KR950034475A - 처리방법 및 처리장치 - Google Patents

처리방법 및 처리장치 Download PDF

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KR950034475A
KR950034475A KR1019950007866A KR19950007866A KR950034475A KR 950034475 A KR950034475 A KR 950034475A KR 1019950007866 A KR1019950007866 A KR 1019950007866A KR 19950007866 A KR19950007866 A KR 19950007866A KR 950034475 A KR950034475 A KR 950034475A
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substrate
resist
removal
liquid
processing
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KR1019950007866A
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KR100284559B1 (ko
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다케노부 마쓰오
가즈키 덴폭
기요히사 다테야마
기미오 모토다
다쓰야 이와사키
에이지 야마구치
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼가이샤
다카시마 히로시
도오교오 에레구토론 큐우슈우 가부시끼가이샤
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Priority claimed from JP6143841A external-priority patent/JP3033008B2/ja
Priority claimed from JP06174797A external-priority patent/JP3114084B2/ja
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼가이샤, 다카시마 히로시, 도오교오 에레구토론 큐우슈우 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR950034475A publication Critical patent/KR950034475A/ko
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Publication of KR100284559B1 publication Critical patent/KR100284559B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Abstract

직사각형기판의 레지스트처리방법은, 기판을 스핀 회전시키면서 기판에 레지스트액을 공급하고, 기판의 적어도 한쪽면에 레지스트막을 형성하는 레지스트 도포공정과, 레지스트를 용해할 수 있는 제거액을 기판양면의 둘레영역에 분사하고, 기판양면의 둘레영역으로 부터 레지스트막을 제거하는 레지스트 제거공정을 가진다.

Description

처리방법 및 처리장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 도포현상을 시스템의 전체개요사시도, 제2도는, 처리유니트를 꺼내었을 때의 도포현상 시스템으로 나타낸 전체개요사시도, 제3도는, 처리장치의 개요를 나타낸 평면도, 제7도는, 처리장치의 둘레부 제거기구를 나타낸 내부 투시도, 제25도는, 본 발명의 제2실시예에 관계되는 처리장치를 나타낸 종단면도, 제29(A)~(C)도는, 처리방법의 순서를 설명하기 위하여 각각 처리장치를 나타낸 평면도이다.

Claims (14)

