Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67098—Apparatus for thermal treatment
  • H01L21/67109—Apparatus for thermal treatment mainly by convection
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
  • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
  • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
  • H05B3/145—Carbon only, e.g. carbon black, graphite
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
  • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
  • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
  • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
  • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
  • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
  • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
  • H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
  • H05B2203/037—Heaters with zones of different power density

Definitions

• Embodiments of the present invention generally relate to substrate processing equipment, and more specifically to a substrate support.
• a substrate support may include a heater to provide a desired temperature of a substrate disposed on the substrate support during processing.
• the inventors have provided an improved substrate support having a heater to facilitate control of the temperature of a substrate.
• a substrate support may include a first member to distribute heat to a substrate when present above a first surface of the first member; a heater coupled to the first member and having one or more heating zones to provide heat to the first member; a second member disposed beneath the first member; a tubular body disposed between the first and second members, wherein the tubular body forms a gap between the first and second members; and a plurality of substrate support pins disposed a first distance above the first surface of the first member, the plurality of substrate support pins to support a backside surface of a substrate when present on the substrate support.
• a substrate support may include a first member to distribute heat to a substrate when present above a first surface of the first member; a plurality of substrate support pins extending from the first surface of the first member to support a backside surface of a substrate when present on the substrate support; one or more resistive heating elements disposed in the first member; a second member disposed below the first member; and a tubular body disposed between the first and second members and forming a gap between a lower surface of the first member and an upper surface of the second member.
• a substrate support may include a first member to distribute heat to a substrate when present above an upper surface of the first member; a plurality of substrate support pins extend from a surface of the first member to support a backside surface of a substrate when present on the substrate support; one or more heating zones each having one or more resistive heating elements, wherein the one or more heating zones are disposed on a lower surface of the first member; a second member disposed below the first member; and a tubular body disposed between the first and second members and forming a gap between the lower surface of the first member and an upper surface of the second member.
• Figure 1 depicts a schematic side view of a substrate support in accordance with some embodiments of the present invention.
• Figures 2A-C depict cross-sectional side views of portions of substrate supports in accordance with some embodiments of the present invention.
• Figures 3A-C depict cross-sectional side views of portions of substrate supports in accordance with some embodiments of the present invention.
• Figure 4 depicts a top view of a multi-zone heater in accordance with some embodiments of the present invention.
• Figure 5 depicts a schematic side view of a substrate support in accordance with some embodiments of the present invention.
• Embodiments of substrate supports having a heater are disclosed herein.
• the inventive substrate support may advantageously facilitate one or more of heating a substrate, maintaining the temperature of a substrate, or distributing heat to a substrate in a desired profile.
• FIG. 1 depicts a substrate support 100 in accordance with some embodiments of the present invention.
• the substrate support 100 may include a first member 1 02 to distribute heat to a substrate 103 when present above a first surface 104 (e.g., an upper surface) of the first member 102 and a heater 106 having one or more heating zones 108 to provide heat to the first member 102.
• the heater 1 06 may further include a second heating zone 301 (as illustrated in Figures 3A-B) which underlies and spans the one or more heating zones 108.
• the second heating zone 301 may be utilized to achieve a base temperature across the first member 102 and the one or more heating zones 108 may be utilized for fine adjustment of the temperature in each location of the first member 102, for example, to achieve a uniform distribution of temperature on the substrate 103 or to achieve a desired non-uniform distribution of temperature on the substrate 103.
• the heater 106 can be disposed below the first member 102. However, this is merely one exemplary embodiment of the heater 106. The heater 106 may be disposed in the first member 102, on a surface of the first member 102, or below the first member 102. Embodiments of the heater 106 are discussed with respect to Figures 3A-B, below.
• the substrate support may provide temperatures ranging from about 450 degrees Celsius to about 600 degrees Celsius.
• embodiments of the substrate support disclosed herein are not limited to the above- mentioned temperature range.
• the temperature may be lower, such as from about 150 degrees Celsius to about 450 degrees Celsius, or higher, such as greater than about 600 degrees Celsius.
• the substrate support 100 may include a second member 107 disposed beneath the first member 102.
