US20100028580A1 - Heat resistant thermoplastic articles - Google Patents
Heat resistant thermoplastic articles Download PDFInfo
- Publication number
- US20100028580A1 US20100028580A1 US12/512,195 US51219509A US2010028580A1 US 20100028580 A1 US20100028580 A1 US 20100028580A1 US 51219509 A US51219509 A US 51219509A US 2010028580 A1 US2010028580 A1 US 2010028580A1
- Authority
- US
- United States
- Prior art keywords
- poly
- group
- hexamethylene
- terephthalamide
- polyamides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 47
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 47
- 239000004952 Polyamide Substances 0.000 claims abstract description 103
- 229920002647 polyamide Polymers 0.000 claims abstract description 103
- 239000000203 mixture Substances 0.000 claims abstract description 74
- 238000012360 testing method Methods 0.000 claims abstract description 41
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 23
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 19
- 239000003381 stabilizer Substances 0.000 claims abstract description 18
- 230000014759 maintenance of location Effects 0.000 claims abstract description 17
- 150000004982 aromatic amines Chemical group 0.000 claims abstract description 16
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 7
- 239000004611 light stabiliser Substances 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 125000000524 functional group Chemical group 0.000 claims abstract description 6
- 230000002787 reinforcement Effects 0.000 claims abstract description 6
- 239000012745 toughening agent Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 150000003839 salts Chemical class 0.000 claims abstract description 4
- -1 aliphatic diamine Chemical class 0.000 claims description 148
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 59
- 125000004432 carbon atom Chemical group C* 0.000 claims description 44
- PGGROMGHWHXWJL-UHFFFAOYSA-N 4-(azepane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCC1 PGGROMGHWHXWJL-UHFFFAOYSA-N 0.000 claims description 35
- 238000002844 melting Methods 0.000 claims description 30
- 230000008018 melting Effects 0.000 claims description 30
- LKWSTQPRPRGLDP-UHFFFAOYSA-N 4-(azacycloundecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCCC1 LKWSTQPRPRGLDP-UHFFFAOYSA-N 0.000 claims description 27
- 239000000178 monomer Substances 0.000 claims description 23
- 125000001931 aliphatic group Chemical group 0.000 claims description 18
- OCBDCKOLSAYNMN-UHFFFAOYSA-N 4-(azacyclotridecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCCCCC1 OCBDCKOLSAYNMN-UHFFFAOYSA-N 0.000 claims description 15
- CSJJNGBTPIRXBE-UHFFFAOYSA-N 6-(azepan-1-yl)-6-oxohexanamide Chemical compound NC(=O)CCCCC(=O)N1CCCCCC1 CSJJNGBTPIRXBE-UHFFFAOYSA-N 0.000 claims description 13
- 239000004014 plasticizer Substances 0.000 claims description 13
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 11
- CELROVGXVNNJCW-UHFFFAOYSA-N 11-aminoundecanamide Chemical compound NCCCCCCCCCCC(N)=O CELROVGXVNNJCW-UHFFFAOYSA-N 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 229920000933 poly (ε-caprolactam) Polymers 0.000 claims description 10
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 9
- FTZSDHHWPWGCDI-UHFFFAOYSA-N dodecanediamide Chemical compound NC(=O)CCCCCCCCCCC(N)=O FTZSDHHWPWGCDI-UHFFFAOYSA-N 0.000 claims description 9
- 150000003951 lactams Chemical class 0.000 claims description 9
- SNNMLPUQKZGXOJ-UHFFFAOYSA-N 12-aminododecanamide Chemical compound NCCCCCCCCCCCC(N)=O SNNMLPUQKZGXOJ-UHFFFAOYSA-N 0.000 claims description 8
- FQLAJSQGBDYBAL-UHFFFAOYSA-N 3-(azepane-1-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2CCCCCC2)=C1 FQLAJSQGBDYBAL-UHFFFAOYSA-N 0.000 claims description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 8
- 229920000577 Nylon 6/66 Polymers 0.000 claims description 8
- 229920003231 aliphatic polyamide Polymers 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 7
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 claims description 7
- 238000002411 thermogravimetry Methods 0.000 claims description 7
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 6
- 239000004953 Aliphatic polyamide Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- VDBXLXRWMYNMHL-UHFFFAOYSA-N decanediamide Chemical compound NC(=O)CCCCCCCCC(N)=O VDBXLXRWMYNMHL-UHFFFAOYSA-N 0.000 claims description 6
- 230000004580 weight loss Effects 0.000 claims description 6
- OECUQWQIGXMPAN-UHFFFAOYSA-N 6-oxo-6-pyrrolidin-1-ylhexanamide Chemical compound NC(=O)CCCCC(=O)N1CCCC1 OECUQWQIGXMPAN-UHFFFAOYSA-N 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 5
- WXBUUJNOVQVTFV-UHFFFAOYSA-N 10-(azacycloundec-1-yl)-10-oxodecanamide Chemical compound NC(=O)CCCCCCCCC(=O)N1CCCCCCCCCC1 WXBUUJNOVQVTFV-UHFFFAOYSA-N 0.000 claims description 4
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 claims description 4
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 claims description 4
- BPWIZTGMTWYMFO-UHFFFAOYSA-N 6-(3-methylpiperidin-1-yl)-6-oxohexanamide Chemical compound CC1CCCN(C(=O)CCCCC(N)=O)C1 BPWIZTGMTWYMFO-UHFFFAOYSA-N 0.000 claims description 4
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 4
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 4
- 229920006143 PA616 Polymers 0.000 claims description 4
- 239000000446 fuel Substances 0.000 claims description 4
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims description 4
- 229960002920 sorbitol Drugs 0.000 claims description 4
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 235000010355 mannitol Nutrition 0.000 claims description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000811 xylitol Substances 0.000 claims description 3
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 3
- 235000010447 xylitol Nutrition 0.000 claims description 3
- 229960002675 xylitol Drugs 0.000 claims description 3
- MXAOILAHPVJWBS-UHFFFAOYSA-N 10-(azepan-1-yl)-10-oxodecanamide Chemical compound NC(=O)CCCCCCCCC(=O)N1CCCCCC1 MXAOILAHPVJWBS-UHFFFAOYSA-N 0.000 claims description 2
- ANDAQSIUDBVMNP-UHFFFAOYSA-N 12-(azepan-1-yl)-12-oxododecanamide Chemical compound NC(=O)CCCCCCCCCCC(=O)N1CCCCCC1 ANDAQSIUDBVMNP-UHFFFAOYSA-N 0.000 claims description 2
- PUMFLNDRVQSSKY-UHFFFAOYSA-N 14-(azepan-1-yl)-14-oxotetradecanamide Chemical compound NC(=O)CCCCCCCCCCCCC(=O)N1CCCCCC1 PUMFLNDRVQSSKY-UHFFFAOYSA-N 0.000 claims description 2
- 229920000393 Nylon 6/6T Polymers 0.000 claims description 2
- 238000001479 atomic absorption spectroscopy Methods 0.000 claims description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 description 22
- 230000032683 aging Effects 0.000 description 17
- 239000004615 ingredient Substances 0.000 description 16
- 229920001577 copolymer Polymers 0.000 description 14
- 239000000126 substance Substances 0.000 description 14
- 229920006115 poly(dodecamethylene terephthalamide) Polymers 0.000 description 13
- 239000012760 heat stabilizer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- HLPFMOOKIBJIQT-UHFFFAOYSA-N 4-(pyrrolidine-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCC1 HLPFMOOKIBJIQT-UHFFFAOYSA-N 0.000 description 10
- 229920006153 PA4T Polymers 0.000 description 10
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 230000007774 longterm Effects 0.000 description 9
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- 150000004985 diamines Chemical class 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 5
- 229920006180 poly(hexamethylene terephthalamide)-poly(2-methyl pentamethylene diamine) Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- JLZIIHMTTRXXIN-UHFFFAOYSA-N 2-(2-hydroxy-4-methoxybenzoyl)benzoic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1C(O)=O JLZIIHMTTRXXIN-UHFFFAOYSA-N 0.000 description 4
- NPKDHUPJIUWYFG-UHFFFAOYSA-N 4-(azecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCC1 NPKDHUPJIUWYFG-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- IPRJXAGUEGOFGG-UHFFFAOYSA-N N-butylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=CC=C1 IPRJXAGUEGOFGG-UHFFFAOYSA-N 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 125000001841 imino group Chemical group [H]N=* 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 229940124530 sulfonamide Drugs 0.000 description 3
- NJPUGXZMKBZIQZ-UHFFFAOYSA-N 1,5-dioxaspiro[5.5]undecane-3,3-dicarboxylic acid Chemical compound O1CC(C(=O)O)(C(O)=O)COC11CCCCC1 NJPUGXZMKBZIQZ-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 2
- GUCMKIKYKIHUTM-UHFFFAOYSA-N 3,3,5,5-tetramethyl-1-[2-(3,3,5,5-tetramethyl-2-oxopiperazin-1-yl)ethyl]piperazin-2-one Chemical compound O=C1C(C)(C)NC(C)(C)CN1CCN1C(=O)C(C)(C)NC(C)(C)C1 GUCMKIKYKIHUTM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-KAZBKCHUSA-N D-altritol Chemical compound OC[C@@H](O)[C@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KAZBKCHUSA-N 0.000 description 2
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical compound O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920003314 Elvaloy® Polymers 0.000 description 2
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 2
- FMRHJJZUHUTGKE-UHFFFAOYSA-N Ethylhexyl salicylate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1O FMRHJJZUHUTGKE-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229920005657 Surlyn® 9320 Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- JWUXJYZVKZKLTJ-UHFFFAOYSA-N Triacetonamine Chemical compound CC1(C)CC(=O)CC(C)(C)N1 JWUXJYZVKZKLTJ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 description 2
- 125000002619 bicyclic group Chemical group 0.000 description 2
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 150000001720 carbohydrates Chemical class 0.000 description 2
- 150000001723 carbon free-radicals Chemical class 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- NATWUQFQFMZVMT-UHFFFAOYSA-N n-ethyl-2-methylbenzenesulfonamide Chemical compound CCNS(=O)(=O)C1=CC=CC=C1C NATWUQFQFMZVMT-UHFFFAOYSA-N 0.000 description 2
- OHPZPBNDOVQJMH-UHFFFAOYSA-N n-ethyl-4-methylbenzenesulfonamide Chemical compound CCNS(=O)(=O)C1=CC=C(C)C=C1 OHPZPBNDOVQJMH-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
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- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 125000003386 piperidinyl group Chemical class 0.000 description 1
- 125000005936 piperidyl group Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- UOIBLYKRMCDKBM-UHFFFAOYSA-N prop-1-en-2-ylbenzene;1-(2,2,6,6-tetramethylpiperidin-4-yl)pyrrole-2,5-dione Chemical compound CC(=C)C1=CC=CC=C1.C1C(C)(C)NC(C)(C)CC1N1C(=O)C=CC1=O UOIBLYKRMCDKBM-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical group 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/36—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
Definitions
- the present invention relates to the field of molded and extruded thermoplastic articles having improved long-term high temperature aging characteristics.
