2607pif.doc/002 A 7 B72607pif.doc / 002 A 7 B7
經濟部中央揉丰局貝工消费合作社印IL 五、發明説明（丨） 本發明是有關於一種用以製作底材的物質組成，且特 別是有關於一種用於製造印刷電路板、化學磨粉合金和化 學鑄鍍合金上之金屬表面與內層的塗底改進方法與溶液。 製造印刷電路板需要使用已處理過之底材，通常，底材 的處理是將一連串不同的化學溶液塗佈於底材表面。在每 次使用溶液之前，一般是以水來沖洗底材，然後再進行最 終的沖洗與烘乾循環。印刷電路板製程可具有數個步驟， 包括材料表層的潔淨（Cleaned)、擦洗（Scrubbed》、蝕刻 (Etched)、保護（Passivated)、處理（Treated)、光罩(Masked)、 製作（Processed)、沉積（Deposited)或不同的結合 (Combinations) ° 印刷電路板製程之起始步驟包含底材淸洗與塗底，以利 於隨後用於界定印刷電路板所需求的電路圖案之光阻或玻 璃版油墨（screen ink)的使用。第1圖繪示習知一種典型使用 化學淸洗和塗底底材的四個步驟，淸洗與塗底技術僅只是 印刷電路板工業上多步驟技術中之一。 在第一步驟中，以酸性溶液塗覆底材，此溶液功能在於 淸洗並移除鉻酸鹽，過程約30秒至1分鐘。此溶液使用的溫 度約在華氏100至120度，然後淸洗底材以移除過多的酸性 溶液。 在第二步驟中，底材表面塗覆一層鈾刻液以進行表面蝕 刻，通常爲濃硫酸或過氧硫酸，也可以輕石(Pumice)利用物 理洗滌方式。蝕刻可移去殘留的鉻酸鹽並使得底材表面結 構粗糙，蝕刻也可增加底材阻絕層(Resist Layer)的黏著 (請先閲讀背面之注意事項再填寫本頁) J· 裝_ ir 線 本紙張尺度逋用中國國家榡準（CNS ) A4规格（210X297公嫠） 經濟部中央標準局貝工消费合作社印製 2607pif.doc/002 A 7 ___B7 五、發明説明（2) 性，特別是假使底材下方具有銅成分。然後淸洗底材以移 除蝕刻液或輕石粒。 第三步驟須端視底材是以化學蝕刻或輕石洗滌來決 定。倘若爲化學蝕刻，則先浸泡於第二酸性溶液後加以淸 洗。通常以一滴或噴灑5%至10%的硫酸來移除生成在蝕刻 銅上的氧化物並將銅鈍化。移除氧化物可降低在最終的淸 洗與先前阻絕膜的乾燥循環中的再氧化現象。若爲輕石洗 滌，則採用中至高壓洗滌來移除輕石粒子，其它物質則不 會被移除。 第四步驟是使用氧化抑制劑或阻絕層黏著促進劑來塗 覆底材。通常使用三氮#(Triaz〇ie)溶液。然後將底材淸洗 並乾燥。此時，塗底底材並爲底材阻絕層的應用而準備。 然而，多步驟淸潔和塗底技術相當費時，費錢及增加額 外的廢棄產品。因此需要將淸洗與塗底底材的單一步驟方 法和配方，特別是可當作淸潔劑，鉻酸鹽去除劑，氧化抑 制劑，黏著增加劑，彈性增加劑與再沉積抑制劑。 化學硏磨工業也使用如上所述之製程來淸洗與塗底底 材。因此，在化學硏磨合金上需要單一步驟與化合物用以 塗底底材。 化學鑄鍍工業也使用如上所述之製程來淸洗與塗底底 材。因此，在化學鑄鍍合金上需要單一步驟與化合物用以 塗底底材。 有鑒於此，本發明的目的就是在提供一種在製造印刷電 路板上用以淸洗與塗底底材的化合物與方法。更特別的 本纸張尺度逍用中鬮囤家棣準（CNS ) A4规格（210X297公釐） 1— —^ I I ^ 裝—— ϋ H ϋ ϋ ~""""線 (請先閲讀背面之注意事項再填寫本頁) 2607pif.doc/002 經濟部中央揉準局負工消费合作社印製 A7 B7 五、發明説明（，） 是’此化合物與方法可淸洗，移除鉻酸鹽，抑止氧化，促 •進黏著’抑止酸性侵害與底材內層中心的再沉積，以及增 加合成物質的彈性。因此，此化合物可將製造印刷電路板 中用於淸洗與塗底的多重步驟簡化爲單一步驟。 本發明之另一目的是提供一種或多種膜胺（Filming Amines) ’當與適當的一種酸或組合酸結合時，具有獨特的 性質。在鍍銅於底材製程中，此溶液可使阻絕層在平滑， 非表面蝕刻銅與其他底材材料上形成化學鍵結。 本發明並包含一配方，使得可以在印刷電路板上蝕刻極 微細的線條與空間，並且不會發生黏著性的損失，和底材 在彎曲時發生破壞或微小碎裂。 本發明另一部份是關於一種組成，此組成可由約 0.003%至3.0%的膜胺，約0.02%至10%的非離子表面活化劑 與足夠酸來使用於底材組合上，並產生小於6_5的pH値。 爲達成本發明之上述目的，一種關於製作塗底底材方 法，包括：從0.003%至3.0%的膜胺與足夠酸來生成小於6 5 的pH値；以此溶液在底材上塗覆；並且將底材乾燥。 爲達成本發明之另一目的，一種單一溶液與方法，可在 化學磨粉合金與化學鑄鍍合金上用來淸洗，抑制氧化和增 進黏著性。 爲讓本發明之上述和其他目的、特徵、和優點能更明顯 易懂，下文特舉一較隹實施例，並配合所附圖式，作詳細 說明如下： 圖式之簡單說明： 本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公釐） 、vs (請先閲讀背面之注意事項再填寫本頁)Printed by the Central Government Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, Co. IL 5. Description of the invention (丨) The present invention relates to a material composition for making substrates, and in particular, to a method for manufacturing printed circuit boards and chemical grinding powder. Improved methods and solutions for the coating of metal surfaces and inner layers on alloys and chemically cast alloys. The manufacture of printed circuit boards requires the use of a treated substrate. Generally, the substrate is treated by applying a series of different chemical solutions to the surface of the substrate. Before each use of the solution, the substrate is usually rinsed with water, followed by the final rinse and dry cycle. The printed circuit board manufacturing process can have several steps, including cleaning (Scrubbed), scrubbing (Etched), protecting (Passivated), treating (Masked), manufacturing (Processing), Depositioned or different combinations ° The initial steps of the printed circuit board manufacturing process include substrate cleaning and coating to facilitate subsequent photoresist or glass printing inks used to define the circuit pattern required by the printed circuit board The use of (screen ink). Figure 1 shows the four steps of a conventional chemical cleaning and coating substrate. The cleaning and coating technology is only one of the multi-step technologies in the printed circuit board industry. In the first step, the substrate is coated with an acidic solution, the function of which is to wash and remove the chromate, the process is about 30 seconds to 1 minute. The temperature of this solution is about 100 to 120 degrees Fahrenheit, and then Wash the substrate to remove too much acidic solution. In the second step, the surface of the substrate is coated with a layer of uranium etching solution for surface etching, usually concentrated sulfuric acid or peroxysulfuric acid. It can also be used as pumice. Cleaning method. Etching can remove the residual chromate and make the substrate surface structure rough. Etching can also increase the adhesion of the substrate's Resist Layer (please read the precautions on the back before filling this page) J · _ Ir line paper size, using China National Standards (CNS) A4 size (210X297 gong) Printed by Shellfish Consumer Cooperative, Central Standards Bureau, Ministry of Economic Affairs 2607pif.doc / 002 A 7 ___B7 V. Description of invention (2) , Especially if there is a copper component under the substrate. Then rinse the substrate to remove the etching solution or pumice. The third step must be determined by the substrate is chemical etching or pumice washing. If it is chemical etching, Soak it in a second acidic solution and rinse it. Usually one drop or spray 5% to 10% sulfuric acid to remove the oxide formed on the etched copper and passivate the copper. Removing the oxide can reduce the final Washing and reoxidation in the drying cycle of the previous barrier film. If it is pumice washing, use medium to high pressure washing to remove pumice particles, and other substances will not be removed. The fourth step is to use oxidation inhibition Agent or barrier The adhesion promoter is used to coat the substrate. Triaz〇ie solution is usually used. The substrate is then rinsed and dried. At this time, the substrate is coated and prepared for the application of the substrate barrier layer. However, The multi-step cleaning and primer technology is time-consuming, expensive, and adds extra waste products. Therefore, a single step method and formula for cleaning and coating the substrate is needed, especially as a detergent and chromate removal Agents, oxidation inhibitors, adhesion increasers, elasticity increasers, and redeposition inhibitors. The chemical honing industry also uses the processes described above to clean and coat substrates. Therefore, a single step and compound are required on a chemical honing alloy to coat a substrate. The chemical casting industry also uses the process described above to wash and prime substrates. Therefore, a single step and compound are required on the chemically cast alloy to coat the substrate. In view of this, an object of the present invention is to provide a compound and a method for washing and coating a substrate on a printed circuit board. More special paper size standard (CNS) A4 specification (210X297 mm) 1 — ^ II ^ Packing — ϋ H ϋ ϋ ~ " " " " Line (Please (Please read the notes on the back before filling in this page) 2607pif.doc / 002 Printed by A7 B7, Central Consumers ’Bureau, Ministry of Economic Affairs, Consumer Cooperatives V. Description of Invention (,) Yes' This compound and method can be washed and removed chromium Acid salt, inhibit oxidation, promote adhesion • inhibit acid attack and redeposition of the inner layer center of the substrate, and increase the elasticity of synthetic materials. As a result, this compound can simplify the multiple steps of rinsing and priming in the manufacture of printed circuit boards into a single step. Another object of the present invention is to provide one or more Filming Amines' having unique properties when combined with a suitable acid or combination of acids. In the process of copper plating on the substrate, this solution can make the barrier layer form a chemical bond with the smooth, non-surface etched copper and other substrate materials. The present invention also contains a formula that makes it possible to etch extremely fine lines and spaces on a printed circuit board without loss of adhesion, and damage or slight chipping of the substrate during bending. Another part of the present invention relates to a composition, which can be composed of about 0.003% to 3.0% of membrane amine, about 0.02% to 10% of non-ionic surfactant and sufficient acid to be used on the substrate combination, and produces less than 6_5 pH 値. In order to achieve the above-mentioned object of the present invention, a method for manufacturing a coated substrate includes: from 0.003% to 3.0% of membrane amine and sufficient acid to generate a pH of less than 6 5; coating the substrate with this solution; and The substrate is dried. In order to achieve another object of the present invention, a single solution and method can be used for washing on chemical grinding alloys and chemical cast alloys to suppress oxidation and increase adhesion. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a more detailed embodiment is given below in conjunction with the accompanying drawings to make a detailed description as follows: Brief description of the drawings: This paper scale Applicable to China National Standard (CNS) A4 specification (210X297mm), vs (Please read the precautions on the back before filling this page)
2607pif.doc/002 A7 2607pif.doc/002 A7 經濟部中央標準扃貝工消费合作社印簟 B7 五、發明説明（Y) 第1圖是習知一種常用於化學淸洗與塗底之四步驟流程 圖；以及 第2圖是依據本發明之一種單一步驟化學清洗與塗底流 程圖。 官施例 本發明是關於在印刷電路板的製造，化學硏磨合金與化 學鑄鍍合金工業上，用於塗底於底材上的一種組成與方 法。此組成提供單一步驟溶液來塗底於底材內層中心及增 加合成物質的彈性。此溶液包含：（1)膜胺或膜胺的結合， (2)酸或酸的結合，（3)水。加入表面活性劑可用來幫助淸 洗，去除鉻酸鹽，抑泡以及濕潤底材。 針對本發明的目的，所使用的底材須經過淸洗劑、鉻酸 鹽去除劑、氧化抑制劑、黏著促進劑、彈性增加劑、再沉 積抑制劑、蝕刻增進劑、增濕劑或任何上述的結合者之處 理才進行塗底。較佳的是底材經過上述所有溶液應用後， 才進行塗底。 膜胺可定義爲一級，二級，三級，或四級胺或其衍生物’ 其接氮官能基的疏水性大到可形成胺溶液，尤其是當此配 方的pH値小於7時，則具有電荷的底材可形成疏水性層。酸 可定義爲當此化合物放置於pH値爲7的水時，會導致pH値 下降至7以下。表面活性劑可定義爲可降低配方表面張力的 化合物。 在本發明中可使用不同的膜胺，較好的膜胺不是陽離 子，兩性，就是非離子。也可使用中性或陰離子胺，但效 —^ ; 11裝— I I 訂— I 線 (請先閲讀背面之注項再填寫本頁) 本紙張尺度遥用中國國家揉準（CNS ) Μ規格（210X297公釐） 2607pif.doc/002 A7 B7 經濟部中央樣準局貝工消费合作社印製 五、發明説明（f) 能較不好，除非使用強酸作爲介質。較好的膜胺可包含， 脂肪酸胺（Fatty Acid Amines)，長鏈烷基胺（Long Chain Alkylamines)以及氣基甲基丙嫌鹽(Amino Methacrylate)，但 並不限定於此。本發明中所使用的胺可由已知技術製造或 由商業購買獲得，較佳的胺包含一級，二級或三級胺；二 胺；烷基胺；C-8到C-22胺；單環三級胺(Basic Mono Cyclic Tertiary Amine);穩態乙胺（Stabilized Abiethylamines);二 胺基丙院 （Diaminopropane); 去水乙胺 (Dehydroabiethylamine);以及乙氧基酯（Ethoxylates)，鹽， 及其它化合物，但並不限於此。舉例而言，胺可由Akzo化 學公司的商標名稱Armeen獲得一級，二級，及三級胺，和 由商標名稱Duomeen獲得二胺。 脂肪酸胺可藉由已知的技術如將氨或氨的衍生物與脂 肪酸反應獲得。脂肪酸胺的分子結構可由氨中心氮原子擁 有的一個或全部氫被脂肪酸官能基-R所取代來定義脂 肪酸胺也可能是四級胺，其中心氮原子與四個脂肪酸官能 基鍵結。每一脂肪酸官能基-R，均爲長鏈，碳數在C8至C22， 例如爲脂肪族化合物，終端有一碳酸官能基的烷基，烷基 鏈可爲非飽和或其它的取代基。由於烷基官能基有大部分 爲碳原子，因此此官能基有很強的疏水性。然而，氮原子 爲親水性，特別是當它有四個R官能基或三個R官能基且被 質子化時。當溶於或擴散在水中或非水性溶劑，分子其中 一部份會被周圍溶劑強烈排斥，此排斥力會驅使分子位於 表面或介面或形成微胞(Micelles)。 (請先聞讀背面之注$項再填寫本頁) t -' τ % 本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公釐） 經濟部中央標準局貝工消费合作社印簟 2607pif.doc/002 A7 B7 五、發明説明（b ) 較好的脂肪酸胺包含，從動物性或植物性脂肪酸來的R 官能基以及油類，如高油類（Tall Oil)，油酸油類（Oleic Oil)，羊脂酸油類(Caprylic Oil)以及椰子油類(Coconut Oil) 以及其衍生物，但並不限於此。較好的胺基甲基丙烯酯 (Amino Methacrylates)包括，二甲基胺乙基甲基丙煤酯 (Dimethylaminoethly Methacrylate)，三乙基銨乙基甲基丙嫌 酯(Triethylammoniumethyl Methacrylate)，二甲基氣丙基甲 基丙嫌醋（Dimethylaminopropyl Methacrylamide)，以及甲基 丙嫌胺丙基三甲基鏡氯化物（Methacrylamidopropyl Trimethylammonium Chloride)，但並不限於此。 更好的膜胺可由Hercules, Inc.樹脂集團下的商業名稱 爲Polyrad上獲得。較好的Polyrad膜胺是Polyrad 0515和 Polyrad 1110，其它更好的膜胺包含可由Mona工業公司商 品名稱Monazoline獲得的有機單根環三級胺（Organic Monobasic Cyclic Tertiary Amines)。較好的Monozlone 膜胺 爲Monozlone T以及Monozlone C，還有其它更好的膜胺可 從Akzo化學公司的商品名稱Ethoduomeen獲得。大部分較 好的Lthoduomeen 膜胺是Ethoduomeen 1/13，Ethoduomeen T/20 以及Ethoduomeen T/25。 本發明中膜胺特別有用的性質包含，疏水性，快速成 膜，抗洗出，成膜持久性，氧化抑止性，黏著促進性，淸 洗，彈力增強與增濕，但並不限定於此。疏水性是因爲在 膜胺的正電荷與大部分底材表面的負電荷間吸引力造成。 較好的膜胺一旦接觸底材，會立刻形成疏水性膜或層而具 9 本紙張尺度適用中國11家揉準（CNS )八4规格（2丨0><297公釐） ^----Γ------装------1T------0 (請先閲讀背面之注意事項再填寫本頁) 2607pif.doc/002 A7 2607pif.doc/002 A7 經濟部中央標準局貝工消费合作社印製 B7 五、發明説明（q ) 有抗水洗出與防止膜分解。在膜胺的正電荷與底材表面的 負電荷間的吸引力也可造成吸附與表面改質，而增進氧化 抑制與黏著。而膜胺的酸鹼中性分子結構能提供分子在介 面迅速定位。此定位能減少介面張力並幫助底材淸洗與增 濕，但卻會產生不需要的泡沬。爲得到這些較好的性質， 此配方可使用一種或更多種膜胺。 例如，能產生足夠的疏水層的較好膜胺包含Polyrad， Monozolone 與 Ethoduomeen。例如 Polyrad 0515， Monozolone T及Ethoduomeen T/13。能抑制泡沬形成與增 濕底材得更好膜胺包含了 Polyrad 1110以及Ethoduomeen T/25。 爲了生產本發明之配方，上述之膜胺與適當酸或結合酸 合成，當酸引入膜胺時，此酸須能將配方之pH値降至7以 下。強酸較弱酸更適合使用，其原因在於強酸只需微量體 積即可降配方之pH値降至7以下，弱酸卻不能。 本發明中酸所擁有的特別性質包含鉻酸鹽移除性，抗洗 出，黏著增進性，淸洗，氧化抑止，彈性增強，抑止再沉 積與增濕，但並不限於此。爲獲得較好的性質，配方可使 用一種或多種酸。 例如，對移除鉻酸鹽較好的酸包含有機與無機酸，更好 的酸包含磷酸，磺酸(Sulfonic)，羥基乙酸(Hydroxyacetic)。 大部分較好的酸包含鹽酸，硫酸，甲烷磺酸（Methane Sulfonic)，以及胺基磺酸(Sulfamic)。這些酸類較佳的原因 在於當該酸與底材接觸時能快速移除鉻酸層。對用於洗出2607pif.doc / 002 A7 2607pif.doc / 002 A7 Central Standard of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives Seal B7 V. Description of Invention (Y) Figure 1 is a four-step process commonly used in chemical cleaning and coating FIG. 2 and FIG. 2 are flowcharts of a single-step chemical cleaning and priming process according to the present invention. Official Example The present invention relates to a composition and method for coating substrates in the manufacture of printed circuit boards, chemical honing alloys and chemical casting alloys. This composition provides a single step solution to coat the center of the inner layer of the substrate and increases the elasticity of the synthetic material. This solution contains: (1) a membrane amine or a combination of membrane amines, (2) an acid or a combination of acids, and (3) water. Surfactants can be added to help with cleaning, chromate removal, foam suppression, and wetting of substrates. For the purposes of the present invention, the substrate used must be subjected to a