KR980700798A - 구리 코팅(copper coating) - Google Patents

구리 코팅(copper coating)

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Publication number
KR980700798A
KR980700798A KR1019970703954A KR19970703954A KR980700798A KR 980700798 A KR980700798 A KR 980700798A KR 1019970703954 A KR1019970703954 A KR 1019970703954A KR 19970703954 A KR19970703954 A KR 19970703954A KR 980700798 A KR980700798 A KR 980700798A
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weight
composition
surfactant
acid
range
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KR1019970703954A
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KR100459104B1 (ko
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토마스 맥그라드 피터
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알파 프라이 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/07—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
    • C23C22/08—Orthophosphates
    • C23C22/12—Orthophosphates containing zinc cations
    • C23C22/16—Orthophosphates containing zinc cations containing also peroxy-compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Insulating Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemically Coating (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

일반적으로 구리인 금속 표면을 과산화수소, 무기산, 트리아졸, 테트라졸 또는 이미다졸 등의 부식 억제제 및 사차 암모늄 표면활성제를 포함하는 접착성 증진 조성물을 사용함으로서 중합 물질의 접착력을 향상시키기 위해 미세하게 거칠게(micro-roughened)한다.

Description

구리 코팅(COPPER COATING)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1 도는 접착성 증진 처리없이 구리 호일상에 만들어진 표면의 형태를 나타낸다.

Claims (23)

