WO2007023847A1 - 携帯機器の筐体 - Google Patents
携帯機器の筐体 Download PDFInfo
- Publication number
- WO2007023847A1 WO2007023847A1 PCT/JP2006/316479 JP2006316479W WO2007023847A1 WO 2007023847 A1 WO2007023847 A1 WO 2007023847A1 JP 2006316479 W JP2006316479 W JP 2006316479W WO 2007023847 A1 WO2007023847 A1 WO 2007023847A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal structure
- portable device
- resin
- case
- metal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1662—Details related to the integrated keyboard
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/44—Furniture or parts thereof
- B29L2031/445—Cabinets
Definitions
- the present invention relates to a casing of a portable device such as a mobile phone, and more particularly to improvement of a casing structure capable of securing strength at the same time as downsizing and thinning.
- the key switch part it is necessary to use a key pressing frame so as to cover the shield frame formed on the mounting substrate, since it is necessary to transmit the key hitting force to the built-in parts. It may use a rigid mounting substrate on both sides and form a key switch on the back. There are also cases where a metal case is used and a key switch is pasted on it. Furthermore, as described in Patent Document 1, a structure may be provided to receive a switch load.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-229938
- the housing structure disclosed in this patent document 1 has some problems.
- the first problem is that if the shield frame formed on the mounting substrate is designed to receive a load, it is necessary to equalize the heights of the shield frames.
- the height of this mounted part varies depending on the part Here, it is necessary to adjust to the highest part.
- a second problem is that when a load is applied to the back surface of the mounted part, stress is applied to the substrate when the key is inserted, which may affect the mounted part. That is, in order to protect the mounted parts, it is necessary to devise a method of reducing the amount of deformation of the substrate, and as a result, the thickness of the substrate may be increased to some extent, resulting in an obstacle to miniaturization and thinning.
- the present invention has been made in view of the serious problems, and improves the switch housing structure of the portable device, and provides a portable device housing having a structure suitable for thinning and downsizing.
- the purpose is
- the casing of the portable device according to the present invention comprises: an interior metal structure having a first bottomed recess shape; and the exterior metal structure of the interior metal structure and the interior site connected thereto. It is provided by integrally molding an exterior material having a larger thermal contraction during cooling than a constituent material of the body, and has a resin outer body having a frame shape.
- the metal structure is formed into a bottomed concave shape by drawing of a thin sheet metal plate or the like, the metal structure is twisted in the bending direction as well as in the bending direction. It is also resistant to deformation. Therefore, by providing a key switch receiving surface on which the key switch is disposed on the surface portion of the box, even if the thickness of the metal structure is thin, it is possible to sufficiently receive the keying stress of the switch surface. It does not affect the internal mounting parts.
- the resin outer package is provided on the outer surface of the metal structure by injection molding or the like, the housing of the present invention is thin and has high rigidity while the outer package is resin molded by design. Can be secured.
- the material of the interior metal structure is, for example, stainless steel, ordinary steel, or titanium, and the metal structure is preferably formed by thin plate drawing. Also before The metal structure is preferably formed by a die casting method, a metal molding method, or a sintering method by metal injection molding.
- the resin outer package thermally contact a mounting substrate on which a battery and mounting components are mounted to the metal structure.
- the heat of the battery and the mounting component can be dissipated through the metal structure, and the heat dissipation can be improved.
- the mounted components are covered with the metal structure, the electromagnetic shielding performance is improved.
- the metal structure has a box shape formed by a portion where the key switch is to be installed and a side wall portion connected to this portion. This makes the protection of built-in parts more reliable.
- the resin sheath has a hinge portion to which another housing is rotatably connected, and the hinge portion is formed of a highly elastic resin material so as to be bent.
- the hinge portion is made of a highly elastic material, so that it is possible to absorb impact when the hinge portion is dropped or the like, and protection of the built-in parts in the strong metal bottomed concave shape and plastic deformation of the whole housing It is possible to make the reduction of the amount of shape compatible.
- a casing of another portable device includes the interior metal structure having the first bottomed recess shape, the exterior portion of the interior metal structure, and the interior portion connected to the interior portion. It is provided by integrally molding an exterior material having a larger thermal contraction at the time of cooling than a constituent material of the metal structure, and has a metal exterior body having a frame shape.
- the present invention it is possible to efficiently disperse the keying load on the key switch surface to the surface power and the back surface of the housing which can not be transmitted to the built-in component. Further, since resin is integrally formed on the metal structure, plastic deformation of the metal can be suppressed. Furthermore, in the present invention, the thickness reduction and the high rigidity can be achieved by the metal structure, and the exterior can be made by resin molding to secure the design. Furthermore, according to the present invention, since the metal housing and the resin housing are integrally formed by injection molding or the like, the metal and resin can be easily separated because the bonding method is not used.