- High temperature resins based on polyamides possess desirable chemical resistance, processability and heat resistance. This makes them particularly well suited for demanding high performance applications including automotive and electrical/electronics applications.
- the mechanical properties generally tend to decrease due to the thermo-oxidation of the polymer. This phenomenon is called heat aging.
- heat stabilizers also referred as antioxidants
- examples of such heat stabilizers include hindered phenol antioxidants, amine antioxidants and phosphorus-based antioxidants.
- heat stabilizers include hindered phenol antioxidants, amine antioxidants and phosphorus-based antioxidants.
- polyamide compositions three types of heat stabilizers are conventionally used to retain the mechanical properties of the composition upon exposure to high temperatures.
- phenolic antioxidants optionally combined with a phosphorus based synergist as previously mentioned
- aromatic amines optionally combined with a phosphorus based synergist
- the third one is the use of copper salts and derivatives.
- Phenolic antioxidants are known to improve the mechanical/physical properties of the thermoplastic composition up to an aging temperature of 120° C.
- EP 1041109 discloses a polyamide composition
- a polyamide composition comprising a polyamide resin, a polyhydric alcohol having a melting point of 150 to 280° C., that has good fluidity and mechanical strength and is useful in injection welding techniques.
- Another problem is the heat ageing performance of polyamide compositions that generally have low levels of reinforcing agents or none at all. Since unreinforced compositions are generally used in applications that require some flexibility; an important attribute of unreinforced thermoplastics is the retention of strain at break upon heat ageing.
- thermoplastic article comprising a polyamide composition comprising
- high-temperature means a temperature of 150° C.
- long-term refers to an aging period equal or longer than 1000 hours (h).
- a polyamide composition, or a molded or extruded article therefrom is deemed to have “high heat stability” when 4 mm test specimens, as disclosed herein, when aged in an oven at an test temperature of 150° C. for a test period of 1000 h, in an atmosphere of air, and tested according to ISO 527-2/1A, have, on average, a retention of strain at break of greater than 80 percent, as compared with a control exposed at said test temperature for 72 h.
- the control herein is identical in composition and shape to that of the 2 mm test bar.
- (meth)acrylate is meant to include acrylate esters and methacrylate esters.
- the polyamide resin used in the present invention has a melting point and/or glass transition.
- melting points and glass transitions are as determined with differential scanning calorimetry (DSC) at a scan rate of 10° C./min in the first heating scan, wherein the melting point is taken at the maximum of the endothermic peak and the glass transition, if evident, is considered the mid-point of the change in enthalpy.
- Polyamides are condensation products of one or more dicarboxylic acids and one or more diamines, and/or one or more aminocarboxylic acids, and/or ring-opening polymerization products of one or more cyclic lactams. Suitable cyclic lactams are caprolactam and laurolactam. Polyamides may be fully aliphatic or semi-aromatic.
- Fully aliphatic polyamides used in the resin composition of the present invention are formed from aliphatic and alicyclic monomers such as diamines, dicarboxylic acids, lactams, aminocarboxylic acids, and their reactive equivalents.
- a suitable aminocarboxylic acid is 11-aminododecanoic acid.
- Suitable lactams are caprolactam and laurolactam.
- the term “fully aliphatic polyamide” also refers to copolymers derived from two or more such monomers and blends of two or more fully aliphatic polyamides. Linear, branched, and cyclic monomers may be used.
- Carboxylic acid monomers comprised in the fully aliphatic polyamides include, but are not limited to aliphatic carboxylic acids, such as for example adipic acid (C6), pimelic acid (C7), suberic acid (C8), azelaic acid (C9), decanedioic acid (C10), dodecanedioic acid (C12), tridecanedioic acid (C13), tetradecanedioic acid (C14), and pentadecanedioic acid (C15).
- aliphatic carboxylic acids such as for example adipic acid (C6), pimelic acid (C7), suberic acid (C8), azelaic acid (C9), decanedioic acid (C10), dodecanedioic acid (C12), tridecanedioic acid (C13), tetradecanedioic acid (C14), and pentadecanedi
- Diamines can be chosen among diamines having four or more carbon atoms, including, but not limited to tetramethylene diamine, hexamethylene diamine, octamethylene diamine, decamethylene diamine, dodecamethylene diamine, 2-methylpentamethylene diamine, 2-ethyltetramethylene diamine, 2-methyloctamethylenediamine; trimethylhexamethylenediamine, meta-xylylene diamine, and/or mixtures thereof.
- the semi-aromatic polyamide is a homopolymer, a copolymer, a terpolymer or more advanced polymers formed from monomers containing aromatic groups.
- One or more aromatic carboxylic acids may be terephthalate or a mixture of terephthalate with one or more other carboxylic acids, such as isophthalic acid, phthalic acid, 2-methyl terephthalic acid and naphthalic acid.
- the one or more aromatic carboxylic acids may be mixed with one or more aliphatic dicarboxylic acids, as disclosed above.
- an aromatic diamine such as meta-xylylene diamine (MXD) can be used to provide a semi-aromatic polyamide, an example of which is MXD6, a homopolymer comprising MXD and adipic acid.
- MXD meta-xylylene diamine
- Preferred polyamides disclosed herein are homopolymers or copolymers wherein the term copolymer refers to polyamides that have two or more amide and/or diamide molecular repeat units.
- the homopolymers and copolymers are identified by their respective repeat units.
- the repeat units are listed in decreasing order of mole % repeat units present in the copolymer. The following list exemplifies the abbreviations used to identify monomers and repeat units in the homopolymer and copolymer polyamides (PA):
- the term “6” when used alone designates a polymer repeat unit formed from -caprolactam.
- the “6” when used in combination with a diacid such as T, for instance 6T, the “6” refers to HMD.
- the diamine In repeat units comprising a diamine and diacid, the diamine is designated first.
- the first “6” refers to the diamine HMD, and the second “6” refers to adipic acid.
- repeat units derived from other amino acids or lactams are designated as single numbers designating the number of carbon atoms.
- Polyamides may have semiaromatic repeat units to the extent that the melting point is less than 210° C. and generally the semiaromatic polyamides of the group have less than 40 mole percent semiaromatic repeat units.
- Semiaromatic repeat units are defined as those derived from monomers selected from one or more of the group consisting of: aromatic dicarboxylic acids having 8 to 20 carbon atoms and aliphatic diamines having 4 to 20 carbon atoms.
- One embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (I) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- said polyamide resin is selected from Group (I) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- One embodiment is a molded or extruded thermoplastic article wherein said polyamide resin is selected from Group (II) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- said polyamide resin is selected from Group (II) Polyamides and wherein said test temperature is at least 150° C. for a test period of at least 1000 hours and said retention of strain is greater than 80%.