  1. 접착성 증진 단계에서 미세하게 거친 변환 코팅면(a micro-roughened con -version-coated surface)을 형성하기 위해서 금속 표면을 과산화수소 0.1 내지 20중량% 무기산, 유기 부식 억제제 및 표면 활성제를 포함하는 접착성 증진 조성물과 접촉시키는 것을 포함하는 금속 표면을 처리하는 방법.
  2. 제1항에 있어서, 상기 금속은 구리 또는 구리 합금, 바림직하게는 구리, 더 바람직하게는 드럼 처리 구리호일인 것을 특징으로 하는 방법.
  3. 제 1 항 또는 제 2 항에 있어서, 과산화수소가 접착성 증진 조성물내에 과산화수소 1.0 중량% 내지 4.0 중량%의 농도로 존재하는 것을 특징으로 하는 방법.
  4. 제 1 항 내지 제 3 항중 어느 한 항에 있어서, 상기 무기산은 인산, 질산, 황산 또는 그 혼합물, 바람직하게는 황산인 것을 특징으로 하는 방법.
  5. 제 1 항 내지 제 4 항중 어느 한 항에 있어서, 상기 조성물내에서 산의 농도는 1내지 50%, 바람직하게는 9 내지 20%의 범위내에 있는 것을 특징으로 하는 방법.
  6. 제 1 항 내지 제 5 항중 어느 한 항에 있어서, 상기 부식 억제제는 트리아졸, 테트라졸(tetrazole) 및/또는 이미다졸, 바람직하게는 트리아졸, 가장 바람직하게는 벤조-트리아졸인 것을 특징으로 하는 방법.
  7. 제 1 항 내지 제 6 항중 어느 한 항에 있어서, 상기 부식 억제제가 상기 접착성 증진 조성물내에 상기 접착성 증진 조성물 총중량의 적어도 0.0001 중량%, 바람직하게는 적어도 0.0005%, 더 바람직하게는 적어도 0.1%이고 많아야 20 줄량%이고 바람직하게는 많아야 10 중량%, 더욱 바람직하게는 5% 까지이고 가장 바람직하게는 1%까지의 양으로 존재하는 것을 특징으로 하는 방법.
  8. 제 1 항 내지 제 7 항중 어느 한 항에 있어서, 상기 표면활성제는 양이온성 표면활성제, 바람직하게는 4차 암모늄 표면활성제인 것을 특징으로 하는 방법.
  9. 제 8 항에 있어서, 상기 4차 암모늄 표면활성제는 에톡실레이트 페티 아민(an ethoxylated fatty amine)이고, 바람직하게는 이소데실옥시프로필 디히드록시에틸 메틸 암모늄 클로리드 및 이소트리데실옥시프로필 디히드록시 에틸 메틸 암모늄 클로리드로 부터 선택되는 것을 특징으로 하는 방법.
  10. 제 1 항 내지 제 9 항중 어느 한 항에 있어서, 상기 표면활성제는 상기 조성물내에 적어도 0.1 중량%, 바람직하게는 적어도 0.5 중량%이고 많아야 5%, 바람직하게는 많아야 3%이고 가장 바람직하게는 많아야 2.5중량%의 양으로 존재하는 것을 특징으로 하는 방법
  11. 제 1 항 내지 제 10 항중 어느 한 항에 있어서, 상기 금속 표면은 어떠한 전처리 없이 상기 접착성 증진 조성물과 접촉하는 것을 특징으로 하는 방법.
  12. 제 1 항 내지 제 11 항중 어느 한 항에 있어서, 75℃까지의 온도에서, 바람직하게는 15내지 35℃, 가장 바람직하게는 20내지 30℃의 범위에서 수행되는 것을 특징으로 하는 방법.
  13. 제 1 항 내지 제 12 항중 어느 한 항에 있어서, 접촉시간은 10초 내지 10분의 범위, 바람직하게는 30초 내지 2분의 범위내인 것을 특징으로 하는 방법.
  14. 제 1 항 내지 제 13 항중 어느 한 항에 있어서, 중합 물질은 그 이후에 바람직하게 상기 접착성 증진 단계와 상기 중합 물질의 접착 단계 사이에 아무런 단계 없이, 또는 단일 린스 및/또는 건조 단계에 따라, 상기 미세하게 거친 변환 코팅 표면에 접착되는 것을 특징으로 하는 방법.
  15. 제 1 항 내지 제 14 항중 어느 한 항에 있어서, 적어도 하나의 절연층과 적어도 하나의 도전층을 포함하는 내부층 및 적어도 절연층(a insulating layer)을 포함하는 외부층을 포함하고 처리되는 상기 금속 표면이 도전층인 다층 PCB를 형성하기 위한 방법.
  16. 제 15 항에 있어서, 접착성 증진 단계후에, 프리-프레그층은 상기 도전층에 직접 인접하게 놓여지고 상기 두층은 상기 접착 단계에서 서로 접착되는 것을 특징으로 하는 다층 PCB를 형성하기 위한 방법.
  17. 과산화수소 0.1 내지 20.0 중량% 무기산, 유기 부식 억제제 0.5 내지 2.5중량% 및 양이온 표면활성제를 포함하는 접착성 증진 조성물.
  18. 제 17 항에 있어서, 과산화수소의 농도는 1 내지 4중량%범위내인 것을 특징으로 하는 조성물.
  19. 제 17 항 또는 제 18 항에 있어서, 상기 표면활성제는 4차 암모늄 표면활성제, 바람직하게는 에톡실레이트 페티 아민(an ethoxylated fatty amine), 더 바람직하게는 이소데실옥시프로필 디히도록시에틸 메틸 암모늄 클로리드와 이소트리데실옥시프로필 디히드록시에틸 메틸 암모늄 클로리드로부터 선택된 것이고, 상기 표면활성제는 상기 조성물내에 적어도 0.001 중량%, 바람직하게는 적어도 0.005 중량%또는 심지어 0.01중량%초과, 그리고 많아야 5%, 바람직하게는 많아야 3% 및 바람직하게는 많아야 2.5중량%의 양으로 존재하는 것을 특징으로 하는 조성물.
  20. 제 17 항 내지 제 19 항중 어느 한 항에 있어서, 부식 억제제는 트리아졸, 테트라졸 및/또는 이미다졸을 0.0005중량% 내지 10중량% 범위내의 농도로 포함하는 것을 특징으로 하는 조성물.
  21. 제 17 항 내지 20 항중 어느 한 항에 있어서, 과산화수소를 위한 안정화제를 포함하는 것을 특징으로 하는 조성물.
  22. 제21항에 있어서, 상기 안정화제는 술폰산, 알코올, 지방족 아민과 그의 염 알콕시 아민, 지방족 산아민(aliphatic acid amines) 및 지방족 이민으로부터 선택되는 것을 특징으로 하는 조성물.
  23. 제21항 또는 22항에 있어서, 상기 산은 황산인 것을 특징으로 하는 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970703954A 1994-12-12 1995-12-12 구리코팅 KR100459104B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9425090.9 1994-12-12
GBGB9425090.9A GB9425090D0 (en) 1994-12-12 1994-12-12 Copper coating
PCT/GB1995/002909 WO1996019097A1 (en) 1994-12-12 1995-12-12 Copper coating

