PH12015501133B1 - Substrate for mounting semiconductor element and method for manufacturing said substrate - Google Patents
Substrate for mounting semiconductor element and method for manufacturing said substrateInfo
- Publication number
- PH12015501133B1 PH12015501133B1 PH12015501133A PH12015501133A PH12015501133B1 PH 12015501133 B1 PH12015501133 B1 PH 12015501133B1 PH 12015501133 A PH12015501133 A PH 12015501133A PH 12015501133 A PH12015501133 A PH 12015501133A PH 12015501133 B1 PH12015501133 B1 PH 12015501133B1
- Authority
- PH
- Philippines
- Prior art keywords
- resist layer
- substrate
- front surface
- light
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012254958A JP6099370B2 (ja) | 2012-11-21 | 2012-11-21 | 半導体素子搭載用基板及びその製造方法 |
| PCT/JP2013/079766 WO2014080746A1 (ja) | 2012-11-21 | 2013-11-01 | 半導体素子搭載用基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PH12015501133A1 PH12015501133A1 (en) | 2015-07-27 |
| PH12015501133B1 true PH12015501133B1 (en) | 2015-07-27 |
Family
ID=50775932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12015501133A PH12015501133B1 (en) | 2012-11-21 | 2015-05-21 | Substrate for mounting semiconductor element and method for manufacturing said substrate |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6099370B2 (ja) |
| KR (1) | KR101691762B1 (ja) |
| CN (1) | CN104813464A (ja) |
| MY (1) | MY179632A (ja) |
| PH (1) | PH12015501133B1 (ja) |
| TW (1) | TWI605553B (ja) |
| WO (1) | WO2014080746A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6497615B2 (ja) | 2015-03-04 | 2019-04-10 | パナソニックＩｐマネジメント株式会社 | 実装基板及びそれを用いたｌｅｄモジュール |
| JP6555927B2 (ja) * | 2015-05-18 | 2019-08-07 | 大口マテリアル株式会社 | 半導体素子搭載用リードフレーム及び半導体装置の製造方法 |
| JP6641807B2 (ja) * | 2015-09-07 | 2020-02-05 | 大口マテリアル株式会社 | 光半導体装置及びその製造方法 |
| JP2017168510A (ja) * | 2016-03-14 | 2017-09-21 | Ｓｈマテリアル株式会社 | 半導体素子搭載用基板、半導体装置、半導体素子搭載用基板の製造方法、及び半導体装置の製造方法 |
| JP6826073B2 (ja) * | 2018-05-31 | 2021-02-03 | デクセリアルズ株式会社 | 偏光板及びその製造方法、並びに光学機器 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3626075B2 (ja) * | 2000-06-20 | 2005-03-02 | 九州日立マクセル株式会社 | 半導体装置の製造方法 |
| JP3960302B2 (ja) * | 2002-12-18 | 2007-08-15 | Ｔｄｋ株式会社 | 基板の製造方法 |
| JP2004253433A (ja) * | 2003-02-18 | 2004-09-09 | Matsushita Electric Ind Co Ltd | プリント配線板とこれを用いたモジュール部品およびプリント配線板の製造方法 |
| JP2005077955A (ja) * | 2003-09-02 | 2005-03-24 | Sanyo Electric Co Ltd | エッチング方法およびそれを用いた回路装置の製造方法 |
| JP4508064B2 (ja) * | 2005-09-30 | 2010-07-21 | 住友金属鉱山株式会社 | 半導体装置用配線基板の製造方法 |
| JP5151438B2 (ja) * | 2007-12-10 | 2013-02-27 | 大日本印刷株式会社 | 半導体装置およびその製造方法、ならびに半導体装置用基板およびその製造方法 |
| JP5370330B2 (ja) * | 2010-10-01 | 2013-12-18 | 住友金属鉱山株式会社 | 半導体素子搭載用基板の製造方法 |
-
2012
- 2012-11-21 JP JP2012254958A patent/JP6099370B2/ja active Active
-
2013
- 2013-11-01 CN CN201380060217.5A patent/CN104813464A/zh active Pending
- 2013-11-01 MY MYPI2015701637A patent/MY179632A/en unknown
- 2013-11-01 KR KR1020157016475A patent/KR101691762B1/ko active IP Right Grant
- 2013-11-01 WO PCT/JP2013/079766 patent/WO2014080746A1/ja active Application Filing
- 2013-11-20 TW TW102142207A patent/TWI605553B/zh active
-
2015
- 2015-05-21 PH PH12015501133A patent/PH12015501133B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN104813464A (zh) | 2015-07-29 |
| WO2014080746A1 (ja) | 2014-05-30 |
| KR20150087387A (ko) | 2015-07-29 |
| PH12015501133A1 (en) | 2015-07-27 |
| TW201436119A (zh) | 2014-09-16 |
| MY179632A (en) | 2020-11-11 |
| JP6099370B2 (ja) | 2017-03-22 |
| JP2014103293A (ja) | 2014-06-05 |
| KR101691762B1 (ko) | 2017-01-09 |
| TWI605553B (zh) | 2017-11-11 |
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