- polyamide resin is selected from Group (III)
- Polyamides are selected from the group consisting of poly(tetramethylene hexanediamide/tetramethylene terephthalamide) (PA46/4T), poly(tetramethylene hexanediamide/hexamethylene terephthalamide) (PA46/6T), poly(tetramethylene hexanediamide/2-methylpentamethylene hexanediamide/decamethylene terephthalamide)_PA46/D6/10T), poly(hexamethylene hexanediamide/hexamethylene terephthalamide) (PA66/6T), poly(hexamethylene hexanediamide/hexamethylene isophthalamide/hexamethylene terephthalamide PA66/6I/6T, and poly(hexamethylene hexanediamide/2-methylpentamethylene hexanediamide/hexamethylene terephthalamide
- polyamide resin is selected from Group (IV) Polyamides selected from the group consisting of poly(tetramethylene terephthalamide/hexamethylene hexanediamide) (PA4T/66), poly(tetramethylene terephthalamide/ ⁇ -caprolactam) (PA4T/6), poly(tetramethylene terephthalamide/hexamethylene dodecanediamide) (PA4T/612), poly(tetramethylene terephthalamide/2-methylpentamethylene hexanediamide/hexamethylene hexanediamide) (PA4T/D6/66), poly(hexaamethylene terephthalamide/2-methylpentamethylene terephthalamide/hexamethylene hexanediamide) (PA6T/DT/66), poly(hexamethylene terephthalamide/hexamethylene hexanediamide) PA6T/66, poly(hexamethylene terephthalamide/hexamethylene hexan
- polyamide resin is selected from Group (V) Polyamides selected from the group consisting of poly(tetramethylene terephthalamide/2-methylpentamethylene terephthalamide) PA4T/DT, poly(tetramethylene terephthalamide/hexamethylene terephthalamide) PA4T/6T, poly(tetramethylene terephthalamide/decamethylene terephthalamide) PA4T/10T, poly(tetramethylene terephthalamide/dodecamethylene terephthalamide)PA4T/12T, poly(tetramethylene terephthalamide/2-methylpentamethylene terephthalamide/hexamethylene terephthalamide) (PA4T/DT/6T), poly(tetramethylene terephthalamide/hexamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA4T/6T/DT), poly(hexamethylene terephthalamide resin is selected from Group (V) Polyamides selected from the group consisting
- the polyamide is a Group (III) Polyamide, Group (IV) Polyamide, Group (V) Polyamide or Group (VI) Polyamide, respectively.
- the polyamides may also be blends of two or more polyamides.
- Preferred blends include those selected from the group consisting of Group (I) and Group (II) Polyamides; Group (I) and (III) Polyamide, Group (I) and Group (VI) Polyamides, Group (II) and Group (III) Polyamides, Group (II) and Group (IV) Polyamides, Group (II) and Group (V) Polyamides, Group (II) and Group (VI) Polyamides, Group (III) and Group (VI) Polyamides, and Group (IV) and Group (V) Polyamides.
- a preferred blend includes Group (II) and Group (V) Polyamides, and a specific preferred blend includes poly(hexamethylene hexanediamide) (PA 66) and poly(hexamethylene terephthalamide/2-methylpentamethylene terephthalamide) (PA 6T/DT).
- Another preferred blend includes Group (II) and Group (III) Polyamides and a specific preferred blend includes poly( ⁇ -caprolactam) (PA6) and poly(hexamethylene hexanediamide/hexamethylene terephthalamide (PA66/6T).
- PA6 poly( ⁇ -caprolactam)
- PA66/6T poly(hexamethylene hexanediamide/hexamethylene terephthalamide
- the molded or extruded thermoplastic article comprises 0.1 to 10 weight percent of one or more polyhydric alcohols having more than two hydroxyl groups and having a number average molecular weight (M n ) of less than 2000 as determined for polymeric materials with gel permeation chromatography (GPC).
- M n number average molecular weight
- Polyhydric alcohols may be selected from aliphatic hydroxylic compounds containing more than two hydroxyl groups, aliphatic-cycloaliphatic compounds containing more than two hydroxyl groups, cycloaliphatic compounds containing more than two hydroxyl groups, aromatic and saccharides.
- An aliphatic chain in the polyhydric alcohol can include not only carbon atoms but also one or more hetero atoms which may be selected, for example, from nitrogen, oxygen and sulphur atoms.
- a cycloaliphatic ring present in the polyhydric alcohol can be monocyclic or part of a bicyclic or polycyclic ring system and may be carbocyclic or heterocyclic.
- a heterocyclic ring present in the polyhydric alcohol can be monocyclic or part of a bicyclic or polycyclic ring system and may include one or more hetero atoms which may be selected, for example, from nitrogen, oxygen and sulphur atoms.
- the one or more polyhydric alcohols may contain one or more substituents, such as ether, carboxylic acid, carboxylic acid amide or carboxylic acid ester groups.
- polyhydric alcohol containing more than two hydroxyl groups include, without limitation, triols, such as glycerol, trimethylolpropane, 2,3-di-(2′-hydroxyethyl)-cyclohexan-1-ol, hexane-1,2,6-triol, 1,1,1-tris-(hydroxymethyl)ethane, 3-(2′-hydroxyethoxy)-propane-1,2-diol, 3-(2′-hydroxypropoxy)-propane-1,2-diol, 2-(2′-hydroxyethoxy)-hexane-1,2-diol, 6-(2′-hydroxypropoxy)-hexane-1,2-diol, 1,1,1-tris-[(2′-hydroxyethoxy)-methyl]-ethane, 1,1,1-tris-[(2′-hydroxypropoxy)-methyl]-propane, 1,1,1-tris-(4′-hydroxyphenyl)-ethane, 1,1,1,
- Preferred polyhydric alcohols include those having a pair of hydroxyl groups which are attached to respective carbon atoms which are separated one from another by at least one atom.
- Especially preferred polyhydric alcohols are those in which a pair of hydroxyl groups is attached to respective carbon atoms which are separated one from another by a single carbon atom.
- the polyhydric alcohol used in the thermoplastic composition is pentaerythritol, dipentaerythritol, tripentaerythritol, di-trimethylolpropane, D-mannitol, D-sorbitol and xylitol. More preferably, the polyhydric alcohol used is dipentaerythritol and/or tripentaerythritol. A most preferred polyhydric alcohol is dipentaerythritol.
- the content of said polyhydric alcohol in the thermoplastic composition is 0.1 to less than 10 weight percent, preferably 0.25-8 weight percent, more preferably 0.25-5 weight percent and most preferably 1-4 weight percent; based on the total weight of said thermoplastic composition.
- the molded or extruded thermoplastic article comprises less than 10 weight percent, preferably 5 weight percent % or less of one or more reinforcement agents.
- the molded or extruded thermoplastic article includes no reinforcement agent.
- a reinforcement agent may be any filler, but is preferably selected from the group consisting calcium carbonate, glass fibers with circular and noncircular cross-section, glass flakes, glass beads, carbon fibers, talc, mica, wollastonite, calcined clay, kaolin, diatomite, magnesium sulfate, magnesium silicate, barium sulfate, titanium dioxide, sodium aluminum carbonate, barium ferrite, potassium titanate and mixtures thereof.
- the molded or extruded thermoplastic article may further comprise 0 to 50 weight percent of a polymeric toughener comprising a reactive functional group and/or a metal salt of a carboxylic acid.
- the molded or extruded thermoplastic article comprises 2 to 20 weight percent polymeric toughener selected from the group consisting of: a copolymer of ethylene, glycidyl(meth)acrylate, and optionally one or more (meth)acrylate esters; an ethylene/ ⁇ -olefin or ethylene/ ⁇ -olefin/diene copolymer grafted with an unsaturated carboxylic anhydride; a copolymer of ethylene, 2-isocyanatoethyl(meth)acrylate, and optionally one or more (meth)acrylate esters; and a copolymer of ethylene and acrylic acid reacted with a Zn, Li, Mg or Mn compound to form the corresponding ionomer.
- the molded or extruded thermoplastic article comprises 0 to 3 weight percent of a co-stabilizer that is useful in combination with the polyhdric alcohol, in affecting the long-term heat stability of article.
- a co-stabilizer that is useful in combination with the polyhdric alcohol, in affecting the long-term heat stability of article.
- Preferred co-stabilizers have a 10% weight loss temperature, as determined by TGA, of greater than 30° C. below said melting point of said polyamide if said melting point is present, or at least 250° C. if said melting point is not present; and said co-stabilizers are selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof.
- TGA weight loss will be determined according to ASTM D 3850-94, using a heating rate of 10° C./min, in air purge stream, with an appropriate flow rate of 0.8 mL/second.
- the co-stabilizer preferably has a 10% weight loss temperature, as determined by TGA, of at least 270° C., and more preferably 290° C., 320° C., and 340° C., and most preferably at least 350° C.
