KR20030030022A - 고밀도 초미세 배선판용 동박 - Google Patents
고밀도 초미세 배선판용 동박 Download PDFInfo
- Publication number
- KR20030030022A KR20030030022A KR10-2003-7003948A KR20037003948A KR20030030022A KR 20030030022 A KR20030030022 A KR 20030030022A KR 20037003948 A KR20037003948 A KR 20037003948A KR 20030030022 A KR20030030022 A KR 20030030022A
- Authority
- KR
- South Korea
- Prior art keywords
- foil
- layer
- carrier
- copper foil
- ultra
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
- Y10T428/12514—One component Cu-based
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
FR-4 캐리어 박리 강도 (kN/m) | PI 캐리어 박리 강도 (kN/m) | 핀홀 (개수) | |
실시예 1 | 0.030 | 0.080 | 0 |
실시예 2 | 0.025 | 0.037 | 0 |
실시예 3 | 0.015 | 0.030 | 0 |
실시예 4 | 0.040 | 0.085 | 0 |
실시예 5 | 0.045 | 0.090 | 0 |
실시예 6 | 0.015 | 0.050 | 0 |
실시예 7 | 0.030 | 0.062 | 0 |
실시예 8 | 0.041 | 0.073 | 0 |
실시예 9 | 0.030 | 0.090 | 0 |
실시예 10 | 0.033 | 0.095 | 0 |
실시예 11 | 0.030 | - | 0 |
비교예 1 | 0.046 | 박리 불가 | 0 |
비교예 2 | 0.030 | 0.020 | 28 |
레이저 천공 가능 펄스 에너지 (mJ) | |
실시예 1 | 14 |
실시예 2 | 12 |
실시예 3 | 10 |
실시예 4 | 13 |
실시예 5 | 10 |
실시예 6 | 15 |
실시예 7 | 10 |
실시예 8 | 14 |
실시예 9 | 15 |
실시예 10 | 10 |
실시예 11 | 14 |
비교예 1 | 1회로 천공 불가능 |
비교예 2 | 18 |
Claims (24)
- 캐리어 박 표면에, 박리층, 확산 방지층 및 전기 동 도금층을 이 순서로 적층하여 이루어지고, 상기 전기 동 도금층의 표면이 조면화되어 있는 것을 특징으로 하는 캐리어 구비 극박 동박.
- 캐리어 박 표면에, 확산 방지층, 박리층 및 전기 동 도금층을 이 순서로 적층하여 이루어지고, 상기 전기 동 도금층의 표면이 조면화되어 있는 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 또는 제 2 항에 있어서, 상기 박리층이 크롬층 또는 크롬 수화 산화물 층인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 3 항에 있어서, 크롬 수화 산화물 층이 pH 7보다 큰 알카리의 처리액에 침지 또는 전해에 의해 형성되는 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서, 상기 확산 방지층이 CO2가스 레이저가 발진하는 파장의 빛을 흡수하기 쉬운 층인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 5 항에 있어서, 상기 CO2가스 레이저가 발진하는 파장의 빛을 흡수하기 쉬운 층이, 니켈, 코발트, 철, 크롬, 몰리브덴, 텅스텐, 동, 알루미늄 및 인으로 이루어진 그룹에서 선택된 원소로 이루어지고, 단일 금속의 층, 2종 이상 금속의 합금층 또는 1종 이상의 금속 산화물 층인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 6 항에 있어서, 박리층이 크롬 수화 산화물 층이고, 상기 CO2가스 레이저가 발진하는 파장의 빛을 흡수하기 쉬운 층이 pH 2 이상으로 유지된 처리액으로 처리한 층인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 7 항 중 어느 한 항에 있어서, 상기 캐리어 박이 동 또는 동 합금의 박인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 8 항 중 어느 한 항에 있어서, 상기 캐리어 박이 전해 동박, 전해 동합금 박, 압연 동박 또는 압연 동합금 박인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 9 항 중 어느 한 항에 있어서, 상기 캐리어 박의 표면이 미처리 전해 동박 또는 미처리 전해 동합금 박의 매트면 또는 광택면인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 10 항 중 어느 한 항에 있어서, 상기 캐리어 박이 미처리 전해 동박 또는 미처리 전해 동합금 박의 매트면 또는 광택면에 조화 처리를 행한 박인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 9 항 중 어느 한 항에 있어서, 상기 캐리어 박이 압연 동박 또는 압연 동합금 박의 압연 마무리 면의 적어도 한쪽 면에 조화 처리를 행한 박인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 11 항 또는 제 12 항에 있어서, 상기 조화 처리는 화학적 또는 전기 화학적으로 표면을 거칠게 하거나, 전기 도금에 의해 조화 입자를 부착시키는 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 11 항 내지 제 13 항 중 어느 한 항에 있어서, 상기 전기 도금에 의한 조화 처리의 입경이 5㎛ 이하인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 14 항 중 어느 한 항에 있어서, 상기 극박 동박이 12㎛ 이하의 두께인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 15 항 중 어느 한 항에 있어서, 상기 캐리어 박이 1mm 이하의 두께의 박인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 16 항에 있어서, 상기 캐리어 박이 7㎛ 내지 70㎛의 두께의 박인 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 17 항 중 어느 한 항에 있어서, 상기 조화 처리된 극박 동박의 표층면에, 동 이외의 금속 도금, 크로메이트 처리 및 실란 결합제 처리에서 선택된 적어도 하나의 처리가 행해진 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 18 항 중 어느 한 항에 있어서, 상기 조화 처리된 극박 동박 표면이 B 단계 상태의 절연 수지층으로 피복되어 있는 것을 특징으로 하는 캐리어 구비 극박 동박.
- 제 1 항 내지 제 19 항 중 어느 한 항에 기재된 캐리어 구비 극박 동박이 수지 기재에 적층되어 있는 것을 특징으로 하는 동장 적층판.
- 제 20 항에 있어서, 상기 동장 적층판의 캐리어 구비 극박 동박으로부터 상기 캐리어 박이 박리되어 있는 것을 특징으로 하는 동장 적층판.
- 제 21 항에 기재된 동장 적층판의 극박 동박 상에 배선 패턴이 형성되어 있는 것을 특징으로 하는 프린트 배선판.
- 제 22 항에 기재된 프린트 배선판을 복수 적층하여 형성된 것을 특징으로 하는 다층 프린트 배선판.
- 미리 배선 패턴이 형성된 내층판의 적어도 편면에, 제 1 항 내지 제 19 항 중 어느 한 항에 기재된 캐리어 구비 극박 동박을 적층하여 동장 적층판을 형성하고, 상기 동장 적층판에서 상기 캐리어 박을 박리하여 상기 극박 동박을 노출시키고, 상기 극박 동박 상에 배선 패턴을 형성시킨 프린트 배선 기판을 복수 적층한 것을 특징으로 하는 다층 프린트 배선판.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000288087 | 2000-09-22 | ||
JPJP-P-2000-00288087 | 2000-09-22 | ||
PCT/JP2001/008220 WO2002024444A1 (fr) | 2000-09-22 | 2001-09-21 | Feuille de cuivre pour carte de connexions ultrafine haute densite |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030030022A true KR20030030022A (ko) | 2003-04-16 |
KR100562956B1 KR100562956B1 (ko) | 2006-03-22 |
Family
ID=18771727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037003948A KR100562956B1 (ko) | 2000-09-22 | 2001-09-21 | 고밀도 초미세 배선판용 동박 |
Country Status (8)
Country | Link |
---|---|
US (2) | US7026059B2 (ko) |
EP (1) | EP1331088A1 (ko) |
JP (2) | JP4072431B2 (ko) |
KR (1) | KR100562956B1 (ko) |
CN (1) | CN1466517B (ko) |
MY (1) | MY146636A (ko) |
TW (1) | TWI276708B (ko) |
WO (1) | WO2002024444A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100700321B1 (ko) * | 2005-11-07 | 2007-03-29 | 삼성전기주식회사 | 미세한 표면 조도가 형성된 기판 및 그 제조 방법 |
KR20140024951A (ko) * | 2011-08-31 | 2014-03-03 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 캐리어가 부착된 구리박 |
WO2015102322A1 (ko) * | 2013-12-30 | 2015-07-09 | 일진머티리얼즈 주식회사 | 동박, 이를 포함하는 전기부품 및 전지 |
Families Citing this family (151)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002292788A (ja) * | 2001-03-30 | 2002-10-09 | Nippon Denkai Kk | 複合銅箔及び該複合銅箔の製造方法 |
JP2003051673A (ja) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板 |
JP4612978B2 (ja) * | 2001-09-20 | 2011-01-12 | 日本電解株式会社 | 複合銅箔及びその製造方法 |
JP2003286596A (ja) * | 2002-03-29 | 2003-10-10 | Nippon Denkai Kk | レーザー穴明けに適した銅箔とその製造方法 |
JP4187465B2 (ja) * | 2002-05-29 | 2008-11-26 | 三井化学株式会社 | 極薄銅箔を用いたポリイミド銅張積層板及びその製造方法 |
WO2004005588A1 (ja) * | 2002-07-04 | 2004-01-15 | Mitsui Mining & Smelting Co.,Ltd. | キャリア箔付電解銅箔 |
JP2004042579A (ja) * | 2002-07-16 | 2004-02-12 | Ube Ind Ltd | 銅張積層板及びその製造方法 |
US6930391B2 (en) * | 2002-08-27 | 2005-08-16 | Intel Corporation | Method for alloy-electroplating group IB metals with refractory metals for interconnections |
JP2004090488A (ja) * | 2002-08-30 | 2004-03-25 | Panac Co Ltd | 金属層転写シート |
TW200404484A (en) * | 2002-09-02 | 2004-03-16 | Furukawa Circuit Foil | Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board |
JP2004169181A (ja) * | 2002-10-31 | 2004-06-17 | Furukawa Techno Research Kk | キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板 |
TW200420208A (en) | 2002-10-31 | 2004-10-01 | Furukawa Circuit Foil | Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier |
JP4456834B2 (ja) * | 2003-03-05 | 2010-04-28 | 新光電気工業株式会社 | レーザ加工方法およびこれに用いるキャリア付金属箔 |
JP2004307884A (ja) * | 2003-04-03 | 2004-11-04 | Fukuda Metal Foil & Powder Co Ltd | プリント配線板用銅箔 |
JP2004314568A (ja) * | 2003-04-21 | 2004-11-11 | Fukuda Metal Foil & Powder Co Ltd | プリント配線板用銅箔 |
JP4300870B2 (ja) * | 2003-05-08 | 2009-07-22 | 日立化成工業株式会社 | プリント配線板の製造方法 |
JP4065215B2 (ja) * | 2003-05-13 | 2008-03-19 | 福田金属箔粉工業株式会社 | プリント配線板用銅箔 |
JP2005005435A (ja) * | 2003-06-11 | 2005-01-06 | Sony Corp | 実装基板及びその製造方法 |
US7132158B2 (en) * | 2003-10-22 | 2006-11-07 | Olin Corporation | Support layer for thin copper foil |
EP1531656A3 (en) * | 2003-11-11 | 2007-10-03 | Furukawa Circuit Foil Co., Ltd. | Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
JP4570070B2 (ja) * | 2004-03-16 | 2010-10-27 | 三井金属鉱業株式会社 | 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法 |
US8263225B2 (en) * | 2004-06-01 | 2012-09-11 | Isola Usa Corp. | Laminate composition for producing reduced curl flat thin core laminate |
TW200609109A (en) * | 2004-08-02 | 2006-03-16 | Nippon Denkai Ltd | Composite copper foil and method for production thereof |
KR100649494B1 (ko) * | 2004-08-17 | 2006-11-24 | 삼성전기주식회사 | 레이저를 이용하여 발광 다이오드 기판을 표면 처리하는발광 다이오드 제조 방법 및 이 방법에 의해 제조된 발광다이오드 |
JP2006193825A (ja) * | 2004-12-13 | 2006-07-27 | Mitsui Mining & Smelting Co Ltd | 孔開き電解金属箔並びにキャリア基材付孔開き電解金属箔及びこれらの製造方法 |
JP4579705B2 (ja) * | 2005-02-02 | 2010-11-10 | 日本製箔株式会社 | クラッド材とその製造方法 |
JP2006240074A (ja) * | 2005-03-03 | 2006-09-14 | Nippon Denkai Kk | 複合銅箔およびその製造方法 |
JP2006312265A (ja) * | 2005-05-09 | 2006-11-16 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板 |
JP5082278B2 (ja) * | 2005-05-16 | 2012-11-28 | ソニー株式会社 | 発光ダイオードの製造方法、集積型発光ダイオードの製造方法および窒化物系iii−v族化合物半導体の成長方法 |
JP4934409B2 (ja) * | 2005-12-15 | 2012-05-16 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
CN1984527B (zh) * | 2005-12-15 | 2010-12-01 | 古河电气工业株式会社 | 带载体的极薄铜箔及印刷电路基板 |