• the second member 107 may function as a facilities management plate, such as for wire and/or piping management to the one or more heating zones 108 or the like.
• the second member 107 may serve as a thermal insulator, preventing convective losses to environment below.
• the second member 107 may comprise a thermally resistive material, such as MACOR® or any suitable thermally resistive material, such as a ceramic material or the like.
• the second member 107 may include an opening 109, for example, centrally disposed through the second member 107.
• the opening 109 may be utilized to couple a feedthrough assembly 1 1 1 to the members 102, 107 of the substrate support 100.
• the feedthrough assembly 1 1 1 may feed various sources and/or control devices, such as a power source 126 to the one or more heating zones 108, or a controller 122 as discussed below.
• the feedthrough assembly 1 1 1 1 may include a conduit 140 which can at least one of provide a gas from a gas source 141 to the backside of the substrate 103 or provide a vacuum from a vacuum pump 143 to secure the substrate 103 to the substrate support 100.
• the vacuum or gas may be alternately provided by a multi-way valve 147 coupling the vacuum pump 143 and gas source 141 to the conduit 140.
• the gas provided by the conduit 140 may be utilized to improve heat transfer between the first member 102 and the substrate 103.
• the gas is helium (He).
• the vacuum pump 143 may be used to secure the substrate 103 to the substrate support 103.
• the gas source 141 may provide a gas to the space between the substrate 103 and the first member 102 to improve heat transfer.
• the conduit 140 may include a flexible section 142, such as a bellows or the like.
• the conduit 140 may be helpful, for example, when the substrate support 100 is leveled, and/or during thermal deformation or expansion of the substrate support 100 during heating.
• the substrate support 100 may be leveled by one or more leveling devices (not shown) disposed about the feedthrough assembly 1 1 1 and through one or more members of the substrate support 100.
• leveling devices may include kinematic jacks or the like.
• the feedthrough assembly 1 1 1 may include a second conduit 160 having a flexible section 162 to exhaust the gas provided by the gas source 141 through the conduit 140 as illustrated in Figure 1 .
• a tubular body 152 may be disposed between the first and second members 1 02, 1 07.
• the tubular body 152 may be utilized to provide a gap 1 54 between the first and second members 102, 107 and/or to provide an additional space for electrical wires, fluid or gas conduits, or the like to be provided to components of the substrate support 100 disposed above.
• the gap 154 may be formed between a lower surface (e.g., a lower surface 302 as illustrated in Figure 3A-B) of the first member 102 and an upper surface 105 of the second member 105.
• the gap 154 may be filled with a gas, such as air, helium (He) or the like.
• the gas may be used as a thermally resistive gas or a heat transfer gas.
• the composition of the gas may be selected based on the desired temperature profiles required for processes being performed a processing system using the support 100.
• the gap 154 may be used to conduct heat from the one or more heating zones 108 coupled to the first layer 1 02 to the second member 107 by providing a gas that is a good thermal conductor.
• An exemplary gas for heat conduction may be helium (He).
• the gap 154 may be used to insulate the support 100 from heat loss, for example, by creating a vacuum in the gap 154.
• the gap 154 may be coupled to a vacuum pump, such as the vacuum pump 141 (coupling not illustrated in Figure 1 ) or another vacuum pump (not shown).
• the tubular body 152 may comprise stainless steel or the like. Further, the tubular body 152 may be fitted to the first and second members 1 02, 107 in any suitable manner, for example, such as disposed in recesses (not shown) about the peripheral edges of tubular body- facing surfaces of the first and second members 102, 1 07 or the like. Alternatively, the tubular member 152 may be a lip or protrusion extending from the first member 102 or the second member 1 07.
• the feedthrough assembly 1 1 1 may include a volume 1 15.
• the volume 1 1 5 may be isolated from the gap 154 and have an atmosphere that may be independently controlled.
• the volume 1 15 may be may be coupled to one or more of a gas source, such as the gas source 141 (coupling not illustrated in Figure 1 ) or another gas source (not shown), or a vacuum pump, such as vacuum pump 143 (coupling not illustrated in Figure 1 ) or another vacuum pump (not shown) to provide a gas and/or vacuum in the volume 1 15.
• a gas source such as the gas source 141 (coupling not illustrated in Figure 1 ) or another gas source (not shown)
• a vacuum pump such as vacuum pump 143 (coupling not illustrated in Figure 1 ) or another vacuum pump (not shown) to provide a gas and/or vacuum in the volume 1 15.
• the feedthrough assembly 1 1 1 may include additional conduits for providing vacuum and/or gas to regions in the substrate support 100.
• the feedthrough assembly may include a conduit 164 to provide one or more of a vacuum, or a gas to the gap 154.
• the conduit 164 may include a flexible section (not shown) similar to other conduits mentioned above for similar reasoning.
• the conduit 1 64 may be used to couple the gap 154 to one or more of a vacuum pump, such as the vacuum pump 143 (coupling not illustrated in Figure 1 ) or another vacuum pump (not shown), or a gas source, such as the gas source 141 (coupling not illustrated in Figure 1 and/or another gas source, for example, such as a purge gas source 121 .
• the purge gas source 121 may be used to provide a purge gas to limit the deposition of materials on the backside of the substrate 1 03 during processing.
• the purge gas may provide to the backside of the substrate 103 via one or more purge gas channels 1 19 disposed in the first member 102.
• the one or more purge gas channels 1 19 may fluidly couple the purge gas provided by the conduit 164 to the gap 154 to a gap 1 17 disposed proximate the edge of the substrate 103.
• the gap 1 1 7 may be formed between an alignment guide 1 18 and the peripheral edge of the substrate 103 on the first surface 104 of the first member 102.
• the purge gas may include one or more of helium (He), nitrogen (N 2 ), or any suitable inert gas.
• the purge gas may be exhausted via the gap 1 17 and may limit or prevent process gases from reaching and r pp ntjng with a backside of the substrate 103 during processing.
• the purge gas may be exhausted from the process chamber via the exhaust system of the process chamber (not shown) to appropriately handle the exhausted purge gas.
• the one or more purge gas channels may be disposed through and about the alignment guide 1 1 8 to provide a purge gas to the gap 1 1 7.
• the members of the substrate support 1 00 may be coupled together by any number of suitable mechanisms.
• suitable mechanisms may include gravity, adhesives, bonding, brazing, molding, mechanical compression (such as by screws, springs, one or more clamps, vacuum, or the like), or the like.
• a non-limiting exemplary form of mechanical compression is illustrated in Figure 1 .
• a compression assembly 145 may include a rod 144 disposed through one or several members of the substrate support 1 00 and used to compress first member 1 02 (and any members between the first and second members 1 02, 1 07) with the second member 1 07.
• the rod 144 is illustrated as a single piece, but may be multiple pieces (not shown) connected together by a hinge, ball and socket structure or the like to facilitate relative movement between the multiple pieces, if necessary.
• the rod 144 may provide flexibility for leveling the substrate support 1 00, similar to as discussed above for the conduit 140.
• the rod 144 may be coupled to the first member 1 02 for example through brazing, welding, or the like, or the rod 144 may be threaded and screwed into a corresponding threaded opening in the first member 1 02 that is configured to receive the rod 144 (not shown).
• An opposing end of the rod 144 may be coupled to the second member 1 07 via a spring 146 or other suitable resilient structure.
• a first end of the spring 146 may be coupled to the rod 1 44 and an opposing second end of the spring 146 may be coupled to the second member 1 07.
• a bolt 1 50 disposed in the second member 1 07 is coupled to the second end of the spring 146.
• a cover 148 may be provided over the bolt 1 50.
• the spring 146 is shown providing a compressive force to pull the rod 144 towards the second member 1 07, the rod 144 and spring 146 could also be configured to provide the desired coupling force by expansion of the spring 146.
• a plurality of compression assemblies 1 50 may be provided, fnr PYPinpie, disposed about a central axis of the support 1 00.
• three compression assemblies 145 may be disposed symmetrically about the central axis of the support 100.
• the members of the substrate support 100 may be coupled together by sintering the members together.