- the one or more co-stabilizers preferably are present from at or about 0.1 to 3 weight percent, and more preferably at or about 0.1 to at or about 1 weight percent, or more preferably from at or about 0.1 to at or about 0.7 weight percent, based on the total weight of the polyamide composition.
- Secondary aryl amines useful in the invention are high molecular weight organic compound having low volatility.
- the high molecular weight organic compound will be selected from the group consisting of secondary aryl amines further characterized as having a molecular weight of at least 260 g/mol and preferably at least 350 g/mol, together with a 10% weight loss temperature as determined by TGA of at least 290° C., preferably at least 300° C., 320° C., 340° C., and most preferably at least 350° C.
- secondary aryl amine an amine compound that contains two carbon radicals chemically bound to a nitrogen atom where at least one, and preferably both carbon radicals, are aromatic.
- aromatic substituents such as, for example, a phenyl, naphthyl or heteroaromatic group, is substituted with at least one substituent, preferably containing 1 to about 20 carbon atoms.
- suitable secondary aryl amines include 4,4′di( ⁇ , ⁇ -dimethylbenzyl)diphenylamine available commercially as Naugard 445 from Uniroyal Chemical Company, Middlebury, Conn.; the secondary aryl amine condensation product of the reaction of diphenylamine with acetone, available commercially as Aminox from Uniroyal Chemical Company; and para-(paratoluenesulfonylamido)diphenylamine also available from Uniroyal Chemical Company as Naugard SA.
- Other suitable secondary aryl amines include N,N ⁇ -di-(2-naphthyl)-p-phenylenediamine, available from ICI Rubber Chemicals, Calcutta, India.
- Suitable secondary aryl amines include 4,4′-bis( ⁇ , ⁇ ′-tertiaryoctyl)diphenylamine, 4,4′-bis( ⁇ -methylbenzhydryl)diphenylamine, and others from EP 0509282 B1.
- the molded or extruded thermoplastic article may have at least one co-stabilizer selected from one or more secondary aryl amines.
- the one or more secondary aryl amines is present at about 0.25 to 1.0 weight percent and more preferably 0.25 to about 0.9 weight percent, based on the total weight of the polyamide composition.
- HALS hindered amine light stabilizers
- HALS are compounds of the following general formulas and combinations thereof:
- R 1 up to and including R 5 are independent substituents.
- suitable substituents are hydrogen, ether groups, ester groups, amine groups, amide groups, alkyl groups, alkenyl groups, alkynyl groups, aralkyl groups, cycloalkyl groups and aryl groups, in which the substituents in turn may contain functional groups; examples of functional groups are alcohols, ketones, anhydrides, imines, siloxanes, ethers, carboxyl groups, aldehydes, esters, amides, imides, amines, nitriles, ethers, urethanes and any combination thereof.
- a hindered amine light stabilizer may also form part of a polymer or oligomer.
- the HALS is a compound derived from a substituted piperidine compound, in particular any compound derived from an alkyl-substituted piperidyl, piperidinyl or piperazinone compound, and substituted alkoxypiperidinyl compounds.
- Examples of such compounds are: 2,2,6,6-tetramethyl-4-piperidone; 2,2,6,6-tetrametyl-4-piperidinol; bis-(1,2,2,6,6-pentamethyl piperidyl)-(3′,5′-di-tert-butyl-4′-hydroxybenzyl)butylmalonate; di-(2,2,6,6-tetramethyl-4-piperidyl)sebacate (Tinuvin® 770, MW 481); oligomer of N-(2-hydroxyethyl)-2,2,6,6-tetramethyl-4-piperidinol and succinic acid (Tinuvin® 622); oligomer of cyanuric acid and N,N-di(2,2,6,6-tetramethyl-4-piperidyl)-hexamethylene diamine; bis-(2,2,6,6-tetramethyl-4-piperidinyl)succinate; bis-(1-octyloxy-2,2,6,
- Tinuvin® and Chimassorb® materials are available from Ciba Specialty Chemicals; Cyasorb® materials are available from Cytec Technology Corp.; Uvasil® materials are available from Great Lakes Chemical Corp.; Saduvor®, Hostavin®, and Nylostab® materials are available from Clariant Corp.; Uvinul® materials are available from BASF; Uvasorb® materials are available from Partecipazioni Industriali; and Good-rite® materials are available from B.F. Goodrich Co. Mark® materials are available from Asahi Denka Co.
- Preferred HALS include high-molecular weight oligomeric or polymeric HALS having a molecular weight of more than about 1000, and preferably more than about 2000.
- HALS are selected from the group consisting or di-(2,2,6,6-tetramethyl-4-piperidyl)sebacate (Tinuvin® 770, MW 481) Nylostab® S-EED (Clariant Huningue S.
- the molded or extruded thermoplastic article may have at least one co-stabilizer selected from one or more HALS.
- the one or more HALS is present at about 0.25 to 1.0 weight percent and more preferably 0.25 to about 0.9 weight percent, based on the total weight of the polyamide composition.
- a preferred embodiment comprises at least two co-stabilizers, at least one selected from the secondary aryl amines; and at least one selected from the group of HALS, as disclosed above, wherein the total weight percent of the mixture of co-stabilizers is at least 0.5 weight percent, and preferably at least 0.9 weight percent.
- the polyamide composition may also comprise other additives commonly used in the art, such as other heat stabilizers or antioxidants, antistatic agents, blowing agents, lubricants, plasticizers, and colorant and pigments.
- additives commonly used in the art, such as other heat stabilizers or antioxidants, antistatic agents, blowing agents, lubricants, plasticizers, and colorant and pigments.
- heat stabilizers include copper stabilizers and hindered phenols, and mixtures thereof.
- thermoplastic articles of the invention A significant advantage of the molded or extruded thermoplastic articles of the invention is that high thermal stability, as measured under AOA conditions disclosed herein, is provided without the use of conventional copper heat stabilizers. Copper heat stabilizers tend to act as corrosive agents over long periods of time at elevated temperatures; and in some environments actually cause degradation of semiaromatic polymers.
- another embodiment is molded or extruded thermoplastic article wherein said polyamide composition comprises less than 25 ppm copper as determined with atomic absorption spectroscopy.
- the polyamide composition may comprise plasticizers.
- a plasticizer will preferably be miscible with the polyamide.
- suitable plasticizers include sulfonamides, preferably aromatic sulfonamides such as benzenesulfonamides and toluenesulfonamides.
- Suitable sulfonamides include N-alkyl benzenesulfonamides and toluenesufonamides, such as N-butylbenzenesulfonamide, N-(2-hydroxypropyl)benzenesulfonamide, N-ethyl-o-toluenesulfonamide, N-ethyl-p-toluenesulfonamide, o-toluenesulfonamide, p-toluenesulfonamide, and the like.
- Preferred are N-butylbenzenesulfonamide, N-ethyl-o-toluenesulfonamide, and N-ethyl-p-toluenesulfonamide.
- the plasticizer may be incorporated into the composition by melt-blending the polymer with plasticizer and, optionally, other ingredients, or during polymerization. If the plasticizer is incorporated during polymerization, the polyamide monomers are blended with one or more plasticizers prior to starting the polymerization cycle and the blend is introduced to the polymerization reactor. Alternatively, the plasticizer can be added to the reactor during the polymerization cycle.
- the polyamide composition contains no more than 5 weight percent of plasticizer.
- thermoplastic composition is a mixture by melt-blending, in which all polymeric ingredients are adequately mixed, and all non-polymeric ingredients are adequately dispersed in a polymer matrix.
- Any melt-blending method may be used for mixing polymeric ingredients and non-polymeric ingredients of the present invention.
- polymeric ingredients and non-polymeric ingredients may be fed into a melt mixer, such as single screw extruder or twin screw extruder, agitator, single screw or twin screw kneader, or Banbury mixer, and the addition step may be addition of all ingredients at once or gradual addition in batches.
- thermoplastic composition having a polyhydric alcohol having two or more hydroxyl groups is useful in increasing long-term thermal stability at high temperatures of molded or extruded articles made therefrom.
- the long-term thermal stability of the articles can be assessed by air oven ageing (AOA) of 4 mm thick test samples at various test temperatures for various test periods of time.
- the test temperature for the composition disclosed herein is at 150° C. and for about 1000 hours test period.
- the term “at 150° C.” refers to the nominal temperature of the environment to which the test bars are exposed; with the understanding that the actual temperature may vary by ⁇ 2° C. from the nominal test temperature.
- test samples after air oven ageing, are tested for tensile strength and strain at break, according to ISO 527-2/1A test method; and compared with a control aged at said test temperature for 72 hours. Ageing the control at the test temperature for 72 hours may allow crystallization to equilibrate in the molded test specimens, and thus may allow more reliable measure of AOA performance. The comparison with the controls provides the retention of strain at break, and thus the various compositions can be assessed as to long-term high temperature ageing performance.
