AU6268198A - Composition and method for priming substrate materials - Google Patents

Composition and method for priming substrate materials

Info

Publication number
AU6268198A
AU6268198A AU62681/98A AU6268198A AU6268198A AU 6268198 A AU6268198 A AU 6268198A AU 62681/98 A AU62681/98 A AU 62681/98A AU 6268198 A AU6268198 A AU 6268198A AU 6268198 A AU6268198 A AU 6268198A
Authority
AU
Australia
Prior art keywords
composition
substrate materials
priming substrate
priming
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU62681/98A
Inventor
James M. Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU6268198A publication Critical patent/AU6268198A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Detergent Compositions (AREA)
AU62681/98A 1997-01-31 1998-01-30 Composition and method for priming substrate materials Abandoned AU6268198A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3662797P 1997-01-31 1997-01-31
US60036627 1997-01-31
PCT/US1998/002178 WO1998033951A1 (en) 1997-01-31 1998-01-30 Composition and method for priming substrate materials

Publications (1)

Publication Number Publication Date
AU6268198A true AU6268198A (en) 1998-08-25

Family

ID=21889686

Family Applications (1)

Application Number Title Priority Date Filing Date
AU62681/98A Abandoned AU6268198A (en) 1997-01-31 1998-01-30 Composition and method for priming substrate materials

Country Status (6)

Country Link
EP (1) EP1017881A1 (en)
JP (1) JP4189609B2 (en)
AU (1) AU6268198A (en)
CA (1) CA2278580A1 (en)
TW (1) TW388194B (en)
WO (1) WO1998033951A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19944908A1 (en) * 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Method of forming a conductor pattern on dielectric substrates
ES2348361T3 (en) 2005-10-25 2010-12-03 Atotech Deutschland Gmbh METHOD FOR IMPROVED ADHESION OF POLYMER MATERIALS TO COPPER SURFACES OR COPPER ALLOYS.

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163727A (en) * 1977-12-05 1979-08-07 Basf Wyandotte Corporation Acidizing-gel composition
JPS5776197A (en) * 1980-10-28 1982-05-13 Furukawa Electric Co Ltd:The Partial plating for strip material
JPS59222276A (en) * 1983-05-26 1984-12-13 Otsuka Kagu Kogyo Kk Rust preventive method
US4510018A (en) * 1984-02-21 1985-04-09 The Lea Manufacturing Company Solution and process for treating copper and copper alloys
JPS6148583A (en) * 1984-08-10 1986-03-10 C Uyemura & Co Ltd Scale remover
JPS6190492A (en) * 1984-10-11 1986-05-08 四国化成工業株式会社 Manufacture of copper through hole printed circuit board
JPS61166986A (en) * 1985-01-17 1986-07-28 Masami Kobayashi Metal plated amorphous alloy
JPH0215185A (en) * 1988-06-30 1990-01-18 Sumitomo Chem Co Ltd Method of removing scale in jacket of apparatus made of glass lining
US5011711A (en) * 1989-07-18 1991-04-30 Toyo Kohan Co., Ltd. Method for post-treatment of electroplated steel sheets for soldering
JPH03229887A (en) * 1990-02-02 1991-10-11 Zero Wan:Kk Removing agent for sulfide on silver alloy surface and method for removing sulfide using the same
JPH03240976A (en) * 1990-02-16 1991-10-28 Nippon Soda Co Ltd Plating resist peeling preventive agent
JPH0423483A (en) * 1990-05-18 1992-01-27 Mitsubishi Electric Corp Manufacture of printed wiring board
JPH04318191A (en) * 1991-04-15 1992-11-09 Nikko Kyodo Co Ltd Surface treating solution and surface treating method
JPH06287774A (en) * 1993-04-05 1994-10-11 Metsuku Kk Surface-treating agent of copper and copper alloy
JP2550915B2 (en) * 1994-06-21 1996-11-06 日本電気株式会社 Method for forming surface protective agent and surface protective film for printed wiring board
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating

Also Published As

Publication number Publication date
EP1017881A1 (en) 2000-07-12
JP4189609B2 (en) 2008-12-03
JP2001511218A (en) 2001-08-07
TW388194B (en) 2000-04-21
CA2278580A1 (en) 1998-08-06
WO1998033951A1 (en) 1998-08-06

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