JP2016131245A - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
JP2016131245A
JP2016131245A JP2016004538A JP2016004538A JP2016131245A JP 2016131245 A JP2016131245 A JP 2016131245A JP 2016004538 A JP2016004538 A JP 2016004538A JP 2016004538 A JP2016004538 A JP 2016004538A JP 2016131245 A JP2016131245 A JP 2016131245A
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Prior art keywords
semiconductor substrate
electrodes
conductive particles
substrate
electrode
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JP2016004538A
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Japanese (ja)
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JP2016131245A5 (https=
Inventor
恭志 阿久津
Yasushi Akutsu
恭志 阿久津
朋之 石松
Tomoyuki Ishimatsu
朋之 石松
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Dexerials Corp
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Dexerials Corp
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Publication of JP2016131245A publication Critical patent/JP2016131245A/ja
Publication of JP2016131245A5 publication Critical patent/JP2016131245A5/ja
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    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
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    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
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    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
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  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
JP2016004538A 2015-01-13 2016-01-13 多層基板 Pending JP2016131245A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015004595 2015-01-13
JP2015004595 2015-01-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020161099A Division JP7207382B2 (ja) 2015-01-13 2020-09-25 多層基板

Publications (2)

Publication Number Publication Date
JP2016131245A true JP2016131245A (ja) 2016-07-21
JP2016131245A5 JP2016131245A5 (https=) 2019-02-21

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