KR100539060B1 - 이방도전성접착제및접착용막 - Google Patents
이방도전성접착제및접착용막 Download PDFInfo
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- KR100539060B1 KR100539060B1 KR1019980044116A KR19980044116A KR100539060B1 KR 100539060 B1 KR100539060 B1 KR 100539060B1 KR 1019980044116 A KR1019980044116 A KR 1019980044116A KR 19980044116 A KR19980044116 A KR 19980044116A KR 100539060 B1 KR100539060 B1 KR 100539060B1
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- conductive particles
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Abstract
Description
Claims (12)
- 절연성 접착제 중에 도전입자가 분산된 이방(異方)도전성 접착제로서,상기 도전입자는 평균 입경(粒徑)이 상이한 2종 이상의 도전입자이고,이들 도전입자는 절연성 접착제에 불용성인 절연성 수지로 피복된 절연피복도전입자이고,평균 입경이 작은 도전입자의 K값이 350kg/㎟ 이상, 평균 입경이 큰 도전입자의 K값이 450kg/㎟ 이하이고, 평균 입경이 작은 도전입자의 K값이 평균 입경이 큰 도전입자의 K값보다 상대적으로 큰 것을 특징으로 하는 이방도전성 접착제.
- 절연성 접착제 중에 도전입자가 분산된 이방 도전성 접착제로서,상기 도전입자는 평균 입경이 상이한 2종 이상의 도전입자이고,이들 도전입자는 절연성 접착제에 불용성인 절연성 수지로 피복된 절연피복 도전입자이고,평균 입경이 작은 도전 입자 함유량/평균 입경이 큰 도전 입자의 함유량의 비는, 개수의 비로 1.1 내지 8의 범위인 것을 특징으로 하는 이방도전성 접착제.
- 절연성 접착제 중에 도전입자가 분산된 이방 도전성 접착제로서,상기 도전입자는 평균 입경이 상이한 2종 이상의 도전입자이고,이들 도전입자는 절연성 접착제에 불용성인 절연성 수지로 피복된 절연피복 도전입자이고,평균 입경이 3±0.5㎛와 5±0.5㎛인 2종류의 도전입자가 분산되어 이루어지는 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제3항 중 어느 한 항에 있어서,평균 입경이 상이한 2종 이상의 도전 입자가 가압에 의해 변형한 입자인 것을 특징으로 하는 이방 도전성 접착제.
- 제1항 내지 제3항 중 어느 한 항에 있어서,평균 입경이 작은 도전입자의 경도(硬度)가, 평균 입경이 큰 도전입자와 동등하거나, 그 이상의 경도를 가지는 것을 특징으로 하는 이방도전성 접착제.
- 제1항 내지 제3항 중 어느 한 항에 있어서,상기 접착제는 IC칩과 회로기판을 접속하는 IC칩 접속용인 것을 특징으로 하는 이방 도전성 접착제.
- 제1항 내지 제3항 중 어느 한 항에 있어서,IC칩에 형성된 4000㎛2 이하의 미소(微小)범프와 회로기판을 접속하는 IC칩 접속용인 것을 특징으로 하는 이방 도전성 접착제.
- 제1항 내지 제3항 중 어느 한 항에 따른 이방 도전성 접착제로 이루어지는 것을 특징으로 하는 이방도전성 접착용 막.
- 제8항에 있어서,IC칩과 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방 도전성 접착용 막.
- 제8항에 있어서,IC칩에 형성된 4000㎛2 이하의 미소범프와 회로기판과를 접속하는 IC칩 접속용인 것을 특징으로 하는 이방도전성 접착용 막.
- 제8항에 있어서,단위 면적당의 막 중에 함유되는 평균 입경이 작은 도전입자의 함유량이 30000∼80000개/㎟의 범위이고, 평균 입경이 큰 도전입자의 함유량이 10000∼30000개/㎟의 범위인 것을 특징으로 하는 이방 도전성 접착용 막.
- 제8항에 있어서,막의 두께가 접속을 행하는 IC칩의 범프 높이와 회로기판 상의 배선패턴의 높이를 합친 두께의 1배 내지 3배인 것을 특징으로 하는 이방 도전성 접착용 막.
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