KR101019445B1 - 액 처리 장치 - Google Patents
액 처리 장치 Download PDFInfo
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- KR101019445B1 KR101019445B1 KR1020070037458A KR20070037458A KR101019445B1 KR 101019445 B1 KR101019445 B1 KR 101019445B1 KR 1020070037458 A KR1020070037458 A KR 1020070037458A KR 20070037458 A KR20070037458 A KR 20070037458A KR 101019445 B1 KR101019445 B1 KR 101019445B1
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- Prior art keywords
- substrate
- liquid
- cup
- drainage
- rotating
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- 239000007788 liquid Substances 0.000 title claims abstract description 186
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000007599 discharging Methods 0.000 claims 4
- 238000000034 method Methods 0.000 description 27
- 239000003595 mist Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 23
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000004381 surface treatment Methods 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 101150038956 cup-4 gene Proteins 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Abstract
Description
Claims (12)
- 기판을 수평으로 유지하고, 기판과 함께 회전 가능한 기판 유지부와,상기 기판 유지부에 유지된 기판을 둘러싸고, 기판과 함께 회전 가능한 회전 컵과,상기 회전 컵 및 상기 기판 유지부를 일체적으로 회전시키는 회전 기구와,적어도 기판의 표면에 처리액을 공급하는 액 공급 기구와,상기 회전 컵으로부터 외부로 배기 및 배액하는 배기·배액부와,표면이 기판 표면과 연속하도록 기판의 외측에 설치되고, 상기 기판 유지부 및 상기 회전 컵과 함께 회전하며, 기판 표면에 공급되어 기판으로부터 털어진 처리액을 그 표면을 통해 상기 회전 컵으로부터 상기 배기·배액부로 안내하는 안내 부재를 포함하는 액 처리 장치.
- 제1항에 있어서, 상기 안내 부재는 기판과 인접하는 부분의 표면의 높이 위치가, 기판의 표면의 높이 위치와 일치하고 있는 것인 액 처리 장치.
- 제1항에 있어서, 상기 안내 부재는 그 내단이 기판에 근접하도록 설치되어 환형의 판형체로 이루어지는 것인 액 처리 장치.
- 제1항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 수평 방향으 로 배출하는 처리액 배출부를 포함하고 있는 것인 액 처리 장치.
- 제1항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 취입하여 아래쪽으로 안내하는 안내 벽과, 취입한 처리액을 아래쪽으로 배출하는 개구부를 포함하고 있는 것인 액 처리 장치.
- 제1항에 있어서, 상기 배기·배액부는 기판으로부터 털어진 배액을 수취하는 환형을 이루는 배액 컵과, 상기 배액 컵의 외측에 설치되고, 상기 회전 컵의 배기를 행하는 배기 컵을 포함하는 것인 액 처리 장치.
- 기판을 수평으로 유지하고, 기판과 함께 회전 가능한 기판 유지부와,상기 기판 유지부에 유지된 기판을 둘러싸며, 기판과 함께 회전 가능한 회전 컵과,상기 회전 컵 및 상기 기판 유지부를 일체적으로 회전시키는 회전 기구와,기판의 표면에 처리액을 공급하는 표면 액 공급 기구와,기판의 이면에 처리액을 공급하는 이면 액 공급 기구와,상기 회전 컵으로부터 외부로 배기 및 배액 하는 배기·배액부와,표리면이 기판 표리면과 연속하도록 기판의 외측에 설치되고, 상기 기판 유지부 및 상기 회전 컵과 함께 회전하며, 기판 표면에 공급되어 기판으로부터 털어진 처리액을 그 표면을 통해 상기 회전 컵으로부터 상기 배기·배액부로 유도하고, 기판 이면에 공급되어 기판으로부터 털어진 처리액을 그 이면을 통해 상기 회전 컵으로부터 상기 배기·배액부로 안내하는 안내 부재를 포함하는 액 처리 장치.
- 제7항에 있어서, 상기 안내 부재는 기판과 인접하는 부분의 표면 및 이면의 높이 위치가, 기판의 표면 및 이면의 높이 위치와 일치하고 있는 것인 액 처리 장치.
- 제7항에 있어서, 상기 안내 부재는 그 내단이 기판에 근접하도록 설치되어 환형의 판형체로 이루어지는 것인 액 처리 장치.