- FIG. 1 is a perspective view showing a structure of a housing of a portable device according to an embodiment of the present invention, where (a) is What was seen from the upper surface side, (b) was seen from the lower surface side.
- FIG. 2 It is an exploded view which shows the state which isolate
- FIG. 4 is a cross-sectional view of the housing shown in FIG.
- FIG. 6 It is an exploded perspective view of the portable device shown in FIG.
- FIG. 7 A cross-sectional view after standing up of the housing thread, (a) is a cross-sectional view taken along the section line passing through the connector 501 shown in FIG. 6; (b) is a cross section taken along the section line passing through the battery 600 FIG.
- FIG. 8 A perspective view showing a metal structure 100 according to a second embodiment of the present invention.
- FIG. 10 A perspective view showing a metal structure 100b of a casing of a portable device according to a fourth embodiment of the present invention.
- FIG. 11 A perspective view showing a metal structure 100c and a resin outer package 200 of a casing of a portable device according to a fifth embodiment of the present invention.
- FIG. 13 is an exploded perspective view showing a metal structure 100c, a resin outer package 200, and a high elasticity metal frame 800 in a casing of a portable device according to a sixth embodiment of the present invention.
- FIG. 14 is a cross-sectional view of FIG.
- FIG. 15 is a partially enlarged view of FIG.
- FIG. 16 (a) is a perspective view showing a modified example of the high elasticity metal frame 800, (b) is a perspective view showing a state in which the frame 800 is attached to the metal structure 100c.
- FIG. 1 is a perspective view showing a structure of a housing of a portable device according to an embodiment of the present invention, in which (a) is viewed from the upper surface side and (b) is also viewed the lower surface side force.
- FIG. 2 is an exploded view showing the metal structure 100 of the casing of the portable device shown in FIG. 1 in a separated state.
- FIG. 3 is a perspective view of the metal structure 100 viewed from the back side.
- FIG. 4 is a cross-sectional view of the case shown in FIG. 5 (a) to 5 (c) are perspective views of the portable device after the lower housing provided with the switch portion is assembled. 6 is an exploded perspective view of the portable device shown in FIG.
- FIG. 7 is a cross-sectional view after assembly of the housing, (a) is a cross-sectional view taken along the section line passing through the connector 501 shown in FIG. 6, and (b) is a cross-sectional view taken along the section line passing through the battery 600 It is.
- the metal structure 100 is formed into a bottomed concave shape by drawing or press forming a metal plate, and is a main structure of a housing.
- This metal structure 100 has a switch receiving surface 101 on which a flexible substrate as a key switch is disposed, a peripheral rib 102 provided on the periphery to secure the overall rigidity, and wiring of the key switch substrate.
- a notch 106 for a card slot for mounting a PCMC IA (Personal Computer Memory) or a card or the like, and a connecting force 107 for connecting with a resin at the time of integral molding are provided.
- the metal structure 100 which is a box-shaped metal casing, has a thickness of, for example, about 0.2 mm to 0.5 mm, and can be obtained by pressing and processing a stainless steel thin plate, a thin steel plate, or a titanium thin plate.
- the switch receiving surface 101 also has a function as a second bottomed concave shape, and strengthens the torsional rigidity and the bending rigidity of the entire metal casing by the increase of the second moment of the cross section and the hardening by finishing.
- the metal structure may be produced by a sintering method typified by die cast molding, metal mold molding, and metal injection molding in addition to thin plate drawing. In the case of this sintering, although it is inferior in thinning, there is an effect that it becomes possible to provide the metal structure with ribs and the like installed inside the casing.
- an outer body 200 made of resin is molded into a casing of a portable device.
- the body is composed. That is, by injection-molding the resin on the metal structure 100 at a predetermined position, the metal structure 100 and the resin sheath 200 can be integrally formed.
- the resin outer package 200 and the box-shaped metal structure 100 are not bonded to each other, the resin wraps around the connection holes 107 of the metal structure 100 so that they do not separate after molding.
- the box-shaped metal structure 100 is formed in a pair so that the resin outer package 200 occupies the periphery uniformly, so the metal shrinks more due to the difference in thermal expansion between the metal and the resin.
- the box-shaped metal structure 100 and the resin sheath 200 are in close contact with each other by shrinkage of the resin portion after resin molding.
- the metal structure has a normal plate shape or a simple bending portion, warpage may occur in the entire case due to contraction at the time of cooling.