• sintering the members together may improve heat transfer between members.
• an embodiment of the substrate support 100 having members sintered together is illustrated in Figure 5.
• the compression assembly(s) 145 may be absent and the first member 102, the heater 106, the tubular body 152 and the second member 107 may be sintered together.
• each member may be formed individually and then sintered to together.
• the tubular body 152 and the second member 107 may be formed separated and then sintered together after formation.
• each member may be formed from aluminum nitride (AIN) or any suitable ceramic material.
• the heater 106 may be any suitable embodiment of a heater as illustrated in Figures 3A-C and discussed below.
• the first member 102 may be illustrated in Figure 5 to have aspects consistent with embodiments of the first member 102 as illustrated in Figure 2A and discussed below, the first member 102 may be any suitable embodiment of a first member as illustrated in Figures 2A-C and discussed below.
• the substrate support 100 may include a plurality of substrate support pins 1 12 disposed a first distance above the first surface 104 of the first member 102, the plurality of substrate support pins 1 12 can support a backside surface of the substrate 103 when present on the substrate support.
• the plurality of substrate support pins 1 12 may be surrounded by a support ring 123.
• the support ring 123 may contact the backside of the substrate 103 proximate the peripheral edge of the substrate 103.
• the support ring 123 may be used, for example, to define a space or volume between the backside of the substrate 103 and the substrate support 100.
• the space may be used to form a vacuum for securing the substrate 103 to support 100 and/or to provide a gas for heat transfer between the support 100 and the substrate 102 as discussed a nvp [0028]
• each of the plurality of substrate support pins and support ring 123 may extend from the first surface 104 of the first member 102 (e.g., the substrate support pins 1 12 and support ring 123 may be a part of, and formed in the first member 102).
• a support layer 1 16 may be disposed on the first surface 104 of the first member 102 and each of the plurality of substrate support pins 1 12 and the support ring 123 may extend from a surface 1 14 of the support layer 1 16.
• the support layer 1 16 and each of the plurality of substrate support pins 1 12 and the support ring 123 may be formed from the same material.
• the support layer 1 16 and the each of the substrate support pins 1 12 and the support ring 123 may be a one- piece structure (illustrated in Figure 2A and discussed below).
• the support layer and each of the plurality of substrate support pins 1 12 and the support ring 123 can be formed of suitable process-compatible materials having wear resistant properties.
• the support layer 1 16 and/or the substrate support pins 1 12 and/or the support ring 123 may be fabricated from a dielectric material.
• the materials used to form the support layer 1 16 and/or the substrate support pins 1 12 and/or the support ring 123 may include one or more of a polyimide (such as KAPTON®), aluminum oxide (AI 2 O 3 ), aluminum nitride (AIN), silicon dioxide (Si0 2 ), silicon nitride (Si 3 N 4 ), silicon carbon (SiC) or the like.
• a polyimide such as KAPTON®
• AL 2 O 3 aluminum oxide
• AIN aluminum nitride
• silicon dioxide Si0 2
• silicon nitride Si 3 N 4
• SiC silicon carbon
• the support layer 1 16 and/or the substrate support pins 1 12 and/or the support ring 123 may comprise KAPTON®.
• the substrate support 100 may include the alignment guide 1 18 extending from the first surface 104 of the first member 102 and about the plurality of substrate support pins 1 12.
• the alignment guide 1 18 may serve to guide, center, and/or align the substrate 103, such as with respect to the one or more heating zones 108 disposed below the substrate 103, for example, when the substrate is lowered onto the substrate support pins 1 12 by a plurality of lift pins (not shown - lift pins holes 1 13 are illustrated in Figure 1 and may extend through support layer 1 1 6 and first and second member 1 02, 1 07).
• the lift pin holes 1 1 3 may be isolated from the gap 1 54, for example, by any suitable structure, such as tubes 125, which isolate the lift pin holes 1 1 3 from the gap 1 54.
• the tubes 125 may prevent a gas provided to the gap 1 54 from reaching the backside of the substrate 1 03 via the lift pin holes 1 1 3.
