TWI263316B - Leadframe for enhanced downbond registration during automatic wire bond process - Google Patents

Leadframe for enhanced downbond registration during automatic wire bond process

Info

Publication number
TWI263316B
TWI263316B TW092119143A TW92119143A TWI263316B TW I263316 B TWI263316 B TW I263316B TW 092119143 A TW092119143 A TW 092119143A TW 92119143 A TW92119143 A TW 92119143A TW I263316 B TWI263316 B TW I263316B
Authority
TW
Taiwan
Prior art keywords
leadframe
downbond
enhanced
wire bond
during automatic
Prior art date
Application number
TW092119143A
Other languages
Chinese (zh)
Other versions
TW200503196A (en
Inventor
Yung-Piu Lau
Naina Mohamed Lebbai Moosa
Original Assignee
Qpl Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200304072-2A external-priority patent/SG140446A1/en
Application filed by Qpl Ltd filed Critical Qpl Ltd
Priority claimed from MYPI20032625 external-priority patent/MY129449A/en
Priority claimed from CN031495796A external-priority patent/CN1571130B/en
Publication of TW200503196A publication Critical patent/TW200503196A/en
Application granted granted Critical
Publication of TWI263316B publication Critical patent/TWI263316B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body

Landscapes

  • Wire Bonding (AREA)

Abstract

A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line and array of dots are plated on the die attach pad of the leadframe and around a periphery of the die attach pad. The leadframe is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line and the dots.
TW092119143A 2003-07-11 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process TWI263316B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TH083796 2003-07-11
SG200304072-2A SG140446A1 (en) 2003-07-11 2003-07-11 Leadframe for enhanced downbond registration during automatic wire bond process
MYPI20032625 MY129449A (en) 2003-07-14 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process
CN031495796A CN1571130B (en) 2003-07-15 2003-07-15 Lead frame for reinforcing lower joint alignment in automatic lead bonding process

Publications (2)

Publication Number Publication Date
TW200503196A TW200503196A (en) 2005-01-16
TWI263316B true TWI263316B (en) 2006-10-01

Family

ID=37966332

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092119143A TWI263316B (en) 2003-07-11 2003-07-14 Leadframe for enhanced downbond registration during automatic wire bond process

Country Status (1)

Country Link
TW (1) TWI263316B (en)

Also Published As

Publication number Publication date
TW200503196A (en) 2005-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees