TWI709221B - 多層基板及其製造方法、及各向異性導電膜 - Google Patents

多層基板及其製造方法、及各向異性導電膜 Download PDF

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TWI709221B
TWI709221B TW105101041A TW105101041A TWI709221B TW I709221 B TWI709221 B TW I709221B TW 105101041 A TW105101041 A TW 105101041A TW 105101041 A TW105101041 A TW 105101041A TW I709221 B TWI709221 B TW I709221B
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semiconductor substrate
electrodes
conductive particles
substrate
anisotropic conductive
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TW105101041A
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Chinese (zh)
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TW201639115A (zh
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阿久津恭志
石松朋之
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日商迪睿合股份有限公司
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  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
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TW105101041A 2015-01-13 2016-01-13 多層基板及其製造方法、及各向異性導電膜 TWI709221B (zh)

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JPJP2015-004595 2015-01-13
JP2015004595 2015-01-13

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TW201639115A TW201639115A (zh) 2016-11-01
TWI709221B true TWI709221B (zh) 2020-11-01

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