- the molded 4 mm test specimens of polyamide composition as disclosed herein, have a retention of strain at break of at least 80% after AOA at 150° C. for 1000 hours and preferably at least 90%, based upon comparison with controls exposed at said test temperature for 72 hours.
- the molded 4 mm test specimens of polyamide composition as disclosed herein, have a retention of strain at break of at least 50% after AOA at 150° C. for about 2000 hours and preferably at least 75%, based upon comparison with controls exposed at said test temperature for 72 hours
- the present invention relates a use of the above disclosed thermoplastic compositions for high temperature applications.
- the present invention relates to a method for manufacturing an article by shaping the thermoplastic composition of the invention.
- articles are films or laminates, automotive parts or engine parts or electrical/electronics parts.
- shaping it is meant any shaping technique, such as for example extrusion, injection moulding, thermoform moulding, compression moulding or blow moulding.
- the article is shaped by injection moulding or blow moulding.
- the molded or extruded thermoplastic articles disclosed herein may have application in automotive and other components that meet one or more of the following requirements: high chemical resistance to polar chemicals such as such as zinc chloride and calcium chloride, high impact requirements; resistance to high temperature; resistance to oil and fuel environment; resistance to chemical agents such as coolants; low permeability to fuels and gases, e.g. carbon dioxide.
- Specific extruded or molded thermoplastic articles are selected from the group consisting of pipes for transporting liquids and gases, inner linings for pipes, fuel lines, air break tubes, coolant pipes, air ducts, pneumatic tubes, hydraulic houses, cable covers, cable ties, connectors, canisters, and push-pull cables.
- Examples 1-3 and comparative examples C-1-C-3 were prepared by melt blending the ingredients listed in the Table in a Buss 55 mm extruder, operating at about 230° C. for PA1010 compositions and 250° C. for PA612 compositions, using a screw speed of about 180 rpm, and a throughput of 100 kg/hour. Ingredient quantities shown in the Table are given in weight percent on the basis of the total weight of the thermoplastic composition.
- the compounded mixture was extruded in the form of laces or strands, cooled in a water bath, chopped into granules and placed into sealed aluminum lined bags in order to prevent moisture pick up.
- the cooling and cutting conditions were adjusted to ensure that the materials were kept below 0.15 wt % of moisture level.
- the thickness of the test specimens was 4 mm and a width of 10 mm according to ISO 527/1A at a testing speed of 50 mm/min (tensile strength and elongation). Tensile Modulus was measured at 50 mm/min.
- test specimens were heat aged in a re-circulating air ovens (Heraeus type UT6060) according to the procedure detailed in ISO 2578. At various heat aging times, the test specimens were removed from the oven, allowed to cool to room temperature and sealed into aluminum lined bags until ready for testing. The tensile mechanical properties were then measured according to ISO 527 using a Zwick tensile instrument. The average values obtained from 5 specimens are given in the Table.
- Retention of strain at break corresponds to the percentage of the strain at break at 1008 hours and 2328 hours heat ageing in comparison with the value of specimens after heat aging for 72 hours considered as being 100%.
- PA612 is Zytel® 158 NC010 resin, having a melting point of about 218° C., available from E. I. du Pont de Nemours and Company, Wilmington, Del.
- PA1010 is Herox® polyamide resin available from E. I. du Pont de Nemours and Company, Wilmington, Del.
- Surlyn®9320 copolymer refers to an ethylene/methacrylic acid copolymer, zinc neutralized, available from E.I. DuPont de Nemours and Company, Wilmington, Del., USA.
- Elvaloy EP4934-4 refers to an ethylene/glycidyl methacrylate copolymer available from E.I. DuPont de Nemours and Company, Wilmington, Del., USA.
- Colloids PE 48/93 refers to a carbon black dispersed in polyethylene available from Colloids Limited.
- DPE refers to dipentaerythritol that was from Perstorp Speciality Chemicals AB, Perstorp, Sweden as Di-Penta 93.
- Cu heat stabilizer refers to a mixture of 7 parts of potassium iodide and 1 part of copper iodide in 0.5 part of a stearate wax binder.
- Irgafos® 168 stabilizer is a heat stabilizer available Ciba Speciality Chemicals Inc, Switzerland.
- Irganox® 1098 stabilizer was available from Ciba Speciality Chemicals Inc, Switzerland.
- Chimassorb® 944 refers to (poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)-imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]]), supplied by Ciba Specialty Chemicals.
- Tinuvin® 234 refers to a HALS available from Ciba Specialty Chemicals.
- Unreinforced PA 612 compositions of Examples 3 with DPE and Comparative Example C-3 without DPE are listed in Table 1.
- Tensile properties after AOA at 150° C. at 72 h, 1008 h, and 2328 h, and % retention of strain at break are listed in Table 1.
- the example showed greater than 80% retention of strain at break, after 1008 hours AOA at 150° C., as compared to the 72 h AOA control. These results are significantly better than the comparative examples having no DPE present.
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| US12/512,195 US20100028580A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles |
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| US12/512,172 Abandoned US20100029821A1 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles including co-stabilizers |
| US12/512,101 Abandoned US20100029820A1 (en) | 2008-07-30 | 2009-07-30 | Long-term heat aging resistant polyamide compositions |
| US12/512,125 Expired - Fee Related US8445574B2 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles including polyhydroxy polymers |
| US12/512,311 Expired - Fee Related US8445575B2 (en) | 2008-07-30 | 2009-07-30 | Thermoplastic articles including polyhydroxy polymers |
| US12/512,062 Abandoned US20100029837A1 (en) | 2008-07-30 | 2009-07-30 | Copolyetherester compositions and articles made from these |
| US13/456,517 Abandoned US20120208954A1 (en) | 2008-07-30 | 2012-04-26 | Copolyetherester compositions and articles made from these |
| US13/615,967 Abandoned US20130072608A1 (en) | 2008-07-30 | 2012-09-14 | Heat resistant thermoplastic articles including polyhydroxy polymers |
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| US12/512,101 Abandoned US20100029820A1 (en) | 2008-07-30 | 2009-07-30 | Long-term heat aging resistant polyamide compositions |
| US12/512,125 Expired - Fee Related US8445574B2 (en) | 2008-07-30 | 2009-07-30 | Heat resistant thermoplastic articles including polyhydroxy polymers |