Publications (2)

Publication Number Publication Date
KR980700798A true KR980700798A (ko) 1998-03-30
KR100459104B1 KR100459104B1 (ko) 2005-06-13

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Country Status (17)

Country Link
US (1) US5800859A (ko)
EP (2) EP0797909B1 (ko)
JP (1) JP2740768B2 (ko)
KR (1) KR100459104B1 (ko)
CN (2) CN1106135C (ko)
AT (2) ATE319282T1 (ko)
AU (1) AU4183596A (ko)
DE (3) DE69534804T2 (ko)
DK (1) DK0797909T3 (ko)
ES (1) ES2150019T3 (ko)
FI (1) FI972472A (ko)
GB (1) GB9425090D0 (ko)
HK (1) HK1002891A1 (ko)
IN (1) IN186543B (ko)
MY (1) MY118585A (ko)
TW (1) TW323305B (ko)
WO (1) WO1996019097A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW374802B (en) * 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
AU6268198A (en) * 1997-01-31 1998-08-25 James M. Taylor Composition and method for priming substrate materials
US5958147A (en) * 1997-05-05 1999-09-28 Akzo Nobel N.V. Method of treating a metal
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6020029A (en) * 1997-06-12 2000-02-01 Macdermid, Incorporated Process for treating metal surfaces
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
JPH1129883A (ja) * 1997-07-08 1999-02-02 Mec Kk 銅および銅合金のマイクロエッチング剤
JP3909920B2 (ja) * 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6120639A (en) * 1997-11-17 2000-09-19 Macdermid, Incorporated Method for the manufacture of printed circuit boards
US6054061A (en) * 1997-12-11 2000-04-25 Shipley Company, L.L.C. Composition for circuit board manufacture
US6261466B1 (en) * 1997-12-11 2001-07-17 Shipley Company, L.L.C. Composition for circuit board manufacture
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US6555170B2 (en) 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
US6174561B1 (en) 1998-01-30 2001-01-16 James M. Taylor Composition and method for priming substrate materials
TW460622B (en) * 1998-02-03 2001-10-21 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
TW470785B (en) * 1998-02-03 2002-01-01 Atotech Deutschland Gmbh Process for preliminary treatment of copper surfaces
JP2000064067A (ja) 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
SG83733A1 (en) * 1998-06-26 2001-10-16 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
SG83734A1 (en) * 1998-06-26 2001-10-16 Atotech Deutschland Gmbh Process to pretreat copper surfaces
US6294220B1 (en) * 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
WO2000002426A1 (en) * 1998-07-01 2000-01-13 Fry's Metals, Inc. D/B/A Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
US6036758A (en) * 1998-08-10 2000-03-14 Pmd (U.K.) Limited Surface treatment of copper
JP5429104B2 (ja) * 1998-12-28 2014-02-26 日立化成株式会社 金属用研磨液及びそれを用いた研磨方法
EP1150341A4 (en) 1998-12-28 2005-06-08 Hitachi Chemical Co Ltd MATERIALS FOR METAL POLLING LIQUID, METAL POLISHING LIQUID, THEIR PRODUCTION AND POLISHING METHOD
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
IT1307040B1 (it) * 1999-05-31 2001-10-23 Alfachimici Spa Procedimento per promuovere l'aderenza tra un substrato inorganicoed un polimero organico.
US6188027B1 (en) 1999-06-30 2001-02-13 International Business Machines Corporation Protection of a plated through hole from chemical attack
