CN1311303C - 显影方法及显影装置 - Google Patents

显影方法及显影装置 Download PDF

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Publication number
CN1311303C
CN1311303C CNB2003101233299A CN200310123329A CN1311303C CN 1311303 C CN1311303 C CN 1311303C CN B2003101233299 A CNB2003101233299 A CN B2003101233299A CN 200310123329 A CN200310123329 A CN 200310123329A CN 1311303 C CN1311303 C CN 1311303C
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CN
China
Prior art keywords
mentioned
developer solution
substrate
alkali concn
resist concentration
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Expired - Fee Related
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CNB2003101233299A
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English (en)
Chinese (zh)
Other versions
CN1501177A (zh
Inventor
立山清久
野村雅文
筱木武虎
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN1501177A publication Critical patent/CN1501177A/zh
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Publication of CN1311303C publication Critical patent/CN1311303C/zh
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
    • G03D3/02—Details of liquid circulation
    • G03D3/06—Liquid supply; Liquid circulation outside tanks
    • G03D3/065—Liquid supply; Liquid circulation outside tanks replenishment or recovery apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
    • G03D3/02—Details of liquid circulation
    • G03D3/06—Liquid supply; Liquid circulation outside tanks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB2003101233299A 2002-11-15 2003-11-15 显影方法及显影装置 Expired - Fee Related CN1311303C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002332578A JP3894104B2 (ja) 2002-11-15 2002-11-15 現像方法及び現像装置及び現像液再生装置
JP332578/2002 2002-11-15

Publications (2)

Publication Number Publication Date
CN1501177A CN1501177A (zh) 2004-06-02
CN1311303C true CN1311303C (zh) 2007-04-18

Family

ID=32290192

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003101233299A Expired - Fee Related CN1311303C (zh) 2002-11-15 2003-11-15 显影方法及显影装置

Country Status (5)

Country Link
US (3) US6969572B2 (enExample)
JP (1) JP3894104B2 (enExample)
KR (1) KR101035465B1 (enExample)
CN (1) CN1311303C (enExample)
TW (1) TWI284922B (enExample)

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* Cited by examiner, † Cited by third party
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JP3894104B2 (ja) * 2002-11-15 2007-03-14 東京エレクトロン株式会社 現像方法及び現像装置及び現像液再生装置
JP2005136364A (ja) * 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
JP4391387B2 (ja) * 2004-10-27 2009-12-24 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4634822B2 (ja) * 2005-02-24 2011-02-16 株式会社東芝 レジストパターン形成方法および半導体装置の製造方法
JP2006278765A (ja) * 2005-03-29 2006-10-12 Fujitsu Ltd 貼合せ基板製造装置の洗浄方法、貼合せ基板製造装置の洗浄用治具及び貼合せ基板製造装置の洗浄装置
JP2006344310A (ja) * 2005-06-09 2006-12-21 Sony Corp 現像方法および現像装置
US7766566B2 (en) * 2005-08-03 2010-08-03 Tokyo Electron Limited Developing treatment apparatus and developing treatment method
CN100471541C (zh) * 2005-09-30 2009-03-25 日本瑞环株式会社 溶剂的回收装置及溶剂的回收方法
CN100555084C (zh) * 2005-11-21 2009-10-28 友达光电股份有限公司 显影液成分调整方法及其显影系统
JP4839820B2 (ja) * 2005-12-19 2011-12-21 三菱化学エンジニアリング株式会社 現像液の供給装置
KR100734659B1 (ko) * 2005-12-28 2007-07-02 동부일렉트로닉스 주식회사 현상 공정 제어 장치 및 방법
US8448804B2 (en) * 2006-10-04 2013-05-28 Ropak Corporation Pivoting cover with a fastening device
CN103852978B (zh) * 2006-11-30 2019-03-22 三菱化学工程株式会社 显影液的浓度调节方法、调制装置和显影液
JP2009099721A (ja) * 2007-10-16 2009-05-07 Dainippon Screen Mfg Co Ltd 基板冷却方法および基板冷却装置
TWI413156B (zh) * 2008-01-28 2013-10-21 Tokyo Ohka Kogyo Co Ltd 光阻液供給回收系統及光阻液回收方法
CN101634816B (zh) * 2008-07-24 2012-05-30 北京京东方光电科技有限公司 显影液控制系统
US7854558B2 (en) * 2009-02-16 2010-12-21 Eastman Kodak Company Developer waste reuse
CN102830595B (zh) * 2012-08-24 2014-08-13 京东方科技集团股份有限公司 一种显影液监控方法及设备
CN103887151B (zh) * 2014-03-07 2017-02-01 京东方科技集团股份有限公司 一种构图装置和构图方法
CN109791374B (zh) * 2017-08-23 2022-05-17 深圳市柔宇科技股份有限公司 显影液回收系统
US11061333B2 (en) * 2017-11-13 2021-07-13 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacturing method of semiconductor device and semiconductor processing system
TWI668528B (zh) * 2017-11-20 2019-08-11 台灣積體電路製造股份有限公司 顯影液過濾系統及顯影液的過濾方法
CN109806658B (zh) * 2017-11-20 2021-10-12 台湾积体电路制造股份有限公司 显影液过滤系统及显影液的过滤方法
JP7060415B2 (ja) * 2018-03-12 2022-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN109802643B (zh) * 2018-11-30 2020-09-08 无锡市好达电子股份有限公司 一种辅助显影版图制作方法
JP7731730B2 (ja) * 2021-08-18 2025-09-01 旭化成株式会社 データ処理装置、現像装置、データ処理方法、および、データ処理プログラム
JP7738447B2 (ja) * 2021-10-08 2025-09-12 東京エレクトロン株式会社 分析装置
JP7369227B2 (ja) * 2022-03-22 2023-10-25 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223881A (en) * 1991-08-07 1993-06-29 Hirama Rika Kenkyujio Ltd. Apparatus for controlling developing solution
JPH0845832A (ja) * 1994-08-03 1996-02-16 Tokyo Electron Ltd 処理方法及び処理装置
JPH097939A (ja) * 1995-04-19 1997-01-10 Tokyo Electron Ltd 基板の処理方法と装置
JPH10321517A (ja) * 1997-05-20 1998-12-04 Tokyo Electron Ltd 処理方法
US5945161A (en) * 1996-12-27 1999-08-31 Tokyo Electron Limited Apparatus and method for supplying process solution to surface of substrate to be processed
US6090205A (en) * 1995-04-19 2000-07-18 Tokyo Electron Limited Apparatus for processing substrate
US6120945A (en) * 1997-05-15 2000-09-19 Kabushiki Kaisha Toshiba Method of developing a photoresist pattern and a developing apparatus

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110580A (ja) * 1993-10-13 1995-04-25 Dainippon Screen Mfg Co Ltd 基板現像装置
JPH08278635A (ja) * 1995-04-07 1996-10-22 Tokyo Ohka Kogyo Co Ltd 現像液の調整方法及び調整装置
JPH09258457A (ja) * 1996-03-18 1997-10-03 Fujitsu Ltd 薬液の回収方法および回収装置
JPH09269320A (ja) * 1996-04-02 1997-10-14 Kubota Corp 水質計
KR20000062334A (ko) * 1996-12-25 2000-10-25 나카노 가츠히코 패턴 가공용 약액 집중 관리 장치
JPH10207082A (ja) * 1997-01-21 1998-08-07 Japan Organo Co Ltd フォトレジスト用アルカリ現像液又はその現像廃液又はその処理液の分析管理方法及び装置
JP3728945B2 (ja) * 1998-10-30 2005-12-21 オルガノ株式会社 フォトレジスト現像廃液からの現像液の回収再利用方法及び装置
JP2000147785A (ja) * 1998-11-12 2000-05-26 Tokyo Ohka Kogyo Co Ltd 現像装置
JP2000338684A (ja) * 1999-05-26 2000-12-08 Nagase & Co Ltd 基板表面処理装置
JP2001077010A (ja) * 1999-09-08 2001-03-23 Matsushita Electric Ind Co Ltd 現像装置およびそれを用いた現像方法および液晶表示装置
JP3686822B2 (ja) * 2000-05-19 2005-08-24 東京エレクトロン株式会社 現像処理装置および現像処理方法
TW447026B (en) 2000-05-24 2001-07-21 Nagase & Co Ltd Substrate surface treating apparatus
US6391530B1 (en) * 2000-11-03 2002-05-21 Kodak Polychrome Graphics, Llc Process for developing exposed radiation-sensitive printing plate precursors
JP2002196503A (ja) * 2000-12-27 2002-07-12 Dainippon Printing Co Ltd 現像液の現像活性の制御方法及び自動制御装置
TWI298423B (en) * 2001-02-06 2008-07-01 Nagase & Co Ltd Developer producing equipment and method
TWI298826B (en) * 2001-02-06 2008-07-11 Hirama Lab Co Ltd Purified developer producing equipment and method
US6752545B2 (en) * 2001-08-16 2004-06-22 Nagase & Co., Ltd. Alkali-based treating liquid, treating liquid adjusting method and equipment, treating liquid supplying method and equipment
KR20040001788A (ko) * 2002-06-28 2004-01-07 주식회사 하이닉스반도체 현상액 재활용장치
JP3894104B2 (ja) * 2002-11-15 2007-03-14 東京エレクトロン株式会社 現像方法及び現像装置及び現像液再生装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223881A (en) * 1991-08-07 1993-06-29 Hirama Rika Kenkyujio Ltd. Apparatus for controlling developing solution
JPH0845832A (ja) * 1994-08-03 1996-02-16 Tokyo Electron Ltd 処理方法及び処理装置
US5965200A (en) * 1994-08-03 1999-10-12 Tokyo Electron Limited Processing apparatus and processing method
JPH097939A (ja) * 1995-04-19 1997-01-10 Tokyo Electron Ltd 基板の処理方法と装置
US6090205A (en) * 1995-04-19 2000-07-18 Tokyo Electron Limited Apparatus for processing substrate
US5945161A (en) * 1996-12-27 1999-08-31 Tokyo Electron Limited Apparatus and method for supplying process solution to surface of substrate to be processed
US6120945A (en) * 1997-05-15 2000-09-19 Kabushiki Kaisha Toshiba Method of developing a photoresist pattern and a developing apparatus
JPH10321517A (ja) * 1997-05-20 1998-12-04 Tokyo Electron Ltd 処理方法

Also Published As

Publication number Publication date
US20060024622A1 (en) 2006-02-02
KR20040042875A (ko) 2004-05-20
TWI284922B (en) 2007-08-01
US20040096760A1 (en) 2004-05-20
US7182531B2 (en) 2007-02-27
US20060246384A1 (en) 2006-11-02
KR101035465B1 (ko) 2011-05-18
CN1501177A (zh) 2004-06-02
JP2004170451A (ja) 2004-06-17
JP3894104B2 (ja) 2007-03-14
US7101646B2 (en) 2006-09-05
US6969572B2 (en) 2005-11-29
TW200415705A (en) 2004-08-16

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