• the alignment guide 1 1 8 may be formed of suitable process compatible materials, such as materials having wear resistant properties and/or a low coefficient of thermal expansion.
• the alignment guide 1 1 8 may be a single piece or an assembly of multiple components.
• the alignment guide 1 1 8 may be fabricated from a dielectric material.
• suitable materials used to form the alignment guide 1 1 8 may include one or more of CELAZOLE® PBI (polybenzlmidazole), aluminum oxide (AI 2 O 3 ), or the like.
• materials for any of the various components of the substrate support 1 00 may be selected based on chemical and thermal compatibility of the materials with each other and/or with a given process application.
• the first member 1 02 may be utilized to distribute heat to the substrate 1 03.
• the first member may act as a heat spreader to diffuse the heat provided by the one or more heating zones 1 08.
• the first member 1 02 may include one or more temperature monitoring devices 120 embedded in the first member 1 02 or extending through the first member 1 02 to monitor the temperature being provided to the substrate 1 03 at one or more positions along the first surface 1 04 of the first member 1 02.
• the temperature monitoring devices 120 may include any suitable device for monitoring temperature, such as one or more of a temperature sensor, resistance temperature device ( TD), optical sensor, or the like.
• the one or more temperature monitoring devices 120 may be coupled to a controller 122 to receive temperature information from each of the plurality of the temperature monitoring devices 120.
• the controller 122 may further be used to control the heating zones 1 08 in response to the temperature information, as discussed further below.
• the first member 1 02 may be formed of suitable process-compatible materials, such as materials having one or more of high thermal conductivity, high rigidity, and a low coefficient of thermal expansion. In snmp p mbodiment, the first member 1 02 may have a thermal conductivity of at least about 140 W/mK. In some embodiment, the first member 102 may have a coefficient of thermal expansion of about 9 x10 "6 /°C or less.
• suitable materials used to form the first member 102 may include one or more of aluminum (Al), copper (Cu) or alloys thereof, aluminum nitride (AIN), beryllium oxide (BeO), pyrolytic boron nitride (PBN), silicon nitride (Si 3 N 4 ), aluminum oxide (AI 2 O 3 ), silicon carbide (SiC), graphite coated with PBN, AIN coated with yttria (Y 2 O 3 ), or the like.
• suitable coating that may be utilized with the first member 102 include diamond like coatings (DLCs) or the like.
• the first member 102 may be formed of a material having a specific thermal conductivity or the like; however, such a material may contaminate the substrate 103 if the backside of the substrate 103 is exposed to the first surface 104 of the first member 102. Accordingly, the support layer 1 16 may be utilized under such conditions and be formed of a different material than the first member 102, where the different material will not contaminate the substrate 103.
• the alignment guide 1 18 may be formed of a different material than the first member 102 for a similar reason.
• Figure 2A depicts an embodiment of the substrate support 102 which includes the alignment guide 1 18, the support layer 1 16 and the plurality of support pins extending from the support layer 1 16, and the first member 102, wherein the alignment guide 1 18 and the support layer 1 16 and support pins 1 12 are formed from different materials than the first member 102.
• the first member 102, the plurality of substrate support pins 1 12, and the alignment guide 1 18 may be formed of the same material as illustrated in Figure 2B.
• the material of the first member is compatible with the process being performed on the substrate 103 and/or the composition of the substrate 103
• embodiments of the substrate support 100 as shown in Figure 2B may be used.
• the support layer 1 16 is int p nrai ith the first member 102 in Figure 2B, a separate support layer 1 16 is not shown in Figure 2B.
• the support layer 1 16 may be considered to be an upper portion of the first member 102.
• the first member 102 may vary in thickness as illustrated in Figure 2C.
• the thickness variation along the first member 102 may facilitate a desired heating profile along the substrate 103 and/or compensate for non-uniformities in a process being performed on the frontside surface of the substrate 103, such as deposition, curing, baking, annealing, etching, and others.
• the first member 102 may increase in thickness from the center to an edge of the first member 102.
• the embodiments of Figure 2C are merely illustrative, and the thickness of the first member 102 may be varied in any suitable manner to provide a desired heating profile along the substrate 103.