| US12/512,311 Expired - Fee Related US8445575B2 (en) | 2008-07-30 | 2009-07-30 | Thermoplastic articles including polyhydroxy polymers |
| US12/512,062 Abandoned US20100029837A1 (en) | 2008-07-30 | 2009-07-30 | Copolyetherester compositions and articles made from these |
| US13/456,517 Abandoned US20120208954A1 (en) | 2008-07-30 | 2012-04-26 | Copolyetherester compositions and articles made from these |
| US13/615,967 Abandoned US20130072608A1 (en) | 2008-07-30 | 2012-09-14 | Heat resistant thermoplastic articles including polyhydroxy polymers |
| US13/644,536 Abandoned US20130053483A1 (en) | 2008-07-30 | 2012-10-04 | Heat resistant thermoplastic articles including co-stabilizers |
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| US20150099838A1 (en) * | 2011-11-08 | 2015-04-09 | Solvay Specialty Polymers Usa, Llc. | High heat resistant polyamide for down hole oil components |
| US20130115401A1 (en) * | 2011-11-08 | 2013-05-09 | E I Du Pont De Nemouras And Company | Hydrolytic resistant polyamide compositions comprising polyhydroxy polymers |
| US20130158168A1 (en) * | 2011-12-19 | 2013-06-20 | E I Du Pont De Nemours And Company | Aliphatic-aromatic copolyetheresters |
| US8906479B2 (en) | 2011-12-30 | 2014-12-09 | E I Du Pont De Nemours And Company | Compositions of polyamide and ionomer |
| US20130171394A1 (en) | 2011-12-30 | 2013-07-04 | E. I. Du Pont De Nemours And Company | Polyamide Composition Containing Ionomer |
| CN104221176B (zh) | 2012-01-16 | 2017-03-01 | 住友电木株式会社 | 用于微电子和光电子器件及其组件的热氧化稳定的、侧链聚醚官能化的聚降冰片烯 |
| CN102627849B (zh) * | 2012-03-16 | 2014-06-18 | 深圳市科聚新材料有限公司 | 一种耐黄变高温尼龙材料及其制备方法 |
| US20130281589A1 (en) | 2012-04-23 | 2013-10-24 | E I Du Pont De Nemours And Company | Thermoplastic polyamide composition |
| CN102643534A (zh) * | 2012-05-03 | 2012-08-22 | 苏州隆阁新材料有限公司 | 一种耐化学腐蚀高抗冲长碳链尼龙母料及其制备方法和应用 |
| EP2847273A1 (en) | 2012-05-07 | 2015-03-18 | DSM IP Assets B.V. | Thermoplastic polymer composition and moulded parts made thereof |
| CN102675869A (zh) * | 2012-05-22 | 2012-09-19 | 苏州新区华士达工程塑胶有限公司 | 一种弹性好的pa6-gf10hb的配方 |
| JP5991033B2 (ja) * | 2012-06-07 | 2016-09-14 | 東ソー株式会社 | ポリアミド樹脂組成物 |
| WO2013188323A1 (en) | 2012-06-13 | 2013-12-19 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with polyetherol heat stabilizer |
| US8871874B2 (en) | 2012-06-13 | 2014-10-28 | E I Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation |
| WO2013188302A1 (en) | 2012-06-13 | 2013-12-19 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with amino acid heat stabilizer |
| EP2861668A1 (en) | 2012-06-13 | 2015-04-22 | E. I. Du Pont de Nemours and Company | Thermoplastic melt-mixed composition with epoxy-carboxylic acid compound heat stabilizer |
| CN103509633B (zh) * | 2012-06-21 | 2015-05-13 | 中国石油天然气股份有限公司 | 一种水溶性聚醚酯润滑添加剂的制备方法 |
| JP5971049B2 (ja) * | 2012-09-14 | 2016-08-17 | 東レ株式会社 | ポリアミド樹脂組成物 |
| JP6274782B2 (ja) * | 2012-09-27 | 2018-02-07 | ユニチカ株式会社 | ポリアミド樹脂組成物およびそれを成形してなる成形体 |
| KR101674242B1 (ko) * | 2013-03-15 | 2016-11-08 | 롯데첨단소재(주) | 전자파 차폐특성이 우수한 열가소성 수지조성물 |
| CN104128145A (zh) * | 2013-05-01 | 2014-11-05 | 英威达科技公司 | 用于清洁或维护搅拌式高压釜的排空系统的系统和方法 |
| BR112016001086B1 (pt) | 2013-07-23 | 2021-08-31 | Performance Polyamides, Sas | Composição de poliamida, método de produção da composição, metodo para manufatura de um artigo e metodo de uso da composição |
| EP2829576A1 (en) | 2013-07-23 | 2015-01-28 | Rhodia Operations | Polyamide composition |
| US9873793B2 (en) | 2013-10-18 | 2018-01-23 | Toray Industries, Inc. | Polyamide resin composition, method of manufacturing and molded product |
| CN103554902B (zh) * | 2013-10-28 | 2016-04-20 | 徐东 | 尼龙复合材料及其制备方法 |
| EP2881438A1 (de) | 2013-12-05 | 2015-06-10 | LANXESS Deutschland GmbH | Polyamidzusammensetzungen |
| CN103726919A (zh) * | 2013-12-26 | 2014-04-16 | 顺达(芜湖)汽车饰件有限公司 | 一种新型调温器座 |
| EP3099729B1 (en) * | 2014-01-28 | 2018-06-06 | Radicifil S.p.A. | Three-component copolymers having high transparency and low gas permeability and process for the production thereof |
| WO2015159834A1 (ja) * | 2014-04-14 | 2015-10-22 | ユニチカ株式会社 | 半芳香族ポリアミド樹脂組成物およびそれを成形してなる成形体 |
| JP6609549B2 (ja) * | 2014-04-30 | 2019-11-20 | ユニチカ株式会社 | 半芳香族ポリアミド樹脂組成物およびそれを成形してなる成形体 |
| WO2015178560A1 (ko) * | 2014-05-23 | 2015-11-26 | 삼성에스디아이 주식회사 | 공중합 폴리아미드 수지, 이의 제조방법 및 이를 포함하는 성형품 |
| JP6595514B2 (ja) * | 2014-06-20 | 2019-10-23 | ローディア オペレーションズ | ポリアミド成形組成物、それらから得られる成形品、およびそれらの使用 |
| US20170210851A1 (en) * | 2014-07-31 | 2017-07-27 | E I Du Pont De Nemours And Company | Furan based polyamides and articles made therefrom |
| JP6657821B2 (ja) * | 2014-12-04 | 2020-03-04 | 東レ株式会社 | ポリアミド樹脂組成物およびその製造方法 |
| WO2016094381A1 (en) * | 2014-12-11 | 2016-06-16 | Ticona Llc | Stabilized flexible thermoplastic composition and products formed therefrom |
| JP6645180B2 (ja) * | 2015-01-08 | 2020-02-14 | 東レ株式会社 | ポリアミド樹脂組成物およびそれを成形してなる成形品 |
| JP6750219B2 (ja) * | 2015-01-09 | 2020-09-02 | 東レ株式会社 | 変性ポリアミド樹脂およびその製造方法 |
| KR20160094724A (ko) | 2015-02-02 | 2016-08-10 | 현대자동차주식회사 | 탄소 장섬유 강화 열가소성 수지 조성물 및 이에 의해 제조된 성형품 |
| JP6724368B2 (ja) * | 2015-02-23 | 2020-07-15 | 東レ株式会社 | 成形品およびポリアミド樹脂組成物 |
| EP3093312A1 (de) * | 2015-05-12 | 2016-11-16 | LANXESS Deutschland GmbH | Thermoplastische formmassen |
| US9878467B2 (en) | 2015-06-19 | 2018-01-30 | The Procter & Gamble Company | Apparatus and process for forming particles |
| CN106317793B (zh) * | 2015-06-19 | 2018-08-21 | 江苏裕兴薄膜科技股份有限公司 | 用于生产耐热老化绝缘膜的pet复合物及其制备方法 |
| EP3115406A1 (de) * | 2015-07-10 | 2017-01-11 | LANXESS Deutschland GmbH | Thermoplastische formmassen |
| CN106478930B (zh) * | 2015-08-24 | 2019-12-27 | 中国石油化工股份有限公司 | 一种热塑性聚酯弹性体基料的制备方法 |
| MX2018004847A (es) | 2015-10-30 | 2018-08-01 | Toray Industries | Composicion de resina de poliester termoplastica y articulo moldeado. |
| CN105315629A (zh) * | 2015-11-06 | 2016-02-10 | 东华大学 | 一种高流动聚酯组合物及其制备方法 |
| CN105440646B (zh) * | 2015-12-18 | 2017-08-11 | 天津金发新材料有限公司 | 一种热塑性树脂组合物及其制备方法与应用 |
| US10875962B2 (en) * | 2016-03-08 | 2020-12-29 | Invista North America S.A.R.L. | Polyamide copolymer and method of making the same |
| KR101816434B1 (ko) | 2016-09-06 | 2018-01-08 | 현대자동차주식회사 | 발포사출용 탄소 장섬유 강화 열가소성 수지 조성물 및 이를 사용하여 제조된 성형품 |
| ES3053669T3 (en) | 2017-03-10 | 2026-01-23 | Advansix Resins & Chemicals Llc | Wire and cable jacket composition of pa6/66 copolymer base resin for improved processability and properties |
| JP6913521B2 (ja) * | 2017-06-09 | 2021-08-04 | 株式会社アズ | 機能性布帛およびその製造方法 |
| US20210079218A1 (en) | 2017-07-13 | 2021-03-18 | Lanxess Deutschland Gmbh | Thermally stabilized compositions |
| JP2020527183A (ja) * | 2017-07-13 | 2020-09-03 | ランクセス・ドイチュランド・ゲーエムベーハー | 熱安定化組成物 |
| WO2019067517A1 (en) * | 2017-09-28 | 2019-04-04 | E. I. Du Pont De Nemours And Company | POLYMERIZATION PROCESS |
| BR112020007184A2 (pt) * | 2017-11-23 | 2020-09-24 | Basf Se | composição de poliamida, processo de produção de composições, uso de composição, molde soldável, uso de álcoois póli-hídricos e processo de aumento da resistência de costura |
