TWI284922B - Developing method and apparatus - Google Patents
Developing method and apparatus Download PDFInfo
- Publication number
- TWI284922B TWI284922B TW092131831A TW92131831A TWI284922B TW I284922 B TWI284922 B TW I284922B TW 092131831 A TW092131831 A TW 092131831A TW 92131831 A TW92131831 A TW 92131831A TW I284922 B TWI284922 B TW I284922B
- Authority
- TW
- Taiwan
- Prior art keywords
- developing
- concentration
- liquid
- unit
- substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 49
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims abstract description 90
- 238000011161 development Methods 0.000 claims abstract description 83
- 238000002156 mixing Methods 0.000 claims abstract description 50
- 239000002904 solvent Substances 0.000 claims abstract description 28
- 230000008569 process Effects 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims description 280
- 239000000758 substrate Substances 0.000 claims description 197
- 229920002120 photoresistant polymer Polymers 0.000 claims description 106
- 238000012545 processing Methods 0.000 claims description 98
- 239000000243 solution Substances 0.000 claims description 59
- 239000003513 alkali Substances 0.000 claims description 34
- 238000005259 measurement Methods 0.000 claims description 33
- 238000003384 imaging method Methods 0.000 claims description 24
- 238000004064 recycling Methods 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 16
- 239000002585 base Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000010790 dilution Methods 0.000 claims description 4
- 239000012895 dilution Substances 0.000 claims description 4
- 108091008695 photoreceptors Proteins 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000007865 diluting Methods 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 238000005375 photometry Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 5
- 239000012141 concentrate Substances 0.000 abstract 1
- 238000012546 transfer Methods 0.000 description 61
- 230000032258 transport Effects 0.000 description 54
- 238000010438 heat treatment Methods 0.000 description 38
- 239000011248 coating agent Substances 0.000 description 28
- 238000000576 coating method Methods 0.000 description 28
- 230000007246 mechanism Effects 0.000 description 26
- 238000004140 cleaning Methods 0.000 description 20
- 238000001816 cooling Methods 0.000 description 20
- 230000007723 transport mechanism Effects 0.000 description 17
- 238000011282 treatment Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000001035 drying Methods 0.000 description 11
- 238000011144 upstream manufacturing Methods 0.000 description 11
- 239000007864 aqueous solution Substances 0.000 description 10
- 238000011084 recovery Methods 0.000 description 10
- 239000011550 stock solution Substances 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000005201 scrubbing Methods 0.000 description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 6
- 238000011068 loading method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 208000005156 Dehydration Diseases 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 235000015073 liquid stocks Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000002798 spectrophotometry method Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 2