- the metal structure overcomes the contraction stress, it is possible to minimize the deformation after molding.
- the metal exterior body obtained by the construction method near resin injection molding instead of the resin.
- a thixomold made of magnesium alloy and a die-casting method of magnesium, aluminum or zinc alloy correspond thereto.
- the thermal expansion coefficient of the constituent material of the metal outer package needs to be larger than the thermal expansion coefficient of the constituent material of the interior metal structure.
- a rib 201 for fixing a built-in mounting board a rib 202 for fixing a connector, a rib 203 for fixing a battery, and a screw boss 204 for fixing a rear cover, It comprises: a hinge portion 205 for connecting with an upper case (not shown) constituting the display portion.
- a peripheral resin rib 206 is formed which covers the periphery of the peripheral rib 102 of the box-shaped metal structure 100. Also, in order to prevent deformation of the peripheral rib 102 due to the resin flowing at the time of molding, the peripheral resin rib 206 is provided with a pressing hole 207.
- a sheet metal part manufactured by press forming has high rigidity because it has a narrow elastic deformation area, but it is plastically deformed and squashes.
- it is necessary to increase the thickness or to use a material having a wide elastic deformation area.
- making the plate thickness thicker than necessary in terms of strength is contrary to the demand for a portable device that needs to be thin, small, and lightweight. For this reason, it is desirable to use a material having a wide elastic deformation area, but this reduces the formability.
- the box-shaped metal structure 100 The resin sheath 200 can suppress the plastic deformation of the metal structure 100 while using the metal material of the elastic deformation region in the range which can be formed into the shape.
- peripheral rib 102 and the peripheral grease rib 206 are integrally deformed, for example, when subjected to a bending load, the peripheral rib 102 is buckled in addition to the load distribution to the peripheral grease rib. The amount of plastic deformation is significantly reduced compared to the single case.
- the flexible substrate 300 as a key switch is mounted on the resin outer package 200 integrally formed on the box-shaped metal structure 100. That is, the wiring 301 of the flexible substrate 300 is passed through the wiring hole 103 of the metal structure 100, and the flexible substrate 300 is adhered to the switch receiving surface 101 of the metal structure 100.
- a dome switch 302 and a light emitting diode (LED) back light 303 are mounted on the flexible substrate 300.
- the key sheet unit 400 is bonded onto the flexible substrate 300. The key sheet unit 400 is bonded to the key attaching surface 108 which is not the switch receiving surface 101.
- Main substrate 500 and battery 600 are mounted on the back surface of resin outer package 200.
- various mounting components other than the SIM connector 501 and the side switch 502 are mounted on both sides of the board.
- shield parts and the like of the wireless unit can be mounted.
- the resin outer package 200 and the rear cover 700 are fastened by a fixing screw (not shown).
- the material of rear cover 700 may be a metal material to make it thinner, or it may be a resin material or an integral molding material of resin and metal.
- the mounted components on the main substrate 500 and the power of the battery 600 generate heat due to current flow
- these components are inscribed in the box-shaped metal structure 100, so heat is diffused efficiently and heat is dissipated. Excellent. It is also possible to use this metal structure 100 as a ground of wiring. Furthermore, the metal structure covers the whole of these mounting components and It also exerts
- the metal structure has a box shape, it is resistant to deformation in the twisting direction as well as in the bending direction. Therefore, even if the thickness is thin, it is possible to receive the tapping stress of the switch surface without any problem. That is, it is possible to efficiently disperse the surface pressure of the casing which can not be transmitted to the built-in parts to the back surface, even if the keying load on the key switch surface of the key sheet unit 400 is transmitted.
- the design can be secured by resin-molding the exterior while maintaining thinness and high rigidity. Furthermore, it is possible to minimize the plastic deformation that is likely to occur in the case of metal casings. And, in the present embodiment, since the metal case (metal structure 100) and the resin case (resin exterior body 200) are integrally formed and not bonded, the metal portion and the metal case are not formed. It is highly recyclable to easily separate it from fat.
- FIG. 8 is a perspective view showing a metal structure 100 of the present embodiment.
- the metal structure 100a of this embodiment is different from the metal structure 100 shown in FIG. 2 in that a part of the end face of the end portion is formed into a hinge shape 109.
- the hinge shape 109 in the metal structure 100a, although the molding shape becomes complicated, the strength of the hinge portion can be improved.
- FIG. 9 is an exploded view showing a portable device according to a third embodiment of the present invention.