cleaning agent, a chromate remover, an oxidation inhibitor, an adhesion promoter, an elasticity enhancer, a redeposition inhibitor, an etch enhancer, a humidifier, or any of the above Only the combination of the treatment of the primer. Preferably, the substrate is primed only after all of the above solutions have been applied. Membrane amines can be defined as primary, secondary, tertiary, or quaternary amines or their derivatives' whose nitrogen-containing functionalities are sufficiently hydrophobic to form amine solutions, especially when the pH of this formulation is less than 7, The charged substrate can form a hydrophobic layer. Acid can be defined as a pH 値 drop below 7 when this compound is placed in water with pH 7 7. Surfactants can be defined as compounds that reduce the surface tension of a formulation. Different membrane amines can be used in the present invention. The preferred membrane amines are either cationic, amphoteric, or non-ionic. Neutral or anionic amines can also be used, but the effect — ^; 11 pack — II order — I line (please read the note on the back before filling this page) This paper size is far from China National Standard (CNS) M specifications ( 210X297 mm) 2607pif.doc / 002 A7 B7 Printed by the Shell Specimen Consumer Cooperative of the Central Sample Bureau of the Ministry of Economic Affairs 5. Description of the Invention (f) Can be bad unless strong acid is used as the medium. The preferred membrane amines may include, but are not limited to, fatty acid amines (Fatty Acid Amines), long chain alkyl amines (Long Chain Alkylamines), and Amino Methacrylate. The amines used in the present invention can be manufactured by known techniques or obtained commercially. Preferred amines include primary, secondary or tertiary amines; diamines; alkylamines; C-8 to C-22 amines; monocyclic Basic Mono Cyclic Tertiary Amine; Stabilized Abiethylamines; Diaminopropane; Dehydroabiethylamine; and Ethoxylates, salts, and others Compounds, but not limited thereto. For example, amines can be obtained from Akzo Chemical Company under the trade name Armeen of primary, secondary, and tertiary amines, and under the trade name Duomeen of diamines. Fatty acid amines can be obtained by known techniques such as reacting ammonia or ammonia derivatives with fatty acids. The fatty acid amine's molecular structure can be defined by the substitution of one or all of the hydrogens possessed by the central nitrogen atom of the ammonia with the fatty acid functional group -R. The fatty acid amine may also be a quaternary amine whose central nitrogen atom is bonded to four fatty acid functional groups. Each of the fatty acid functional groups -R is a long chain and has a carbon number from C8 to C22. For example, it is an aliphatic compound, and the terminal is an alkyl group having a carbonic acid functional group. The alkyl chain may be unsaturated or other substituents. Since most of the alkyl functional groups are carbon atoms, this functional group is highly hydrophobic. However, the nitrogen atom is hydrophilic, especially when it has four R functional groups or three R functional groups and is protonated. When dissolved or diffused in water or non-aqueous solvents, part of the molecules will be strongly repelled by the surrounding solvents. This repulsive force will drive the molecules to the surface or interface or form micelles. (Please read the note on the back of the page before filling in this page) t-'τ% This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). doc / 002 A7 B7 V. Description of the invention (b) The preferred fatty acid amines include R functional groups from animal or vegetable fatty acids and oils, such as high oil (Tall Oil), oleic oil (Oleic Oil), Caprylic Oil and Coconut Oil and derivatives thereof, but are not limited thereto. Preferred Amino Methacrylates include Dimethylaminoethly Methacrylate, Triethylammoniumethyl Methacrylate, Dimethylaminoethly Methacrylate Dimethylaminopropyl Methacrylamide and Methacrylamidopropyl Trimethylammonium Chloride are not limited thereto. Better membrane amines are available under the trade name Polyrad from the Hercules, Inc. resin group. The preferred Polyrad membrane amines are Polyrad 0515 and Polyrad 1110. Other better membrane amines include Organic Monobasic Cyclic Tertiary Amines available from Mona Industries under the trade name Monazoline. Better Monozlone membrane amines are Monozlone T and Monozlone C, and other better membrane amines are available from Akzo Chemical Company under the trade name Ethoduomeen. Most of the better Lthoduomeen membrane amines are Ethoduomeen 1/13, Ethoduomeen T / 20 and Ethoduomeen T / 25. Particularly useful properties of membrane amines in the present invention include, hydrophobicity, rapid film formation, resistance to wash-out, film formation durability, oxidation inhibition, adhesion promotion, washing, elasticity enhancement and humidification, but are not limited thereto . Hydrophobicity is due to the attractive force between the positive charge of the membrane amine and the negative charge on the surface of most substrates. Once the better membrane amine comes into contact with the substrate, it will immediately form a hydrophobic film or layer with 9 paper sizes that are applicable to 11 Chinese CNS 8.4 specifications (2 丨 0 > < 297 mm) ^- --Γ ------ install --------- 1T ------ 0 (Please read the precautions on the back before filling this page) 2607pif.doc / 002 A7 2607pif.doc / 002 A7 Economy Printed by B7, Shellfish Consumer Cooperative of the Ministry of Standards of the People's Republic of China. 