JP2016131245A - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
JP2016131245A
JP2016131245A JP2016004538A JP2016004538A JP2016131245A JP 2016131245 A JP2016131245 A JP 2016131245A JP 2016004538 A JP2016004538 A JP 2016004538A JP 2016004538 A JP2016004538 A JP 2016004538A JP 2016131245 A JP2016131245 A JP 2016131245A
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JP
Japan
Prior art keywords
semiconductor substrate
electrodes
conductive particles
substrate
electrode
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Pending
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JP2016004538A
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English (en)
Japanese (ja)
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JP2016131245A5 (enExample
Inventor
恭志 阿久津
Yasushi Akutsu
恭志 阿久津
朋之 石松
Tomoyuki Ishimatsu
朋之 石松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of JP2016131245A publication Critical patent/JP2016131245A/ja
Publication of JP2016131245A5 publication Critical patent/JP2016131245A5/ja
Pending legal-status Critical Current

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    • H10W72/851—
    • H10W72/012—
    • H10W72/20—
    • H10W72/30—
    • H10W90/00—
    • H10W46/00—
    • H10W46/301—
    • H10W72/01204—
    • H10W72/01212—
    • H10W72/013—
    • H10W72/01304—
    • H10W72/01361—
    • H10W72/072—
    • H10W72/07223—
    • H10W72/07232—
    • H10W72/07253—
    • H10W72/07254—
    • H10W72/073—
    • H10W72/07323—
    • H10W72/07332—
    • H10W72/07338—
    • H10W72/07354—
    • H10W72/074—
    • H10W72/223—
    • H10W72/224—
    • H10W72/225—
    • H10W72/234—
    • H10W72/244—
    • H10W72/247—
    • H10W72/252—
    • H10W72/253—
    • H10W72/255—
    • H10W72/261—
    • H10W72/325—
    • H10W72/347—
    • H10W72/353—
    • H10W72/354—
    • H10W72/823—
    • H10W74/15—
    • H10W90/26—
    • H10W90/288—
    • H10W90/291—
    • H10W90/297—
    • H10W90/722—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W99/00—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
JP2016004538A 2015-01-13 2016-01-13 多層基板 Pending JP2016131245A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015004595 2015-01-13
JP2015004595 2015-01-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020161099A Division JP7207382B2 (ja) 2015-01-13 2020-09-25 多層基板

Publications (2)

Publication Number Publication Date
JP2016131245A true JP2016131245A (ja) 2016-07-21
JP2016131245A5 JP2016131245A5 (enExample) 2019-02-21

Family

ID=56405859

Family Applications (2)

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JP2016004538A Pending JP2016131245A (ja) 2015-01-13 2016-01-13 多層基板
JP2020161099A Active JP7207382B2 (ja) 2015-01-13 2020-09-25 多層基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020161099A Active JP7207382B2 (ja) 2015-01-13 2020-09-25 多層基板

Country Status (6)

Country Link
US (1) US10199358B2 (enExample)
JP (2) JP2016131245A (enExample)
KR (1) KR101974763B1 (enExample)
CN (2) CN113690209B (enExample)
TW (3) TWI786440B (enExample)
WO (1) WO2016114318A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018185175A (ja) * 2017-04-24 2018-11-22 デクセリアルズ株式会社 検査冶具の製造方法
US11456323B2 (en) 2017-10-20 2022-09-27 Sony Semiconductor Solutions Corporation Imaging unit
US12066458B2 (en) 2016-11-30 2024-08-20 Dexerials Corporation Conductive particle-disposed film having conductive particles disposed within an elastomer film, method for producing the same, test probe unit, and continuity test method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
TWI826476B (zh) * 2018-06-26 2023-12-21 日商力森諾科股份有限公司 各向異性導電膜及其製造方法以及連接結構體的製造方法
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
JP7125547B2 (ja) * 2018-12-29 2022-08-24 深南電路股▲ふん▼有限公司 多様に組み立て可能なプリント基板及びその製造方法
KR20220112922A (ko) * 2021-02-05 2022-08-12 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JP2002110897A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 半導体装置およびその製造方法
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
WO2007036994A1 (ja) * 2005-09-28 2007-04-05 Spansion Llc 半導体装置およびその製造方法並びにフィルムの製造方法
JP2010251547A (ja) * 2009-04-16 2010-11-04 Elpida Memory Inc 半導体装置及びその製造方法

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234773A (ja) 1985-08-02 1987-02-14 Honda Motor Co Ltd 研削盤における砥石ストツク装置
JPH0334064Y2 (enExample) * 1985-08-21 1991-07-18
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
JP2748713B2 (ja) * 1991-03-29 1998-05-13 日立化成工業株式会社 接続部材
JPH08330736A (ja) 1995-06-01 1996-12-13 Toray Ind Inc 多層基板およびその製造方法
JPH1056099A (ja) * 1996-08-12 1998-02-24 Shinko Electric Ind Co Ltd 多層回路基板およびその製造方法
KR100539060B1 (ko) * 1997-10-28 2007-04-25 소니 케미카루 가부시키가이샤 이방도전성접착제및접착용막
JP3624818B2 (ja) * 1999-10-12 2005-03-02 ソニーケミカル株式会社 異方性導電接続材料、接続体、およびその製造方法
JP2001237365A (ja) 2000-02-23 2001-08-31 Seiko Epson Corp 接続用端子の接合方法、半導体装置の製造方法および半導体装置
JPWO2003003798A1 (ja) 2001-06-29 2004-10-21 東レエンジニアリング株式会社 異方導電性接着剤を用いた接合方法
JP2003204135A (ja) * 2002-09-20 2003-07-18 Canon Inc マルチチップモジュール、及びディスプレイパネル
JP3740469B2 (ja) * 2003-01-31 2006-02-01 株式会社東芝 半導体装置および半導体装置の製造方法
JP4340517B2 (ja) 2003-10-30 2009-10-07 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP2006310082A (ja) 2005-04-28 2006-11-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
KR100987688B1 (ko) * 2005-10-14 2010-10-13 가부시키가이샤후지쿠라 프린트 배선 기판 및 프린트 배선 기판의 제조 방법
WO2007060812A1 (ja) * 2005-11-22 2007-05-31 Sony Corporation 半導体装置および半導体装置の製造方法
KR100777255B1 (ko) 2006-04-18 2007-11-20 중앙대학교 산학협력단 이방성 도전 필름 및 이를 이용한 전자부품의 실장방법
JP2006339160A (ja) 2006-06-02 2006-12-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
US8834170B2 (en) * 2006-11-06 2014-09-16 University Of Florida Research Foundation, Inc. Devices and methods for utilizing mechanical surgical devices in a virtual environment
JP4872663B2 (ja) * 2006-12-28 2012-02-08 株式会社日立製作所 接合用材料及び接合方法
KR100842921B1 (ko) * 2007-06-18 2008-07-02 주식회사 하이닉스반도체 반도체 패키지의 제조 방법
KR20090011568A (ko) * 2007-07-26 2009-02-02 주식회사 하이닉스반도체 반도체 패키지 및 그의 제조 방법
JP5291917B2 (ja) * 2007-11-09 2013-09-18 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN101960591A (zh) * 2008-03-28 2011-01-26 日本电气株式会社 半导体装置、其制造方法、印刷电路板及电子设备
US8334170B2 (en) * 2008-06-27 2012-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for stacking devices
US8097953B2 (en) * 2008-10-28 2012-01-17 Taiwan Semiconductor Manufacturing Company, Ltd. Three-dimensional integrated circuit stacking-joint interface structure
US8674482B2 (en) * 2008-11-18 2014-03-18 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Semiconductor chip with through-silicon-via and sidewall pad
JP4730426B2 (ja) * 2008-11-19 2011-07-20 ソニー株式会社 実装基板及び半導体モジュール
KR20100079183A (ko) * 2008-12-30 2010-07-08 주식회사 동부하이텍 반도체 패키지 장치와 그 제조 방법
US8647923B2 (en) * 2009-04-06 2014-02-11 Canon Kabushiki Kaisha Method of manufacturing semiconductor device
JP2010272737A (ja) 2009-05-22 2010-12-02 Elpida Memory Inc 半導体装置の製造方法
JP4825286B2 (ja) * 2009-08-07 2011-11-30 ナミックス株式会社 多層配線板の製造方法
JP5595708B2 (ja) * 2009-10-09 2014-09-24 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその調整方法並びにデータ処理システム
JP5271886B2 (ja) * 2009-12-08 2013-08-21 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8232137B2 (en) * 2009-12-10 2012-07-31 Intersil Americas Inc. Heat conduction for chip stacks and 3-D circuits
US8048721B2 (en) * 2010-03-18 2011-11-01 Powertech Technology Inc. Method for filling multi-layer chip-stacked gaps