- the size of the substrate 500 and the battery 600 is almost the same as that of the resin outer package 200, and the mounting component 503 is concentrated on one surface (for example, the lower surface) of the substrate 500 and has a switch surface. It is also effective to form a laminated structure of the resin outer package 200 and the metal structure 100, the substrate 500, and the battery 600. Also in this case, the heat dissipation by contact with the metal structure 100 and the shielding effect by the metal structure 100 are also effective.
- FIG. 10 is a perspective view showing a metal structure 100b of a casing of a portable device according to a fourth embodiment of the present invention. As shown in FIG.
- the rib 110 when the case is relatively large, the rib 110 can be formed on the switch receiving surface 101 of the box-shaped metal structure 100 to increase the rigidity of the switch receiving surface 101. By doing this, even if the switch receiving surface 101 is large, the strength of the switch receiving surface 101 can be improved, and the load of switch pressing can be supported.
- the rib 110 is also effective as a support for the key sheet unit 400 to prevent misalignment.
- FIG. 11 is a perspective view showing the metal structure 100 c and the resin outer package 200 of the casing of the portable device according to the fifth embodiment of the present invention
- FIG. 12 shows the state with the rear cover removed after assembling the portable device.
- FIG. 18 is a perspective view from the back showing
- the switch can not be arranged in the notch 111, there is an advantage that the rib 112 as a partition of a built-in object such as a battery can be formed by a thin metal plate which is a part of the metal structure 100c.
- FIG. 13 is an exploded perspective view showing a metal structure 100c and a resin outer package 200 of a casing of a portable device according to a sixth embodiment of the present invention and a high elasticity metal frame 800
- FIG. 15 is a partially enlarged view of FIG.
- cross-sectional shape of the high elasticity metal frame 800 is not rectangular as shown in FIG.
- this frame 800 is shown in FIG.
- the thickness of the device affecting the thinness of the device remains thin, and the peripheral portion is highly elastic. It can be said that it is advantageous to make the device thinner by strengthening it with Further, a highly elastic material having high elasticity has a drawback that when the metal structure is formed by drawing, the forming is difficult because the drawing is plastic deformation. But, By forming the frame portion as a highly elastic metal frame, this weakness is eliminated, and the external metal structure can be easily formed by drawing.
- the present invention is useful as a housing of a mobile device such as a mobile phone or PDA.
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
- Input From Keyboards Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/813,613 US8989823B2 (en) | 2005-08-25 | 2006-08-23 | Casing for portable device |
EP06782932A EP1918800A4 (en) | 2005-08-25 | 2006-08-23 | HOUSING FOR PORTABLE DEVICE |
JP2007532146A JP4367558B2 (ja) | 2005-08-25 | 2006-08-23 | 携帯機器の筐体 |
US14/630,862 US9374445B2 (en) | 2005-08-25 | 2015-02-25 | Casing for portable device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-244822 | 2005-08-25 | ||
JP2005244822 | 2005-08-25 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/813,613 A-371-Of-International US8989823B2 (en) | 2005-08-25 | 2006-08-23 | Casing for portable device |
US14/630,862 Continuation US9374445B2 (en) | 2005-08-25 | 2015-02-25 | Casing for portable device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007023847A1 true WO2007023847A1 (ja) | 2007-03-01 |
Family
ID=37771590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/316479 WO2007023847A1 (ja) | 2005-08-25 | 2006-08-23 | 携帯機器の筐体 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8989823B2 (ja) |