5. Description of the Invention (q) It is resistant to washing out and preventing the membrane from decomposing. The attractive force between the positive charge of the membrane amine and the negative charge on the substrate surface can also cause adsorption and surface modification, and promote oxidation inhibition and adhesion. The acid-base neutral molecular structure of membrane amines can provide rapid localization of molecules at the interface. This positioning can reduce interface tension and help substrate washing and humidification, but it can cause unwanted foaming. To achieve these better properties, this formulation can use one or more membrane amines. For example, better membrane amines that produce sufficient hydrophobic layers include Polyrad, Monozolone, and Ethoduomeen. Examples are Polyrad 0515, Monozolone T and Ethoduomeen T / 13. Polyamine 1110 and Ethoduomeen T / 25 are the membrane amines that inhibit the formation of moisturizing and moisturizing substrates. In order to produce the formulation of the present invention, the above-mentioned membrane amine is synthesized with a suitable acid or a combined acid. When an acid is introduced into the membrane amine, this acid must be able to reduce the pH of the formulation to below 7. Strong acids are more suitable for use than weak acids. The reason is that strong acids need only a small volume to lower the pH of the formula to below 7, but weak acids cannot. The special properties possessed by the acid in the present invention include chromate removal, resistance to washing out, adhesion promotion, washing, oxidation inhibition, elasticity enhancement, inhibition of redeposition and humidification, but it is not limited thereto. For better properties, one or more acids can be used in the formulation. For example, acids that are better for removing chromate include organic and inorganic acids, and more preferred acids include phosphoric acid, Sulfonic, Hydroxyacetic. Most of the preferred acids include hydrochloric acid, sulfuric acid, Methane Sulfonic, and Sulfamic. These acids are preferred because they can quickly remove the chromic acid layer when the acid is in contact with the substrate. For washing out
Hu Jj ^ 裝 I H I ϋ n n 線 (請先Μ讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） 2607pif.doc/002 A7 2607pif.doc/002 A7 經濟部中央標準局負工消费合作社印裝 B7_ 五、發明説明（？） 阻絕層與增進黏著較好的酸包含有機酸與非有機酸。更好 的酸包含甲酸’丙二酸(Mal〇nic)，丁氨二酸(Aspartic)，醋 酸(Acetic)，檸檬酸(Citric)，硝酸，磷酸，磺酸，甲烷磺酸， 胺基磺酸，與羥基乙酸。大部分較好的酸是沒食子酸 (Gallic)，順丁嫌二酸(Maleic)，與反丁嫌二酸(Funamric)。 本發明之配方由重量百分比約0.0008%至8.0%的膜胺 與可將pH値降至7以下的酸來合成。更甚著，此配方可由重 量百分比約爲0.003%至3.0%的膜胺與將pH値降至6.5以下 的酸來合成。 當混合時，膜胺與酸形成一帶有強正電荷之陽離子分子 並能快速地與帶負電荷的底材形成鍵結。此鍵結在底材形 成一層疏水層，此疏水性鍵結同時能抑止酸類侵害帶有電 荷之底材，但卻無法抑止酸侵害非帶有電荷之表面(如底材 鉻酸鹽層部分）。因此，膜胺與酸結合所形成的疏水層能幫 助底材移除鉻酸鹽。特別的是，膜胺與酸的結合可快速形 成一層抑止洗出，使膜能持久的疏水層，此疏水層從底材 與鍍銅內部中心材料間移除鉻酸鹽並轉換爲塗覆，以及使 混合物有彈性。此結合也有當淸洗劑，氧化抑止劑，黏著 促進劑，彈性增強劑，再沉積抑止劑，以及蝕刻增強劑等 功能。 此配方爲了膜胺與酸，更包含載體，或一溶劑，此溶劑 最好爲去離子水。自來水可被接受，但較不好，其因在於 自來水中有不相關之金屬離子。蒸餾水不像去離子水好的 原因在於該成本過高。有機溶劑，諸如甘油，醚，和乙醇， 本纸張尺度適用中國國家榡準（CNS ) A4规格（210X297公釐） 'Iϋ - I ϋ n 111 111 線 (請先w讀背面之注意事項再填寫本頁) 2607pif.doc/002 A7 B7 五、發明说明（q) 但不限於此，也可加入水中。有機溶劑對高分子量的膜胺 溶解度特別有用。但有機溶劑通常爲政府所列管的揮發性 有機物質（Volatile Organic Compounds，VOCs) 〇 本配方更包含了表面活性劑。雖然並非所需，但表面活 性劑能增加淸潔作用，幫助鉻酸鹽的移除，並有增濕劑及/ 或減少配方泡沬產生的功能。表面活性劑降低了配方的表 面張力，較佳値爲70 dyne/cm2，甚至50 dyne/cm2 ’最佳可 達到30 dyne/cm2。較好的表面活性劑可由Rhone-Poulene的 商標名稱Antrox獲得。更好的表面活性劑包含Antrox LF224 與 Antarox BL-214 〇 基本上，表面活性劑可藉由降低配方的表面張力來增加 淸洗作用與鉻酸鹽的移除。也就是說，表面活性劑可充作 污染物的快速去除劑，例如指紋，油類，油脂，灰塵與諸 如此類等，但並不限於此。表面活性劑也能藉由配方酸性 部分來引發鉻酸鹽溼度的增加，加速去除鉻酸鹽。一非離 子性表面活性劑也能減少配方泡沬的形成。當大部分的表 面活性劑接觸時(在配方加熱時，詳述如下），表面活性劑開 始從配方表面如油般的分離，此分離行爲可幫助抑止泡沬 的發生。若底材噴灑此一配方時’其抗泡性質特別受到青 睞。 此外，配方加入鈾刻物質來加速鉻酸鹽的移除’並且/ 或使底材粗糙，因此可作爲黏著促進劑。較好的蝕刻物質 包含鐵鹽，過氧化物與酸，但並不限於此。更好的蝕刻物 質包含氯化鐵與氯化銅。 本纸張尺度適用中國國家揉準（CNS ) A4规格（210X297公釐） I 1 ------ (請先閲讀背面之注$項再填寫本頁) -s 經濟部中央揉準局貝工消费合作社印装 2607pif.doc/002 A7 B7 五、發明説明（β) 在其他目的上，染色劑或染料可用來加入配方中以辨識 配方。安定劑加入配方中以穩定配方。香料的加入可用以 遮掩或移除配方中的臭味。其它加入的成分可幫助配方塗 底底材，包含淸洗，鉻酸鹽的移除，氧化的抑止，黏著的 增進，彈性的加強，再沉積的抑止，增濕或其他上述的結 合，但並不限於此。 因此，本發明中塗底底材較佳的成分是由一適當而足夠 的酸與膜胺混合形成在底材上的一層疏水層並移除底材上 的鉻酸鹽層。溶劑以水較佳，表面活性劑可隨意加入來幫 助底材淸洗，抗泡，或增濕。 實驗例一：配方的製造方法包括將20加崙的去離子水 在室溫中置入於50加崙的乾淨混合槽中。約20盎司的 Polyrad 0515膜胺加入水中並攪拌。接著，加入鹽酸於溶液 中使得溶液酸性體積百分比濃度約爲50%，而膜胺的重量百 分比濃度約爲0.28%。然後加入約5磅的Antarox LF 222(— 種表面活性劑)於溶液中並混合。 實驗例二：配方的製造方法包括將20加崙的蒸餾水在 室溫中置入於50加崙乾淨混合槽中。將約18盎司的Polyrad 0515膜胺加入水中並擴散於中。再加入18盘司的Polyrad mo膜胺使槽中胺的濃度約爲0.5%。接著，70%的羥基乙 酸(商業上稱爲乙醇酸)緩慢加入直到溶液變爲澄淸且所有 粒子均反應成爲羥基乙酸酯。然後，加入鹽酸於溶液中並 混合，使得酸液的體積百分比濃度爲50%而膜胺的濃度約爲 0.5% 〇 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） ---7------g------、玎------Φ * - (請先閲讀背面之注意事項再填寫本頁) 經濟部中央橾準局貝工消費合作杜印製 2607pif.doc/〇〇2 A7 B7 五、發明説明（丨丨） 實驗例三：配方的製造方法包括將20加崙的去離子水 在室溫中置入於50加擦乾淨混合槽中。將M〇naz〇i〇ne τ膜 胺與鹽酸加入槽中並充分混合使其Monazoline濃度約爲 0.6%而鹽酸的體積百分比濃度約爲25%。然後，加入約22 磅，重量百分比濃度爲5%的六水氯化鐵（Ferric Chloride hexahydrate，當作蝕刻劑）。接著混合溶液直到澄淸爲止。 實驗例四：配方的製造方法包括將2加崙的自來水在室 溫中置入於5加崙乾淨混合槽中。將約2盎司的Monazolone T 膜胺與醋酸混合直到中和。接著，體積百分比濃度約20% 鹽酸與30%磷酸混合於槽中產生一溶液。其酸性體積百分比 濃度爲50%，而膜胺的重量百分比濃度爲〇.〇8。約1%的 Antarox LF 224加入溶液中作爲一非離子性增濕劑。 實驗例五：配方的製造方法包括將16加崙的蒸餾水與4 加崙的異丙醇(isopropyl alcohol)在室溫中置入於50加崙乾 淨混合槽中。加入約18盎司的Ethoduomeem T/13膜胺使膜 胺的重量濃度約爲0.3%。再混合約1%的Antarox BL-214。 實驗例六：配方的製造方法包括將20加崙的去離子水 在室溫中置入於50加崙乾淨混合槽中。加入20盎司的 Ethoduomeem T/13膜胺於其中。再加入順丁烯二酸直到溶 液呈中性爲止，然後加入鹽酸使得最終酸液重量百分比濃 度約爲5〇%。再混合2%的Antarox LF 222。接著，加入約 0.001% FD&C Blue #1，0.001 螢光素鈉（Uranine)染料及體積 濃度約爲10%二乙烯元醇丁醚（diethylene glycol butyl ether) 〇 本纸張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐） ^----!-------裝-- (請先閲讀背面之注$項再填寫本頁) 訂 線· 經濟部中央標率局貝工消费合作社印製 26〇7pif.doc/002 A7 B7 五、發明説明（p) 本發明之配方以下列方式製作爲隹，對原所要求的目 的而言，含一分膜胺，一分酸與一分表面活性劑的配方詳 細製作如下，提供一個在室溫下裝有20加崙去離子水的50 加崙容器，將約20盎司的Polyrad 0515膜胺加入容器中並攪 拌。以對流式攪拌葉片攪拌10分鐘爲佳，才能使膜胺能在 水中充分的擴散。當充分的擴散時，此溶液將變得混濁且 膜胺粒子會彼此分離。然後將約25加崙的鹽酸加入該容器 中使得酸的體積百分比濃度達到約50%，而膜胺則爲 0.28%。將溶液充分攪拌30分鐘使酸液能充分的在溶液中擴 散，當完全擴散後，溶液中看不到任何粒子且pH値在小於 獲等於7。接著加入體積濃度約1%的Antarox LF 224並在容 器中攪拌。 經濟部中央揉準局貝工消费合作社印装 (請先閲讀背面之注$項再填寫本頁) 對另一個原要求目的言，本配方以一分膜胺與兩分酸 混合於溶液中。提供一個在室溫下裝有20加崙去離子水的 50加崙乾淨容器。約20盎司的Polyrad 0515膜胺加入容器中 並攪拌。以對流式攪拌葉片攪拌1〇分鐘爲佳，才能使膜胺 能在水中充分的擴散。當充分的擴散時，此溶液將變得混 濁且膜胺粒子會彼此分離。然後加入約0.1加崙的羥基乙酸 並攪拌約10分鐘或直到混合液成爲中性爲止。當溶液澄淸 時將它充分攪拌。此溶液可自由加熱使其更易達到中性， 然後約25加崙的鹽酸加入直到最終溶液之鹽酸體積百分比 濃度達到50%。 本配方以上述方法製作爲佳，儲存於容器中並在底材 表面稀釋。此配方以稀釋成原體積濃度的1%_5%爲佳，較 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部中央梯準局負工消费合作社印*. 2607pif.doc/002 A7 五、發明説明（β) 好的爲5%-20%及更好的是10%。 將配方稀釋爲一 10%稀釋液（爲原要求目的）之步驟如 下，提供一裝有45加崙水之容器，蒸餾水爲佳。此容器以 塑膠或合成品爲佳，金屬容器較不好，其因在於金屬較塑 膠或合成品易反應且會快速的被配方中之酸液所侵害。將 水加熱至華氏55-125度，加熱至華氏75-105度較好，華氏 85_95度更佳。然後加入5加崙的配方於容器中並攪拌。以 如上述之對流式攪拌葉片攪拌5分鐘爲佳，才能使膜胺能在 水中充分的擴散。產生的溶液溫度以調整至華氏90-150度 爲佳，華氏100-130度較好，華氏110-120度更佳。如此，本 配方才使用於底材上。 至於其他濃度百分比之配方，從1%至25%，可由上述 相似之方法製作。有些因素會影響配方濃度，其中一項因 素爲配方與底材接觸的持續時間。典型接觸時間約爲10秒 至1〇分鐘。另一因素則包含鉻酸鹽層的厚度。鉻酸鹽厚度 會因底材間以及底材從0.001至5公厘的不同而改變。另一項 會影響濃度百分比的是配方用於底材之溫度。通常，溫度 愈高，鉻酸鹽的去除愈快，容器的大小可從1加崙至5000加 崙以用來稀釋該配方。通常這大小與底材的大小與數量及 底材與配方接觸的時間及速度有關。 本配方可爲淸洗劑，鉻酸鹽去除劑，氧化抑止劑，黏 著促進劑，彈性增強劑，再沉積抑止劑，蝕刻增強劑，增 濕劑以及上述任一之結合，但並不限於此。 若爲淸洗劑。此配方可鬆弛並移除底材上之指紋’油’ 本纸張尺度通用中國國家標準（CNS ) A4規格（210X297公釐） ^--------.--^---裝------訂-----1丨線 (請先閱讀背面之注意事項再填寫本頁) 2607pif.doc/002 A7 B7 五、發明説明（丨义） 油脂，灰塵，污染物以及諸如此類，這提供了底材在塗底 與後續過程之前的初淸洗。 本配方也可作爲一鉻酸鹽去除劑。藉由配方上之酸質 子與三個氫原子來移除鉻酸鹽。 本配方也可作爲一氧化抑止劑。藉由配方在底材上形 成的疏水層來阻隔底材與氧源(如酸或環境中）之接觸。 本配方也能促進底材阻絕層的黏著性。在底材表面取 代鉻酸鹽的疏水層可作爲一化學鍵結劑來保護底材。阻絕 層通常包括光阻或玻璃版油墨，且使用於底材經過塗底之 後以界定電路圖案，當配方用於經過鍍銅的底材表面之 後，黏著性會特別增進。假若沒有完全消除，黏著性會從 底材的邊緣至整片降低。 本配方也能省去表面蝕刻的需求。在印刷電路板製程 中在底材表面上通常發生蝕刻反應。不需要表面蝕刻之因 在於膜胺層與阻絕層間的化學鍵。當底材爲金屬（除了鉻以 外)時，化學鍵的強度會特別強，因此銅可作爲底材。因爲 銅從底材移除時有大量的還原，此外，蝕刻物質，如鐵鹽， 可與配方混合或合倂於配方中以提供鉻酸鹽快速移除及/或 增加阻絕層之黏著性(如上所述）。 配方也可作爲再沉積抑止劑，藉由配方形成於底材上 的疏水性膜胺層來阻止鉻酸鹽，污染物與諸如此類等的沉 積。 配方也可作爲彈性增強劑，在一般鍍銅之底材上，光 阻會因金屬在銅與阻絕層間的觸媒影響而受損。