JP2011222553A (ja) * 2010-04-02 2011-11-04 Denso Corp 半導体チップ内蔵配線基板及びその製造方法
JP2011243725A (ja) * 2010-05-18 2011-12-01 Elpida Memory Inc 半導体装置の製造方法
US9030024B2 (en) * 2010-06-17 2015-05-12 Conversant Intellectual Property Management Inc. Semiconductor device with through-silicon vias
US8445918B2 (en) * 2010-08-13 2013-05-21 International Business Machines Corporation Thermal enhancement for multi-layer semiconductor stacks
KR20120032254A (ko) * 2010-09-28 2012-04-05 삼성전자주식회사 반도체 적층 패키지 및 이의 제조 방법
WO2012073417A1 (ja) * 2010-12-01 2012-06-07 パナソニック株式会社 電子部品実装体、電子部品、基板
JP5167335B2 (ja) * 2010-12-22 2013-03-21 株式会社日立製作所 半導体装置
KR101817156B1 (ko) * 2010-12-28 2018-01-10 삼성전자 주식회사 관통 전극을 갖는 적층 구조의 반도체 장치, 반도체 메모리 장치, 반도체 메모리 시스템 및 그 동작방법
JP5932267B2 (ja) * 2011-08-31 2016-06-08 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置及びその製造方法
JP5780228B2 (ja) * 2011-11-11 2015-09-16 住友ベークライト株式会社 半導体装置の製造方法
KR101784507B1 (ko) 2011-12-14 2017-10-12 에스케이하이닉스 주식회사 반도체 적층 패키지 및 제조 방법, 이를 포함하는 전자 시스템
CN103988289A (zh) * 2011-12-16 2014-08-13 旭化成电子材料株式会社 带各向异性导电薄膜的半导体芯片、带各向异性导电薄膜的半导体晶片、以及半导体装置
JP2013183120A (ja) * 2012-03-05 2013-09-12 Elpida Memory Inc 半導体装置
WO2014034741A1 (ja) 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6058336B2 (ja) * 2012-09-28 2017-01-11 ルネサスエレクトロニクス株式会社 半導体装置
KR20140099604A (ko) * 2013-02-04 2014-08-13 삼성전자주식회사 적층 패키지 및 적층 패키지의 제조 방법
KR20150005113A (ko) * 2013-07-04 2015-01-14 에스케이하이닉스 주식회사 광학 신호 경로를 포함하는 반도체 패키지
KR102084540B1 (ko) * 2013-10-16 2020-03-04 삼성전자주식회사 반도체 패키지 및 그 제조방법
JP2015177062A (ja) * 2014-03-14 2015-10-05 株式会社東芝 半導体装置の製造方法および半導体装置
US9349670B2 (en) * 2014-08-04 2016-05-24 Micron Technology, Inc. Semiconductor die assemblies with heat sink and associated systems and methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JP2002110897A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 半導体装置およびその製造方法
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
WO2007036994A1 (ja) * 2005-09-28 2007-04-05 Spansion Llc 半導体装置およびその製造方法並びにフィルムの製造方法
JP2010251547A (ja) * 2009-04-16 2010-11-04 Elpida Memory Inc 半導体装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12066458B2 (en) 2016-11-30 2024-08-20 Dexerials Corporation Conductive particle-disposed film having conductive particles disposed within an elastomer film, method for producing the same, test probe unit, and continuity test method
JP2018185175A (ja) * 2017-04-24 2018-11-22 デクセリアルズ株式会社 検査冶具の製造方法
JP7042037B2 (ja) 2017-04-24 2022-03-25 デクセリアルズ株式会社 検査冶具の製造方法
US11456323B2 (en) 2017-10-20 2022-09-27 Sony Semiconductor Solutions Corporation Imaging unit

Also Published As

Publication number Publication date
JP7207382B2 (ja) 2023-01-18
CN113690209B (zh) 2025-07-25
US20180026012A1 (en) 2018-01-25
CN107112314A (zh) 2017-08-29
CN113690209A (zh) 2021-11-23
KR20170093171A (ko) 2017-08-14
TWI786440B (zh) 2022-12-11
JP2020202409A (ja) 2020-12-17
KR101974763B1 (ko) 2019-05-02
TW202312423A (zh) 2023-03-16
US10199358B2 (en) 2019-02-05
TWI709221B (zh) 2020-11-01
WO2016114318A1 (ja) 2016-07-21
TW201639115A (zh) 2016-11-01
TW202107672A (zh) 2021-02-16
TWI838943B (zh) 2024-04-11
CN107112314B (zh) 2021-07-27

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