JP4825178B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP4825178B2 JP4825178B2 JP2007198826A JP2007198826A JP4825178B2 JP 4825178 B2 JP4825178 B2 JP 4825178B2 JP 2007198826 A JP2007198826 A JP 2007198826A JP 2007198826 A JP2007198826 A JP 2007198826A JP 4825178 B2 JP4825178 B2 JP 4825178B2
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- cup
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- wafer
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- 239000000758 substrate Substances 0.000 title claims description 113
- 239000007788 liquid Substances 0.000 claims description 177
- 238000003860 storage Methods 0.000 claims description 22
- 238000009423 ventilation Methods 0.000 claims 1
- 101150038956 cup-4 gene Proteins 0.000 description 35
- 238000004140 cleaning Methods 0.000 description 34
- 238000000034 method Methods 0.000 description 32
- 239000003595 mist Substances 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 15
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 12
- 239000002253 acid Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 239000003513 alkali Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 229910021529 ammonia Inorganic materials 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
Description
図10は、第1例に係る処理装置100aを示す断面図である。
図11は、第2例に係る処理装置100bを示す断面図である。
図13は、第3例に係る処理装置100cを示す断面図である。
Claims (9)
- 基板を水平に保持し、基板とともに回転可能な基板保持部と、
前記基板保持部を回転させる回転機構と、
基板に処理液を供給する処理液供給機構と、
前記基板保持部の外側に、この基板保持部に保持された基板を囲繞するように設けられ、前記基板保持部とともに回転し、回転する基板から振り切られた処理液を受ける壁部を有する回転カップと、
前記回転カップの外側に、この回転カップ及び前記基板保持部を囲繞するように設けられ、前記回転する基板から振り切られた処理液を収容する環状の液収容部と、この環状の液収容部よりも内側に設けられた内側環状空間とを備えた排気及び排液カップと、
前記排気及び排液カップの内側環状空間に接続された排気機構と、
を具備し、
前記排気及び排液カップが、前記液収容部の下方に設けられ、前記内側環状空間の全周に連通された下部環状空間を、さらに備え、
前記排気機構が、前記下部環状空間を介して前記内側環状空間に接続されていることを特徴とする基板処理装置。 - 前記下部環状空間の上部に、前記基板保持部に対向する少なくとも1つの通気孔が形成されていることを特徴とする請求項1に記載の基板処理装置。
- 前記通気孔が複数あり、これら複数の通気孔が、前記下部環状空間の上部に、環状に並んで形成されていることを特徴とする請求項2に記載の基板処理装置。
- 基板を水平に保持し、基板とともに回転可能な基板保持部と、
前記基板保持部を回転させる回転機構と、
基板に処理液を供給する処理液供給機構と、
前記基板保持部の外側に、この基板保持部に保持された基板を囲繞するように設けられ、前記基板保持部とともに回転し、回転する基板から振り切られた処理液を受ける壁部を有する回転カップと、
前記回転カップの外側に、この回転カップ及び前記基板保持部を囲繞するように設けられ、底壁部と、この底壁部の外周に沿って形成された環状外壁部と、この環状外壁部よりも内側に形成された環状内壁部と、を備えた排気カップと、
前記排気カップの内側に、前記回転カップ及び前記基板保持部を囲繞し、かつ、前記排気カップの底壁部との間に下部環状空間を形成し、前記排気カップの環状外壁部との間に外側環状空間を形成し、前記排気カップの環状内壁部との間に内側環状空間を形成するように設けられ、前記回転する基板から振り切られた処理液を収容する環状の液収容部を備えた排液カップと、
前記下部環状空間に接続された排気機構と、
前記下部環状空間と前記外側環状空間との間に配置された気流調整部材と、を備え、
前記下部環状空間の上部に対応した前記排液カップの部分に、前記基板保持部に対向する少なくとも1つの通気孔が形成されていることを特徴とする基板処理装置。 - 前記通気孔が複数あり、これら複数の通気孔が、前記下部環状空間の上部に対応した前記排液カップの部分に、環状に並んで形成されていることを特徴とする請求項4に記載の基板処理装置。
- 前記気流調整部材が、前記下部環状空間と前記外側環状空間とを連通させる複数の通気孔を備えることを特徴とする請求項4に記載の基板処理装置。
- 前記気流調整部材が、前記下部環状空間と前記外側環状空間とを遮断することを特徴とする請求項4に記載の基板処理装置。
- 前記気流調整部材が交換可能であり、この気流調整部材を交換することで、前記下部環状空間と前記外側環状空間とを連通させること、及び前記下部環状空間と前記外側環状空間とを遮断することのいずれかを選択可能としたことを特徴とする請求項4に記載の基板処理装置。
- 前記環状外壁部上に、前記排液カップの上方を覆うように設けられた上側壁を有し、
前記上側壁が、前記外側環状空間を閉塞することを特徴とする請求項4に記載の基板処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007198826A JP4825178B2 (ja) | 2007-07-31 | 2007-07-31 | 基板処理装置 |
KR1020080061035A KR101244591B1 (ko) | 2007-07-31 | 2008-06-26 | 기판 처리 장치 |
US12/219,312 US8042560B2 (en) | 2007-07-31 | 2008-07-18 | Substrate processing apparatus |
TW097128852A TW200921771A (en) | 2007-07-31 | 2008-07-30 | Substrate processing apparatus |
DE102008035802A DE102008035802A1 (de) | 2007-07-31 | 2008-07-31 | Substratbearbeitungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007198826A JP4825178B2 (ja) | 2007-07-31 | 2007-07-31 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009038083A JP2009038083A (ja) | 2009-02-19 |
JP4825178B2 true JP4825178B2 (ja) | 2011-11-30 |
Family