- 206010036790 Productive cough Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000004042 decolorization Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
- G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
- G03D3/02—Details of liquid circulation
- G03D3/06—Liquid supply; Liquid circulation outside tanks
- G03D3/065—Liquid supply; Liquid circulation outside tanks replenishment or recovery apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
- G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
- G03D3/02—Details of liquid circulation
- G03D3/06—Liquid supply; Liquid circulation outside tanks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3071—Process control means, e.g. for replenishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002332578A JP3894104B2 (ja) | 2002-11-15 | 2002-11-15 | 現像方法及び現像装置及び現像液再生装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200415705A TW200415705A (en) | 2004-08-16 |
| TWI284922B true TWI284922B (en) | 2007-08-01 |
Family
ID=32290192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092131831A TWI284922B (en) | 2002-11-15 | 2003-11-13 | Developing method and apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6969572B2 (enExample) |
| JP (1) | JP3894104B2 (enExample) |
| KR (1) | KR101035465B1 (enExample) |
| CN (1) | CN1311303C (enExample) |
| TW (1) | TWI284922B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI387041B (zh) * | 2007-10-16 | 2013-02-21 | Dainippon Screen Mfg | Substrate cooling method and substrate cooling device |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3894104B2 (ja) * | 2002-11-15 | 2007-03-14 | 東京エレクトロン株式会社 | 現像方法及び現像装置及び現像液再生装置 |
| JP2005136364A (ja) * | 2003-10-08 | 2005-05-26 | Zao Nikon Co Ltd | 基板搬送装置、露光装置、並びにデバイス製造方法 |
| JP4391387B2 (ja) * | 2004-10-27 | 2009-12-24 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP4634822B2 (ja) * | 2005-02-24 | 2011-02-16 | 株式会社東芝 | レジストパターン形成方法および半導体装置の製造方法 |
| JP2006278765A (ja) * | 2005-03-29 | 2006-10-12 | Fujitsu Ltd | 貼合せ基板製造装置の洗浄方法、貼合せ基板製造装置の洗浄用治具及び貼合せ基板製造装置の洗浄装置 |
| JP2006344310A (ja) * | 2005-06-09 | 2006-12-21 | Sony Corp | 現像方法および現像装置 |
| US7766566B2 (en) * | 2005-08-03 | 2010-08-03 | Tokyo Electron Limited | Developing treatment apparatus and developing treatment method |
| CN100471541C (zh) * | 2005-09-30 | 2009-03-25 | 日本瑞环株式会社 | 溶剂的回收装置及溶剂的回收方法 |
| CN100555084C (zh) * | 2005-11-21 | 2009-10-28 | 友达光电股份有限公司 | 显影液成分调整方法及其显影系统 |
| JP4839820B2 (ja) * | 2005-12-19 | 2011-12-21 | 三菱化学エンジニアリング株式会社 | 現像液の供給装置 |
| KR100734659B1 (ko) * | 2005-12-28 | 2007-07-02 | 동부일렉트로닉스 주식회사 | 현상 공정 제어 장치 및 방법 |
| US8448804B2 (en) * | 2006-10-04 | 2013-05-28 | Ropak Corporation | Pivoting cover with a fastening device |
| CN103852978B (zh) * | 2006-11-30 | 2019-03-22 | 三菱化学工程株式会社 | 显影液的浓度调节方法、调制装置和显影液 |
| TWI413156B (zh) * | 2008-01-28 | 2013-10-21 | Tokyo Ohka Kogyo Co Ltd | 光阻液供給回收系統及光阻液回收方法 |
| CN101634816B (zh) * | 2008-07-24 | 2012-05-30 | 北京京东方光电科技有限公司 | 显影液控制系统 |
| US7854558B2 (en) * | 2009-02-16 | 2010-12-21 | Eastman Kodak Company | Developer waste reuse |