• the plurality of support pins 1 12 may have varying lengths to compensate for the thickness variation in the first member 102.
• each support pin 1 12 has a length such that it contacts a backside surface of the substrate 103 at about the same vertical height.
• the plurality of support pins 1 12 may be individually fashioned and coupled to the first member 102 as illustrated in Figure 2C.
• the plurality of support pins 1 12 may be integral with the first member 102, for example, similar to the embodiments of the support pins 1 12 shown in Figure 2B.
• the heater 106 may include one or more resistive heating elements 124.
• each of the one or more heating zones 108 includes one or more resistive heating elements 124.
• the one or more heating zones 108 may be distributed in any suitable configuration that is desired to provide a desired temperature profile on the substrate 103.
• Each of the resistive heating elements 124 may be coupled to a power source 126.
• the power source 126 may provide any suitable type of power, such as direct current (DC) or alternating current (AC), which is compatible with the resistive heating elements 124.
• the power source 126 may be coupled to and controlled by the controller 122 or by another controller (not shnwn ⁇ such as a system controller for controlling a process chamber having the substrate support disposed therein, or the like.
• the power source 126 may further include a power divider (not shown) that divides the power provided to the resistive heating elements 124 in each heating zone 108.
• the power divider may act in response to one or more of the temperature monitoring devices 120 to selectively distribute power to the resistive heating elements 124 in specific heating zones 108.
• multiple power sources may be provided for the resistive heating elements in each respective heater zone.
• the heating zones 108 may be disposed about a central axis 402 of the substrate support 100.
• the one or more heating zones 108 may include a first heating zone 404 having a first radius 406 extending from the central axis 402 along the upper surface of the second member 106 (e.g. , a central zone), a second heating zone 408 circumscribing the first heating zone 404 (e.g., a middle zone), and a third, fourth, fifth, and sixth heating zones 410 disposed about the second heating zone 408 (e.g.
• each of the four heating zones 410 may correspond to about one quarter of the outer region of the substrate support 100.
• a temperature monitoring device (such as the temperature monitoring device 120 discussed above) may be provided to sense data corresponding to the temperature within each zone (or at a desired location within each zone).
• each temperature monitoring device is an RTD.
• Each of the temperature monitoring devices may be coupled to the controller (such as controller 122 discussed above) to provide feedback control over each corresponding heating zone 108.
• the compact design of the substrate support 100 and the tunability of heating to adjust for temperature non-uniformities on the substrate 103 can facilitate one or more of heating a substrate, maintaining the temperature of a substrate, uniformly distributing heat to or removing heat from a substrate, or create temperature non-uniformities on a substrate.
• the heater 106 may coupled to the first member 102 in any suitable manner, such as disposed in the first member 102, disposed on a surface of the first member 102, or disposed in a separate member which is coupled to the first member 102. For example, several non-limiting variations of the heater 106 are illustrated in the embodiments shown in Figures 3A-C.
• Figures 3A-C depict a partial cross sectional view of the support 100 in accordance with some embodiments of the invention.
• elements such as the compression assembly 150, the temperature monitoring device 120, support pins 1 12, support layer 1 16 or other elements of the support illustrated in Figures 1 and 2A-B have been omitted, but may be used in accordance with any of the embodiments of the heater 106 illustrated in Figures 3A-C and described below.
• the heater 106 may be disposed in the first member 102.
• the one or more resistive elements 124 may be disposed in the first member 102 in any suitable manner, such as arranged in heating zones 108, to provide a desired temperature profile to the substrate 103.
• the one or more resistive elements 124 may be disposed at any suitable distance from a lower surface 302 of the first member 102 to provide the desired temperature profile.
• the heating zones 108 are illustrated as being disposed at the same distance from the lower surface 302 in Figure 3A, the distance from the lower surface 302 may vary for one or more of the heating zones 108.
• the heater 106 may include a second heat zone 301 which may be utilized to achieve a base temperature across the first member 102.
• the second heat zone 301 may include one or more resistive elements 303, which may be uniformly dispersed throughout the second heat zone 301 .
• the element 303 may be one or more resistive elements 303.
• the heater 106 may include the one or more resistive heating elements 124 deposited onto the lower surface 302 of the first member 102.
• deposition may include any suitable deposition technique for forming a desired pattern of heating zones 108.
• the one or more resistive heating elements 124 may comprise platinum, nichrome, INHDNFL®, resistive ceramics or other suitable resistive heating materials.
• a coating 304 may be used to cover the one or more heating elements disposed on the lower surface 302.
• the coating 304 may cover the entire lower surface 302 as illustrated in Figure 3B, or be limited to covering the one or more heating elements 124.
• the coating 304 may comprise an insulating material, such as a glass, ceramic, or the like.
• the one or more resistive elements 303 may also be deposited below the one or more resistive heating elements 124.
• the one or more resistive elements 124 and the one or more resistive elements 303 may be separated by an insulating layer (not shown) such as a dielectric layer or the like, which can be deposited prior to depositing the one or more resistive elements 303.
• the coating 304 may be deposited to cover the one or more resistive elements 124, and then the one or more resistive elements 303 may be deposited atop the coating 304.
• a second coating (not shown) may be deposited to cover the one or more resistive elements 303.
• the support 100 may include a third member 306 disposed beneath the first member 102 and above the tubular body 152.
• the heater 106 may include the one or more resistive heating elements 124 disposed in the third member 306.
• deposition may include any suitable deposition technique for forming a desired pattern of heating zones 108.
• the one or more resistive elements 124 - and optionally, the one or more resistive elements 303 - may be disposed in the third member 306 in any suitable manner, such as arranged in heating zones 108, to provide a desired temperature profile to the substrate 103.
• the third member 306 may comprise two members (not shown), for example, a first member including the one or more resistive heating elements 124 and a second member including the one or more resistive heating elements 303.
• the one or more resistive elements 124 may be disposed at any suitable distance from a lower surface 302 of the first member 102 to provide the desired temperature profile.
• the heating zones 108 are illustrated as being disposed at the same distance from the lower surface 302 in Figure 3C, the distance from the lower surface 302 may vary for one or more of the heating zones 108.
• the third member 306 may be formed of suitable process- compatible materials, such as materials having one or more of high mechanical strength (e.g., Bending strength at least about 200 MPa), high electrical resistivity (e.g., at least about 10 14 ohm-cm), a low coefficient of thermal expansion (e.g., no more than about 5 x 10 "6 °C).
• high mechanical strength e.g., Bending strength at least about 200 MPa
• high electrical resistivity e.g., at least about 10 14 ohm-cm
• a low coefficient of thermal expansion e.g., no more than about 5 x 10 "6 °C.
• Suitable materials may include one or more of silicon carbon (SiC), silicon nitride (Si 3 N 4 ), aluminum nitride (AIN), aluminum oxide (AI 2 O 3 ), beryllium oxide (BeO), pyrolytic boron nitride (PBN), graphite coated with PBN, AIN coated with yttria (Y 2 O 3 ), or the like.
• Other suitable coating that may be utilized with the third member 306 may include diamond like coatings (DLCs) or the like
• inventive substrate support may advantageously facilitate one or more of heating a substrate, maintaining the temperature of a substrate, or uniformly distributing heat to or removing heat from a substrate, or create temperature non-uniformities on a substrate.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Resistance Heating (AREA)

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• 2011
  • 2011-08-08 US US13/205,020 patent/US10242890B2/en not_active Expired - Fee Related
• 2012
  • 2012-07-30 JP JP2014525044A patent/JP6127051B2/ja not_active Expired - Fee Related
  • 2012-07-30 CN CN201280038838.9A patent/CN103733327B/zh not_active Expired - Fee Related
  • 2012-07-30 WO PCT/US2012/048781 patent/WO2013022633A2/en not_active Ceased
  • 2012-07-30 KR KR1020147006112A patent/KR102026727B1/ko not_active Expired - Fee Related
  • 2012-08-01 TW TW101127756A patent/TWI560802B/zh not_active IP Right Cessation

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