KR20000048223A - 이방도전성 접착필름 - Google Patents
이방도전성 접착필름 Download PDFInfo
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- KR20000048223A KR20000048223A KR1019990058641A KR19990058641A KR20000048223A KR 20000048223 A KR20000048223 A KR 20000048223A KR 1019990058641 A KR1019990058641 A KR 1019990058641A KR 19990058641 A KR19990058641 A KR 19990058641A KR 20000048223 A KR20000048223 A KR 20000048223A
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- South Korea
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- adhesive film
- thin film
- anisotropic conductive
- conductive adhesive
- film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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Abstract
Description
기재 | 입경(㎛) | 입경편차(㎛) | 압축탄성률(kgf/㎟) | 회복률(%) | 도금 | 돌출부의 수 | 배합량(체적%) | 절연층(유무) | 도통저항 | 절연저항 | 에이징후 | ||
실시예 | 1 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 19.6 | 8.0 | 유 | 0 | 0 | 0 |
2 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 25.6 | 2.5 | 무 | 0 | 0 | 0 | |
3 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 20.0 | 2.5 | 무 | 0 | 0 | 0 | |
4 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈 | 25.6 | 2.5 | 무 | 0 | 0 | 0 | |
5 | 아크릴로니트릴 스티렌 | 5 | ±1 | 480 | 30 | 니켈/금 | 26.0 | 2.5 | 무 | 0 | 0 | 0 | |
6 | 벤조구아나민 | 5 | ±2 | 800 | 10 | 니켈/금 | 26.0 | 2.5 | 무 | 0 | 0 | 0 | |
7 | 벤조구아나민 | 3 | ±1 | 800 | 10 | 니켈/금 | 20.0 | 2.5 | 무 | 0 | 0 | 0 | |
8 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 25.6 | 8.0 | 유 | 0 | 0 | 0 | |
9 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 25.6 | 15.0 | 유 | 0 | 0 | 0 | |
비교예 | 1 | 스티렌 | 5 | ±1 | 400 | 0 | 니켈/금 | 26.0 | 2.5 | 무 | △ | 0 | × |
2 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 0.8 | 2.5 | 무 | △ | 0 | × | |
3 | 벤조구아나민 | 5 | ±3 | 800 | 10 | 니켈/금 | 26.0 | 2.5 | 무 | △ | △ | △ | |
4 | 스티렌 | 5 | ±1 | 80 | 0 | 니켈/금 | 30.0 | 2.5 | 무 | △ | 0 | △ | |
5 | 벤조구아나민 | 2 | ±1 | 800 | 10 | 니켈/금 | 18.0 | 2.5 | 무 | △ | 0 | △ | |
6 | 니켈 | 5 | ±1 | - | - | 금 | - | 2.5 | 무 | 0 | 0 | × | |
7 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 19.6 | 0.5 | 무 | △ | 0 | △ | |
8 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 19.6 | 20.0 | 유 | 0 | △ | 0 | |
9 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 19.6 | 8.0 | 무 | 0 | △ | 0 | |
10 | 벤조구아나민 | 5 | ±1 | 800 | 10 | 니켈/금 | 8.0 | 2.5 | 무 | △ | 0 | × |
Claims (11)
- 접속단자간을 전기적으로 접속하기 위한 이방도전성 접착필름으로써,필름상으로 형성된 절연성 접착제와,그 절연성 접착제중에 분산되고, 수지입자의 표면에 도전성 박막을 가지며 그 도전성 박막의 표면에 돌출부가 형성된 도전입자를 갖는 것을 특징으로 하는 이방도전성 접착필름.
- 제 1 항에 있어서, 상기 수지입자의 경도가 10 % 압축변형시의 K 값으로 1 ×102∼ 2 ×103kgf/㎟ 인 것을 특징으로 하는 이방도전성 접착필름.
