TWI786440B - 多層基板、及多層基板之製造方法 - Google Patents

多層基板、及多層基板之製造方法 Download PDF

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Publication number
TWI786440B
TWI786440B TW109134185A TW109134185A TWI786440B TW I786440 B TWI786440 B TW I786440B TW 109134185 A TW109134185 A TW 109134185A TW 109134185 A TW109134185 A TW 109134185A TW I786440 B TWI786440 B TW I786440B
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semiconductor substrate
electrodes
conductive particles
substrate
electrode
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TW109134185A
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Chinese (zh)
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TW202107672A (zh
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阿久津恭志
石松朋之
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日商迪睿合股份有限公司
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    • H10W72/851—
    • H10W72/012—
    • H10W72/20—
    • H10W72/30—
    • H10W90/00—
    • H10W46/00—
    • H10W46/301—
    • H10W72/01204—
    • H10W72/01212—
    • H10W72/013—
    • H10W72/01304—
    • H10W72/01361—
    • H10W72/072—
    • H10W72/07223—
    • H10W72/07232—
    • H10W72/07253—
    • H10W72/07254—
    • H10W72/073—
    • H10W72/07323—
    • H10W72/07332—
    • H10W72/07338—
    • H10W72/07354—
    • H10W72/074—
    • H10W72/223—
    • H10W72/224—
    • H10W72/225—
    • H10W72/234—
    • H10W72/244—
    • H10W72/247—
    • H10W72/252—
    • H10W72/253—
    • H10W72/255—
    • H10W72/261—
    • H10W72/325—
    • H10W72/347—
    • H10W72/353—
    • H10W72/354—
    • H10W72/823—
    • H10W74/15—
    • H10W90/26—
    • H10W90/288—
    • H10W90/291—
    • H10W90/297—
    • H10W90/722—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W99/00—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
TW109134185A 2015-01-13 2016-01-13 多層基板、及多層基板之製造方法 TWI786440B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-004595 2015-01-13
JP2015004595 2015-01-13

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TW202107672A TW202107672A (zh) 2021-02-16
TWI786440B true TWI786440B (zh) 2022-12-11

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Application Number Title Priority Date Filing Date
TW109134185A TWI786440B (zh) 2015-01-13 2016-01-13 多層基板、及多層基板之製造方法
TW111142394A TWI838943B (zh) 2015-01-13 2016-01-13 各向異性導電膜、連接構造體、以及連接構造體的製造方法
TW105101041A TWI709221B (zh) 2015-01-13 2016-01-13 多層基板及其製造方法、及各向異性導電膜

Family Applications After (2)

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TW111142394A TWI838943B (zh) 2015-01-13 2016-01-13 各向異性導電膜、連接構造體、以及連接構造體的製造方法
TW105101041A TWI709221B (zh) 2015-01-13 2016-01-13 多層基板及其製造方法、及各向異性導電膜

Country Status (6)

Country Link
US (1) US10199358B2 (enExample)
JP (2) JP2016131245A (enExample)
KR (1) KR101974763B1 (enExample)
CN (2) CN113690209B (enExample)
TW (3) TWI786440B (enExample)
WO (1) WO2016114318A1 (enExample)

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JP7042037B2 (ja) * 2017-04-24 2022-03-25 デクセリアルズ株式会社 検査冶具の製造方法
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JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
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Also Published As

Publication number Publication date
JP7207382B2 (ja) 2023-01-18
CN113690209B (zh) 2025-07-25
US20180026012A1 (en) 2018-01-25
CN107112314A (zh) 2017-08-29
CN113690209A (zh) 2021-11-23
JP2016131245A (ja) 2016-07-21
KR20170093171A (ko) 2017-08-14
JP2020202409A (ja) 2020-12-17
KR101974763B1 (ko) 2019-05-02
TW202312423A (zh) 2023-03-16
US10199358B2 (en) 2019-02-05
TWI709221B (zh) 2020-11-01
WO2016114318A1 (ja) 2016-07-21
TW201639115A (zh) 2016-11-01
TW202107672A (zh) 2021-02-16
TWI838943B (zh) 2024-04-11
CN107112314B (zh) 2021-07-27

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