KR930014781A - 단일 웨이퍼 반도체 프로세싱 장비용 프로그램가능 멀티존 가스 및 액체 주입기 - Google Patents
단일 웨이퍼 반도체 프로세싱 장비용 프로그램가능 멀티존 가스 및 액체 주입기 Download PDFInfo
- Publication number
- KR930014781A KR930014781A KR1019920026427A KR920026427A KR930014781A KR 930014781 A KR930014781 A KR 930014781A KR 1019920026427 A KR1019920026427 A KR 1019920026427A KR 920026427 A KR920026427 A KR 920026427A KR 930014781 A KR930014781 A KR 930014781A
- Authority
- KR
- South Korea
- Prior art keywords
- mixing manifold
- process liquid
- injector
- conduit
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45574—Nozzles for more than one gas
-
- H10P32/12—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H10P32/171—
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- H10P72/0402—
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US815,718 | 1986-01-02 | ||
| US81571891A | 1991-12-30 | 1991-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR930014781A true KR930014781A (ko) | 1993-07-23 |
Family
ID=25218632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920026427A Ceased KR930014781A (ko) | 1991-12-30 | 1992-12-30 | 단일 웨이퍼 반도체 프로세싱 장비용 프로그램가능 멀티존 가스 및 액체 주입기 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0550058B1 (enExample) |
| JP (1) | JP2723439B2 (enExample) |
| KR (1) | KR930014781A (enExample) |
| DE (1) | DE69227575T2 (enExample) |
| TW (1) | TW239895B (enExample) |
Families Citing this family (294)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2790009B2 (ja) * | 1992-12-11 | 1998-08-27 | 信越半導体株式会社 | シリコンエピタキシャル層の成長方法および成長装置 |
| DE69433656T2 (de) * | 1993-07-30 | 2005-02-17 | Applied Materials, Inc., Santa Clara | Verfahren zum Einleiten reaktiven Gases in eine Substratbearbeitungsvorrichtung |
| US6500734B2 (en) | 1993-07-30 | 2002-12-31 | Applied Materials, Inc. | Gas inlets for wafer processing chamber |
| US5746875A (en) * | 1994-09-16 | 1998-05-05 | Applied Materials, Inc. | Gas injection slit nozzle for a plasma process reactor |
| ES2125058T3 (es) * | 1994-11-16 | 1999-02-16 | Goodrich Co B F | Producto, procedimiento y aparato de infiltracion/deposito quimico en fase vapor con gradiente de presion. |
| KR100201386B1 (ko) * | 1995-10-28 | 1999-06-15 | 구본준 | 화학기상증착장비의 반응가스 분사장치 |
| US6294026B1 (en) * | 1996-11-26 | 2001-09-25 | Siemens Aktiengesellschaft | Distribution plate for a reaction chamber with multiple gas inlets and separate mass flow control loops |
| FI972874A0 (fi) * | 1997-07-04 | 1997-07-04 | Mikrokemia Oy | Foerfarande och anordning foer framstaellning av tunnfilmer |
| US6300255B1 (en) * | 1999-02-24 | 2001-10-09 | Applied Materials, Inc. | Method and apparatus for processing semiconductive wafers |
| US6489241B1 (en) * | 1999-09-17 | 2002-12-03 | Applied Materials, Inc. | Apparatus and method for surface finishing a silicon film |
| US6333272B1 (en) * | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| US20040142558A1 (en) | 2002-12-05 | 2004-07-22 | Granneman Ernst H. A. | Apparatus and method for atomic layer deposition on substrates |
| WO2004088729A1 (en) * | 2003-03-26 | 2004-10-14 | Tokyo Electron Limited | Chemical processing system and method |
| US7601223B2 (en) | 2003-04-29 | 2009-10-13 | Asm International N.V. | Showerhead assembly and ALD methods |
| US7537662B2 (en) | 2003-04-29 | 2009-05-26 | Asm International N.V. | Method and apparatus for depositing thin films on a surface |
| KR100513920B1 (ko) * | 2003-10-31 | 2005-09-08 | 주식회사 시스넥스 | 화학기상증착 반응기 |
| US20110048325A1 (en) * | 2009-03-03 | 2011-03-03 | Sun Hong Choi | Gas Distribution Apparatus and Substrate Processing Apparatus Having the Same |
| TWI467658B (zh) * | 2009-07-21 | 2015-01-01 | United Microelectronics Corp | 半導體製程 |
| US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
| US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3854443A (en) * | 1973-12-19 | 1974-12-17 | Intel Corp | Gas reactor for depositing thin films |
| JPS5687328A (en) * | 1979-12-18 | 1981-07-15 | Matsushita Electronics Corp | Semiconductor treatment device |
| US4980204A (en) * | 1987-11-27 | 1990-12-25 | Fujitsu Limited | Metal organic chemical vapor deposition method with controlled gas flow rate |
| JPH02187018A (ja) * | 1989-01-13 | 1990-07-23 | Mitsubishi Electric Corp | 化学気相成長装置 |
| US5134965A (en) * | 1989-06-16 | 1992-08-04 | Hitachi, Ltd. | Processing apparatus and method for plasma processing |
| US4993358A (en) * | 1989-07-28 | 1991-02-19 | Watkins-Johnson Company | Chemical vapor deposition reactor and method of operation |
| JPH03170675A (ja) * | 1989-11-28 | 1991-07-24 | Mitsubishi Electric Corp | 化学気相成長装置 |
| JPH02142525U (enExample) * | 1990-05-10 | 1990-12-04 | ||
| DE4142877A1 (de) * | 1990-12-28 | 1992-07-02 | Mitsubishi Electric Corp | Cvd-verfahren und vorrichtung zu dessen durchfuehrung |
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- 1992-12-29 EP EP92122099A patent/EP0550058B1/en not_active Expired - Lifetime
- 1992-12-30 KR KR1019920026427A patent/KR930014781A/ko not_active Ceased
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1993
- 1993-01-04 JP JP5029566A patent/JP2723439B2/ja not_active Expired - Fee Related
- 1993-06-02 TW TW082104385A patent/TW239895B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP0550058A3 (en) | 1993-09-01 |
| JPH0645266A (ja) | 1994-02-18 |
| DE69227575D1 (de) | 1998-12-17 |
| EP0550058A2 (en) | 1993-07-07 |
| TW239895B (enExample) | 1995-02-01 |
| EP0550058B1 (en) | 1998-11-11 |
| DE69227575T2 (de) | 1999-06-02 |
| JP2723439B2 (ja) | 1998-03-09 |
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