TWI605553B - Semiconductor device mounting substrate and method for manufacturing the same - Google Patents

Semiconductor device mounting substrate and method for manufacturing the same Download PDF

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Publication number
TWI605553B
TWI605553B TW102142207A TW102142207A TWI605553B TW I605553 B TWI605553 B TW I605553B TW 102142207 A TW102142207 A TW 102142207A TW 102142207 A TW102142207 A TW 102142207A TW I605553 B TWI605553 B TW I605553B
Authority
TW
Taiwan
Prior art keywords
photoresist layer
layer
plating layer
metal plate
semiconductor element
Prior art date
Application number
TW102142207A
Other languages
English (en)
Chinese (zh)
Other versions
TW201436119A (zh
Inventor
Shigeru Hosomomi
Original Assignee
Sh Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sh Materials Co Ltd filed Critical Sh Materials Co Ltd
Publication of TW201436119A publication Critical patent/TW201436119A/zh
Application granted granted Critical
Publication of TWI605553B publication Critical patent/TWI605553B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW102142207A 2012-11-21 2013-11-20 Semiconductor device mounting substrate and method for manufacturing the same TWI605553B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012254958A JP6099370B2 (ja) 2012-11-21 2012-11-21 半導体素子搭載用基板及びその製造方法
PCT/JP2013/079766 WO2014080746A1 (ja) 2012-11-21 2013-11-01 半導体素子搭載用基板及びその製造方法

Publications (2)

Publication Number Publication Date
TW201436119A TW201436119A (zh) 2014-09-16
TWI605553B true TWI605553B (zh) 2017-11-11

Family

ID=50775932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102142207A TWI605553B (zh) 2012-11-21 2013-11-20 Semiconductor device mounting substrate and method for manufacturing the same

Country Status (7)

Country Link
JP (1) JP6099370B2 (ja)
KR (1) KR101691762B1 (ja)
CN (1) CN104813464A (ja)
MY (1) MY179632A (ja)
PH (1) PH12015501133B1 (ja)
TW (1) TWI605553B (ja)
WO (1) WO2014080746A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6497615B2 (ja) 2015-03-04 2019-04-10 パナソニックＩｐマネジメント株式会社 実装基板及びそれを用いたｌｅｄモジュール
JP6555927B2 (ja) * 2015-05-18 2019-08-07 大口マテリアル株式会社 半導体素子搭載用リードフレーム及び半導体装置の製造方法
JP6641807B2 (ja) * 2015-09-07 2020-02-05 大口マテリアル株式会社 光半導体装置及びその製造方法
JP2017168510A (ja) * 2016-03-14 2017-09-21 Ｓｈマテリアル株式会社 半導体素子搭載用基板、半導体装置、半導体素子搭載用基板の製造方法、及び半導体装置の製造方法
JP6826073B2 (ja) * 2018-05-31 2021-02-03 デクセリアルズ株式会社 偏光板及びその製造方法、並びに光学機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3626075B2 (ja) * 2000-06-20 2005-03-02 九州日立マクセル株式会社 半導体装置の製造方法
JP3960302B2 (ja) * 2002-12-18 2007-08-15 Ｔｄｋ株式会社 基板の製造方法
JP2004253433A (ja) * 2003-02-18 2004-09-09 Matsushita Electric Ind Co Ltd プリント配線板とこれを用いたモジュール部品およびプリント配線板の製造方法
JP2005077955A (ja) * 2003-09-02 2005-03-24 Sanyo Electric Co Ltd エッチング方法およびそれを用いた回路装置の製造方法
JP4508064B2 (ja) * 2005-09-30 2010-07-21 住友金属鉱山株式会社 半導体装置用配線基板の製造方法
JP5151438B2 (ja) * 2007-12-10 2013-02-27 大日本印刷株式会社 半導体装置およびその製造方法、ならびに半導体装置用基板およびその製造方法
JP5370330B2 (ja) * 2010-10-01 2013-12-18 住友金属鉱山株式会社 半導体素子搭載用基板の製造方法

Also Published As

Publication number Publication date
CN104813464A (zh) 2015-07-29
WO2014080746A1 (ja) 2014-05-30
KR20150087387A (ko) 2015-07-29
PH12015501133A1 (en) 2015-07-27
TW201436119A (zh) 2014-09-16
MY179632A (en) 2020-11-11
JP6099370B2 (ja) 2017-03-22
JP2014103293A (ja) 2014-06-05
PH12015501133B1 (en) 2015-07-27
KR101691762B1 (ko) 2017-01-09

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