- 제7항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 수평 방향으로 배출하는 처리액 배출부를 포함하고 있는 것인 액 처리 장치.
- 제7항에 있어서, 상기 회전 컵은 기판으로부터 털어진 처리액을 취입하여 아래쪽으로 안내하는 안내 벽과, 취입한 처리액을 아래쪽으로 배출하는 개구부를 포함하고 있는 것인 액 처리 장치.
- 제7항에 있어서, 상기 배기·배액부는 기판으로부터 털어진 배액을 수취하는 환형을 이루는 배액 컵과, 상기 배액 컵의 외측에 설치되고, 상기 회전 컵의 배기 를 행하는 배기 컵을 포함하는 것인 액 처리 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006114960 | 2006-04-18 | ||
JPJP-P-2006-00114960 | 2006-04-18 |
Publications (2)
Publication Number | Publication Date |
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KR20070103314A KR20070103314A (ko) | 2007-10-23 |
KR101019445B1 true KR101019445B1 (ko) | 2011-03-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020070037458A KR101019445B1 (ko) | 2006-04-18 | 2007-04-17 | 액 처리 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7998308B2 (ko) |
EP (1) | EP1848025B1 (ko) |
KR (1) | KR101019445B1 (ko) |
CN (2) | CN101441991B (ko) |
AT (1) | ATE450885T1 (ko) |
DE (1) | DE602007003506D1 (ko) |
TW (1) | TW200802579A (ko) |
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US8268087B2 (en) * | 2007-12-27 | 2012-09-18 | Tokyo Electron Limited | Liquid processing apparatus, liquid processing method, and storage medium |
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JP6057334B2 (ja) * | 2013-03-15 | 2017-01-11 | 株式会社Screenホールディングス | 基板処理装置 |
JP6281161B2 (ja) | 2013-09-27 | 2018-02-21 | 東京エレクトロン株式会社 | 液処理装置 |
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JP6090113B2 (ja) * | 2013-10-30 | 2017-03-08 | 東京エレクトロン株式会社 | 液処理装置 |
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JP6267141B2 (ja) * | 2014-06-04 | 2018-01-24 | 東京エレクトロン株式会社 | 液塗布方法、液塗布装置、及びコンピュータ読み取り可能な記録媒体 |
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2007
- 2007-04-17 US US11/785,351 patent/US7998308B2/en active Active
- 2007-04-17 TW TW096113508A patent/TW200802579A/zh unknown
- 2007-04-17 EP EP07007786A patent/EP1848025B1/en not_active Expired - Fee Related
- 2007-04-17 DE DE602007003506T patent/DE602007003506D1/de active Active
- 2007-04-17 AT AT07007786T patent/ATE450885T1/de active
- 2007-04-17 KR KR1020070037458A patent/KR101019445B1/ko active IP Right Grant
- 2007-04-18 CN CN2008101795797A patent/CN101441991B/zh active Active
- 2007-04-18 CN CN2007100961916A patent/CN101060070B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5997653A (en) | 1996-10-07 | 1999-12-07 | Tokyo Electron Limited | Method for washing and drying substrates |
US20030168089A1 (en) | 1999-10-06 | 2003-09-11 | Ichiro Katakabe | Method of and apparatus for cleaning substrate |
JP2002170804A (ja) | 2000-12-04 | 2002-06-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
US20040180141A1 (en) * | 2003-03-10 | 2004-09-16 | Shinji Kobayashi | Coating and processing apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
TW200802579A (en) | 2008-01-01 |
CN101441991A (zh) | 2009-05-27 |
CN101060070A (zh) | 2007-10-24 |
KR20070103314A (ko) | 2007-10-23 |
US20070240824A1 (en) | 2007-10-18 |
CN101060070B (zh) | 2010-10-27 |
DE602007003506D1 (de) | 2010-01-14 |
TWI362068B (ko) | 2012-04-11 |
CN101441991B (zh) | 2010-11-03 |
EP1848025A1 (en) | 2007-10-24 |
US7998308B2 (en) | 2011-08-16 |
EP1848025B1 (en) | 2009-12-02 |
ATE450885T1 (de) | 2009-12-15 |
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