KR101974763B1 - 다층 기판 - Google Patents

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KR101974763B1
KR101974763B1 KR1020177017940A KR20177017940A KR101974763B1 KR 101974763 B1 KR101974763 B1 KR 101974763B1 KR 1020177017940 A KR1020177017940 A KR 1020177017940A KR 20177017940 A KR20177017940 A KR 20177017940A KR 101974763 B1 KR101974763 B1 KR 101974763B1
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South Korea
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semiconductor substrate
conductive particles
substrate
conductive
electrodes
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Korean (ko)
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KR20170093171A (ko
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야스시 아쿠츠
도모유키 이시마츠
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데쿠세리아루즈 가부시키가이샤
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    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
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  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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