| CN111201286B (zh) * | 2017-11-30 | 2022-12-30 | 尤尼吉可株式会社 | 聚酰胺树脂组合物和将其成型而成的成型体 |
| CN111511838A (zh) * | 2017-12-21 | 2020-08-07 | 性能聚酰胺有限公司 | 包含半结晶共聚酰胺和扁平玻璃纤维的聚酰胺制剂 |
| BR112020013316B1 (pt) * | 2018-02-02 | 2024-01-09 | Basf Se | Uso de álcoois poli-hídricos e processo para aumentar a resistência da costura de solda |
| KR102817521B1 (ko) * | 2018-08-30 | 2025-06-05 | 셀라니즈 폴리머즈 홀딩, 인크. | 열안정성이 향상된 코폴리에테르에스테르 조성물 |
| DE102019200905A1 (de) * | 2019-01-24 | 2020-07-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Stabilisierung von halogenfreien thermoplastischen Kunststoff-Rezyklaten, Kunststoff-Zusammensetzung, Stabilisator-Zusammensetzung sowie Verwendung der Stabilisator-Zusammensetzung |
| MX2021009511A (es) * | 2019-02-06 | 2021-11-12 | Ascend Performance Mat Operations Llc | Poliamidas que tienen altos niveles de grupos terminales de amina. |
| JP7356382B2 (ja) * | 2019-04-15 | 2023-10-04 | 旭化成株式会社 | ポリアミド組成物及び成形品 |
| US20220064443A1 (en) | 2019-05-16 | 2022-03-03 | Unitika Ltd. | Polyamide resin composition |
| CN110229515B (zh) * | 2019-06-28 | 2021-12-10 | 江苏晋伦塑料科技有限公司 | 一种高耐热聚酰胺组合物及其制备方法 |
| US11753505B2 (en) * | 2019-09-09 | 2023-09-12 | Xerox Corporation | Polyamides with pendent optical absorbers and related methods |
| WO2021079244A1 (en) | 2019-10-24 | 2021-04-29 | Invista North America S.A.R.L. | Polyamide compositions and articles made therefrom |
| EP3848410A1 (de) * | 2020-01-09 | 2021-07-14 | L. Brüggemann GmbH & Co. KG | Polyamid-werkstoffe mit verbesserten langzeitgebrauchseigenschaften |
| BR112022014743A2 (pt) | 2020-01-27 | 2022-10-11 | Basf Se | Composição de moldagem termoplástica, uso de pelo menos um poliéster hiperramificado, uso da composição de moldagem termoplástica e fibra, folha ou molde |
| CN113372615A (zh) * | 2020-03-10 | 2021-09-10 | 双键化工股份有限公司 | 稳定剂的用途、塑料组合物及其塑料产品 |
| US20230129664A1 (en) | 2020-03-25 | 2023-04-27 | Basf Se | Heat-aging resistant polyamide molding compositions |
| FR3111351B1 (fr) * | 2020-06-10 | 2022-09-09 | Arkema France | Compositions de polyamide presentant un module eleve et une faible constante dielectrique et leur utilisation |
| CN112011175A (zh) * | 2020-09-11 | 2020-12-01 | 广州辰东新材料有限公司 | 一种金属色共聚尼龙改性材料 |
| KR20220046155A (ko) | 2020-10-07 | 2022-04-14 | 현대자동차주식회사 | 유리 장섬유 강화 열가소성 수지 조성물 및 이를 포함하는 성형품 |
| KR102911799B1 (ko) * | 2020-10-14 | 2026-01-14 | 주식회사 엘지화학 | 열가소성 수지 조성물, 이의 제조방법 및 이로부터 제조된 성형품 |
| KR102589937B1 (ko) * | 2021-04-01 | 2023-10-17 | 현대모비스 주식회사 | 레이더용 웨이브가이드 |
| CN114181522B (zh) * | 2021-11-03 | 2024-08-09 | 横店集团得邦工程塑料有限公司 | 一种耐醇解热稳定型ppa复合材料及其制备方法 |
| WO2023100065A1 (en) | 2021-12-01 | 2023-06-08 | Inv Nylon Polymers Americas, Llc | Polyamide compositions and articles made therefrom |
| CN114957973B (zh) * | 2022-06-09 | 2023-09-15 | 江门市德众泰尼龙有限公司 | 一种汽车水室料及其制备方法 |
| CN116396474B (zh) * | 2023-04-10 | 2024-06-18 | 宜兴市江山生物科技有限公司 | 一种具有多种用途的超支化聚醚酯及其制备方法 |
| CN121729444A (zh) | 2023-08-31 | 2026-03-24 | Ems-化学公开股份有限公司 | 用于制造具有高的熔接痕强度的构件的聚酰胺成型料 |
| CN118620518A (zh) * | 2024-06-04 | 2024-09-10 | 赵幸凯 | 一种电子器件用耐高温环保绝缘涂料及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1041109A2 (en) * | 1999-03-30 | 2000-10-04 | Ube Industries, Ltd. | Polyamide compositions having good fluidity |
| US20020151625A1 (en) * | 2000-10-04 | 2002-10-17 | Sadayuki Yakabe | Flame retardant reinforced polyamide resin composition |
| US20060058432A1 (en) * | 2004-05-04 | 2006-03-16 | General Electric Company | Halogen-free flame retardant polyamide composition with improved electrical and flammability properties |
Family Cites Families (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1041109A (en) * | 1912-03-28 | 1912-10-15 | Stevens Arms & Tool Company J | Magazine-gun. |
| NL103099C (https=) | 1957-04-11 | |||
| BE793332A (fr) * | 1972-01-26 | 1973-04-16 | Du Pont | Copolyesters thermoplastiques a segments |
| US4013624A (en) * | 1972-03-20 | 1977-03-22 | E. I. Du Pont De Nemours And Company | Branched thermoplastic copolyesters |
| US4332855A (en) * | 1978-04-14 | 1982-06-01 | Raychem Corporation | Polymeric compositions |
| US4205158A (en) * | 1979-03-28 | 1980-05-27 | E. I. Du Pont De Nemours And Company | Copolyetherester based on ethylene oxide-capped poly(propylene oxide) glycol and branching agent |
| US4351745A (en) * | 1980-01-09 | 1982-09-28 | E. I. Du Pont De Nemours And Company | Electrically conductive polyetherester elastomers |
| GB2170593B (en) | 1985-02-01 | 1988-09-14 | Central Electr Generat Board | Temperature measurement |
| DE3665317D1 (en) * | 1985-05-17 | 1989-10-05 | Akzo Nv | Copolyetherester based on poly(propylene oxide) glycol blocked with ethylene oxide |
| JP2640368B2 (ja) * | 1987-12-08 | 1997-08-13 | 旭化成工業株式会社 | ポリアミド樹脂組成物 |
| US5362777A (en) * | 1988-11-03 | 1994-11-08 | Ivan Tomka | Thermoplastically processable starch and a method of making it |
| JPH048764A (ja) * | 1990-04-26 | 1992-01-13 | Toyoda Gosei Co Ltd | エンジン用制振性樹脂成形品 |
| DE4112324A1 (de) | 1991-04-16 | 1992-10-22 | Basf Ag | Stabilisierte thermoplastische teilaromatische polyamidformmassen |
| JPH051223A (ja) * | 1991-06-27 | 1993-01-08 | Showa Denko Kk | 耐光性に優れたポリアミド樹脂組成物 |
| DE4305166A1 (de) * | 1993-02-19 | 1994-08-25 | Bayer Ag | Thermostabile kupferhaltige Polyamidformmassen |
| BE1009072A3 (nl) * | 1995-02-03 | 1996-11-05 | Dsm Nv | Copolyetherester. |
| JPH08283570A (ja) * | 1995-04-17 | 1996-10-29 | Sumitomo Chem Co Ltd | 樹脂組成物 |
| JPH09286887A (ja) * | 1996-04-18 | 1997-11-04 | Sumitomo Chem Co Ltd | 樹脂組成物 |
| JPH10130497A (ja) * | 1996-11-01 | 1998-05-19 | Mitsubishi Gas Chem Co Inc | ポリアミド樹脂組成物 |
| JPH11189673A (ja) * | 1997-12-26 | 1999-07-13 | Ajinomoto Co Inc | 熱可塑性樹脂組成物 |
| EP1086985B1 (en) * | 1997-09-02 | 2003-10-15 | Ajinomoto Co., Inc. | Thermoplastic resin composition, agent for improving thermal aging resistance of thermoplastic resin, and resin molded article obtained therefrom |
| NL1009288C2 (nl) * | 1998-05-29 | 1999-11-30 | Dsm Nv | UV stabiele polyetherester copolymeer samenstelling en folie daarvan. |
| JP2000026625A (ja) * | 1998-07-15 | 2000-01-25 | Asahi Chem Ind Co Ltd | 密着耐熱性ラップフィルム |
| US6075113A (en) * | 1998-10-05 | 2000-06-13 | Mirror Image Technologies, Inc. | Wheel composition |
| JP2008274305A (ja) * | 1999-03-30 | 2008-11-13 | Ube Ind Ltd | 良好な流動性を有するポリアミド組成物 |
| US6645336B1 (en) * | 1999-09-27 | 2003-11-11 | E. I. Du Pont De Nemours And Company | Extrusion coating process |
| JP2002275370A (ja) * | 2001-03-21 | 2002-09-25 | Asahi Kasei Corp | 難燃性ポリアミド樹脂組成物 |
| KR100448115B1 (ko) * | 2000-11-30 | 2004-09-10 | 현대자동차주식회사 | 폴리아미드 수지 조성물 |
| KR100387850B1 (ko) * | 2000-12-29 | 2003-06-18 | 현대자동차주식회사 | 폴리아미드 수지 조성물 및 이를 이용한 합성수지제품 |
| US20040024102A1 (en) * | 2002-07-30 | 2004-02-05 | Hayes Richard Allen | Sulfonated aliphatic-aromatic polyetherester films, coatings, and laminates |
