TW200725861A - Semiconductor package and process for making the same - Google Patents

Semiconductor package and process for making the same

Info

Publication number
TW200725861A
TW200725861A TW094147292A TW94147292A TW200725861A TW 200725861 A TW200725861 A TW 200725861A TW 094147292 A TW094147292 A TW 094147292A TW 94147292 A TW94147292 A TW 94147292A TW 200725861 A TW200725861 A TW 200725861A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
package body
making
same
semiconductor package
Prior art date
Application number
TW094147292A
Other languages
Chinese (zh)
Other versions
TWI287865B (en
Inventor
Dae-Hoon Jung
Seok-Won Lee
Sang-Bae Park
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94147292A priority Critical patent/TWI287865B/en
Publication of TW200725861A publication Critical patent/TW200725861A/en
Application granted granted Critical
Publication of TWI287865B publication Critical patent/TWI287865B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.
TW94147292A 2005-12-29 2005-12-29 Semiconductor package and process for making the same TWI287865B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94147292A TWI287865B (en) 2005-12-29 2005-12-29 Semiconductor package and process for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94147292A TWI287865B (en) 2005-12-29 2005-12-29 Semiconductor package and process for making the same

Publications (2)

Publication Number Publication Date
TW200725861A true TW200725861A (en) 2007-07-01
TWI287865B TWI287865B (en) 2007-10-01

Family

ID=39201793

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94147292A TWI287865B (en) 2005-12-29 2005-12-29 Semiconductor package and process for making the same

Country Status (1)

Country Link
TW (1) TWI287865B (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8879757B2 (en) 2012-11-20 2014-11-04 Tsinghua University Thermoacoustic device
US8908888B2 (en) 2012-11-20 2014-12-09 Tsinghua University Earphone
US8913764B2 (en) 2012-11-20 2014-12-16 Tsinghua University Earphone
US8913765B2 (en) 2012-11-20 2014-12-16 Tsinghua University Earphone
US8923534B2 (en) 2012-11-20 2014-12-30 Tsinghua University Earphone
US8975539B2 (en) 2011-12-14 2015-03-10 Novatek Microelectronics Corp. Lead frame package structure with low electromagnetic interference
TWI487384B (en) * 2012-11-20 2015-06-01 Hon Hai Prec Ind Co Ltd Earphone
US9088851B2 (en) 2012-11-20 2015-07-21 Tsinghua University Thermoacoustic device array
TWI503003B (en) * 2012-11-20 2015-10-01 Hon Hai Prec Ind Co Ltd Acoustic chip
US9161135B2 (en) 2012-11-20 2015-10-13 Tsinghua University Thermoacoustic chip
US9264819B2 (en) 2012-11-20 2016-02-16 Tsinghua University Thermoacoustic device
US9491535B2 (en) 2012-11-20 2016-11-08 Tsinghua University Earphone
US9756442B2 (en) 2012-11-20 2017-09-05 Tsinghua University Method for making thermoacoustic device array
US9774971B2 (en) 2012-11-20 2017-09-26 Tsinghua University Method for making thermoacoustic device
TWI613768B (en) * 2017-03-20 2018-02-01 矽品精密工業股份有限公司 Electronic package and method for fabricating the same
TWI744779B (en) * 2019-05-28 2021-11-01 大陸商武漢杰開科技有限公司 Multi-device packaging structure and manufacturing method thereof
CN113838839A (en) * 2020-06-23 2021-12-24 光宝科技新加坡私人有限公司 Sensing assembly packaging structure and packaging method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI610406B (en) * 2015-02-09 2018-01-01 精材科技股份有限公司 Chip package and manufacturing method thereof

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975539B2 (en) 2011-12-14 2015-03-10 Novatek Microelectronics Corp. Lead frame package structure with low electromagnetic interference
TWI479627B (en) * 2011-12-14 2015-04-01 Novatek Microelectronics Corp Lead frame package structure with low electromagnetic interference
US9161135B2 (en) 2012-11-20 2015-10-13 Tsinghua University Thermoacoustic chip
US9241221B2 (en) 2012-11-20 2016-01-19 Tsinghua University Thermoacoustic chip
US8923534B2 (en) 2012-11-20 2014-12-30 Tsinghua University Earphone
US8913764B2 (en) 2012-11-20 2014-12-16 Tsinghua University Earphone
US8908888B2 (en) 2012-11-20 2014-12-09 Tsinghua University Earphone
TWI487384B (en) * 2012-11-20 2015-06-01 Hon Hai Prec Ind Co Ltd Earphone
US9088851B2 (en) 2012-11-20 2015-07-21 Tsinghua University Thermoacoustic device array
TWI503003B (en) * 2012-11-20 2015-10-01 Hon Hai Prec Ind Co Ltd Acoustic chip
US8879757B2 (en) 2012-11-20 2014-11-04 Tsinghua University Thermoacoustic device
US8913765B2 (en) 2012-11-20 2014-12-16 Tsinghua University Earphone
US9264819B2 (en) 2012-11-20 2016-02-16 Tsinghua University Thermoacoustic device
US9402127B2 (en) 2012-11-20 2016-07-26 Tsinghua University Earphone
US9491535B2 (en) 2012-11-20 2016-11-08 Tsinghua University Earphone
US9756442B2 (en) 2012-11-20 2017-09-05 Tsinghua University Method for making thermoacoustic device array
US9774971B2 (en) 2012-11-20 2017-09-26 Tsinghua University Method for making thermoacoustic device
TWI613768B (en) * 2017-03-20 2018-02-01 矽品精密工業股份有限公司 Electronic package and method for fabricating the same
TWI744779B (en) * 2019-05-28 2021-11-01 大陸商武漢杰開科技有限公司 Multi-device packaging structure and manufacturing method thereof
CN113838839A (en) * 2020-06-23 2021-12-24 光宝科技新加坡私人有限公司 Sensing assembly packaging structure and packaging method thereof

Also Published As

Publication number Publication date
TWI287865B (en) 2007-10-01

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