to ensure that The reinforcing plate 16 is closely attached to the flexible circuit board to increase the reliability of the fingerprint identification module 10.
  • the orthographic projection of the reinforcing plate 16 on the first adhesive layer 12 is outside the orthographic projection of the fingerprint identification chip 11 on the first adhesive layer 12, that is, the reinforcing plate 16 is set to avoid the fingerprint identification chip 11 to avoid reinforcement
  • the board 16 contacts the fingerprint identification chip 11 to damage the fingerprint identification chip 11, and at the same time, it can ensure that the fingerprint identification chip 11 collects fingerprint images.
  • the reinforcing plate 16 may be made of a material with higher structural strength.
  • the reinforcing plate 16 is, for example, a steel plate, a plastic plate, and the like.
  • the high strength of the steel plate can increase the structural strength of the fingerprint identification module 10 and improve the reliability of the fingerprint identification module 10.
  • the plastic plate increases the structural strength of the fingerprint identification module 10, it can reduce the weight of the fingerprint identification module 10 and reduce the manufacturing cost of the fingerprint identification module 10.
  • the reinforcing plate 16 is arranged around the fingerprint identification chip 11 to ensure the structural strength of the fingerprint identification module 10 around the fingerprint identification chip 11 and improve the reliability of the fingerprint identification module 10.
  • the second adhesive layer 17 may be a double-sided adhesive tape, so as to facilitate the assembly of the fingerprint identification module 10.
  • the second adhesive layer 17 may also be formed by glue coating, which is not specifically limited herein.
  • the flexible circuit board is further provided with a peripheral circuit part 134 (for example, a capacitor, a resistor, etc.).
  • the flexible circuit board can mount the peripheral circuit part 134 to the flexible circuit board through Surface Mount Technology (SMT), and then attach the flexible circuit board with circuit elements to the first adhesive layer 12.
  • SMT Surface Mount Technology
  • the fingerprint recognition module 10 includes a protective layer 18 disposed on the side of the reinforcing plate 16 opposite to the second adhesive layer 17, and the sensing surface 112 includes a sensing area 1122,
  • the orthographic projection of the protective layer 18 on the first adhesive layer 12 is outside the orthographic projection of the sensing area 1122 on the first adhesive layer 12.
  • the sensing area 1122 is an effective area for the fingerprint identification chip 11 to collect fingerprint images
  • the protective layer 18 is arranged to avoid the sensing area 1122 of the fingerprint identification chip 11 to ensure that the fingerprint identification module 10 can collect fingerprint image information.
  • the protective layer 18 can also protect the fingerprint identification module 10 from damage caused by external impact.
  • the protective layer 18 may partially cover the area on the sensing surface 122 outside the sensing area 1122. In this way, the protective layer 18 may separate the fingerprint identification chip 11 and the display screen 20 to maintain the sensitivity of the fingerprint identification chip 11.
  • the measuring surface 112 and the lower surface 24 of the display screen 20 are arranged relatively spaced apart, which can protect the fingerprint identification chip 11 to a certain extent.
  • the protective layer 18 may be protective foam. In this way, the protective foam can play a buffering effect, thereby realizing the protection of the fingerprint identification module 10.
  • the protective foam and the lower surface 24 of the display screen 20 are relatively spaced apart.
  • the protective foam can be set in contact with the lower surface 24 of the display screen 20.
  • the display screen 20 and the fingerprint chip 11 clamp the protective foam
  • the display screen 20 and the reinforcing plate 16 clamp the protection foam. Foam.
  • the structure of the input and output assembly 100 is made more compact, which is beneficial to optimize the spatial configuration of the electronic device 1000.
  • the fingerprint identification module 10 for example, the fingerprint identification chip 11 and the reinforcing plate 16 of the fingerprint identification module 10) can be prevented from directly contacting the display screen 20 and cause the display screen 20 or fingerprint identification Chip 11 is damaged.
  • the protective foam contacts the lower surface 24 of the display screen 20 for installation, the protective foam does not adhere to the lower surface 24 of the display screen 20, so that the fingerprint recognition module 10 can be easily disassembled. Separate from the display 20.