在曝光於 » - 1 I— I ij n LI 1^1 I— n I (請先閲讀背面之注意事項再填寫本頁)Hu Jj ^ Install IHI ϋ nn cable (please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 size (210X297 mm) 2607pif.doc / 002 A7 2607pif.doc / 002 A7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs B7_ V. Description of the invention (?) The barrier layer and the adhesion-promoting acid include organic acids and non-organic acids. Better acids include formic acid, malonic acid, aspartic acid, acetic acid, citric acid, nitric acid, phosphoric acid, sulfonic acid, methanesulfonic acid, aminosulfonic acid , With glycolic acid. Most of the better acids are Gallic, Maleic, and Funamric. The formulation of the present invention is synthesized from a membrane amine of about 0.0008% to 8.0% by weight and an acid capable of reducing the pH to below 7. What's more, this formulation can be synthesized from a membrane amine with a weight percentage of about 0.003% to 3.0% and an acid that lowers the pH to below 6.5. When mixed, the membrane amine and the acid form a strongly positively charged cationic molecule and can quickly form a bond with a negatively charged substrate. This bond forms a hydrophobic layer on the substrate. This hydrophobic bond can also prevent acids from attacking charged substrates, but it cannot prevent acids from attacking non-charged surfaces (such as the chromate layer of the substrate). . Therefore, the hydrophobic layer formed by the combination of membrane amine and acid can help the substrate remove chromate. In particular, the combination of membrane amine and acid can quickly form a layer that inhibits washing out, making the membrane a durable hydrophobic layer. This hydrophobic layer removes the chromate from the substrate and the inner core material of the copper plating and converts it to coating. And make the mixture elastic. This combination also functions as a cleaning agent, an oxidation inhibitor, an adhesion promoter, an elasticity enhancer, a redeposition inhibitor, and an etching enhancer. This formulation contains a carrier or a solvent for membrane amines and acids, and the solvent is preferably deionized water. Tap water is acceptable, but not as good because of unrelated metal ions in the tap water. Distilled water is not as good as deionized water because the cost is too high. Organic solvents, such as glycerin, ether, and ethanol, this paper size applies to China National Standard (CNS) A4 (210X297 mm) 'Iϋ-I ϋ n 111 111 line (please read the precautions on the back before filling (This page) 2607pif.doc / 002 A7 B7 5. Description of the invention (q) But not limited to this, it can also be added to water. Organic solvents are particularly useful for high molecular weight membrane amine solubility. However, the organic solvents are usually volatile organic compounds (VOCs) listed by the government. This formula also contains surfactants. Although not required, surfactants can increase the cleaning effect, help the removal of chromate, and have the function of moisturizers and / or reduce the generation of foaming. The surfactant reduces the surface tension of the formulation, preferably dyne / cm2 is 70 dyne / cm2, and even 50 dyne / cm2 is the best, which can reach 30 dyne / cm2. Preferred surfactants are available from Rhone-Poulene under the trade name Antrox. Better surfactants include Antrox LF224 and Antarox BL-214. Basically, surfactants can increase scouring and chromate removal by reducing the surface tension of the formulation. That is, the surfactant can be used as a rapid removing agent for pollutants, such as fingerprints, oils, grease, dust and the like, but it is not limited to this. Surfactants can also increase the chromate humidity by accelerating the removal of chromate by the acidic portion of the formula. A non-ionic surfactant can also reduce the formation of foam in formulas. When most surfactants come into contact (the formula is heated, as detailed below), the surfactant begins to separate as oil from the surface of the formula, and this separation behavior can help prevent the occurrence of foaming. When the substrate is sprayed with this formula, its antifoaming properties are particularly favored. In addition, uranium-etched substances are added to accelerate the removal of chromate and / or roughen the substrate, so it can be used as an adhesion promoter. Preferred etching materials include, but are not limited to, iron salts, peroxides, and acids. Better etchants include ferric chloride and copper chloride. This paper size applies to China National Standards (CNS) A4 (210X297 mm) I 1 ------ (Please read the note on the back before filling this page) -s Central Government Standards Bureau of the Ministry of Economic Affairs Printed by the Industrial and Commercial Cooperatives 2607pif.doc / 002 A7 B7 V. Description of the Invention (β) For other purposes, dyes or dyes can be added to the formula to identify the formula. Stabilizers are added to the formula to stabilize the formula. Flavors can be added to mask or remove odors from the formula. Other added ingredients can help formulate the substrate, including scouring, removal of chromate, inhibition of oxidation, improvement of adhesion, enhancement of elasticity, inhibition of redeposition, humidification or other combinations of the above, but also Not limited to this. Therefore, the preferred component of the substrate for coating in the present invention is to form a hydrophobic layer on the substrate by mixing an appropriate and sufficient acid with membrane amine and remove the chromate layer on the substrate. The solvent is preferably water. Surfactants can be added at will to help substrate washing, anti-foaming, or humidification. Experimental Example 1: The method of manufacturing the formula includes placing 20 gallons of deionized water in a 50 gallon clean mixing tank at room temperature. Approximately 20 ounces of Polyrad 0515 membrane amine was added to the water and stirred. Next, hydrochloric acid was added to the solution so that the acidic volume percent concentration of the solution was about 50%, and the weight percent concentration of the membrane amine was about 0.28%. About 5 pounds of Antarox LF 222 (a surfactant) was then added to the solution and mixed. Experimental Example 2: The manufacturing method of the formula includes placing 20 gallons of distilled water in a 50 gallon clean mixing tank at room temperature. About 18 ounces of Polyrad 0515 membrane amine was added to the water and diffused into it. Polyrad mo membrane amine of 18 pans was added to make the concentration of amine in the tank about 0.5%. Next, 70% glycolic acid (commercially referred to as glycolic acid) was slowly added until the solution became clear and all particles reacted to form glycolate. Then, add hydrochloric acid to the solution and mix it so that the volume percentage concentration of the acid solution is 50% and the concentration of the membrane amine is about 0.5%. 