| EP1389633A1 (en) * | 2002-08-14 | 2004-02-18 | The Procter & Gamble Company | Improved thermoplastic hydrophilic adhesive compositions for dry and wet surfaces the compositions having an increased water adhesion stability |
| NL1022859C2 (nl) * | 2003-03-06 | 2004-09-07 | Dsm Nv | UV-gestabiliseerde polyamidesamenstelling. |
| JP4619624B2 (ja) * | 2003-03-31 | 2011-01-26 | 旭硝子株式会社 | 積層ホース |
| US20040242737A1 (en) * | 2003-04-14 | 2004-12-02 | Georgios Topulos | Polyamide composition for blow molded articles |
| US7241403B2 (en) * | 2003-05-29 | 2007-07-10 | General Electric Company | Method for making a conductive thermoplastic composition |
| EP1486696A1 (en) * | 2003-06-11 | 2004-12-15 | DSM IP Assets B.V. | Process for making a compression spring member from copolyetherester |
| EP1498445A1 (en) * | 2003-07-18 | 2005-01-19 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| ES2385439T3 (es) * | 2003-08-19 | 2012-07-24 | Solvay Specialty Polymers Usa, Llc. | Cuerpo hueco de poliamida modificada para impacto |
| JP2005145996A (ja) * | 2003-11-11 | 2005-06-09 | Mitsubishi Engineering Plastics Corp | ポリアミド樹脂組成物 |
| US20050113532A1 (en) * | 2003-11-26 | 2005-05-26 | Fish Robert B.Jr. | High flow, toughened, weatherable polyamide compositions containing a blend of stabilizers |
| KR20060120224A (ko) * | 2003-12-25 | 2006-11-24 | 제이에스알 가부시끼가이샤 | 열가소성 엘라스토머 조성물 및 그의 제조 방법 및 성형품 |
| EP1711549B1 (en) * | 2004-02-05 | 2008-09-10 | DSMIP Assets B.V. | Block copolyetherester elastomer and preparation thereof |
| US7144972B2 (en) * | 2004-07-09 | 2006-12-05 | E. I. Du Pont De Nemours And Company | Copolyetherester compositions containing hydroxyalkanoic acids and shaped articles produced therefrom |
| EP1767578B1 (en) * | 2004-07-12 | 2013-11-06 | DSM IP Assets B.V. | Thermoplastic resin composition |
| EP1683830A1 (en) * | 2005-01-12 | 2006-07-26 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| JP4802555B2 (ja) * | 2005-05-27 | 2011-10-26 | 横浜ゴム株式会社 | 成型用樹脂組成物 |
| DE102005026265A1 (de) * | 2005-06-08 | 2006-12-14 | Degussa Ag | Brandgeschützte Polyamidformmasse |
| US7825176B2 (en) * | 2005-08-31 | 2010-11-02 | Sabic Innovative Plastics Ip B.V. | High flow polyester composition |
| WO2007036929A2 (en) * | 2005-09-29 | 2007-04-05 | Nilit Ltd. | Modified polyamides, uses thereof and process for their preparation |
| DE602006013351D1 (de) * | 2005-11-23 | 2010-05-12 | Du Pont | Kohlefaserverstärkte polyamidharzzusammensetzung |
| JP4468295B2 (ja) * | 2005-12-15 | 2010-05-26 | ダイセルポリマー株式会社 | めっき樹脂成形体 |
| EP2014712B1 (en) * | 2006-04-25 | 2010-06-02 | The Nippon Synthetic Chemical Industry Co., Ltd. | Resin composition and multilayer structure making use of the same |
| JP5301086B2 (ja) * | 2006-05-12 | 2013-09-25 | ディーエスエム アイピー アセッツ ビー.ブイ. | 自動車外装部品製造用樹脂組成物 |
| JP5169037B2 (ja) * | 2006-06-30 | 2013-03-27 | 東レ株式会社 | 熱可塑性樹脂組成物、その製造方法およびそれからなる成形品 |
| MY150503A (en) * | 2006-06-30 | 2014-01-30 | Toray Industries | Thermoplastic resin composition and molded article thereof |
| KR100864605B1 (ko) * | 2007-06-29 | 2008-10-23 | 로디아폴리아마이드 주식회사 | 페인트 부착성이 강화된 열가소성 폴리아마이드 수지조성물 |
| JP5272715B2 (ja) * | 2007-12-26 | 2013-08-28 | 東レ株式会社 | 熱可塑性ポリエステル樹脂組成物 |
-
2009
- 2009-07-30 KR KR1020117004583A patent/KR20110032001A/ko not_active Withdrawn
- 2009-07-30 US US12/512,195 patent/US20100028580A1/en not_active Abandoned
- 2009-07-30 CN CN2009801299747A patent/CN102112545A/zh active Pending
- 2009-07-30 JP JP2011521312A patent/JP5667054B2/ja not_active Expired - Fee Related
- 2009-07-30 EP EP09791004.6A patent/EP2307482B1/en active Active
- 2009-07-30 EP EP09790988A patent/EP2307503A1/en not_active Withdrawn
- 2009-07-30 CA CA2726010A patent/CA2726010A1/en not_active Abandoned
- 2009-07-30 CN CN2009801297737A patent/CN102112549B/zh not_active Expired - Fee Related
- 2009-07-30 KR KR1020117004405A patent/KR101644200B1/ko not_active Ceased
- 2009-07-30 JP JP2011521317A patent/JP6042064B2/ja active Active
- 2009-07-30 JP JP2011521324A patent/JP2011529993A/ja active Pending
- 2009-07-30 US US12/512,109 patent/US20100029819A1/en not_active Abandoned
- 2009-07-30 WO PCT/US2009/052212 patent/WO2010014785A1/en not_active Ceased
- 2009-07-30 US US12/512,172 patent/US20100029821A1/en not_active Abandoned
- 2009-07-30 WO PCT/US2009/052232 patent/WO2010014796A2/en not_active Ceased
- 2009-07-30 WO PCT/US2009/052238 patent/WO2010014801A1/en not_active Ceased
- 2009-07-30 EP EP09803583.5A patent/EP2307499A4/en not_active Withdrawn
- 2009-07-30 US US12/512,101 patent/US20100029820A1/en not_active Abandoned
- 2009-07-30 WO PCT/US2009/052217 patent/WO2010014790A1/en not_active Ceased
- 2009-07-30 US US12/512,125 patent/US8445574B2/en not_active Expired - Fee Related
- 2009-07-30 JP JP2011521311A patent/JP2011529987A/ja not_active Withdrawn
- 2009-07-30 EP EP09790983.2A patent/EP2307480B1/en not_active Not-in-force
- 2009-07-30 US US12/512,311 patent/US8445575B2/en not_active Expired - Fee Related
- 2009-07-30 JP JP2011521315A patent/JP2011529990A/ja active Pending
- 2009-07-30 EP EP20090790995 patent/EP2307481A1/en not_active Withdrawn
- 2009-07-30 US US12/512,062 patent/US20100029837A1/en not_active Abandoned
- 2009-07-30 CN CN2009801298212A patent/CN102112551B/zh not_active Expired - Fee Related
- 2009-07-30 EP EP09790987A patent/EP2307502A1/en not_active Withdrawn
- 2009-07-30 CN CN2009801298157A patent/CN102112525B/zh active Active
- 2009-07-30 WO PCT/US2009/052219 patent/WO2010014791A1/en not_active Ceased
- 2009-07-30 CN CN2009801298227A patent/CN102112526B/zh active Active
- 2009-07-30 CN CN2009801299732A patent/CN102112527B/zh not_active Expired - Fee Related
- 2009-07-30 WO PCT/US2009/052231 patent/WO2010014795A1/en not_active Ceased
- 2009-07-30 JP JP2011521314A patent/JP5677953B2/ja not_active Expired - Fee Related
- 2009-07-30 CN CN2009801297741A patent/CN102112550A/zh active Pending
- 2009-07-30 EP EP09790992.3A patent/EP2307504B1/en not_active Not-in-force
- 2009-07-30 CA CA2725384A patent/CA2725384A1/en not_active Abandoned
- 2009-07-30 JP JP2011521310A patent/JP5475777B2/ja not_active Expired - Fee Related
- 2009-07-30 WO PCT/US2009/052253 patent/WO2010014810A1/en not_active Ceased
-
2012
- 2012-04-26 US US13/456,517 patent/US20120208954A1/en not_active Abandoned
- 2012-09-14 US US13/615,967 patent/US20130072608A1/en not_active Abandoned
- 2012-10-04 US US13/644,536 patent/US20130053483A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1041109A2 (en) * | 1999-03-30 | 2000-10-04 | Ube Industries, Ltd. | Polyamide compositions having good fluidity |
| US20020151625A1 (en) * | 2000-10-04 | 2002-10-17 | Sadayuki Yakabe | Flame retardant reinforced polyamide resin composition |
| US20060058432A1 (en) * | 2004-05-04 | 2006-03-16 | General Electric Company | Halogen-free flame retardant polyamide composition with improved electrical and flammability properties |
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