US6475299B1 (en) * 1999-07-09 2002-11-05 Samsung Electro-Mechanics Co., Ltd. Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the same
US6372055B1 (en) 1999-10-29 2002-04-16 Shipley Company, L.L.C. Method for replenishing baths
US7351353B1 (en) † 2000-01-07 2008-04-01 Electrochemicals, Inc. Method for roughening copper surfaces for bonding to substrates
ES2270789T3 (es) * 2000-05-22 2007-04-16 Macdermid Incorporated Proceso para mejorar la adhesion de materiales polimericos a supercifies metalicas.
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US6419784B1 (en) * 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
DE10066028C2 (de) * 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
US6506314B1 (en) 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
JP4033611B2 (ja) * 2000-07-28 2008-01-16 メック株式会社 銅または銅合金のマイクロエッチング剤およびそれを用いるマイクロエッチング法
US6521139B1 (en) 2000-08-04 2003-02-18 Shipley Company L.L.C. Composition for circuit board manufacture
JP4381574B2 (ja) * 2000-08-17 2009-12-09 日鉱金属株式会社 積層板用銅合金箔
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
JP4521951B2 (ja) * 2000-08-28 2010-08-11 イビデン株式会社 エッチング液
JP2002076611A (ja) * 2000-08-28 2002-03-15 Ibiden Co Ltd 多層プリント配線板の製造方法
EP1209253A3 (en) * 2000-11-28 2004-02-25 Shipley Co. L.L.C. Process for treating adhesion promoted metal surfaces with epoxy resins
KR100379824B1 (ko) 2000-12-20 2003-04-11 엘지.필립스 엘시디 주식회사 식각용액 및 식각용액으로 패턴된 구리배선을 가지는전자기기용 어레이기판
WO2002061810A1 (en) * 2001-01-16 2002-08-08 Cabot Microelectronics Corporation Ammonium oxalate-containing polishing system and method
JP4309602B2 (ja) 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
US6749760B2 (en) 2001-10-26 2004-06-15 Intel Corporation Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
DE10302596A1 (de) * 2002-01-24 2003-08-28 Shipley Company Marlborough Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
JP3693976B2 (ja) * 2002-04-08 2005-09-14 花王株式会社 香粧品基剤組成物
KR20030080546A (ko) * 2002-04-09 2003-10-17 삼성전기주식회사 다층 인쇄회로기판의 제조방법
KR20030082767A (ko) * 2002-04-18 2003-10-23 주식회사 덕성 수용액에서의 전해질의 전기전도도가 높은 물질을 이용한레지스트 박리액 조성물
US6841263B2 (en) * 2002-05-03 2005-01-11 The John Hopkins University Method of adhering a solid polymer to a substrate and resulting article
US6716281B2 (en) * 2002-05-10 2004-04-06 Electrochemicals, Inc. Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
JP2004068068A (ja) * 2002-08-05 2004-03-04 Nippon Parkerizing Co Ltd 複合材、その製造方法
US7186305B2 (en) 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6969638B2 (en) * 2003-06-27 2005-11-29 Texas Instruments Incorporated Low cost substrate for an integrated circuit device with bondpads free of plated gold
SG140446A1 (en) * 2003-07-11 2008-03-28 Qpl Ltd Leadframe for enhanced downbond registration during automatic wire bond process
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
JP2005086071A (ja) * 2003-09-10 2005-03-31 Hitachi Chem Co Ltd 多層配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
CN100334927C (zh) * 2004-04-13 2007-08-29 广东光华化学厂有限公司 用于提高电路板内层铜面与聚合材料粘结力的棕化处理液