  1. 기판을 스핀회전시키면서 기판에 레지스트액을 공급하고, 기판의 적어도 한쪽면에 레지스트막을 형성하는 레지스트 도포공정과, 레지스트를 용해할 수 있는 제거액을 기판양면의 둘레영역에 분사하고, 기판양면의 둘레부영역으로 부터 레지스트막을 제거하는 레지스트 제거공정을 가지는 것을 특징으로 하는 직사각형 기판의 레지스트 처리 방법.
  2. 제1항에 있어서, 레지스터 제거공정에서는, 기판의 4변 근방의 양면으로부터 동시 진행적으로 레지스트막을 제거하는 것을 특징으로 하는 처리방법.
  3. 제1항에 있어서, 레지스트 제거공정은, 기판의 마주보는 2변 근방의 양면으로부터 동시 진행적으로 레지스트막을 제거하는 제1제거공정과, 기판의 다른 2변 근방의 양면으로부터 동시 진행적으로 레지스트막을 제거하는 제2제거공정을 구비하는 것을 특징으로 하는 처리방법.
  4. 제1항에 있어서, 레지스트 제거공정은 보조 세정공정을 더욱 포함하여며, 이 보조 세정공정에서, 기판 코너부의 뒷면을 향하여 레지스트를 용해할 수 있는 제거액을 뿜어대고, 기판 코너부의 이면으로 부터 레지스트막을 제거하는 것을 특징으로 하는 처리방법.
  5. 제1항에 있어서, 레지스트 제거공정에서는, 기판의 표면측보다도 기판의 이면측 쪽을 폭넓게 레지스트막을 제거하는 것을 특징으로 하는 처리방법.
  6. 제1항에 있어서, 레지스트 제거공정에서는, 기판의 모서리 끝단부로 부터 5~10㎜폭의 영역으로부터 레지스트막을 제거하는 것을 특징으로 하는 처리방법.
  7. 제1항에 있어서, 레지스트 제거공정에서는, 제거액으로서 신나를 이용하는 것을 특징으로 하는 처리방법.
  8. 기판을 스핀 회전시켜서 기판이 레지스트액을 도포하는 레지스트 도포수단과, 이 레지스트 도포수단에 인접하도록 설치되어, 도포된 레지스트를 기판에서 제거하는 레지스트 제거수단을 구비하고, 상기 레지스트 제거수단은, 레지스트를 용해할 수 있는 제거액을 기판의 둘레부에 뿜어대는 노즐 수단과, 이 노즐수단을 기판의 둘레부를 따라서 이동시키는 이동수단과, 기판을 레지스트 도포수단과 레지스트 제거수단과의 사이에서 반송하는 반송수단을 갖는 것을 특징으로 하는 직사각형 기판의 레지스트 처리장치.
  9. 제8항에 있어서, 레지스트 제거수단은, 기판을 유지하는 유지수단과, 이 유지수단을 기판과 함께 회전시키는 회전수단을 더욱 포함하는 것을 특징으로하는 처리장치.
  10. 제8항에 있어서, 노즐수단은, 기판의 둘레부를 따라서 이동가능하게 설치되고, 기판양면의 둘레부에 제거액을 뿜어대는 주 세정노즐과, 기판뒷면의 코너부에 제거액을 뿜어대는 보조세정 노즐을 갖는 것을 특징으로 하는 처리방법.
  11. 제10항에 있어서, 주세정노즐을, 기판의 표면측 및 뒷면측에 각각 적어도 2개 설치되어 있고, 각 주세정 노즐로부터 분사된 제거액이 서로 간섭하지 않도록 상기 주세정 노즐이 위치해 있는 것을 특징으로 하는 처리방법.
  12. 처리용기내의 기판에 레지스트액을 공급하면서 기판을 스핀회전시켜서, 처리용기내를 배기함과 동시에 외기를 도입하므로써, 레지스트 도포중의 기관의 윗쪽영역에서 기판중앙으로부터 기판 둘레로 향하는 기류를 발생시키고, 레지스트 도포종료후에 처리용기내의 분위기를 외기와 치환하는 것을 특징으로 하는 직사각형 기판의 레지스트 처리방법.
  13. 기판의 얹어놓이는 스테이지를 갖는 처리용기와, 스테이지상의 기판에 레지스트액을 공급하는 레지스트공급수단과, 스테이지를 스핀 회전시키는 스핀 회전수단과, 기판 둘레부의 근방에 설치된 배기 통로를 가지며, 이 배기 통로를 통하여 처리용기내를 배기하는 배기수단과, 처리용기내의 외기를 도입하는 외기도입수단을 가지는 것을 특징으로 하는 직사각형 기판의 레지스트 처리장치.
  14. 제13항에 있어서, 처리용기의 상부에, 이 처리용기의 회전에 따라서 처리용기내에 바깥공기를 도입하는 나사홈 형상 또는 나산형상의 바깥공기 도입통로를 설치하고 있는 것을 특징으로 하는 처리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950007866A 1994-04-04 1995-04-04 처리방법 및 처리장치 KR100284559B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP8913894 1994-04-04
JP94-89138 1994-04-04
JP6143841A JP3033008B2 (ja) 1994-06-02 1994-06-02 処理方法及び処理装置
JP94-143841 1994-06-02
JP94-174797 1994-07-04
JP06174797A JP3114084B2 (ja) 1994-04-04 1994-07-04 処理方法及び処理装置

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Publication Number Publication Date
KR950034475A true KR950034475A (ko) 1995-12-28
KR100284559B1 KR100284559B1 (ko) 2001-04-02

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KR (1) KR100284559B1 (ko)
TW (1) TW399104B (ko)

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