SG140446A1 - Leadframe for enhanced downbond registration during automatic wire bond process - Google Patents

Leadframe for enhanced downbond registration during automatic wire bond process

Info

Publication number
SG140446A1
SG140446A1 SG200304072-2A SG2003040722A SG140446A1 SG 140446 A1 SG140446 A1 SG 140446A1 SG 2003040722 A SG2003040722 A SG 2003040722A SG 140446 A1 SG140446 A1 SG 140446A1
Authority
SG
Singapore
Prior art keywords
leadframe
downbond
enhanced
wire bond
automatic wire
Prior art date
Application number
SG200304072-2A
Inventor
Lau Yung Piu
Moosa Naina Mohamed Lebbai
Original Assignee
Qpl Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qpl Ltd filed Critical Qpl Ltd
Priority to SG200304072-2A priority Critical patent/SG140446A1/en
Priority to TW092119143A priority patent/TWI263316B/en
Publication of SG140446A1 publication Critical patent/SG140446A1/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

LEADFRAME FOR ENHANCED DOWNBOND REGISTRATION DURING AUTOMATIC WIRE BOND PROCESS A process for enhancing visual detectability of a leadframe (100) having a die attach pad (202) and a plurality of contacts (203), during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line or an array of dots are plated on the die attach pad (202) of the leadframe and around a periphery of the die attach pad. The leadframe (100) is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line or the dots.
SG200304072-2A 2003-07-11 2003-07-11 Leadframe for enhanced downbond registration during automatic wire bond process SG140446A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200304072-2A SG140446A1 (en) 2003-07-11 2003-07-11 Leadframe for enhanced downbond registration during automatic wire bond process
TW092119143A TWI263316B (en) 2003-07-11 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200304072-2A SG140446A1 (en) 2003-07-11 2003-07-11 Leadframe for enhanced downbond registration during automatic wire bond process

Publications (1)

Publication Number Publication Date
SG140446A1 true SG140446A1 (en) 2008-03-28

Family

ID=39205023

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200304072-2A SG140446A1 (en) 2003-07-11 2003-07-11 Leadframe for enhanced downbond registration during automatic wire bond process

Country Status (1)

Country Link
SG (1) SG140446A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310547A (en) * 1986-07-02 1988-01-18 Hitachi Ltd Semiconductor device
JPH08335763A (en) * 1994-12-12 1996-12-17 Alpha Metals Ltd Copper coating
US6585905B1 (en) * 1998-06-10 2003-07-01 Asat Ltd. Leadless plastic chip carrier with partial etch die attach pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310547A (en) * 1986-07-02 1988-01-18 Hitachi Ltd Semiconductor device
JPH08335763A (en) * 1994-12-12 1996-12-17 Alpha Metals Ltd Copper coating
US6585905B1 (en) * 1998-06-10 2003-07-01 Asat Ltd. Leadless plastic chip carrier with partial etch die attach pad

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