KR101042869B1 - 이방도전성 접착 필름 및 접속체의 제조 방법 - Google Patents
이방도전성 접착 필름 및 접속체의 제조 방법 Download PDFInfo
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- KR101042869B1 KR101042869B1 KR1020080075794A KR20080075794A KR101042869B1 KR 101042869 B1 KR101042869 B1 KR 101042869B1 KR 1020080075794 A KR1020080075794 A KR 1020080075794A KR 20080075794 A KR20080075794 A KR 20080075794A KR 101042869 B1 KR101042869 B1 KR 101042869B1
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Abstract
Description
기재 | 입경 (㎛) |
입경 편차 (㎛) |
압축탄성률(kgf/㎟) | 회복률 (%) |
도금 | 돌출부의 수 | 배합량 (체적%) |
절연층(유무) | 도통저항 | 절연저항 | 에이징후 | ||
실시예 | 1 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
19.6 | 8.0 | 유 | 0 | 0 | 0 |
2 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
25.6 | 2.5 | 무 | 0 | 0 | 0 | |
3 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
20.0 | 2.5 | 무 | 0 | 0 | 0 | |
4 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 | 25.6 | 2.5 | 무 | 0 | 0 | 0 | |
5 | 아크릴로니트릴 스티렌 | 5 | ±1 | 480 | 30 | 니켈 /금 |
26.0 | 2.5 | 무 | 0 | 0 | 0 | |
6 | 벤조구아나민 | 5 | ±2 | 800 | 10 | 니켈 /금 |
26.0 | 2.5 | 무 | 0 | 0 | 0 | |
7 | 벤조구아나민 | 3 | ±1 | 800 | 10 | 니켈 /금 |
20.0 | 2.5 | 무 | 0 | 0 | 0 | |
8 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
25.6 | 8.0 | 유 | 0 | 0 | 0 | |
9 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
25.6 | 15.0 | 유 | 0 | 0 | 0 | |
비교예 | 1 | 스티렌 | 5 | ±1 | 400 | 0 | 니켈 /금 |
26.0 | 2.5 | 무 | △ | 0 | × |
2 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
0.8 | 2.5 | 무 | △ | 0 | × | |
3 | 벤조구아나민 | 5 | ±3 | 800 | 10 | 니켈 /금 |
26.0 | 2.5 | 무 | △ | △ | △ | |
4 | 스티렌 | 5 | ±1 | 80 | 0 | 니켈 /금 |
30.0 | 2.5 | 무 | △ | 0 | △ | |
5 | 벤조구아나민 | 2 | ±1 | 800 | 10 | 니켈 /금 |
18.0 | 2.5 | 무 | △ | 0 | △ | |
6 | 니켈 | 5 | ±1 | - | - | 금 | - | 2.5 | 무 | 0 | 0 | × | |
7 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
19.6 | 0.5 | 무 | △ | 0 | △ | |
8 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
19.6 | 20.0 | 유 | 0 | △ | 0 | |
9 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
19.6 | 8.0 | 무 | 0 | △ | 0 | |
10 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 /금 |
8.0 | 2.5 | 무 | △ | 0 | × |
Claims (5)
- 접속 단자간을 전기적으로 접속하기 위한 이방도전성 접착 필름 제조 방법으로서,수지 입자의 표면에 무전해 도금을 실시할 때의 처리 온도를 변화시킴으로써, 상기 수지 입자의 표면에, 금속으로 이루어진 돌출부를 갖는 도전성 박막을 형성하여 도전 입자를 준비하는 공정과,상기 도전 입자를 절연성 접착제 수지 용액에 분산시켜 도포용 페이스트를 조제하는 공정과,상기 도포용 페이스트를 기재 상에 필름상으로 도포하여 건조시키는 공정을 갖는, 이방도전성 접착 필름의 제조 방법.
- 삭제
- 제 1 항에 있어서,상기 도전성 박막의 표면의 돌출부의 높이가 0.01~3㎛ 인, 이방도전성 접착 필름의 제조 방법.
- 제 1 항에 있어서,상기 도전성 박막의 표면의 돌출부의 평균 개수가 4~300 개인, 이방도전성 접착 필름의 제조 방법.
- 표면에 산화막이 형성된 전극을 갖는 1 쌍의 전극을 접착함과 함께 상기 1 쌍의 전극을 전기적으로 접속하는 공정을 갖는 접속체의 제조 방법으로서,수지 입자의 표면에 무전해 도금을 실시할 때의 처리 온도를 변화시킴으로써, 금속으로 이루어진 돌출부를 갖는 도전성 박막을 상기 수지 입자의 표면에 형성한 도전 입자를 사용하고, 상기 도전 입자를 절연성 접착제 수지 용액에 분산시켜 도포용 페이스트를 조제하고, 또한 상기 도포용 페이스트를 기재 상에 필름상으로 도포하여 건조시킴으로써 이방도전성 접착 필름을 준비하는 공정과,상기 1 쌍의 전극 사이에 상기 이방도전성 접착 필름을 배치하고, 열압착을 실시하는 공정을 갖는, 접속체의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-1998-00369068 | 1998-12-25 | ||
JP36906898A JP3379456B2 (ja) | 1998-12-25 | 1998-12-25 | 異方導電性接着フィルム |
Related Parent Applications (1)
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KR1019990058641A Division KR100878175B1 (ko) | 1998-12-25 | 1999-12-17 | 이방도전성 접착필름 |
Related Child Applications (1)
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KR1020090082060A Division KR101086659B1 (ko) | 1998-12-25 | 2009-09-01 | 이방도전성 접착 필름 |
Publications (2)
Publication Number | Publication Date |
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KR20080075827A KR20080075827A (ko) | 2008-08-19 |
KR101042869B1 true KR101042869B1 (ko) | 2011-06-20 |
Family
ID=18493480
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Application Number | Title | Priority Date | Filing Date |
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KR1019990058641A KR100878175B1 (ko) | 1998-12-25 | 1999-12-17 | 이방도전성 접착필름 |
KR1020080075794A KR101042869B1 (ko) | 1998-12-25 | 2008-08-01 | 이방도전성 접착 필름 및 접속체의 제조 방법 |
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KR1019990058641A KR100878175B1 (ko) | 1998-12-25 | 1999-12-17 | 이방도전성 접착필름 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6344156B1 (ko) |
JP (1) | JP3379456B2 (ko) |
KR (2) | KR100878175B1 (ko) |
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Also Published As
Publication number | Publication date |
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KR20080075827A (ko) | 2008-08-19 |
US6344156B1 (en) | 2002-02-05 |
KR20000048223A (ko) | 2000-07-25 |
JP2000195339A (ja) | 2000-07-14 |
JP3379456B2 (ja) | 2003-02-24 |
KR100878175B1 (ko) | 2009-01-12 |
US20020014615A1 (en) | 2002-02-07 |
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