〇 This paper size applies to China National Standard (CNS) A4 (210X297 mm)- -7 ------ g ------, 玎 ------ Φ *-(Please read the notes on the back before filling in this page) Printed 2607pif.doc / 〇〇2 A7 B7 V. Description of the Invention (丨 丨) Experimental Example 3: The manufacturing method of the formula includes placing 20 gallons of deionized water in a 50 plus rubbing mixing tank at room temperature. Add Monazone τ membrane amine and hydrochloric acid to the tank and mix thoroughly so that the Monazoline concentration is about 0.6% and the volume percentage concentration of hydrochloric acid is about 25%. Then, add about 22 pounds of Ferric Chloride hexahydrate (as an etchant) at a concentration of 5% by weight. The solution was then mixed until clear. Experimental Example 4: The manufacturing method of the formula includes placing 2 gallons of tap water in a 5 gallon clean mixing tank at room temperature. Approximately 2 ounces of Monazolone T membrane amine was mixed with acetic acid until neutralized. Next, a volume concentration of about 20% hydrochloric acid and 30% phosphoric acid are mixed in the tank to produce a solution. Its acidic volume percentage concentration is 50%, and the membrane amine's weight percentage concentration is 0.08. About 1% of Antarox LF 224 was added to the solution as a non-ionic humidifier. Experimental Example 5: A method for manufacturing a formula includes placing 16 gallons of distilled water and 4 gallons of isopropyl alcohol in a 50-gallon dry mixing tank at room temperature. Adding about 18 ounces of Ethoduomeem T / 13 membrane amine resulted in a membrane amine concentration of about 0.3% by weight. Mix about 1% of Antarox BL-214. Experimental Example 6: The manufacturing method of the formula includes placing 20 gallons of deionized water in a 50 gallon clean mixing tank at room temperature. Add 20 ounces of Ethoduomeem T / 13 Membrane. Maleic acid was added until the solution became neutral, and then hydrochloric acid was added so that the final acid solution had a concentration of about 50% by weight. Mix 2% Antarox LF 222 again. Then, add about 0.001% FD & C Blue # 1, 0.001 sodium fluorescein (Uranine) dye and volume concentration of about 10% diethylene glycol butyl ether 〇 This paper is applicable to Chinese countries 橾Standard (CNS) A4 size (210X297 mm) ^ ----! ----------- (Please read the note on the back before filling this page) Threading · Central Standards Bureau, Ministry of Economic Affairs Printed by Shelley Consumer Cooperatives 26〇7pif.doc / 002 A7 B7 V. Description of the invention (p) The formula of the present invention is made as 隹 in the following way. For the purpose originally required, it contains a film of amine, a point of The formula of the acid and a portion of the surfactant is made as follows. A 50 gallon container containing 20 gallons of deionized water at room temperature is provided. About 20 ounces of Polyrad 0515 membrane amine is added to the container and stirred. It is better to stir by a convection stirring blade for 10 minutes so that the membrane amine can be sufficiently diffused in water. When sufficiently diffused, the solution will become cloudy and the membrane amine particles will separate from each other. About 25 gallons of hydrochloric acid was then added to the container so that the volume percent concentration of the acid reached about 50%, while the membrane amine was 0.28%. The solution was thoroughly stirred for 30 minutes so that the acid solution could be sufficiently dispersed in the solution. When the solution was completely diffused, no particles could be seen in the solution and the pH was less than or equal to 7. Then add Antarox LF 224 with a volume concentration of about 1% and stir in a container. Printed by the Central Government Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives (please read the note on the back before filling out this page). For another original request, this formula mixes one membrane amine and two acid in solution. Provide a 50 gallon clean container containing 20 gallons of deionized water at room temperature. Approximately 20 ounces of Polyrad 0515 membrane amine was added to the container and stirred. It is better to stir by a convection stirring blade for 10 minutes so that the membrane amine can fully diffuse in water. When sufficiently diffused, the solution will become cloudy and the membrane amine particles will separate from each other. Then add about 0.1 gallons of glycolic acid and stir for about 10 minutes or until the mixture becomes neutral. When the solution is clear, stir it thoroughly. This solution can be heated freely to make it easier to reach neutrality, and then about 25 gallons of hydrochloric acid is added until the final solution has a 50% volumetric hydrochloric acid concentration. This formulation is best made by the method described above, stored in a container and diluted on the surface of the substrate. This formula is preferably diluted to 1% _5% of the original volume concentration. Compared with this paper size, it applies the Chinese National Standard (CNS) A4 specification (210X297 mm). Printed by the Consumers ’Cooperative of the Central Elevator of the Ministry of Economic Affairs *. / 002 A7 V. Description of the invention (β) Good 5% -20% and better 10%. To dilute the formula to a 10% dilution (for the purpose originally required), provide a container containing 45 gallons of water, preferably distilled water. The container is preferably a plastic or synthetic product, and a metal container is not good because the metal is more reactive than plastic or synthetic products and will be quickly attacked by the acid in the formula. It is better to heat the water to 55-125 degrees Fahrenheit, 75-105 degrees Fahrenheit, and more preferably 85-95 degrees Fahrenheit. Then add 5 gallons of the formula to the container and stir. It is better to stir for 5 minutes with the convection stirring blade as mentioned above, so that the membrane amine can be sufficiently diffused in water. The temperature of the resulting solution is preferably adjusted to 90-150 degrees Fahrenheit, 100-130 degrees Fahrenheit is better, and 110-120 degrees Fahrenheit is better. In this way, this formula is used on the substrate. As for other concentration percentage formulas, from 1% to 25%, they can be made by similar methods. There are several factors that can affect the formulation concentration, one of which is the duration of the formulation's contact with the substrate. A typical contact time is about 10 seconds to 10 minutes. Another factor includes the thickness of the chromate layer. Chromate thickness varies from substrate to substrate and from 0.001 to 5 mm. Another thing that affects the percentage of concentration is the temperature at which the formulation is applied to the substrate. Generally, the higher the temperature, the faster the chromate is removed, and the container size can range from 1 gallon to 5000 gallons to dilute the formulation. Usually this size is related to the size and quantity of the substrate and the time and speed of contact between the substrate and the formulation. This formulation can be a cleaning agent, a chromate remover, an oxidation inhibitor, an adhesion promoter, an elasticity enhancer, a redeposition inhibitor, an etching enhancer, a humidifier, and a combination of any of the above, but it is not limited to this . If it is a lotion. This formula relaxes and removes the fingerprint 'oil' on the substrate. The paper size is common Chinese National Standard (CNS) A4 (210X297 mm) ^ --------.-- ^ --- pack ------ Order ----- 1 丨 Line (Please read the precautions on the back before filling this page) 2607pif.doc / 002 A7 B7 V. Description of the invention (丨 meaning) Grease, dust, pollutants and And so on, this provides an initial cleaning of the substrate before the primer and subsequent processes. This formulation can also be used as a monochromate remover. The chromate is removed by the acidic protons and three hydrogen atoms in the formula. This formulation can also be used as an inhibitor of oxidation. A hydrophobic layer formed on the substrate is used to block the substrate from contact with an oxygen source, such as an acid or the environment. This formulation can also promote the adhesion of the substrate barrier layer. The hydrophobic layer, which replaces the chromate on the surface of the substrate, can be used as a chemical bonding agent to protect the substrate. The barrier layer usually includes photoresist or glass plate ink, and is used after the substrate is coated to define the circuit pattern. When the formula is applied to the surface of the copper-plated substrate, the adhesion will be particularly improved. If it is not completely eliminated, the adhesion will decrease from the edge of the substrate to the entire sheet. This formulation also eliminates the need for surface etching. Etching reactions typically occur on the surface of substrates during printed circuit board manufacturing. Surface etching is not required because of the chemical bond between the membrane amine layer and the barrier layer. When the substrate is metal (other than chromium), the chemical bond strength is particularly strong, so copper can be used as the substrate. Because copper has a large amount of reduction when it is removed from the substrate, in addition, etching materials, such as iron salts, can be mixed with or combined with the formula to provide rapid removal of chromate and / or increase the adhesion of the barrier layer ( As described above). The formulation can also act as a redeposition inhibitor, preventing the deposition of chromates, pollutants, and the like by a hydrophobic membrane amine layer formed on the substrate. The formula can also be used as an elasticity enhancer. On general copper-plated substrates, the photoresist will be damaged due to the influence of the metal catalyst between the copper and the barrier layer. Exposure to »-1 I— I ij n LI 1 ^ 1 I— n I (Please read the notes on the back before filling out this page)
、1T 線 經濟部中央揉準局負工消费合作社印装 本紙張尺度逋用中國國家標準（CNS > Μ規格（210Χ297公釐} 2607pif.doc/002 A7 B7 五、發明説明（γ) 光譜中紫外光區的光化輻射下，此觸媒效應會引起黏著邊 界的自由基聚合，這會導致某種程度上的碎裂而妨礙膜的 黏著與彈性，在剝除時碎裂性會妨礙移除阻絕層上僅存的 分子層。然而，鍵結在藉由配方產生的疏水層之光阻並沒 有接觸銅，使得銅在曝光於光化輻射下能保有獨特的彈 性。假若一中性之玻璃版油墨取代光阻，將不會有如此之 觸媒影響，銅底材之彈性提供底材或部分的抗碎性。 在印刷電路板製程中，以本配方用於塗底底材上的製 程包含配方的製造，包括至少以本配方塗覆於底材的一部 份，淸洗底材，然後烘乾底材。該過程詳述如下。 準備如上所述之配方，無論是濃的形式或稀釋的形式 均可。 用本配方以不同的方法塗覆底材，比如浸泡，噴灑， 或沖洗，但並不限於此。不管使用的塗覆技術爲何種，呈 裝配方的容器以較大的尺寸與在生產線上可堆積爲佳如此 底材塗覆也可成爲生產操作之一部份。浸泡時間以20秒至5 分鐘爲佳，更好的浸泡時間爲直到鉻酸鹽層移除且底材成 爲疏水性。必要時，塗覆可重複許多次(或底材塗覆增長至 所需時間）’直到能完全塗覆底材。 接著以淸洗底材來移除殘餘配方及預防斑點產生爲 佳。然而淸洗並非必要的。淸洗底材的方法包括使用如下 的溶液水，有機溶劑，與諸如此類等覆蓋底材，但並不限 於此。底材的淸洗以蒸餾水或異丙醇（Isopropyl Alcohol, ISA)爲佳，以去離子水較好。採用去離子水之因在於去離 本紙張尺度逍用中國國家標準（CNS > A4規格（210X297公釐） ：----:----K---^------1T------0 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央揉率局貝工消费合作社印製 26〇7pifd〇c/〇〇2 A7 B7 五、發明说明（丨&) (請先閲讀背面之注意事項再填寫本頁) 子水中無離子存在，淸淨’快速，相當低的成本，易於在 生產線上操作完成。淸洗步驟可重複多次直到移除殘留配 方爲止。 下一步以烘乾底材爲佳，如此底材在進一步製程時不 會有水滴產生及能預防斑點的發生。但烘乾底材並非必要 的。底材以強風加熱烘乾較佳。強而熱的空氣較佳之因在 於快速，成本低，且易在生產線上操作完成。然而也可使 用其他烘乾技術’例如化學法如ISA，週遭空氣，離心法及 諸如此類等，但並不限於此β 在印刷電路板製程中，除了使用配方來淸洗與塗底底 材與內層中心材料及增加合成材料的彈性外，本配方也可 用於化學硏磨製程。一般化學硏磨係指製造金屬合金。更 特別的是’化學硏磨係指將巨大的金屬層切成小片，且具 有複雜圖案或孔洞的碎裂金屬組成，例如導線架。 經濟部中央標準局負工消费合作杜印裝 化學硏磨包含在金屬薄片前面與/或後面使用一阻絕 層。接著在紫外光區以光化輻射使底材曝光。此曝光會導 致未受光阻保護的面積被顯影，也就是說，完全蝕刻。金 屬片以含有鎳鐵合金，銅，鎳，鈷及其它的結合或諸如此 類較佳。藉由此製程，可製造擁有大部分複雜或空隙且小 而個別的金屬》 對其他目的言，本發明的配方在化學磨粉製造上以單 一溶液來淸洗、抑止氧化及增進合金間的黏著性。本配方 之淸洗、氧化抑止及黏著促進性等性質已在上述討論。本 配方的製造與應用也與上述相同。因此在阻絕層應用之前 本紙張尺度逋用中國國家橾準（CNS > Α4規格（21〇χ297公釐） 2607pif.doc/0 02 A7 B7 五、發明说明（η) 可以上述之配方或稀釋來塗覆於金屬片上0 除了在製造印刷電路板或化學硏磨應用本配方來塗底 底材外’也可用於化學鑄鍍製程上。通常化學鑄鍍係指製 造金屬合金。更特別的是，化學鑄鍍係指將金屬合金沉積 在底材材質上。 化學鑄鍍包含應用一阻絕層在底材或其他部分上。在 使用阻絕層後，將底材在紫外光區以光化輻射曝光。此曝 光會導致未受到光阻保護的面積被顯影與鍍鑄。藉由此製 程’可分離金屬合金，如銅，錫，鎳及其它可鍍在底材上 的物質。 對其他目的言’本發明的配方在化學鑄鍍製造上以單 一溶液來淸洗、抑止氧化及增進合金間的黏著性。本配方 之淸洗、氧化抑止、底材保護、及促進合金間的黏著等性 質已在上述討論。溶液的製造與應用也與上述相同。酸液 以硫酸爲佳。因此，在應用阻絕層前，可以此溶液塗覆於 底材上。 綜上所述，雖然本發明已以一些較佳實施例掲露如 上’然其並非用以限定本發明，任何熟習此技藝者，在不 脫離本發明之精神和範圍內，當可作各種之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 爲準。 本紙張尺度適用中Big家標率（CNS ) A4規格（210x297公釐） ：----„--------^---^------1T------線， {請先閲讀背面之注$項再填寫本頁) 經濟部中央標率局貝工消费合作社印装1, 1T line Ministry of Economic Affairs, Central Bureau of Standards, Bureau of Work, Consumer Cooperatives, printed paper size, using Chinese national standards (CNS > M specifications (210 × 297 mm) 2607pif.doc / 002 A7 B7 V. Description of the invention (γ) spectrum Under actinic radiation in the ultraviolet region, this catalyst effect will cause radical polymerization of the adhesive boundary, which will cause fragmentation to a certain extent, hinder the adhesion and elasticity of the film, and fragmentation will prevent removal during peeling. The only molecular layer remaining on the barrier layer. However, the photoresist bonded to the hydrophobic layer produced by the formula does not contact copper, so that copper can maintain unique elasticity when exposed to actinic radiation. If a neutral glass The plate ink replaces the photoresist, and there will be no such catalyst effect. The elasticity of the copper substrate provides the substrate or part of the chip resistance. In the printed circuit board manufacturing process, this formula is used to coat the substrate. Including the manufacture of a recipe, including coating at least a portion of the substrate with this recipe, washing the substrate, and then drying the substrate. The process is detailed below. Prepare the formulation as described above, whether in a concentrated form or Diluted form Use this recipe to coat substrates in different ways, such as dipping, spraying, or rinsing, but it is not limited to this. Regardless of the coating technology used, the container in the assembly side is larger in size and available on the production line. Substrate coating is also good, so substrate coating can also be part of the production operation. Soaking time is preferably 20 seconds to 5 minutes. Better soaking time is until the chromate layer is removed and the substrate becomes hydrophobic. Necessary The coating can be repeated many times (or the substrate coating has grown to the required time) 'until the substrate can be completely coated. It is better to rinse the substrate to remove the residual formula and prevent spotting. However, the rinse It is not necessary. The method of rinsing the substrate includes using the following solution water, organic solvents, and the like to cover the substrate, but is not limited to this. The substrate is rinsed with distilled water or isopropyl alcohol (ISA) It is better to use deionized water. The reason for using deionized water is to deviate from the paper size and use the Chinese national standard (CNS > A4 specification (210X297 mm)): ----: ---- K- -^ ------ 1T ------ 0 (Please read the Please fill in this page for the matters needing attention) Printed by Shelley Consumer Cooperative of the Central Rubbing Bureau of the Ministry of Economic Affairs 26〇7pifd〇c / 〇〇2 A7 B7 V. Description of Invention (丨 &) (Please read the notes on the back before filling in this Page) There is no ion in the sub-water, so the cleaning is fast, the cost is very low, and it is easy to operate on the production line. The cleaning step can be repeated many times until the residual formula is removed. The next step is to dry the substrate, so The substrate will not have water droplets and prevent speckles during further processing. However, drying the substrate is not necessary. It is better to heat and dry the substrate. Strong and hot air is better because it is fast and low cost. , And easy to complete on the production line. However, other drying techniques can also be used, such as chemical methods such as ISA, ambient air, centrifugation, and the like, but are not limited to this. In the printed circuit board manufacturing process, in addition to using the formula to clean and coat the substrate and the substrate In addition to the layer center material and increasing the elasticity of synthetic materials, this formula can also be used in chemical honing processes. General chemical honing refers to the manufacture of metal alloys. More specifically, 'chemical honing' refers to a large metal layer cut into small pieces and composed of broken metal with complex patterns or holes, such as lead frames. The Central Standards Bureau of the Ministry of Economic Affairs and Consumer Co-operation Du Duanqi Chemical honing involves the use of a barrier layer in front of and / or behind the metal foil. The substrate is then exposed to actinic radiation in the ultraviolet region. This exposure causes areas that are not protected by photoresist to be developed, that is, completely etched. The metal sheet preferably contains a combination of nickel-iron alloy, copper, nickel, cobalt, and others or the like. By this process, small and individual metals with most complex or voids can be manufactured. "For other purposes, the formula of the present invention is used in chemical milling to produce a single solution to rinse, inhibit oxidation and promote adhesion between alloys. Sex. The cleaning, oxidation inhibition and adhesion promotion properties of this formulation have been discussed above. The manufacture and application of this formula are the same as above. Therefore, before the application of the barrier layer, the Chinese standard (CNS > A4 size (21 × 297 mm)) was used for this paper. 2607pif.doc / 0 02 A7 B7 V. Description of the invention (η) The above formula or dilution can be used Coating on metal sheet 0 In addition to applying this formula to coat substrates in the manufacture of printed circuit boards or chemical honing, it can also be used in the chemical casting process. Generally, chemical casting refers to the manufacture of metal alloys. More specifically, Chemical casting refers to depositing a metal alloy on the substrate material. Chemical casting includes applying a barrier layer on the substrate or other parts. After using the barrier layer, the substrate is exposed to actinic radiation in the ultraviolet region. This exposure will result in areas that are not protected by photoresist being developed and plated. Through this process 'metal alloys such as copper, tin, nickel and other materials that can be plated on the substrate can be separated. For other purposes' this The formula of the invention uses a single solution to purify, suppress oxidation and improve adhesion between alloys in the manufacture of chemical casting plating. This formula has properties such as purging, oxidation inhibition, substrate protection, and promotion of adhesion between alloys. In the discussion above, the manufacturing and application of the solution are also the same as above. The acid solution is preferably sulfuric acid. Therefore, before applying the barrier layer, this solution can be coated on the substrate. In summary, although the present invention has some The preferred embodiment is disclosed as above, but it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be Depends on the scope of the attached patent application. The size of this paper applies to the Big Family Standard Rate (CNS) A4 (210x297 mm): ---- „-------- ^ --- ^ ------ 1T ------ line, {Please read the note $ on the back before filling this page) Printed by the Shell Standard Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs