TW202312423A - 多層基板 - Google Patents
多層基板 Download PDFInfo
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- TW202312423A TW202312423A TW111142394A TW111142394A TW202312423A TW 202312423 A TW202312423 A TW 202312423A TW 111142394 A TW111142394 A TW 111142394A TW 111142394 A TW111142394 A TW 111142394A TW 202312423 A TW202312423 A TW 202312423A
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Abstract
本發明提供一種多層基板,積層有具有貫通電極之半導體基板,導通特性優異,且可低成本地製造。於俯視多層基板時,導電粒子選擇性地存在於貫通電極對向之位置。多層基板具有如下連接構造:對向之貫通電極藉由導電粒子而連接,形成有該貫通電極之半導體基板彼此藉由絕緣接著劑而接著。
Description
本發明係關於一種多層基板。
於IC之高密度安裝領域中,使用將組裝有IC等電子零件之半導體基板積層而成之多層基板。
作為多層基板之製造方法,存在將具有凸塊之貫通電極形成於各個半導體基板,藉由凸塊之回焊將對向之半導體基板的貫通電極彼此連接之方法(專利文獻1);或於對向之半導體基板之間,夾持絕緣接著劑層中分散有導電粒子之各向異性導電膜,進行加熱加壓而將貫通電極彼此連接之方法(專利文獻2)。
先前技術文獻
專利文獻
專利文獻1:日本特開2010-272737號公報
專利文獻2:日本特開平8-330736號公報
[發明所欲解決之課題]
然而,於各個半導體基板之貫通電極形成凸塊,將對向之半導體基板的貫通電極藉由焊料之回焊而連接,從而將半導體基板積層之方法的製造步驟繁雜。
將對向之貫通電極使用各向異性導電膜而連接且將半導體基板積層之方法中,雖可簡化多層基板之製造步驟,但由於各向異性導電膜係於絕緣接著劑層無規地分散有導電粒子者,故而存在如下問題:由於有各向異性導電膜之導電粒子未被充分夾持於對向之半導體基板的貫通電極間之情形,而導致導通特性不均。另一方面,亦存在如下問題:由於無助於貫通電極之連接的導電粒子大量存在於對向之半導體基板間,無用之導電粒子會花費成本。
因此,本發明之課題在於利用簡便之製造步驟,低成本地提供一種使用各向異性導電膜將半導體基板積層,且導通特性優異之多層基板。
[解決課題之技術手段]
本發明人於使用各向異性導電膜將半導體基板積層而製造多層基板時,發現若對應於半導體基板之貫通電極的配置而選擇性地配置各向異性導電膜之絕緣接著劑中的導電粒子,則可將對向之半導體基板之貫通電極利用導電粒子確實地連接,又,使無助於連接之導電粒子數量減少而降低多層基板之製造成本,從而思及本發明。
即,本發明提供一種多層基板,積層有具有貫通電極之半導體基板,
於俯視多層基板時,導電粒子選擇性地存在於貫通電極對向之位置,
該多層基板具有如下連接構造:對向之貫通電極藉由導電粒子而連接,形成有該貫通電極之半導體基板彼此藉由絕緣接著劑而接著。
作為該多層基板,尤其是提供如下態樣:積層有具有貫通電極之第1半導體基板與具有貫通電極之第2半導體基板,
該多層基板具有如下連接構造:第1半導體基板之貫通電極與第2半導體基板之貫通電極對向,藉由選擇性地配置於該等之間的導電粒子而連接,
第1半導體基板與第2半導體基板藉由絕緣接著劑而接著。
又,本發明提供一種多層基板之製造方法,其使形成於半導體基板之貫通電極彼此對向而接合,該方法將各向異性導電膜夾持於具有貫通電極之半導體基板彼此之間,對該各向異性導電膜進行加熱加壓,藉此,將該等半導體基板進行各向異性導電連接,該各向異性導電膜對應於貫通電極對向之部分於俯視多層基板時的位置而於絕緣接著劑層選擇性地配置有導電粒子。
作為該多層基板之製造方法,尤其是提供如下態樣:將具有貫通電極之第1半導體基板與具有貫通電極之第2半導體基板以使該等之貫通電極彼此對向的方式進行接合,於第1半導體基板與第2半導體基板之間,夾持各向異性導電膜,對該各向異性導電膜進行加熱加壓,藉此,將第1半導體基板與第2半導體基板進行各向異性導電連接,該各向異性導電膜對應於貫通電極之配置而於絕緣接著劑層選擇性地配置有導電粒子。
進而,作為於上述多層基板之製造方法中使用之各向異性導電膜,本發明提供一種各向異性導電膜,其含有絕緣接著劑層與配置於該絕緣接著劑層之導電粒子,該各向異性導電膜對應於利用各向異性導電膜連接之貫通電極之配置而於絕緣接著劑層選擇性地配置有導電粒子。
又,作為對上述多層基板之製造方法有用之各向異性導電膜,提供一種各向異性導電膜,其含有絕緣接著劑層與配置於該絕緣接著劑層之導電粒子,該各向異性導電膜形成有2個以上之導電粒子靠近之導電粒子單元,
於該導電粒子單元中,任意之導電粒子與最靠近於該導電粒子的導電粒子之距離為導電粒子直徑之0.2~0.5倍。
[發明之效果]
根據本發明之多層基板,由於半導體基板之貫通電極彼此藉由導電粒子而確實地連接,故而導通特性穩定,且由於無助於連接之導電粒子於半導體基板間減少,故而抑制多層基板之製造成本。又,因同樣之原因,而亦對削減儀器人-時(instrumentation man-hour)有效果。
本發明之多層基板藉由使用導電粒子選擇性地配置於特定之位置的各向異性導電膜,可利用簡便之步驟製造。
尤其於藉由本發明之方法製造積層3片以上的半導體基板而成之多層基板之情形時,若於積層之半導體基板間使用共用之各向異性導電膜,則可大幅削減多層基板之總製造成本。因此,能夠以低價格提供本發明之多層基板。
以下,一面參照圖式一面對本發明詳細地進行說明。再者,於各圖中,相同符號表示相同或同等之構成要素。
<多層基板之連接構造>
圖1係本發明之一實施態樣的多層基板1A之剖視圖。
該多層基板1A於配線基板2積層有3層半導體基板3A、3B、3C,各半導體基板3A、3B、3C係形成有IC等半導體零件之半導體晶圓。於配線基板2形成有貫通電極4X,於各半導體基板3A、3B、3C形成有貫通電極4A、4B、4C。而且,於貫通電極4X露出於配線基板2之表面之部分、或貫通電極4A、4B、4C露出於半導體基板之表面之部分,分別形成有電極墊。再者,於本發明中,作為半導體基板3A、3B、3C,亦可使用半導體晶片。又,於本發明中,構成多層基板之半導體基板之積層數量並無特別限制。
多層基板1A有如下連接構造:配線基板2之貫通電極4X與第1半導體基板3A之貫通電極4A對向,該等貫通電極4X、4A藉由選擇性地配置於該等之間的導電粒子11而電連接。又,有如下連接構造:第1半導體基板3A之貫通電極4A與第2半導體基板3B之貫通電極4B對向,該等貫通電極4A、4B藉由選擇性地配置於該等之間的導電粒子11而電連接。
於該連接構造中,所謂導電粒子11選擇性地配置於貫通電極4A、4B對向之部位,係指導電粒子11主要存在於貫通電極4A、4B之對向面或其附近,且由貫通電極4A、4B之對向面捕捉1個以上之導電粒子11。就成本之方面而言,貫通電極4A、4B之對向面的捕捉數量較佳為1個~數個。於使用各向異性導電膜而於貫通電極4A、4B之對向面配置多個導電粒子之情形時,可緩和半導體基板3A、3B與導電粒子11之位置對準之精度。另一方面,就導通穩定性之方面而言,較佳將貫通電極4A、4B之對向面的捕捉數量設為10個以上。於使用各向異性導電膜於貫通電極4A、4B之對向面配置導電粒子之情形時,為了更穩定地捕捉導電粒子,亦可於各向異性導電膜之對應之部位配置欲由貫通電極4A、4B的對向面捕捉之所需的導電粒子數量之等倍至數倍之導電粒子。藉由此方式行,可緩和位置對準之精度,且亦可期待削減半導體基板之製造所需要的時間之效果。
第1半導體基板3A與第2半導體基板3B之對向面彼此係藉由絕緣接著劑12而接著。絕緣接著劑12係由下述各向異性導電膜10A之絕緣接著劑層形成。
與第1半導體基板3A之貫通電極4A連接的第2半導體基板3B之貫通電極4B於第3半導體基板3C側,亦與第3半導體基板3C之貫通電極4C對向,藉由選擇性地配置於該等之間的導電粒子11而將第2半導體基板3B之貫通電極4B與第3半導體基板3C之貫通電極4C電連接。該第2半導體基板3B與第3半導體基板3C之對向面彼此亦藉由絕緣接著劑12而接著。