  • the circuit board 13 may not be limited to a flexible circuit board, but a printed circuit board (Printed Circuit Board, PCB) or a flexible and hard board can be selected according to actual needs, that is, the circuit board 13 can include a printed circuit board or a rigid-flex board.
  • PCB printed Circuit Board
  • the printed circuit board can realize the electrical connection of the fingerprint identification chip 11, and at the same time, the printed circuit board has a certain strength, which can increase the structural strength of the fingerprint identification module 10.
  • the fingerprint recognition module 10 can omit the reinforcing plate 16, and the protective layer 18 can be directly arranged on the side of the printed circuit board opposite to the first adhesive layer 12, and the printed circuit board can be connected to the external circuit through the flexible circuit board. Connect to optimize the spatial configuration of the electronic device 1000.
  • the rigid-flex board combines the flexible circuit board and the printed circuit board, and the area corresponding to the first adhesive layer 12 can have a certain strength. Similarly, it can realize the electrical connection of the fingerprint identification chip 11, and at the same time, increase the fingerprint identification module.
  • the structural strength of the group 10 it can have a certain flexibility outside the area corresponding to the first adhesive layer 12 to optimize the spatial configuration of the electronic device 1000.
  • the fingerprint recognition module 10 can omit the reinforcing plate 16 and the protective layer 18 can be arranged on the side of the rigid-flex board opposite to the first adhesive layer 12.
  • the side of the middle frame 202 opposite to the display screen 20 can be used to install other electronic components of the electronic device 1000, such as a battery 300, a main board, an antenna, and a speaker.