EP (1) | EP1918800A4 (ja) |
JP (6) | JP4367558B2 (ja) |
CN (2) | CN101605156B (ja) |
WO (1) | WO2007023847A1 (ja) |
Cited By (12)
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JP2008245160A (ja) * | 2007-03-28 | 2008-10-09 | Kyocera Corp | 電子機器 |
WO2009033349A1 (fr) * | 2007-09-13 | 2009-03-19 | Yuen Fat Lee | Boîtier pour ordinateur portatif et procédé de fabrication associé |
JP2009129429A (ja) * | 2007-11-28 | 2009-06-11 | Casio Comput Co Ltd | 電子機器、及び、配線シートの積層構造 |
JP2009177803A (ja) * | 2007-12-27 | 2009-08-06 | Kyocera Corp | 電子機器 |
JP2010081125A (ja) * | 2008-09-25 | 2010-04-08 | Toshiba Corp | 携帯電話端末 |
JP2010109712A (ja) * | 2008-10-30 | 2010-05-13 | Kyocera Corp | 携帯電子機器 |
JP2010252242A (ja) * | 2009-04-20 | 2010-11-04 | Sharp Corp | 携帯端末 |
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WO2016088643A1 (ja) * | 2014-12-02 | 2016-06-09 | 株式会社東海理化電機製作所 | モジュール及びこのモジュールを用いた電子キー |
JP2016522583A (ja) * | 2013-06-17 | 2016-07-28 | ゼットティーイー コーポレーションZte Corporation | 電子機器のバッテリーハウジングアセンブリ、プラスチック金属アセンブリ及びプラスチック部材 |
CN106624087A (zh) * | 2017-01-17 | 2017-05-10 | 上海与德信息技术有限公司 | 移动终端、金属壳体及cnc加工方法 |
KR20190027304A (ko) * | 2017-09-06 | 2019-03-14 | 진야하오 정밀 금속 과학기술 (심천) 주식회사 | 분절식 외부 프레임을 구비하는 휴대폰 중간판 |
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WO2007023847A1 (ja) * | 2005-08-25 | 2007-03-01 | Nec Corporation | 携帯機器の筐体 |
CN101394432A (zh) * | 2007-09-17 | 2009-03-25 | 深圳富泰宏精密工业有限公司 | 便携式电子装置机壳 |
TWI381789B (zh) * | 2007-10-12 | 2013-01-01 | Chi Mei Comm Systems Inc | 便攜式電子裝置機殼 |
JP5146286B2 (ja) * | 2008-11-28 | 2013-02-20 | 富士通株式会社 | 装置筐体及び携帯端末装置 |
US20100168752A1 (en) | 2008-12-29 | 2010-07-01 | Edwards Jon M | Orthopaedic cutting tool having a chemically etched metal insert and method of manufacturing |
US9375221B2 (en) | 2008-12-29 | 2016-06-28 | Depuy (Ireland) | Orthopaedic cutting block having a chemically etched metal insert |
JP5306840B2 (ja) * | 2009-01-22 | 2013-10-02 | 京セラ株式会社 | 携帯電子機器 |
WO2010125250A1 (fr) * | 2009-04-27 | 2010-11-04 | Archos | Boitier pour appareil electronique, appareil comprenant un tel boitier et procede de fabrication d'un tel boitier |
US8422240B2 (en) * | 2009-07-27 | 2013-04-16 | Panasonic Corporation | Electronic apparatus |
US8100682B2 (en) * | 2009-09-10 | 2012-01-24 | Research In Motion Limited | System for injection molding |
JP2011120159A (ja) * | 2009-12-07 | 2011-06-16 | Sanyo Electric Co Ltd | 折り畳み式電子機器 |
US20110159259A1 (en) * | 2009-12-31 | 2011-06-30 | Cheil Industries Inc. | Molded Article for Electronic Device Housing and Method for Preparing the Same |
US8610629B2 (en) * | 2010-05-27 | 2013-12-17 | Apple Inc. | Housing structures for optimizing location of emitted radio-frequency signals |
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CN106624087A (zh) * | 2017-01-17 | 2017-05-10 | 上海与德信息技术有限公司 | 移动终端、金属壳体及cnc加工方法 |
KR20190027304A (ko) * | 2017-09-06 | 2019-03-14 | 진야하오 정밀 금속 과학기술 (심천) 주식회사 | 분절식 외부 프레임을 구비하는 휴대폰 중간판 |
KR102079822B1 (ko) | 2017-09-06 | 2020-02-20 | 진야하오 정밀 금속 과학기술 (심천) 주식회사 | 분절식 외부 프레임을 구비하는 휴대폰 중간판 |
Also Published As
Publication number | Publication date |
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JP2014014181A (ja) | 2014-01-23 |
US20150207906A1 (en) | 2015-07-23 |
JP4367558B2 (ja) | 2009-11-18 |
JP4998430B2 (ja) | 2012-08-15 |
JP2009022049A (ja) | 2009-01-29 |
JP5692326B2 (ja) | 2015-04-01 |
CN101605156A (zh) | 2009-12-16 |
US20090005132A1 (en) | 2009-01-01 |
EP1918800A4 (en) | 2012-08-15 |
EP1918800A1 (en) | 2008-05-07 |
JP2009117863A (ja) | 2009-05-28 |
JP2014197900A (ja) | 2014-10-16 |
JP5858096B2 (ja) | 2016-02-10 |
JP5664528B2 (ja) | 2015-02-04 |
JPWO2007023847A1 (ja) | 2009-02-26 |
CN100533337C (zh) | 2009-08-26 |
CN101103323A (zh) | 2008-01-09 |
CN101605156B (zh) | 2013-01-09 |
US9374445B2 (en) | 2016-06-21 |
JP2012075154A (ja) | 2012-04-12 |
JP5012825B2 (ja) | 2012-08-29 |
US8989823B2 (en) | 2015-03-24 |
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