ID=40176161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007198826A Active JP4825178B2 (ja) | 2007-07-31 | 2007-07-31 | 基板処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8042560B2 (ja) |
JP (1) | JP4825178B2 (ja) |
KR (1) | KR101244591B1 (ja) |
DE (1) | DE102008035802A1 (ja) |
TW (1) | TW200921771A (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4920643B2 (ja) * | 2008-07-09 | 2012-04-18 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP2011054619A (ja) * | 2009-08-31 | 2011-03-17 | Hitachi Kokusai Electric Inc | 基板処理装置 |
TWI445065B (zh) * | 2009-12-18 | 2014-07-11 | J E T Co Ltd | Substrate processing device |
JP5726637B2 (ja) * | 2011-05-24 | 2015-06-03 | 東京エレクトロン株式会社 | 液処理装置、液処理方法 |
US9242279B2 (en) | 2011-05-24 | 2016-01-26 | Tokyo Electron Limited | Liquid processing apparatus and liquid processing method |
JP5726636B2 (ja) * | 2011-05-24 | 2015-06-03 | 東京エレクトロン株式会社 | 液処理装置、液処理方法 |
JP6057624B2 (ja) | 2012-09-03 | 2017-01-11 | 株式会社Screenセミコンダクターソリューションズ | カップおよび基板処理装置 |
KR20150000548A (ko) * | 2013-06-24 | 2015-01-05 | 삼성전자주식회사 | 기판 처리 장치 |
JP6250973B2 (ja) * | 2013-08-08 | 2017-12-20 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6234736B2 (ja) * | 2013-08-30 | 2017-11-22 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
JP6229933B2 (ja) | 2013-09-27 | 2017-11-15 | 株式会社Screenホールディングス | 処理カップ洗浄方法、基板処理方法および基板処理装置 |
JP6359925B2 (ja) | 2014-09-18 | 2018-07-18 | 株式会社Screenホールディングス | 基板処理装置 |
JP6308141B2 (ja) * | 2015-02-03 | 2018-04-11 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、及び記憶媒体 |
JP7314634B2 (ja) * | 2019-06-11 | 2023-07-26 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
KR102346529B1 (ko) * | 2019-06-24 | 2021-12-31 | 세메스 주식회사 | 액 공급 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법 |
CN113019827A (zh) * | 2021-03-06 | 2021-06-25 | 山东阅航环保科技有限公司 | 一种方便上色的中空玻璃风干装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05146736A (ja) * | 1991-11-27 | 1993-06-15 | Sharp Corp | スピン式コーテイング装置 |
US5718763A (en) * | 1994-04-04 | 1998-02-17 | Tokyo Electron Limited | Resist processing apparatus for a rectangular substrate |
JP3102831B2 (ja) | 1994-06-20 | 2000-10-23 | 大日本スクリーン製造株式会社 | 回転処理装置 |
TW406216B (en) * | 1995-05-24 | 2000-09-21 | Tokyo Electron Ltd | Apparatus for coating resist on substrate |
JP2003264167A (ja) | 1996-10-07 | 2003-09-19 | Tokyo Electron Ltd | 液処理方法及びその装置 |
TW418452B (en) * | 1997-10-31 | 2001-01-11 | Tokyo Electron Ltd | Coating process |
JP2000138163A (ja) | 1998-10-30 | 2000-05-16 | Tokyo Electron Ltd | 液処理装置 |
JP3587723B2 (ja) | 1999-04-30 | 2004-11-10 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP4593713B2 (ja) * | 2000-02-04 | 2010-12-08 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
JP2002368066A (ja) | 2001-06-06 | 2002-12-20 | Tokyo Electron Ltd | 処理装置 |
JP3890025B2 (ja) * | 2003-03-10 | 2007-03-07 | 東京エレクトロン株式会社 | 塗布処理装置及び塗布処理方法 |
JP3890026B2 (ja) * | 2003-03-10 | 2007-03-07 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
-
2007
- 2007-07-31 JP JP2007198826A patent/JP4825178B2/ja active Active
-
2008
- 2008-06-26 KR KR1020080061035A patent/KR101244591B1/ko active IP Right Grant
- 2008-07-18 US US12/219,312 patent/US8042560B2/en not_active Expired - Fee Related
- 2008-07-30 TW TW097128852A patent/TW200921771A/zh unknown
- 2008-07-31 DE DE102008035802A patent/DE102008035802A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE102008035802A1 (de) | 2009-02-05 |
US8042560B2 (en) | 2011-10-25 |
KR101244591B1 (ko) | 2013-03-25 |
KR20090013024A (ko) | 2009-02-04 |
JP2009038083A (ja) | 2009-02-19 |
TW200921771A (en) | 2009-05-16 |
TWI374485B (ja) | 2012-10-11 |
US20090031948A1 (en) | 2009-02-05 |
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