  • a groove 2024 is opened on the side of the middle frame 202 opposite to the display screen 20, and the battery 300 is at least partially disposed in the groove 2024.
  • the housing 200 further includes a back cover (not shown) provided on the side of the middle frame 202 opposite to the display screen 20.
  • the back cover cooperates with the middle frame 202 to form a receiving space (not shown), and other electronic components of the electronic device 1000 can be arranged in the receiving space. In this way, the back cover can protect the electronic components in the electronic device 1000.

Abstract

本申请公开了一种输入输出组件(100)。输入输出组件(100)包括显示屏(20)和指纹识别模组(10)。显示屏(20)包括朝向用户的上表面(22)和与上表面(22)相背的下表面(24)，指纹识别模组(10)与下表面(24)相对间隔设置。本申请还公开了一种电子设备(1000)。

Description

输入输出组件和电子设备
优先权信息
本申请请求2019年04月25日向中国国家知识产权局提交的、申请号为201910340062.X的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及消费性电子技术领域，更具体而言，涉及一种输入输出组件和电子设备。
背景技术
相关技术中，为了提高手机的屏占比，屏下指纹方案已经成为一种趋势。为了固定指纹识别模组并降低厚度，现有的一种手机将指纹识别模组贴附在显示屏下表面，利用显示屏的透光特性采集指纹图像。然而，由于都是光学元件，显示屏与指纹识别模组之间过于贴近容易发生干涉，且将指纹识别模组直接粘附到显示屏的下表面，在组装过程中容易损伤显示屏，影响显示屏的稳定性。再有，如此设置也不利于指纹识别模组和显示屏后续的维修。
发明内容
本申请的实施方式提供了一种输入输出组件和电子设备。
本申请实施方式的输入输出组件包括显示屏和指纹识别模组，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面，所述指纹识别模组与所述下表面相对间隔设置。
本申请实施方式的电子设备包括壳体和输入输出组件，所述输入输出组件包括显示屏和指纹识别模组，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面，所述指纹识别模组与所述下表面相对间隔设置。
本申请实施方式的电子设备中，显示屏可以与指纹识别芯片间隔设置，可以减少显示屏与指纹识别模组之间的干涉，增加电子设备的稳定性，同时，便于显示屏和指纹识别模组分开，降低了指纹识别模组的拆卸难度，有利于后续指纹识别模组的维修。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明 显和容易理解，其中：
图1是本申请实施方式的电子设备的立体示意图。
图2是本申请实施方式的电子设备的分解示意图。
图3是本申请实施方式的电子设备的平面示意图。
图4是图3的电子设备沿IV-IV方向的剖面示意图。
图5是本申请实施方式的电子设备的另一分解示意图。
图6是本申请实施方式的输入输出组件的平面示意图。
图7是本申请实施方式的输入输出组件的剖面示意图。
图8是图7的输入输出组件在VIII部分的放大示意图。
图9是本申请实施方式的指纹识别模组的立体示意图。
图10是本申请实施方式的指纹识别模组的分解示意图。
图11是本申请实施方式的指纹识别模组的剖面示意图。
图12是图11的指纹识别模组在XII部分的放大示意图。
主要附图元件说明：
电子设备1000、输入输出组件100、指纹识别模组10、指纹识别芯片11、感测面112、感测区1122、贴合面114、第一粘合层12、电路板13、通孔132、外围电路部分134、引线14、保护胶15、补强板16、第二粘合层17、保护层18、保护膜19、显示屏20、上表面22、指纹感应区222、下表面24、盖板30、壳体200、中框202、承载面2020、沉槽2022、凹槽2024、电池300。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