如此,多層基板1A具有配線基板2之貫通電極4X與3層半導體基板之貫通電極4A、4B、4C於多層基板之積層方向直線狀地相連之連接構造。根據該直線狀地相連之連接構造,電性傳輸之路徑變短,故而可提高傳輸速度。
<多層基板之導電粒子>
多層基板1A係如下所述,藉由使用導電粒子具有特定配置之本發明之各向異性導電膜,將構成多層基板之各層連接而製造。各向異性導電膜之導電粒子11的粒徑大小通常小於貫通電極4A、4B之對向面的直徑,但於多層基板1A中,由於導電粒子11自最初之形狀壓潰,故而粒徑之大小亦可成為與貫通電極4A、4B之對向面的直徑相同之程度。其意味著壓潰之導電粒子11既可收納於貫通電極4A、4B之對向面內,亦可為外周部之至少一部分自貫通電極4A、4B之對向面伸出之狀態。再者,根據導電粒子11之構成素材不同,亦存在導電粒子11於多層基板1A中亦維持粒子形狀之情形。
於多層基板1A之第1半導體基板3A與第2半導體基板3B之間,如上所述,導電粒子11選擇性地存在於貫通電極4A、4B對向之部位,大部分導電粒子11被對向之貫通電極4A、4B捕捉。因此,即便存在未被對向之貫通電極4A、4B捕捉之導電粒子11,此種導電粒子11之數量亦較佳為存在於第1半導體基板3A與第2半導體基板3B之間的導電粒子之總數的5%以下,更佳為0.5%以下。尤其較佳導電粒子11之大致全部由貫通電極4A、4B捕捉。於構成多層基板1A之其他半導體基板間亦相同。藉由以此方式減少無助於貫通電極4A、4B、4C之連接之導電粒子11,可容易地模擬分析性能,削減改善工時。
<配線基板>
此處,作為構成多層基板1A之配線基板2,可使用FR4等環氧玻璃基板等。作為配線基板2,亦可使用IC晶片或IC形成用之矽晶圓。配線基板2係根據多層基板1A之用途等而適當選擇。
於配線基板2之電極部分,根據需要設置有焊料球5。
<半導體基板>
作為半導體基板3A、3B、3C,只要具有貫通電極4A、4B、4C,則並無特別限制,例如,可使用矽等一般之半導體材料。
貫通電極4A、4B、4C之規格可適當設定。例如,貫通電極4A、4B、4C既可為具備電極墊者,亦可為具備凸塊者。但是,於將半導體基板3A、3B、3C積層之情形時,使用將各半導體基板3A、3B、3C之貫通電極4A、4B、4C以於多層基板1A之厚度方向跨及至少2層半導體基板而直線狀地相連之方式,較佳以跨及多層基板1A之正面背面而直線狀地相連之方式進行配置者。
<搭載零件>
於本發明之多層基板,可根據需要搭載各種零件。
例如,圖2所示之多層基板1B具有各層之貫通電極4X、4A、4B、4C直線狀地相連之連接構造,且於最外層具有連接於貫通電極4C之散熱用的散熱器(heat sink)6。因此,多層基板1B能夠將自形成於配線基板2或半導體基板3A、3B、3C之IC等電子零件等釋放之熱利用散熱器6有效率地散熱。
<多層基板之製造方法>
作為本發明之多層基板之製造方法,例如,於圖2之多層基板1B之情形時,首先,如圖3A所示,於具有貫通電極4X之配線基板2與具有貫通電極4A之半導體基板3A之間,夾持本發明之各向異性導電膜10A,並對各向異性導電膜10A進行加熱加壓,藉此將配線基板2與第1半導體基板3A進行各向異性導電性連接,獲得圖3B所示之2層連接構造體,該各向異性導電膜10A對應於待連接之貫通電極4X、4A之配置而於絕緣接著劑層12選擇性地配置有導電粒子11。更具體而言,使配線基板2與各向異性導電膜10A以待連接之貫通電極4X與導電粒子11的配置吻合之方式進行位置對準並重疊,進而使第1半導體基板3A亦同樣地進行位置對準並重疊,進行加熱加壓而將該等進行各向異性導電性連接。
同樣地,如圖3C所示,使第1半導體基板3A與各向異性導電膜10B進行位置對準並重疊,於其上使第2半導體基板3B進行位置對準並重疊,進行加熱加壓而進行各向異性導電性連接,獲得圖3D所示之3層連接構造。進而,同樣地於第2半導體基板3B之上使各向異性導電膜與第3半導體基板3C進行位置對準並重疊,進行加熱加壓。該位置對準亦可藉由使用CCD等觀測各向異性導電膜之與貫通電極對應的導電粒子(於如下所述形成有導電粒子單元之情形時,為構成該導電粒子單元之導電粒子)與貫通電極,使該等重疊而進行。
然後,於第3半導體基板3C上藉由導熱性帶等而連接散熱器6,於配線基板2之電極墊形成焊料球5,藉由常規方法而獲得多層基板1B。或者,亦可設置導電粒子代替焊料球5。
再者,作為配線基板2或半導體基板3A、3B、3C與各向異性導電膜10A、10B之位置對準之方法,亦可藉由於配線基板2、半導體基板3A、3B、3C及各向異性導電膜10A、10B分別預先標註調正標示(alignment mark),對準該等調正標示以進行位置對準。
即,以往於將半導體基板積層而製造多層基板之情形時,作為一例,於半導體基板形成數十μm~數百μm之大小之調正標示,使用CCD或雷射而進行半導體基板彼此之位置對準。另一方面,由於在各向異性導電膜,導電粒子係單分散(monodispersed)或格子狀地配置,故而未於各向異性導電膜標註調正標示。與此相對,本發明中所使用之各向異性導電膜對應於待連接之貫通電極的配置而於絕緣接著劑層12選擇性地配置有導電粒子11,故而可將導電粒子11之配置作為調正標示之代替。較佳於各向異性導電膜設置一些亦包括此種導電粒子之配置在內之調正標示。
<各向異性導電膜>
用於本發明之多層基板的製造方法之本發明之各向異性導電膜對應於待連接之貫通電極的配置而於絕緣接著劑層12選擇性地配置有導電粒子11,較佳藉由導電粒子11而形成有調正標示。作為調正標示,較佳為藉由導電粒子之配置而形成者。藉此,可明確地檢測調正標示,且無需追加用以於各向異性導電膜標註調正標示之新的步驟。另一方面,調正標示亦可藉由利用雷射照射等使絕緣接著劑層12局部硬化而形成。藉此,容易變更標註調正標示之位置。
作為此種各向異性導電膜之製造方法,藉由對金屬板進行機械加工、雷射加工、光蝕刻等公知之加工方法而製作具有與導電粒子11之配置對應的凸部之模具,對該模具填充硬化性樹脂,使之硬化,藉此製造凹凸反轉之樹脂模具,將導電粒子放入至該樹脂模具之凹部,於其上填充絕緣接著劑層形成用組成物,使之硬化,自模具取出即可。
又,為了將導電粒子11以特定之配置放置於絕緣接著劑層12,亦可為於絕緣接著劑層形成組成物層之上設置以特定之配置形成有貫通孔之構件,自其上供給導電粒子11,並使之通過貫通孔等方法。
<形成各向異性導電膜之導電粒子>
作為形成各向異性導電膜10A、10B之導電粒子,可自用於公知之各向異性導電膜者中適當選擇。例如,可列舉焊料、鎳、鈷、銀、銅、金、鈀等金屬粒子、金屬被覆樹脂粒子等。金屬被覆樹脂粒子之金屬被覆可利用無電解鍍敷法、濺鍍法等公知之金屬膜形成方法而形成。金屬被覆只要形成於芯樹脂材(core resin material)之表面,則並無特別限制。芯樹脂材既可僅由樹脂形成,亦可為了提高導通可靠性而設為含有導電微粒子者。
作為導電粒子,於上述粒子之中,就導通可靠性與成本之方面而言,較佳使用焊料粒子。另一方面,於在後續步驟中無需回焊步驟之情形時等,較佳使用金屬被覆樹脂粒子。其原因在於,於本發明中,由於係藉由對絕緣性接著劑層配置有導電粒子之各向異性導電膜進行加熱加壓,而進行貫通電極彼此之連接或半導體基板彼此之接著,故而若使用金屬被覆樹脂粒子作為導電粒子,則能夠使加熱加壓低溫化,絕緣性接著劑之材料選擇之範圍擴大。
又,作為導電粒子,亦可併用2種以上之粒子。
導電粒子11之粒徑就電極間接合的穩定性之方面而言,較佳為2~40 μm。
<形成各向異性導電膜之絕緣接著劑層>
作為絕緣接著劑層12,可適當採用公知之各向異性導電膜中所使用之絕緣性樹脂層。例如,可使用含有丙烯酸酯化合物與光自由基聚合起始劑之光自由基聚合型樹脂層、含有丙烯酸酯化合物與熱自由基聚合起始劑之熱自由基聚合型樹脂層、含有環氧化合物與熱陽離子聚合起始劑之熱陽離子聚合型樹脂層、含有環氧化合物與熱陰離子聚合起始劑之熱陰離子聚合型樹脂層等。又,該等樹脂層可根據需要而設為分別聚合而成者。又,亦可由多層樹脂層形成絕緣接著劑層12。
但是,於自多層基板1A切出晶片等視用途而於製造多層基板1A後將多層基板1A切斷之情形時,絕緣接著劑層12較佳具有耐切斷之柔軟性與接著性。
又,亦可於絕緣接著劑層12中,根據需要添加二氧化矽微粒子、氧化鋁、氫氧化鋁等絕緣性填料。絕緣性填料之摻合量較佳相對於形成絕緣接著劑層之樹脂100質量份,設為3~40質量份。藉此,即便於各向異性導電性連接時絕緣接著劑層12熔融,亦可抑制因熔融之樹脂導致導電粒子11無用地移動。
較理想絕緣性填料之大小為不阻礙各向異性導電性連接之大小。
於以此方式製造之各向異性導電膜10A、10B中,存在於特定之位置以外之導電粒子幾乎不存在。然而,可能存在即便存在於特定之位置亦未被對向之貫通電極4A、4B捕捉的導電粒子。因此,於將該各向異性導電膜10A、10B用於半導體基板3A、3B之連接之後,於對向之半導體基板3A、3B之間,未被貫通電極4A、4B捕捉之導電粒子11的數量較佳為存在於對向之半導體基板3A、3B之間的導電粒子11之總數的5%以下。
<變化態樣1>
本發明之多層基板可採用各種態樣。
例如,圖4所示之多層基板1C係藉由於圖1所示之多層基板1A中,使用共用之各向異性導電膜作為將配線基板2之貫通電極4X與第1半導體基板3A之貫通電極4A連接的各向異性導電膜、將第1半導體基板3A之貫通電極4A與第2半導體基板3B之貫通電極4B連接的各向異性導電膜、及將第2半導體基板3B之貫通電極4B與第3半導體基板3C之貫通電極4C連接的各向異性導電膜而製造者。即,作為各向異性導電膜,使用於俯視欲製造之多層基板1C時,對應於配線基板2或各半導體基板3A、3B、3C之貫通電極彼此對向之位置而於絕緣接著劑層12選擇性地配置有導電粒子11者。藉此,於俯視多層基板1C時,於貫通電極4X、4A、4B、4C對向之位置會存在導電粒子11、11x。換言之,於對向之貫通電極之間,未必僅存在相對於該貫通電極而選擇性地配置之導電粒子。例如,於半導體基板3A與半導體基板3B之間,除了於形成在該等之貫通電極4A、4B對向之位置而選擇性地配置有導電粒子11以外,亦存在無助於半導體基板3A之貫通電極4A與半導體基板3B之貫通電極4B之連接的導電粒子11x。因此,相對於存在於半導體基板3A與半導體基板3B之間的所有導電粒子,半導體基板3A與半導體基板3B之間未被貫通電極捕捉之導電粒子可超過5%而存在。然而,存在於半導體基板3A與半導體基板3B之間且無助於該等之連接的導電粒子11x有助於配線基板2之貫通電極4X與第1半導體基板3A之貫通電極4A的連接。又,於俯視多層基板1C時,於貫通電極彼此不對向之位置未配置導電粒子,或者實質上不存在導電粒子。即,於圖4所示之多層基板1C中,較佳為如下狀態:於多層基板之膜厚方向的任意剖面之各半導體基板間,於所有與貫通電極於垂直方向重疊的位置存在導電粒子。
若以此方式將各半導體基板使用共用之各向異性導電膜連接,則可削減多層基板之製造所需要之總成本。又,亦可容易地應對多層基板之製品陣容(lineup)之增加(規格變更)。
如上所述,於本發明之多層基板中,於俯視多層基板時,導電粒子選擇性地存在於貫通電極對向之位置。而且,藉由以此方式配置之導電粒子而連接對向之貫通電極,並將形成有該貫通電極之半導體基板彼此藉由絕緣接著劑接著。於該情形時,對向之貫通電極既可如圖1所示,藉由選擇性地僅配置於該對向之貫通電極之間的導電粒子11而連接,又,亦可如圖4所示,於形成有對向之貫通電極之半導體基板間含有無助於該對向之貫通電極之連接的導電粒子11x。
<變化態樣2>
圖5A所示之多層基板1D係於圖1所示之多層基板1A中,將對向之貫通電極4X、4A、4B、4C分別藉由2個以上之導電粒子11連接者。圖5B係表示用於該連接之各向異性導電膜10D的導電粒子11之配置之俯視圖。
於該各向異性導電膜10D中,於絕緣接著劑層12形成有2個以上之導電粒子4靠近地配置之導電粒子單元11u。各導電粒子單元11u較佳對應於利用該各向異性導電膜1D連接之貫通電極之配置而配置,藉由構成導電粒子單元11u之多個導電粒子11而將對向之貫通電極連接。藉由將對向之貫通電極利用構成導電粒子單元11u之多個導電粒子11連接,而與利用一個一個導電粒子連接之情形時相比,可使連接後之導通電阻強健(robust)化。