| CN102830595B (zh) * | 2012-08-24 | 2014-08-13 | 京东方科技集团股份有限公司 | 一种显影液监控方法及设备 |
| CN103887151B (zh) * | 2014-03-07 | 2017-02-01 | 京东方科技集团股份有限公司 | 一种构图装置和构图方法 |
| CN109791374B (zh) * | 2017-08-23 | 2022-05-17 | 深圳市柔宇科技股份有限公司 | 显影液回收系统 |
| US11061333B2 (en) * | 2017-11-13 | 2021-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Manufacturing method of semiconductor device and semiconductor processing system |
| TWI668528B (zh) * | 2017-11-20 | 2019-08-11 | 台灣積體電路製造股份有限公司 | 顯影液過濾系統及顯影液的過濾方法 |
| CN109806658B (zh) * | 2017-11-20 | 2021-10-12 | 台湾积体电路制造股份有限公司 | 显影液过滤系统及显影液的过滤方法 |
| JP7060415B2 (ja) * | 2018-03-12 | 2022-04-26 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| CN109802643B (zh) * | 2018-11-30 | 2020-09-08 | 无锡市好达电子股份有限公司 | 一种辅助显影版图制作方法 |
| JP7731730B2 (ja) * | 2021-08-18 | 2025-09-01 | 旭化成株式会社 | データ処理装置、現像装置、データ処理方法、および、データ処理プログラム |
| JP7738447B2 (ja) * | 2021-10-08 | 2025-09-12 | 東京エレクトロン株式会社 | 分析装置 |
| JP7369227B2 (ja) * | 2022-03-22 | 2023-10-25 | 株式会社Ｓｃｒｅｅｎホールディングス | 現像装置 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2561578B2 (ja) * | 1991-08-07 | 1996-12-11 | 株式会社平間理化研究所 | 現像液管理装置 |
| JPH07110580A (ja) * | 1993-10-13 | 1995-04-25 | Dainippon Screen Mfg Co Ltd | 基板現像装置 |
| JP3116297B2 (ja) * | 1994-08-03 | 2000-12-11 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
| JPH08278635A (ja) * | 1995-04-07 | 1996-10-22 | Tokyo Ohka Kogyo Co Ltd | 現像液の調整方法及び調整装置 |
| TW494714B (en) * | 1995-04-19 | 2002-07-11 | Tokyo Electron Ltd | Method of processing substrate and apparatus for processing substrate |
| JP3964475B2 (ja) | 1995-04-19 | 2007-08-22 | 東京エレクトロン株式会社 | 基板の処理方法と装置 |
| JPH09258457A (ja) * | 1996-03-18 | 1997-10-03 | Fujitsu Ltd | 薬液の回収方法および回収装置 |
| JPH09269320A (ja) * | 1996-04-02 | 1997-10-14 | Kubota Corp | 水質計 |
| KR20000062334A (ko) * | 1996-12-25 | 2000-10-25 | 나카노 가츠히코 | 패턴 가공용 약액 집중 관리 장치 |
| TW357389B (en) * | 1996-12-27 | 1999-05-01 | Tokyo Electric Ltd | Apparatus and method for supplying process solution to surface of substrate to be processed |
| JP3362767B2 (ja) | 1997-05-20 | 2003-01-07 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
| JPH10207082A (ja) * | 1997-01-21 | 1998-08-07 | Japan Organo Co Ltd | フォトレジスト用アルカリ現像液又はその現像廃液又はその処理液の分析管理方法及び装置 |
| JP3795627B2 (ja) * | 1997-05-15 | 2006-07-12 | 東芝電子エンジニアリング株式会社 | レジストの現像方法 |
| JP3728945B2 (ja) * | 1998-10-30 | 2005-12-21 | オルガノ株式会社 | フォトレジスト現像廃液からの現像液の回収再利用方法及び装置 |
| JP2000147785A (ja) * | 1998-11-12 | 2000-05-26 | Tokyo Ohka Kogyo Co Ltd | 現像装置 |
| JP2000338684A (ja) * | 1999-05-26 | 2000-12-08 | Nagase & Co Ltd | 基板表面処理装置 |
| JP2001077010A (ja) * | 1999-09-08 | 2001-03-23 | Matsushita Electric Ind Co Ltd | 現像装置およびそれを用いた現像方法および液晶表示装置 |
| JP3686822B2 (ja) * | 2000-05-19 | 2005-08-24 | 東京エレクトロン株式会社 | 現像処理装置および現像処理方法 |
| TW447026B (en) | 2000-05-24 | 2001-07-21 | Nagase & Co Ltd | Substrate surface treating apparatus |
| US6391530B1 (en) * | 2000-11-03 | 2002-05-21 | Kodak Polychrome Graphics, Llc | Process for developing exposed radiation-sensitive printing plate precursors |
| JP2002196503A (ja) * | 2000-12-27 | 2002-07-12 | Dainippon Printing Co Ltd | 現像液の現像活性の制御方法及び自動制御装置 |
| TWI298423B (en) * | 2001-02-06 | 2008-07-01 | Nagase & Co Ltd | Developer producing equipment and method |