请参阅图1至图5，本申请实施方式的电子设备1000包括输入输出组件100和壳体200。输入输出组件100设置在壳体200。在一个例子中，输入输出组件100至少部分地设置在壳体200内。
请参阅图6至图8，输入输出组件100包括指纹识别模组10和显示屏20。显示屏20包括朝向用户的上表面22和与上表面22相背的下表面24，其中，上表面22可以用于向用户显示图像信息。指纹识别模组10与显示屏20的下表面24相对间隔设置。
请参阅图9至图12，指纹识别模组10包括指纹识别芯片11和第一粘合层12。指纹识 别芯片11包括用于检测指纹的感测面112和与感测面112相背的贴合面114。第一粘合层12包括具有粘性的第一粘合面122和与第一粘合面122相背的第二粘合面124，第一粘合面122粘附在贴合面114上。
其中，壳体200包括中框202，第二粘合面124粘附在中框202上。指纹识别芯片11的感测面112与显示屏20的下表面24相对间隔设置。
本申请实施方式的指纹识别模组10、输入输出组件100和电子设备1000中，指纹识别模组10可以通过第一粘合层12进行粘附，装配方式简单。指纹识别模组10相对显示屏20的下表面24设置，可以实现屏下指纹识别，且显示屏20与指纹识别模组10相对间隔设置，有利于减少显示屏20与指纹识别模组10之间的干涉，增加输入输出组件100和电子设备1000的稳定性。同时，降低了指纹识别模组10的拆卸难度，可方便指纹识别模组10后续的维修。
其中，中框202可以支撑指纹识别模组10，实现指纹识别模组10与显示屏20相对间隔设置。
在某些实施方式中，输入输出组件100包括盖板30，盖板30设置在显示屏20的上表面22。
具体地，盖板30可以是透明盖板30。透明盖板30例如是透明玻璃、蓝宝石或PET防爆膜等。如此，透明的盖板30保证显示屏20的显示效果，同时可以保护显示屏20，增加电子设备1000的可靠性。
在某些实施方式中，显示屏20包括OLED(Organic Light-Emitting Diode，有机发光二极管)显示屏，指纹识别模组10可以是光学指纹识别模组、超声波指纹识别模组或其他适用于屏下指纹方案的指纹识别模组。光学指纹识别模组可以利用OLED显示屏的透光特性，在显示屏20下表面24的一侧采集位于显示屏20上表面22一侧的手指指纹图像，从而实现屏下指纹识别。超声波指纹识别模组可以利用超声波对于显示屏20和手指不同的穿透特性，同样地，可以在显示屏20下表面24的一侧采集位于显示屏20上表面22一侧的手指指纹信息，实现屏下指纹识别。
需要说明的是，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参阅图8，在某些实施方式中，指纹识别模组10与显示屏20的下表面24之间的距 离可小于2mm。
可以理解，指纹识别模组10设置在显示屏20下方时，指纹识别模组10与显示屏20的下表面24之间的距离过大，指纹识别模组10采集指纹图像的距离相应增加，不利于指纹识别模组10采集指纹图像，且会增加电子设备1000的尺寸。指纹识别模组10与显示屏20的下表面24之间的距离小于2mm可保证指纹识别模组10可以较好地采集手指指纹图像，同时，输入输出组件100可以保持较小的厚度，有利于电子设备1000的小型化设计。
优选地，指纹识别模组10与显示屏20的下表面24之间的距离可小于1mm。
请参阅图6，在某些实施方式中，显示屏20的上表面22包括指纹感应区222，指纹识别模组10对应指纹感应区222与显示屏20的下表面24间隔设置。如图6所示，指纹感应区222为显示屏20上表面22的一部分，手指位于指纹感应区222时，指纹识别模组10可以采集指纹图像，手指位于指纹感应区222之外的区域时，指纹识别模组10不采集指纹图像。需要说明的是，指纹感应区222不限于位于图示所示的位置，而可以根据需要设置在显示屏20上表面22的其他位置。
当然，在其他实施方式中，指纹感应区222可以是显示屏20的整个上表面22，如此，手指位于显示屏20上表面22的任一位置时，指纹识别模组10均可以采集指纹图像。此时，指纹识别模组10相对整个显示屏20的下表面24间隔设置。
在某些实施方式中，显示屏20的下表面24贴附在中框202上，中框202包括与显示屏20相对的承载面2020，承载面2020开设有沉槽2022，指纹识别模组10至少部分地设置在沉槽2022内。