於各向異性導電膜中,構成導電粒子單元11u之導電粒子數量為2個以上,就導通穩定性之觀點而言更佳為3個以上。又,就於各向異性導電性連接時,可藉由不僅於對向之貫通電極的電極面內,而且亦於電極之外周存在導電粒子而擴大膜之貼合偏移的容許範圍之觀點而言,構成導電粒子單元11u之導電粒子數量較佳為30個以下,更佳為20個以下。
又,就容易由貫通電極之對向部分捕捉多個導電粒子之方面而言,於導電粒子單元11u中,導電粒子單元11u內之任意導電粒子與最靠近於該導電粒子之導電粒子的距離L較佳未達導電粒子直徑之0.5倍,鄰接之導電粒子彼此亦可接觸。另一方面,就防止在各向異性導電連接時壓潰之導電粒子11彼此互相干涉而使導電粒子之配置自所需的位置偏移之方面而言,於導電粒子單元11u中鄰接之導電粒子較佳相距導電粒子直徑之0.2倍以上。
<變化態樣3>
於藉由使用共用之各向異性導電膜將各半導體基板連接而削減製造多層基板所需要之總成本之情形時,亦可使用導電粒子單元11u配置於一面之各向異性導電膜而製造多層基板。於該情形時,構成各導電粒子單元11u之導電粒子數量為3個以上,較佳為12個以上,更佳為20個以上,於各導電粒子單元內導電粒子並非配置為一行,而是配置為面狀。為了避免產生短路,導電粒子單元11u彼此之間隔設為導電粒子直徑之1倍以上,根據半導體基板之電極間隔而適當決定。若導電粒子單元之直徑或最長邊的長度相對於電極之直徑或最長邊的長度之比例過小,則電極之導電粒子捕捉性差,若該比例過大,則擔心產生短路,故而下限較佳為0.3倍以上,更佳為0.5倍以上,進而較佳為0.7倍以上,上限較佳為3倍以下,更佳為2倍以下。又,導電粒子單元之直徑或最長邊的長度若未達電極之直徑或最長邊的長度之等倍,則導電粒子單元會收納於電極內,故而導電粒子之夾持之狀態容易變得良好,若為等倍以上則導電粒子與電極之位置對準時之邊限(margin)擴大,故而可實現多層基板之製造時間之縮短。
藉由共用地使用導電粒子單元11u以適當之間隔配置於一面之各向異性導電膜,而與對要連接之每個半導體基板使用導電粒子之配置不同的各向異性導電膜之情形時相比,可大幅降低多層基板之製造成本。本發明亦包含此種各向異性導電膜、及使用其之多層基板。
本發明之多層基板可用於以高密度半導體封裝等為首之要求高密度安裝的各種半導體之各種用途。又,亦可將多層基板切斷為特定之尺寸而使用。
實施例
以下,藉由實施例對本發明具體地進行說明。
實施例1~3,比較例1
(1)半導體基板
作為構成多層基板之半導體基板3,準備外形為7 mm□、厚度為200 μm之矩形,且如圖6所示,具有鉻製電極墊之貫通電極4形成為周邊(peripheral)配置(
30 μm,85 μm節距(pitch),280接腳)者。於半導體基板上形成有200 μm□之四邊形標記作為調正標示。
(2)各向異性導電膜之製造
如表1所示,製造使特定之粒徑之導電粒子(微粉焊料粉,三井金屬礦業股份有限公司)無規地配置於絕緣接著劑層(比較例1,粒子密度17.1個/mm
2),或對應於半導體基板之電極配置而配置於絕緣接著劑層(實施例1~3,85 μm節距,280處)之各向異性導電膜。
於該情形時,於實施例1、2中,如圖6所示,於每1處電極4配置1個導電粒子11,於實施例3中,如圖7所示,於每1處電極4配置3個導電粒子11。
又,於實施例1~3中,藉由導電粒子之排列而形成調正標示。於該情形時,使導電粒子之排列的輪廓與半導體基板之調正標示的輪廓大致一致。
更具體而言,準備厚度2 mm之鎳板,以凸部(直徑25 μm,高度20 μm)成為上述電極之配置的方式圖案化而製作轉印母盤,對轉印母盤以乾燥厚度成為30 μm之方式塗佈含有苯氧基樹脂(YP-50,新日鐵住金化學股份有限公司)60質量份、丙烯酸酯樹脂(M208,東亞合成股份有限公司)29質量份、光聚合起始劑(IRGACURE184,巴斯夫日本股份有限公司)2質量份之光聚合性樹脂組成物,於80℃乾燥5分鐘之後,利用高壓水銀燈進行1000 mJ光照射,藉此製成具有凹部之轉印模具。
另一方面,由苯氧基樹脂(YP-50,新日鐵住金化學股份有限公司)60質量份、環氧樹脂(jER828,三菱化學股份有限公司)40質量份、及陽離子系硬化劑(SI-60L,三新化學工業股份有限公司)2質量份製備絕緣接著劑形成用組成物,將其塗佈於膜厚50 μm之PET膜上,利用80℃之烘箱使之乾燥5分鐘,於PET膜上以5 μm形成由絕緣性樹脂構成之黏著層。
對上述具有凹部之轉印模具填充導電粒子,於其上覆蓋上述絕緣性樹脂之黏著層,照射紫外線而使絕緣性樹脂所含之硬化性樹脂硬化。然後,將絕緣性樹脂自模具剝離,以60℃、0.5 MPa積層與黏著層同樣地製作之絕緣性樹脂層(厚度15 μm),製造各實施例之各向異性導電膜。
另一方面,導電粒子無規地分散之比較例1之各向異性導電膜係藉由將導電粒子與絕緣性樹脂利用自轉公轉式混合裝置(新基股份有限公司)攪拌,獲得導電粒子之分散物,並將該分散物之塗膜形成為20 μm而製造。
(3)多層基板之製造
將(1)中準備之半導體基板使用(2)中製造之各向異性導電膜以表1所示之積層數重疊,進行加熱加壓(180℃,40 MPa,20秒),藉此製造多層基板。
(4)評價
對於所獲得之多層基板,以如下方式評價(a)導通電阻、(b)導通可靠性、(c)短路產生率。將該等之結果示於表1。
(a)導通電阻
使用數位萬用表(34401A,安捷倫科技股份有限公司),利用四端子法,流通電流1 mA而測量多層基板之正面背面之電極間的導通電阻。將測得之電阻值為5 Ω以下設為OK,將超過5 Ω者設為NG。
(b)導通可靠性
與(a)同樣地測量將多層基板於溫度85℃、濕度85%RH之恆溫槽中放置500小時之後的導通電阻,將該導通電阻為10 Ω以下設為OK,將超過10 Ω者設為NG。
(c)短路產生率
將積層之半導體基板逐片地剝離,觀察相鄰之電極是否因導電粒子而短路,將無短路之情形時設為OK,即便存在1個亦設為NG。
[表1]
比較例1 | 實施例1 | 實施例2 | 實施例3 | |
半導體基板之積層數量 | 3 | 3 | 4 | 3 |
粒徑(μm) | 20 | 20 | 20 | 10 |
導通電阻 | NG | OK | OK | OK |
導通可靠性(85℃、85%RH、500 hr) | NG | OK | OK | OK |
短路產生率 | OK | OK | OK | OK |
根據表1,使用導電粒子無規地分散之各向異性導電膜將第1半導體基板與第2半導體基板連接之比較例1中,導通電阻或導通可靠性差,但對應於電極配置而選擇性地配置導電粒子之實施例1~3中,導通電阻、導通可靠性、短路產生率之任一者均良好。
再者,於實施例3中,由於在貫通電極4內配置3個導電粒子11,故而各向異性導電膜與半導體基板之位置對準可取得邊限。
實施例4~11
於實施例4~7中,於實施例1中,使用表2所示之平均粒徑之金/鎳被覆樹脂粒子(Micropearl,積水化學工業股份有限公司)作為導電粒子,以表2所示之方式變更每個電極之導電粒子的個數、導電粒子相對於電極之配置、及導電粒子間之最靠近距離,在不藉由導電粒子之排列形成調正標示下使導電粒子與電極直接位置對準並將膜貼合,除此以外,重複實施例1之操作,藉此製造各向異性導電膜,並製造使用各向異性導電膜之多層基板,對多層基板進行評價。其結果,於實施例4~7之任一者中,導通電阻、導通可靠性、及短路產生率均良好。再者,於實施例5、7、9中,雖然無與調正標示對應之導電粒子之排列,但使導電粒子亦存在於電極之外周部,故而可於膜之貼合步驟中使位置偏移之容許範圍擴大。
又,於實施例8~11中,將構成半導體基板之周邊配置的電極(85 μm節距,280接腳)之各個電極4的外形自
30 μm之圓形變更為30 μm×50 μm之矩形(電極之排列方向為30 μm),重複與實施例4~7同樣之操作。其結果,於實施例8~11之任一者中,導通電阻、導通可靠性、及短路產生率均良好。
[表2]
平均粒徑 (μm) | 每個電極之導電粒子個數 | 導電粒子相對於電極之配置 | 導電粒子間之最靠近距離(μm) | 半導體基板(7 mm×7 mm)中之平均個數密度(個/mm 2) | |
實施例4 | 10 | 4 | 圖8A | 4.9 | 22.9 |
實施例5 | 10 | 16 | 圖8B | 4.9 | 91.4 |
實施例6 | 10 | 3 | 圖8C | 4.9 | 17.1 |
實施例7 | 10 | 9 | 圖8D | 4.9 | 51.4 |
實施例8 | 10 | 6 | 圖8E | 4.9 | 34.3 |
實施例9 | 10 | 20 | 圖8F | 4.9 | 114.3 |
實施例10 | 20 | 2 | 圖8G | 4.0 | 11.4 |
實施例11 | 20 | 8 | 圖8H | 4.0 | 45.7 |
參考例1
於實施例1中,將導電粒子設為平均粒徑10 μm之鎳被覆樹脂粒子(Micropearl,積水化學工業股份有限公司),將導電粒子之配置設為導電粒子間距離10 μm之四方格子(導電粒子之個數密度:2500個/mm
2),除此以外重複與實施例1同樣之操作,藉此製造各向異性導電膜,並製造使用各向異性導電膜之多層基板,對多層基板進行評價。其結果,任一實施例之導通電阻、導通可靠性、及短路產生率均良好。
參考例2
於實施例1中,將導電粒子設為平均粒徑4 μm之鎳被覆樹脂粒子(Micropearl AUL704,積水化學工業股份有限公司),將導電粒子之配置設為導電粒子間距離4 μm之四方格子(導電粒子之個數密度:16000個/mm
2),除此以外重複與實施例1同樣之操作,藉此製造各向異性導電膜,並製造使用各向異性導電膜之多層基板,對多層基板進行評價。其結果,任一實施例之導通電阻、導通可靠性、及短路產生率均良好。
1A、1B、1C、1D:多層基板
2:配線基板
3、3A、3B、3C:半導體基板
4、4A、4B、4C、4X:貫通電極
5:焊料球
6:散熱器
10A、10B、10D:各向異性導電膜
11、11x:導電粒子
11u:導電粒子單元
12:絕緣接著劑或絕緣接著劑層
L:導電粒子間之距離
[圖1]係本發明之一實施態樣的多層基板1A之剖視圖。
[圖2]係本發明之一實施態樣的多層基板1B之剖視圖。
[圖3A]係多層基板1B之製造步驟之說明圖。
[圖3B]係多層基板1B之製造步驟之說明圖。
[圖3C]係多層基板1B之製造步驟之說明圖。
[圖3D]係多層基板1B之製造步驟之說明圖。
[圖4]係多層基板1C之剖視圖。
[圖5A]係多層基板1D之剖視圖。
[圖5B]係用於製造多層基板1D的各向異性導電膜10D之導電粒子之配置圖(俯視圖)。
[圖6]係用於製造實施例1之多層基板的半導體基板之表面之電極與導電粒子之配置圖。
[圖7]係用於製造實施例3之多層基板的半導體基板之表面之電極與導電粒子之配置圖。
[圖8A]係用於製造實施例4之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
[圖8B]係用於製造實施例5之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
[圖8C]係用於製造實施例6之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
[圖8D]係用於製造實施例7之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
[圖8E]係用於製造實施例8之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
[圖8F]係用於製造實施例9之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
[圖8G]係用於製造實施例10之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
[圖8H]係用於製造實施例11之多層基板的半導體基板之表面的電極與導電粒子之配置圖。
1A:多層基板
2:配線基板
3A、3B、3C:半導體基板
4A、4B、4C、4x:貫通電極
5:焊料球
10:各向異性導電膜
11:導電粒子
12:絕緣接著劑或絕緣接著劑層
Claims (1)
- 一種多層基板,積層有具有貫通電極之半導體基板, 於俯視多層基板時,導電粒子選擇性地存在於貫通電極對向之位置, 該多層基板具有如下連接構造:對向之貫通電極藉由導電粒子而連接,形成有該貫通電極之半導體基板彼此藉由絕緣接著劑而接著。
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