- 제 1 항에 있어서, 상기 수지입자의 10 % 압축변형시의 회복률이 5 % 이상인 것을 특징으로 하는 이방도전성 접착필름.
- 제 1 항에 있어서, 상기 도전성 박막의 압축탄성률이 1.5 ×104kgf/㎟ 이상인 것을 특징으로 하는 이방도전성 접착필름.
- 제 2 항에 있어서, 상기 수지입자의 10 % 압축변형시의 회복률이 5 % 이상인 것을 특징으로 하는 이방도전성 접착필름.
- 제 2 항 또는 3 항에 있어서, 상기 도전성 박막의 압축탄성률이 1.5 ×104kgf/㎟ 이상인 것을 특징으로 하는 이방도전성 접착필름.
- 접속단자간을 전기적으로 접속하기 위한 이방도전성 접착필름으로써,필름상으로 형성된 절연성 접착제와,그 절연성 접착제중에 분산되고 수지입자의 표면에 도전성 박막을 가지며 그 도전성 박막의 표면에 돌출부가 형성된 도전입자를 가지며,상기 수지입자의 경도가 10 % 압축변형시의 K 값으로 1 ×102∼ 2 ×103kgf/㎟ 임과 동시에, 상기 수지입자의 10 % 압축변형시의 회복률이 5 % 이상이며, 또한 상기 도전성 박막의 압축탄성률이 1.5 ×104kgf/㎟ 이상인 것을 특징으로 하는 이방도전성 접착필름.
- 제 1 항 또는 7 항에 있어서, 상기 도전성 박막의 표면의 돌출부의 높이가 0.01 ∼ 3 ㎛ 인 것을 특징으로 하는 이방도전성 접착필름.
- 제 1 항 또는 7 항에 있어서, 상기 도전성 박막의 표면의 돌출부의 평균개수가 4 ∼ 300 개인 것을 특징으로 하는 이방도전성 접착필름.
- 제 1 항 또는 7 항에 있어서, 상기 도전입자의 배합량이 1 ∼ 15 체적% 인 것을 특징으로 하는 이방도전성 접착필름.
- 제 1 항 또는 7 항에 있어서, 상기 도전입자의 도전성 박막의 표면에 절연층이 형성되어 있는 것을 특징으로 하는 이방도전성 접착필름.
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JP36906898A JP3379456B2 (ja) | 1998-12-25 | 1998-12-25 | 異方導電性接着フィルム |
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KR1019990058641A KR100878175B1 (ko) | 1998-12-25 | 1999-12-17 | 이방도전성 접착필름 |
KR1020080075794A KR101042869B1 (ko) | 1998-12-25 | 2008-08-01 | 이방도전성 접착 필름 및 접속체의 제조 방법 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100538956B1 (ko) * | 2000-02-22 | 2005-12-26 | 소니 케미카루 가부시키가이샤 | 접속재료 |
KR100597391B1 (ko) * | 2004-05-12 | 2006-07-06 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 함유하는 이방 전도성 접착필름 |
US8057894B2 (en) | 2004-10-22 | 2011-11-15 | Toray Advanced Materials Korea, Inc. | Adhesive tape for electronic components |
KR100650284B1 (ko) * | 2005-02-22 | 2006-11-27 | 제일모직주식회사 | 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료 |
US7960023B2 (en) | 2007-03-13 | 2011-06-14 | Toray Advanced Materials Korea Inc. | Adhesive film for stacking semiconductor chips |
KR101435307B1 (ko) * | 2011-01-19 | 2014-08-27 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
Also Published As
Publication number | Publication date |
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US6344156B1 (en) | 2002-02-05 |
KR100878175B1 (ko) | 2009-01-12 |
JP2000195339A (ja) | 2000-07-14 |
KR20080075827A (ko) | 2008-08-19 |
US20020014615A1 (en) | 2002-02-07 |
KR101042869B1 (ko) | 2011-06-20 |
JP3379456B2 (ja) | 2003-02-24 |
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