如此，中框202同时支撑显示屏20和指纹识别模组10，通过沉槽2022可实现指纹识别模组10相对显示屏20下表面24间隔设置，保证指纹识别模组10采集指纹图像信息。沉槽2022还可以充分利用中框202的厚度，优化电子设备1000的空间配置。具体地，在一个例子中，第一粘合层12的第二粘合面124粘附在沉槽2022的底面。
在某些实施方式中，沉槽2022的尺寸和形状与指纹识别模组10的尺寸和形状相适应。
如此，沉槽2022可以与指纹识别模组10紧密配合，沉槽2022可以限定指纹识别模组10的位置，使得指纹识别模组10与中框202不容易发生相对移动。提高电子设备1000的可靠性。此外，指纹识别模组10安装到中框202时，沉槽2022可为指纹识别模组10的安装提供定位，方便电子设备1000的装配。
在某些实施方式中，显示屏20的下表面24贴附在承载面2020上。承载面2020可以用于支撑显示屏20。相应地，沉槽2022的深度不小于指纹识别模组10的厚度。
如此，指纹识别模组10可以完全收容于沉槽2022内并与显示屏20的下表面24相对间隔设置。
在一个例子中，第一粘合层12可以是双面胶，指纹识别模组10制造时，第一粘合层12的第一粘合面122可以粘附在指纹识别芯片11的贴合面114上，而在第一粘合层12的第二粘合面124设置保护膜19，以保持第二粘合面124的黏着性。然后，在指纹识别模组10安装到中框202时，可以撕下保护膜19，而将指纹识别模组10通过第二粘合面124贴附到沉槽2022内。如此，可方便指纹识别模组10的安装。
在某些实施方式中，指纹识别模组10包括电路板13。电路板13粘附在第一粘合面122上。电路板13与指纹识别芯片11电性连接。
如此，指纹识别芯片11通过电路板13与外部电路(图未示)实现电连接，从而提供驱动指纹识别芯片11工作的电源，以及实现指纹信息的传输。例如，指纹图像信息可以通过电路板13传输至外部电路进行处理。
可以理解，电路板13与指纹识别芯片11设置在第一粘合层12的同一侧，在图示的例子中，指纹识别芯片11与电路板13相互间隔设置在第一粘合面122上，也即电路板13避开指纹识别芯片11设置在第一粘合面122上。如此，可降低指纹识别模组10的厚度，有利于指纹识别模组10小型化设计。
进一步地，请参阅图10和图12，在某些实施方式中，电路板13围绕指纹识别芯片11间隔设置在第一粘合面122上。此时，电路板13开设有通孔132，指纹识别芯片11位于通孔132内并设置在第一粘合面122上。
在某些实施方式中，指纹识别模组10还包括连接指纹识别芯片11和电路板13的引线14。
如此，指纹识别芯片11可以通过引线14与电路板13实现电连接。具体地，引线14可以是金线，指纹识别模组10可以通过引线键合(wire bonding)工艺将指纹识别芯片11与电路板13做电路连接，实现指纹识别芯片11的封装。
进一步地，在某些实施方式中，指纹识别模组10包括位于指纹识别芯片11与电路板13之间且涂覆引线14的保护胶15。
如此，保护胶15连接指纹识别芯片11和电路板13，使得指纹识别芯片11与电路板13的相对位置稳定，增加指纹识别模组10结构的稳定性。保护胶15涂覆引线14可进一步保证引线14连接的稳定性。
在图10所示的实施方式中，指纹识别芯片11呈矩形，对于引线14连接在指纹识别芯片11一侧边的情况，保护胶15不限于覆盖引线14，而可围绕指纹识别芯片11填充在指纹识别芯片11与电路板13之间的间隙，保证指纹识别模组10的稳定性。
具体地，对于指纹识别芯片11位于通孔132的情况，保护胶14至少部分地位于通孔132内并围绕指纹识别芯片11以填充指纹识别芯片11与电路板13之间的间隙。
在其他实施方式中，指纹识别芯片11的形状不限于矩形，而可以根据实际情况选择圆形、方形、椭圆形或其他形状，在此不做具体限定。
在某些实施方式中，电路板13包括柔性电路板。指纹识别模组10包括补强板16和第二粘合层17。补强板16通过第二粘合层17粘附在柔性电路板与第一粘合层12相背的一侧。补强板16和第二粘合层17在第一粘合层12上的正投影基本相同且位于指纹识别芯片11在第一粘合层12上的正投影之外。
可以理解，补强板16与指纹识别芯片11设置在第一粘合层12的同一侧，补强板16和第二粘合层17在第一粘合层12上的正投影基本相同可以保证补强板16与柔性电路板紧密贴合，增加指纹识别模组10的可靠性。补强板16在第一粘合层12上的正投影位于指纹识别芯片11在第一粘合层12上的正投影之外，即补强板16避开指纹识别芯片11设置，避免补强板16与指纹识别芯片11接触而损坏指纹识别芯片11，同时可以保证指纹识别芯片11采集指纹图像。
其中，柔性电路板有利于优化电子设备1000的空间配置，补强板16可以由结构强度较高的材料制成，补强板16例如是钢板、塑料板等。钢板强度较高，可以增加指纹识别模组10的结构强度，提高指纹识别模组10的可靠性。塑料板增加指纹识别模组10结构强度的同时，可以减轻指纹识别模组10的重量，降低指纹识别模组10的制造成本。
在图示的实施方式中，补强板16围绕指纹识别芯片11设置，保证指纹识别芯片11周围的指纹识别模组10的结构强度，提高指纹识别模组10的可靠性。在一个例子中，第二粘合层17可以是双面胶，如此，可方便指纹识别模组10装配。当然，在其他实施方式中，第二粘合层17还可以由胶水涂覆形成，在此不做具体限定。
在某些实施方式中，柔性电路板还设置有外围电路部分134(例如电容、电阻等)。柔性电路板可以通过表面贴装技术(Surface Mount Technology，SMT)将外围电路部分134贴装到柔性电路板，然后再将带有电路元件的柔性电路板贴附到第一粘合层12上。
请参阅图12，在某些实施方式中，指纹识别模组10包括设置在补强板16与第二粘合层17相背一侧的保护层18，感测面112包括感测区1122，保护层18在第一粘合层12上的正投影位于感测区1122在第一粘合层12上的正投影之外。
需要说明的是，感测区1122为指纹识别芯片11采集指纹图像的有效区域，保护层18避开指纹识别芯片11的感测区1122设置，保证指纹识别模组10可以采集指纹图像信息。保护层18还可以保护指纹识别模组10，防止外力撞击造成指纹识别模组10损坏。
在一个例子中，保护层18可部分地覆盖感测面122上位于感测区1122之外区域，如此，保护层18可以隔开指纹识别芯片11和显示屏20以保持指纹识别芯片11的感测面112与显示屏20的下表面24相对间隔设置，能够在一定程度上保护指纹识别芯片11。
在某些实施方式中中，保护层18可以是保护泡棉。如此，保护泡棉可以起到缓冲作用，从而实现对指纹识别模组10的保护。
在图8所示的实施方式中，保护泡棉与显示屏20的下表面24相对间隔设置。在替换的实施方式中，保护泡棉可以接触显示屏20的下表面24进行设置，此时，显示屏20和指纹芯片11夹挤保护泡棉，以及显示屏20与补强板16夹挤保护泡棉。如此，使得输入输出组件100的结构更加紧密，有利于优化电子装置1000的空间配置。同时，在保护泡棉的缓冲作用下，可以避免指纹识别模组10(例如指纹识别模组10的指纹识别芯片11和补强板16)与显示屏20直接接触而造成显示屏20或指纹识别芯片11损坏。
具体地，保护泡棉接触显示屏20的下表面24进行设置时，保护泡棉不与显示屏20的下表面24进行粘合，以使指纹识别模组10拆卸时可以方便指纹识别模组10与显示屏20进行分离。
需要说明的是，在其他实施方式中，电路板13可以不限于柔性电路板，而可以根据实际需要选择印刷电路板(Printed Circuit Board，PCB)或软硬结合板，也即是说，电路板13可以包括印刷电路板或软硬结合板。
具体地，印刷电路板可以实现指纹识别芯片11的电性连接，同时，印刷电路板具有一定的强度，可以增加指纹识别模组10的结构强度。此时，指纹识别模组10可以省略补强板16，保护层18可以直接设置在印刷电路板与第一粘合层12相背的一侧，而印刷电路板可以通过柔性电路板与外部电路连接以优化电子设备1000的空间配置。
软硬结合板结合了柔性电路板和印刷电路板，与第一粘合层12对应的区域可以具有一定的强度，同样地，可以实现指纹识别芯片11的电性连接，同时，增加指纹识别模组10的结构强度；在第一粘合层12对应的区域之外可以具有一定的挠性以优化电子设备1000的空间配置。相应地，指纹识别模组10可以省略补强板16，保护层18可以设置在软硬结合板与第一粘合层12相背的一侧。
在某些实施方式中，中框202与显示屏20相背的一侧可以用于安装电子设备1000的其他电子元件，例如，电池300、主板、天线和扬声器等。在图示的例子中，中框202与显示屏20相背的一侧开设有凹槽2024，电池300至少部分地设置在凹槽2024内。
进一步地，壳体200还包括设置在中框202与显示屏20相背一侧的后盖(图未示)。后盖与中框202配合形成收容空间(图未示)，电子设备1000的其他电子元件可以设置在收容空间内。如此，后盖可以保护电子设备1000内的电子元件。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。 在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种输入输出模组，其特征在于，包括：
    显示屏，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面；和
