SG140446A1 - Leadframe for enhanced downbond registration during automatic wire bond process - Google Patents
Leadframe for enhanced downbond registration during automatic wire bond processInfo
- Publication number
- SG140446A1 SG140446A1 SG200304072-2A SG2003040722A SG140446A1 SG 140446 A1 SG140446 A1 SG 140446A1 SG 2003040722 A SG2003040722 A SG 2003040722A SG 140446 A1 SG140446 A1 SG 140446A1
- Authority
- SG
- Singapore
- Prior art keywords
- leadframe
- downbond
- enhanced
- wire bond
- automatic wire
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
LEADFRAME FOR ENHANCED DOWNBOND REGISTRATION DURING AUTOMATIC WIRE BOND PROCESS A process for enhancing visual detectability of a leadframe (100) having a die attach pad (202) and a plurality of contacts (203), during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line or an array of dots are plated on the die attach pad (202) of the leadframe and around a periphery of the die attach pad. The leadframe (100) is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line or the dots.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200304072-2A SG140446A1 (en) | 2003-07-11 | 2003-07-11 | Leadframe for enhanced downbond registration during automatic wire bond process |
TW092119143A TWI263316B (en) | 2003-07-11 | 2003-07-14 | Leadframe for enhanced downbond registration during automatic wire bond process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200304072-2A SG140446A1 (en) | 2003-07-11 | 2003-07-11 | Leadframe for enhanced downbond registration during automatic wire bond process |
Publications (1)
Publication Number | Publication Date |
---|---|
SG140446A1 true SG140446A1 (en) | 2008-03-28 |
Family
ID=39205023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200304072-2A SG140446A1 (en) | 2003-07-11 | 2003-07-11 | Leadframe for enhanced downbond registration during automatic wire bond process |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG140446A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6310547A (en) * | 1986-07-02 | 1988-01-18 | Hitachi Ltd | Semiconductor device |
JPH08335763A (en) * | 1994-12-12 | 1996-12-17 | Alpha Metals Ltd | Copper coating |
US6585905B1 (en) * | 1998-06-10 | 2003-07-01 | Asat Ltd. | Leadless plastic chip carrier with partial etch die attach pad |
-
2003
- 2003-07-11 SG SG200304072-2A patent/SG140446A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6310547A (en) * | 1986-07-02 | 1988-01-18 | Hitachi Ltd | Semiconductor device |
JPH08335763A (en) * | 1994-12-12 | 1996-12-17 | Alpha Metals Ltd | Copper coating |
US6585905B1 (en) * | 1998-06-10 | 2003-07-01 | Asat Ltd. | Leadless plastic chip carrier with partial etch die attach pad |
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