US20060065365A1 (en) * 2004-09-30 2006-03-30 Ferrier Donald R Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
US20070017902A1 (en) * 2005-07-22 2007-01-25 Stmicroelectronics S.A. Method for the chemical treatment of copper surfaces for the removal of carbonaceous residues
DE602006009614D1 (de) 2006-02-17 2009-11-19 Atotech Deutschland Gmbh Zusammensetzung und Verfahren zur Behandlung der Oberflächen von Kupferlegierungen, um die Haftfähigkeit zwischen der Metalloberfläche und dem gebundenen polymerischen Material zu verbessern
US7704562B2 (en) * 2006-08-14 2010-04-27 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US7962232B2 (en) * 2006-10-01 2011-06-14 Dell Products L.P. Methods and media for processing a circuit board
US7883738B2 (en) 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
US10017863B2 (en) 2007-06-21 2018-07-10 Joseph A. Abys Corrosion protection of bronzes
TWI453301B (zh) 2007-11-08 2014-09-21 Enthone 浸鍍銀塗層上的自組分子
US7972655B2 (en) 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
US20120168075A1 (en) * 2008-03-21 2012-07-05 Enthone Inc. Adhesion promotion of metal to laminate with multi-functional molecular system
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
JP2009299096A (ja) * 2008-06-10 2009-12-24 Ebara Densan Ltd プリント回路基板用銅及び銅合金の表面処理液と表面処理方法
US8088246B2 (en) * 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
KR20100091663A (ko) 2009-02-11 2010-08-19 삼성전자주식회사 표면개질제, 이를 사용하여 제조된 적층 구조, 그 구조의 제조방법 및 이를 포함하는 트랜지스터
US20100221574A1 (en) * 2009-02-27 2010-09-02 Rochester Thomas H Zinc alloy mechanically deposited coatings and methods of making the same
DE102009013534A1 (de) * 2009-03-19 2010-09-23 Crinotec Gmbh Verfahren und Vorrichtung zur Bestimmung eines Fremdstoffgehalts in einer Matrix
CN101560656B (zh) * 2009-04-14 2011-05-18 东莞市中实焊锡有限公司 一种无铅印制电路板铜面保护剂及其制备方法
US8512504B2 (en) 2009-05-06 2013-08-20 Steven A. Castaldi Process for improving adhesion of polymeric materials to metal surfaces
JP2011179085A (ja) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd 電気めっき用前処理剤、電気めっきの前処理方法及び電気めっき方法
CA2801875C (en) * 2010-06-11 2018-09-04 Alchimer Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition
KR101958606B1 (ko) 2010-07-06 2019-03-14 아토테크 도이칠란드 게엠베하 인쇄회로기판의 제조 방법
KR101730983B1 (ko) 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
CN101967634A (zh) * 2010-10-26 2011-02-09 广东多正化工科技有限公司 印刷线路板棕化处理剂
EP2453041B1 (en) * 2010-11-10 2014-02-12 Atotech Deutschland GmbH Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
EP2654111B1 (en) 2010-12-27 2018-04-18 Furukawa Electric Co., Ltd. Lithium-ion secondary battery, electrode for secondary battery, and electrolytic copper foil for secondary battery electrode
JP5906459B2 (ja) * 2012-03-30 2016-04-20 パナソニックＩｐマネジメント株式会社 太陽電池及びその製造方法
JP5935163B2 (ja) * 2012-03-30 2016-06-15 ナガセケムテックス株式会社 レジスト密着性向上剤及び銅配線製造方法
JP5718476B2 (ja) 2012-06-27 2015-05-13 古河電気工業株式会社 リチウムイオン二次電池用電解銅箔、リチウムイオン二次電池の負極電極及びリチウムイオン二次電池
US9338896B2 (en) 2012-07-25 2016-05-10 Enthone, Inc. Adhesion promotion in printed circuit boards
KR101850112B1 (ko) * 2012-12-26 2018-04-19 한화테크윈 주식회사 그래핀, 그래핀 제조용 조성물 및 이를 이용한 그래핀의 제조 방법
CN104066274A (zh) * 2013-03-21 2014-09-24 元杰企业有限公司 一种用于印刷电路板制程的铜箔表面改质方法
US9355864B2 (en) * 2013-08-06 2016-05-31 Tel Nexx, Inc. Method for increasing adhesion of copper to polymeric surfaces
KR101568687B1 (ko) 2014-04-30 2015-11-13 주식회사 엘 앤 에프 방열 시트 및 그 제조방법
CN104032295B (zh) * 2014-05-13 2016-05-18 合肥奥福表面处理科技有限公司 一种铜杆塑化处理方法
KR101590081B1 (ko) 2014-10-07 2016-02-02 한국생산기술연구원 인쇄회로기판 내층의 표면처리 방법
JP6779136B2 (ja) * 2015-01-07 2020-11-04 太陽インキ製造株式会社 金属基材用表面処理剤
CN105050337B (zh) * 2015-07-02 2018-09-04 广州杰赛科技股份有限公司 一种刚挠结合板的制作方法
WO2017090161A1 (ja) * 2015-11-26 2017-06-01 近藤　和夫 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法
CN107278052A (zh) * 2016-04-08 2017-10-20 东莞市斯坦得电子材料有限公司 用于印制线路板光致图形转移前处理的化学粗化工艺
JP6870245B2 (ja) * 2016-09-06 2021-05-12 昭和電工マテリアルズ株式会社 銅製部材の表面処理方法及び半導体実装用基板の製造方法
US20190144686A1 (en) * 2017-11-10 2019-05-16 Aculon, Inc. Surface treatment compositions and coated articles prepared therefrom
US10083926B1 (en) * 2017-12-13 2018-09-25 Dialog Semiconductor (Uk) Limited Stress relief solutions on WLCSP large/bulk copper plane design
EP3567993B1 (en) 2018-05-08 2022-02-23 Atotech Deutschland GmbH & Co. KG A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, and acidic aqueous non-etching protector solution
CN108842150A (zh) * 2018-07-23 2018-11-20 铜陵金力铜材有限公司 一种铜制品表面处理方法
CN108966511A (zh) * 2018-07-30 2018-12-07 生益电子股份有限公司 一种降低高速pcb信号插入损耗的内层表面处理方法
CN109195303A (zh) * 2018-07-30 2019-01-11 生益电子股份有限公司 一种降低高速pcb信号插入损耗的内层表面处理方法
US11678433B2 (en) 2018-09-06 2023-06-13 D-Wave Systems Inc. Printed circuit board assembly for edge-coupling to an integrated circuit
CN109536962B (zh) * 2018-11-20 2023-06-16 无锡格菲电子薄膜科技有限公司 一种cvd石墨烯生长衬底铜箔酸性刻蚀液
CN109355649B (zh) * 2018-12-21 2020-08-28 苏州美吉纳纳米新材料科技有限公司 一种pcb铜面氧化剂及其制备方法
CN109986191A (zh) * 2019-04-15 2019-07-09 上海交通大学 一种应用于金属/高分子连接的表面处理方法
US11647590B2 (en) 2019-06-18 2023-05-09 D-Wave Systems Inc. Systems and methods for etching of metals
CN112624786B (zh) * 2019-09-24 2022-08-30 佳总兴业股份有限公司 复合式基板的制造方法
CN110819991B (zh) * 2019-11-08 2022-07-15 日月光半导体(上海)有限公司 蚀刻液及使用其的封装基板的制造方法
CN112064026A (zh) * 2020-08-03 2020-12-11 罗山县金硕电子材料有限公司 一种新型的铜面粗糙度咬蚀稳定剂及其制备方法
CA3110357A1 (en) * 2021-02-25 2022-08-25 Sixring Inc. Modified sulfuric acid and uses thereof
KR20240018632A (ko) 2021-06-09 2024-02-13 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 구리층과 유기층의 복합재 및 그 복합재의 제조방법
WO2023190264A1 (ja) * 2022-03-29 2023-10-05 四国化成工業株式会社 トリアゾール化合物、該トリアゾール化合物の合成方法、カップリング剤およびそれらの利用
CN114807943B (zh) * 2022-06-27 2022-09-16 深圳市板明科技股份有限公司 一种5g高频线路生产工艺用微蚀刻液和微蚀方法及其应用
CN114774937B (zh) * 2022-06-27 2022-09-16 深圳市板明科技股份有限公司 一种线路板电镀用环保型无机酸性除油剂和除油方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556883A (en) * 1967-07-21 1971-01-19 Mitsubishi Edogawa Kagaku Kk Method for chemically polishing copper or copper alloy
US3668131A (en) * 1968-08-09 1972-06-06 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
US3756957A (en) * 1971-03-15 1973-09-04 Furukawa Electric Co Ltd Solutions for chemical dissolution treatment of metallic materials
JPS5120972B1 (ko) * 1971-05-13 1976-06-29
BE791457A (fr) * 1971-11-18 1973-05-16 Du Pont Solutions acides stabilisees d'eau oxygenee
JPS5332341B2 (ko) * 1973-03-27 1978-09-07
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
SE400575B (sv) * 1974-12-13 1978-04-03 Nordnero Ab Bad for betning av koppar och dess legeringar
SE425007B (sv) * 1976-01-05 1982-08-23 Shipley Co Stabil etslosning omfattande svavelsyra och veteperoxid samt anvendning av densamma
US4144119A (en) * 1977-09-30 1979-03-13 Dutkewych Oleh B Etchant and process
CA1146851A (en) * 1978-05-01 1983-05-24 Donald F. Greene Hydrogen peroxide disinfecting and sterilizing compositions
JPS57164984A (en) * 1981-04-06 1982-10-09 Metsuku Kk Exfoliating solution for tin or tin alloy
GB2106086A (en) * 1981-09-08 1983-04-07 Dart Ind Inc Stabilization of hydrogen peroxide solutions
US4437931A (en) * 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals
US4973380A (en) * 1983-10-06 1990-11-27 Olin Corporation Process for etching copper base materials
GB8522046D0 (en) * 1985-09-05 1985-10-09 Interox Chemicals Ltd Stabilisation
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen
US4880495A (en) * 1987-04-13 1989-11-14 The Harshaw Chemical Company Regeneration of copper etch bath
US4859281A (en) * 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
JPH01240683A (ja) * 1988-03-19 1989-09-26 Sanshin Kagaku Kogyo Kk 銅のエッチング液組成物およびエッチング方法
JP2909743B2 (ja) * 1989-03-08 1999-06-23 富山日本電気株式会社 銅または銅合金の化学研磨方法
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces
JPH0379778A (ja) * 1989-08-21 1991-04-04 Sanshin Chem Ind Co Ltd 銅のエッチング液組成物およびエッチング方法
JPH0379788A (ja) * 1989-08-22 1991-04-04 Nisshin Steel Co Ltd 密着性に優れたＺｎ―Ｎｉ合金めっきステンレス鋼板の製造方法
JPH03140481A (ja) * 1989-10-26 1991-06-14 Matsushita Electric Works Ltd 銅張り板の表面処理法
JPH03140482A (ja) * 1989-10-26 1991-06-14 Matsushita Electric Works Ltd 銅張り板の表面処理法
JPH03140483A (ja) * 1989-10-26 1991-06-14 Matsushita Electric Works Ltd 銅張り板の表面処理法
JPH03140484A (ja) * 1989-10-26 1991-06-14 Matsushita Electric Works Ltd 銅張り板の表面処理法
JPH03285393A (ja) * 1990-04-02 1991-12-16 Matsushita Electric Works Ltd 多層配線基板の製造方法
JPH05127819A (ja) * 1991-10-31 1993-05-25 Nec Corp ストロークコマンド支援方式
JPH06112646A (ja) * 1992-09-29 1994-04-22 Metsuku Kk 銅または銅合金表面の処理方法
US5376387A (en) * 1993-07-16 1994-12-27 Eastman Kodak Company Hydrogen peroxide composition
JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤

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EP0797909A1 (en) 1997-10-01
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MY118585A (en) 2004-12-31
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FI972472A0 (fi) 1997-06-11
GB9425090D0 (en) 1995-02-08
EP0797909B1 (en) 2000-07-26
DE69518166D1 (de) 2000-08-31
ATE195052T1 (de) 2000-08-15
CN1422924A (zh) 2003-06-11
DE797909T1 (de) 1998-03-05
CN1106135C (zh) 2003-04-16
ES2150019T3 (es) 2000-11-16
DE69534804D1 (de) 2006-04-27
US5800859A (en) 1998-09-01
EP0993241A1 (en) 2000-04-12
WO1996019097A1 (en) 1996-06-20
EP0993241B1 (en) 2006-03-01
DK0797909T3 (da) 2000-12-18
HK1002891A1 (en) 1998-09-25
AU4183596A (en) 1996-07-03
DE69534804T2 (de) 2006-11-02

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