| TWI298826B (en) * | 2001-02-06 | 2008-07-11 | Hirama Lab Co Ltd | Purified developer producing equipment and method |
| US6752545B2 (en) * | 2001-08-16 | 2004-06-22 | Nagase & Co., Ltd. | Alkali-based treating liquid, treating liquid adjusting method and equipment, treating liquid supplying method and equipment |
| KR20040001788A (ko) * | 2002-06-28 | 2004-01-07 | 주식회사 하이닉스반도체 | 현상액 재활용장치 |
| JP3894104B2 (ja) * | 2002-11-15 | 2007-03-14 | 東京エレクトロン株式会社 | 現像方法及び現像装置及び現像液再生装置 |
-
2002
- 2002-11-15 JP JP2002332578A patent/JP3894104B2/ja not_active Expired - Fee Related
-
2003
- 2003-11-13 KR KR1020030080297A patent/KR101035465B1/ko not_active Expired - Fee Related
- 2003-11-13 US US10/706,091 patent/US6969572B2/en not_active Expired - Fee Related
- 2003-11-13 TW TW092131831A patent/TWI284922B/zh not_active IP Right Cessation
- 2003-11-15 CN CNB2003101233299A patent/CN1311303C/zh not_active Expired - Fee Related
-
2005
- 2005-09-20 US US11/229,534 patent/US7101646B2/en not_active Expired - Fee Related
-
2006
- 2006-06-29 US US11/476,574 patent/US7182531B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI387041B (zh) * | 2007-10-16 | 2013-02-21 | Dainippon Screen Mfg | Substrate cooling method and substrate cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060024622A1 (en) | 2006-02-02 |
| KR20040042875A (ko) | 2004-05-20 |
| US20040096760A1 (en) | 2004-05-20 |
| US7182531B2 (en) | 2007-02-27 |
| US20060246384A1 (en) | 2006-11-02 |
| KR101035465B1 (ko) | 2011-05-18 |
| CN1501177A (zh) | 2004-06-02 |
| JP2004170451A (ja) | 2004-06-17 |
| JP3894104B2 (ja) | 2007-03-14 |
| US7101646B2 (en) | 2006-09-05 |
| US6969572B2 (en) | 2005-11-29 |
| CN1311303C (zh) | 2007-04-18 |
| TW200415705A (en) | 2004-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI284922B (en) | Developing method and apparatus | |
| TWI375135B (en) | Reduced-pressure drying device | |
| TWI388031B (zh) | 處理系統 | |
| TWI299286B (en) | Coating method and coating apparatus | |
| CN111433888A (zh) | 液供给装置和液供给方法 | |
| TW200842940A (en) | Substrate processing apparatus | |
| KR101568050B1 (ko) | 기판 처리 장치 | |
| TW201243906A (en) | Developing method and developing apparatus and coating and developing apparatus with it | |
| JP4247890B2 (ja) | 塗布ノズル及び塗布装置 | |
| TWI234796B (en) | Solution treatment method and solution treatment unit | |
| JP2003257833A (ja) | 液処理方法および液処理装置 | |
| JP2006049757A (ja) | 基板処理方法 | |
| KR20070088370A (ko) | 현상 처리 장치, 현상 처리 방법, 컴퓨터 판독 가능한 기억매체 | |
| KR20130006297A (ko) | 현상 처리 장치, 현상 처리 방법 및 컴퓨터 기억 매체 | |
| JP3763125B2 (ja) | 基板処理装置 | |
| KR101413832B1 (ko) | 레지스트액 공급 장치 및 기판 처리 시스템 | |
| TWI313193B (en) | Coating method, coating apparatus and memory medium | |
| JP2005011996A (ja) | 塗布処理方法及び塗布処理装置 | |
| JP3865669B2 (ja) | 液処理装置及び液処理方法 | |
| JP2011025220A (ja) | テンプレート処理装置、インプリントシステム、テンプレート処理方法、プログラム及びコンピュータ記憶媒体 | |
| KR100873265B1 (ko) | 기판처리장치 및 막형성장치 | |
| KR101067143B1 (ko) | 도포막형성 장치 및 도포막형성 방법 | |
| JP3968038B2 (ja) | 基板処理方法及び基板処理装置及び現像処理方法及び現像処理装置 | |
| KR101118885B1 (ko) | 처리 장치 및 처리 방법 | |
| JP2001274082A (ja) | 現像処理方法及び現像処理装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |