MY129449A - Leadframe for enhanced downbond registration during automatic wire bond process - Google Patents

Leadframe for enhanced downbond registration during automatic wire bond process

Info

Publication number
MY129449A
MY129449A MYPI20032625A MY129449A MY 129449 A MY129449 A MY 129449A MY PI20032625 A MYPI20032625 A MY PI20032625A MY 129449 A MY129449 A MY 129449A
Authority
MY
Malaysia
Prior art keywords
leadframe
downbond
enhanced
wire bond
during automatic
Prior art date
Application number
Inventor
Lau Yung Piu
Mohamed Lebbal Moosa Naina
Original Assignee
Qpl Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qpl Ltd filed Critical Qpl Ltd
Priority to TW092119143A priority Critical patent/TWI263316B/en
Priority to MYPI20032625 priority patent/MY129449A/en
Publication of MY129449A publication Critical patent/MY129449A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

A PROCESS FOR ENHANCING VISUAL DETECTABILITY OF LEADFRAME (100) HAVING A DIE ATTACH PAD (202) AND A PLURALITY OF CONTACTS (203), DURING AUTOMATED WIREBONDING IN THE PRODUCTION OF AN INTEGRATED CIRCUIT PACKAGE. AT LEAST ONE OF A RING, A LINE AND AN ARRAY OF DOTS ARE PLATED ON THE DIE ATTACH PAD (202) OF THE LEADFRAME (100) AND AROUND A PERIPHERY OF THE DIE ATTACH PAD. THE LEADFRAME (100) IS SURFACE TREATED TO CAUSE A COLOR CHANGE ION A SURFACE OF THE LEADFRAME FOR IMPROVED VISUAL DETACTABILITY OF THE AT LEAST ONE OF THE RING, THE LINE AND THE DOTS.
MYPI20032625 2003-07-11 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process MY129449A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092119143A TWI263316B (en) 2003-07-11 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process
MYPI20032625 MY129449A (en) 2003-07-14 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20032625 MY129449A (en) 2003-07-14 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process

Publications (1)

Publication Number Publication Date
MY129449A true MY129449A (en) 2007-04-30

Family

ID=47289791

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20032625 MY129449A (en) 2003-07-11 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process

Country Status (1)

Country Link
MY (1) MY129449A (en)

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