    指纹识别模组，所述指纹识别模组与所述下表面相对间隔设置。
  2. 根据权利要求1所述的输入输出模组，其特征在于，所述指纹识别模组包括：
    指纹识别芯片，所述指纹识别芯片包括用于感测指纹的感测面和与所述感测面相背的贴合面，所述感测面与所述下表面相对间隔设置；和
    第一粘合层，所述第一粘合层包括具有粘性的第一粘合面和与所述第一粘合面相背的第二粘合面，所述第一粘合面粘附在所述贴合面上。
  3. 根据权利要求1所述的输入输出模组，其特征在于，所述指纹识别模组包括电路板，所述电路板粘附在所述第一粘合面上，所述指纹识别芯片与所述电路板电性连接。
  4. 根据权利要求3所述的输入输出模组，其特征在于，所述指纹识别模组还包括：
    连接所述指纹识别芯片和所述电路板的引线；和
    位于所述指纹识别芯片与所述电路板之间且涂覆所述引线的保护胶。
  5. 根据权利要求3所述的输入输出模组，其特征在于，所述电路板包括柔性电路板，所述指纹识别模组包括：
    补强板；和
    第二粘合层，所述补强板通过所述第二粘合层粘附在所述柔性电路板与所述第一粘合层相背的一侧，所述补强板和所述第二粘合层在所述第一粘合层上的正投影相同且位于所述指纹识别芯片在所述第一粘合层上的正投影之外。
  6. 根据权利要求5所述的输入输出模组，其特征在于，所述指纹识别模组包括设置在所述补强板与所述第二粘合层相背一侧的保护层，所述感测面包括感应区，所述保护层在所述第一粘合层上的正投影位于所述感应区在所述第一粘合层上的正投影之外。
  7. 根据权利要求3所述的输入输出模组，其特征在于，所述电路板包括印刷电路板或软硬结合板。
  8. 根据权利要求1所述的输入输出模组，其特征在于，所述指纹识别模组与所述下表面之间的距离小于1mm。
  9. 根据权利要求1所述的输入输出模组，其特征在于，所述指纹识别模组包括光学指纹识别模组或超声波指纹识别模组。
  10. 一种电子设备，其特征在于包括：壳体和输入输出组件，所述输入输出组件包括：
    显示屏，所述显示屏包括朝向用户的上表面和与所述上表面相背的下表面；和
    指纹识别模组，所述指纹识别模组与所述下表面相对间隔设置。
  11. 根据权利要求10所述的电子设备，其特征在于，所述壳体包括中框，所述指纹识别模组包括：
    指纹识别芯片，所述指纹识别芯片包括用于感测指纹的感测面和与所述感测面相背的贴合面，所述感测面与所述下表面相对间隔设置；和
    第一粘合层，所述第一粘合层包括具有粘性的第一粘合面和与所述第一粘合面相背的第二粘合面，所述第一粘合面粘附在所述贴合面上，所述第二粘合面粘附在所述中框上。
  12. 根据权利要求10所述的电子设备，其特征在于，所述指纹识别模组包括电路板，所述电路板粘附在所述第一粘合面上，所述指纹识别芯片与所述电路板电性连接。
  13. 根据权利要求12所述的电子设备，其特征在于，所述指纹识别模组还包括：
    连接所述指纹识别芯片和所述电路板的引线；和
    位于所述指纹识别芯片与所述电路板之间且涂覆所述引线的保护胶。
  14. 根据权利要求12所述的电子设备，其特征在于，所述电路板包括柔性电路板，所述指纹识别模组包括：
    补强板；和
    第二粘合层，所述补强板通过所述第二粘合层粘附在所述柔性电路板与所述第一粘合层相背的一侧，所述补强板和所述第二粘合层在所述第一粘合层上的正投影相同且位于所述指纹识别芯片在所述第一粘合层上的正投影之外。
  15. 根据权利要求14所述的电子设备，其特征在于，所述指纹识别模组包括设置在所 述补强板与所述第二粘合层相背一侧的保护层，所述感测面包括感应区，所述保护层在所述第一粘合层上的正投影位于所述感应区在所述第一粘合层上的正投影之外。
  16. 根据权利要求12所述的电子设备，其特征在于，所述电路板包括印刷电路板或软硬结合板。
  17. 根据权利要求10所述的电子设备，其特征在于，所述指纹识别模组与所述下表面之间的距离小于1mm。
  18. 根据权利要求11所述的电子设备，其特征在于，所述中框包括与所述显示屏相对的承载面，所述承载面形成有沉槽；
    所述指纹识别模组至少部分收容于所述沉槽内，所述第二粘合面粘附在所述沉槽的底面。
  19. 根据权利要求18所述的电子设备，其特征在于，所述沉槽的形状和尺寸与所述指纹识别模组的形状和尺寸相适应。
  20. 根据权利要求18所述的电子设备，其特征在于，所述沉槽的深度不小于所述指纹识别模组的厚度。
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