JP4927503B2 (ja) * | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
JP2007281361A (ja) * | 2006-04-11 | 2007-10-25 | Asahi Kasei Corp | ポリイミド系プリント基板及びポリイミド系プリント配線板 |
JP4975021B2 (ja) * | 2006-05-02 | 2012-07-11 | 浩之 石見 | 熱可塑性樹脂成形用金型、キャビティ型及びそのキャビティ型の製造方法 |
JP4754402B2 (ja) * | 2006-05-17 | 2011-08-24 | 三井金属鉱業株式会社 | キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板 |
TW200804626A (en) | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
JP2007314855A (ja) * | 2006-05-29 | 2007-12-06 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔、銅張積層板及びプリント配線基板 |
CN101466875B (zh) * | 2006-06-12 | 2011-01-05 | 日矿金属株式会社 | 具有粗化处理面的轧制铜或铜合金箔以及该轧制铜或铜合金箔的粗化方法 |
JP2007216687A (ja) * | 2007-04-20 | 2007-08-30 | Ube Ind Ltd | 銅張積層板の製造方法、電子部品用基板の製造方法 |
US20090246554A1 (en) * | 2007-05-23 | 2009-10-01 | Mikio Furukawa | Laminate having peelability and production method therefor |
JP5959149B2 (ja) * | 2008-09-05 | 2016-08-02 | 古河電気工業株式会社 | キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板 |
KR101426038B1 (ko) * | 2008-11-13 | 2014-08-01 | 주식회사 엠디에스 | 인쇄회로기판 및 그 제조방법 |
EP2351876A1 (en) * | 2008-11-25 | 2011-08-03 | JX Nippon Mining & Metals Corporation | Copper foil for printed circuit |
JP2009143233A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
CN102265711B (zh) * | 2008-12-26 | 2014-11-05 | 吉坤日矿日石金属株式会社 | 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 |
JP5379528B2 (ja) * | 2009-03-24 | 2013-12-25 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板 |
CN101924037B (zh) * | 2009-06-16 | 2012-08-22 | 日月光半导体制造股份有限公司 | 无核心封装基板的制造方法 |
WO2010147059A1 (ja) * | 2009-06-18 | 2010-12-23 | Jx日鉱日石金属株式会社 | 電子回路及びその形成方法並びに電子回路形成用銅張積層板 |
JP5448616B2 (ja) * | 2009-07-14 | 2014-03-19 | 古河電気工業株式会社 | 抵抗層付銅箔、該銅箔の製造方法および積層基板 |
WO2011090044A1 (ja) * | 2010-01-25 | 2011-07-28 | Jx日鉱日石金属株式会社 | 二次電池負極集電体用銅箔 |
CN102452197B (zh) | 2010-10-21 | 2014-08-20 | 财团法人工业技术研究院 | 附载箔铜箔及其制造方法 |
JP4824828B1 (ja) * | 2010-11-04 | 2011-11-30 | 福田金属箔粉工業株式会社 | 複合金属箔及びその製造方法並びにプリント配線板 |
TWI417424B (zh) * | 2010-11-08 | 2013-12-01 | Chang Chun Petrochemical Co | 多孔性銅箔之製造方法 |
US8329315B2 (en) * | 2011-01-31 | 2012-12-11 | Nan Ya Plastics Corporation | Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method |
US8828245B2 (en) * | 2011-03-22 | 2014-09-09 | Industrial Technology Research Institute | Fabricating method of flexible circuit board |
US9585261B2 (en) | 2011-03-30 | 2017-02-28 | Mitsui Mining & Smelting Co., Ltd. | Manufacturing method of multilayer printed wiring board |
TWI561138B (en) * | 2011-03-30 | 2016-12-01 | Mitsui Mining & Smelting Co | Method of manufacturing multi-layer printed wiring board and multi-layer printed wiring board obtained by the manufacturing method |
JP5628106B2 (ja) * | 2011-07-08 | 2014-11-19 | 福田金属箔粉工業株式会社 | 複合金属箔及びその製造方法並びにプリント配線板 |
JP5653876B2 (ja) * | 2011-09-30 | 2015-01-14 | 古河電気工業株式会社 | レーザー吸収層付き銅箔および該銅箔を用いた銅張り積層板及びプリント配線板 |
JP5985812B2 (ja) * | 2011-11-04 | 2016-09-06 | Jx金属株式会社 | 印刷回路用銅箔 |
JP5875350B2 (ja) * | 2011-11-30 | 2016-03-02 | 三井金属鉱業株式会社 | 電解銅合金箔及びキャリア箔付電解銅合金箔 |
US9663868B2 (en) | 2011-12-28 | 2017-05-30 | Mitsui Mining & Smelting Co., Ltd. | Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil |
JP5903446B2 (ja) * | 2012-02-06 | 2016-04-13 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板の製造方法、プリント回路板の製造方法、銅張積層板の製造方法及び電子機器の製造方法 |
JP5854872B2 (ja) * | 2012-02-15 | 2016-02-09 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、積層体及びプリント配線板の製造方法 |
WO2013129508A1 (ja) | 2012-03-01 | 2013-09-06 | 三井金属鉱業株式会社 | キャリア箔付銅箔、キャリア箔付銅箔の製造方法及びそのキャリア箔付銅箔を用いて得られるレーザー孔明け加工用の銅張積層板 |
JP5204908B1 (ja) | 2012-03-26 | 2013-06-05 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板 |
JP5814168B2 (ja) * | 2012-03-27 | 2015-11-17 | Jx日鉱日石金属株式会社 | キャリア付銅箔 |
JP5922227B2 (ja) * | 2012-04-24 | 2016-05-24 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板の製造方法 |
JP5228130B1 (ja) | 2012-08-08 | 2013-07-03 | Jx日鉱日石金属株式会社 | キャリア付銅箔 |
KR101391811B1 (ko) | 2012-08-17 | 2014-05-07 | 일진머티리얼즈 주식회사 | 캐리어박 부착 극박동박, 이를 채용한 동부착적층판 및 프린트 배선판 |
JP5481577B1 (ja) * | 2012-09-11 | 2014-04-23 | Jx日鉱日石金属株式会社 | キャリア付き銅箔 |
WO2014046259A1 (ja) * | 2012-09-20 | 2014-03-27 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
KR101400778B1 (ko) * | 2012-10-05 | 2014-06-02 | 일진머티리얼즈 주식회사 | 레이저 가공용 동박, 이를 채용한 동부착적층판 및 상기 동박의 제조방법 |
TWI486260B (zh) | 2012-11-16 | 2015-06-01 | Nanya Plastics Corp | 具有黑色極薄銅箔之銅箔結構及其製造方法 |
JP5247929B1 (ja) * | 2012-11-28 | 2013-07-24 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板及びプリント回路板 |
JP5364838B1 (ja) * | 2012-11-30 | 2013-12-11 | Jx日鉱日石金属株式会社 | キャリア付銅箔 |
CN103857178B (zh) * | 2012-12-03 | 2017-07-04 | 南亚塑胶工业股份有限公司 | 具有黑色极薄铜箔的铜箔结构及其制造方法 |
KR102038137B1 (ko) * | 2012-12-21 | 2019-10-30 | 주식회사 넥스플렉스 | 다층 연성금속박 적층체 및 이의 제조방법 |
CN103056918A (zh) * | 2012-12-21 | 2013-04-24 | 深圳市柳鑫实业有限公司 | 一种用于提高钻孔孔位精确度的铝片及制造方法 |
JP6140481B2 (ja) * | 2013-03-05 | 2017-05-31 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
JP6271134B2 (ja) * | 2013-03-05 | 2018-01-31 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
JP6140480B2 (ja) * | 2013-03-05 | 2017-05-31 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
JP6176948B2 (ja) * | 2013-03-05 | 2017-08-09 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント回路板の製造方法、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
JP5997080B2 (ja) * | 2013-03-05 | 2016-09-21 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
CN105008594A (zh) * | 2013-03-05 | 2015-10-28 | 三井金属矿业株式会社 | 激光加工用铜箔、带有载体箔的激光加工用铜箔、覆铜层压体及印刷线路板的制造方法 |
JP6274736B2 (ja) * | 2013-03-06 | 2018-02-07 | Jx金属株式会社 | キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板、及びプリント配線板の製造方法 |
JP6329727B2 (ja) * | 2013-03-06 | 2018-05-23 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法 |
US8822036B1 (en) * | 2013-03-06 | 2014-09-02 | Ut-Battelle, Llc | Sintered silver joints via controlled topography of electronic packaging subcomponents |
US20140308538A1 (en) * | 2013-03-15 | 2014-10-16 | Gbc Metals, Llc | Surface treated aluminum foil for electronic circuits |
JP6425399B2 (ja) * | 2013-03-28 | 2018-11-21 | Jx金属株式会社 | キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
JP6403969B2 (ja) * | 2013-03-29 | 2018-10-10 | Jx金属株式会社 | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
JP6438208B2 (ja) * | 2013-04-03 | 2018-12-12 | Jx金属株式会社 | キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法 |
JP6335449B2 (ja) * | 2013-07-24 | 2018-05-30 | Jx金属株式会社 | キャリア付銅箔、銅張積層板の製造方法及びプリント配線板の製造方法 |
US10257938B2 (en) | 2013-07-24 | 2019-04-09 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board |
CN104512088A (zh) * | 2013-09-26 | 2015-04-15 | 俞伽达企业股份有限公司 | 铜箔剥离机构及其方法 |
WO2015076372A1 (ja) * | 2013-11-22 | 2015-05-28 | 三井金属鉱業株式会社 | 埋設回路を備えるプリント配線板の製造方法及びその製造方法で得られるプリント配線板 |
JP5870148B2 (ja) | 2013-11-27 | 2016-02-24 | Jx金属株式会社 | キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
JP5710737B1 (ja) * | 2013-11-29 | 2015-04-30 | Jx日鉱日石金属株式会社 | 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器 |
EP3094764A4 (en) | 2014-01-15 | 2017-08-30 | Savroc Ltd | Method for producing chromium-containing multilayer coating and a coated object |
BR112016016106B1 (pt) | 2014-01-15 | 2023-04-04 | Savroc Ltd | Método para produção de um revestimento de cromo sobre um objeto por trivalente cromagem |
JP5830635B1 (ja) * | 2014-02-14 | 2015-12-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔、並びにこれを用いて作製された銅張積層板、プリント配線基板及びコアレス基板 |
WO2015151935A1 (ja) * | 2014-03-31 | 2015-10-08 | 三井金属鉱業株式会社 | キャリア箔付銅箔、銅張積層板及びプリント配線板 |
US9758889B2 (en) | 2014-05-08 | 2017-09-12 | Ymt Co., Ltd. | Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby |
CN105101627B (zh) * | 2014-05-09 | 2019-03-01 | Jx日矿日石金属株式会社 | 附载体铜箔及其制造方法、印刷配线板及其制造方法、积层体、电子机器 |
JP5851552B2 (ja) * | 2014-05-15 | 2016-02-03 | ワイエムティー カンパニー リミテッド | 銅箔層を有する基板及びその製造方法 |
WO2016005651A1 (en) * | 2014-07-11 | 2016-01-14 | Savroc Ltd | A chromium-containing coating, a method for its production and a coated object |
WO2016093109A1 (ja) * | 2014-12-08 | 2016-06-16 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
JP6640567B2 (ja) * | 2015-01-16 | 2020-02-05 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法 |
KR101852671B1 (ko) | 2015-01-21 | 2018-06-04 | 제이엑스금속주식회사 | 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법 |
KR20160093555A (ko) * | 2015-01-29 | 2016-08-08 | 제이엑스금속주식회사 | 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 |
CN107428129B (zh) * | 2015-03-24 | 2019-06-18 | 三井金属矿业株式会社 | 带载体的极薄铜箔、其制造方法、覆铜层叠板和印刷电路板 |
JP2016194112A (ja) * | 2015-03-31 | 2016-11-17 | Jx金属株式会社 | キャリア付金属箔、積層体、プリント配線板、電子機器、キャリア付金属箔の製造方法及びプリント配線板の製造方法 |
JP6466235B2 (ja) * | 2015-04-16 | 2019-02-06 | 三井金属鉱業株式会社 | キャリア付銅箔、キャリア付銅張積層板、及びプリント配線板の製造方法 |
KR102412000B1 (ko) * | 2015-05-12 | 2022-06-22 | 삼성전기주식회사 | 동박적층판 및 이를 이용한 인쇄회로기판의 제조방법 |
JP6782561B2 (ja) | 2015-07-16 | 2020-11-11 | Jx金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
JP6058182B1 (ja) | 2015-07-27 | 2017-01-11 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6006445B1 (ja) | 2015-07-27 | 2016-10-12 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6190500B2 (ja) | 2015-08-06 | 2017-08-30 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6200042B2 (ja) | 2015-08-06 | 2017-09-20 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP6339636B2 (ja) | 2015-08-06 | 2018-06-06 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
US10131998B2 (en) * | 2015-10-02 | 2018-11-20 | Global Solar Energy, Inc. | Metalization of flexible polymer sheets |
US9709348B2 (en) * | 2015-10-27 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Heat-dissipating copper foil and graphene composite |
JP2017124533A (ja) * | 2016-01-13 | 2017-07-20 | Jx金属株式会社 | キャリア付銅箔、積層体、キャリア付銅箔の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
US9707738B1 (en) | 2016-01-14 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Copper foil and methods of use |
KR102432584B1 (ko) * | 2016-02-24 | 2022-08-12 | 에스케이넥실리스 주식회사 | 비전도성 고분자막과의 박리강도를 향상시킬 수 있는 동박, 그 제조방법, 및 그것을 포함하는 연성동박적층필름 |
WO2017149811A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
WO2017149810A1 (ja) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
KR102462505B1 (ko) | 2016-04-22 | 2022-11-02 | 삼성전자주식회사 | 인쇄회로기판 및 반도체 패키지 |
TW201811557A (zh) * | 2016-06-21 | 2018-04-01 | 日商Jx金屬股份有限公司 | 附脫模層的銅箔、積層體、印刷配線板的製造方法及電子機器的製造方法 |
KR102018942B1 (ko) | 2016-09-29 | 2019-09-05 | 제이엑스금속주식회사 | 캐리어 부착 금속박, 적층체, 프린트 배선판의 제조 방법, 전자기기의 제조 방법 및 캐리어 부착 금속박의 제조 방법 |
US9955588B1 (en) * | 2016-11-28 | 2018-04-24 | Chang Chun Petrochemical Co., Ltd. | Multilayer carrier foil |
JP6471140B2 (ja) | 2016-11-30 | 2019-02-13 | 福田金属箔粉工業株式会社 | 複合金属箔及び該複合金属箔を用いた銅張積層板並びに該銅張積層板の製造方法 |
JP6336142B2 (ja) * | 2017-01-05 | 2018-06-06 | Jx金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント回路板の製造方法、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
KR101944784B1 (ko) | 2017-01-16 | 2019-02-08 | 일진머티리얼즈 주식회사 | 캐리어박 부착 극박동박 |
WO2018181061A1 (ja) * | 2017-03-30 | 2018-10-04 | 古河電気工業株式会社 | 表面処理銅箔及びこれを用いた銅張積層板 |
US11576267B2 (en) * | 2017-10-26 | 2023-02-07 | Mitsui Mining & Smelting Co., Ltd. | Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board |
KR102613885B1 (ko) * | 2017-12-27 | 2023-12-15 | 미쓰이금속광업주식회사 | 캐리어를 구비한 구리박 |
WO2019188843A1 (ja) * | 2018-03-28 | 2019-10-03 | 大日本印刷株式会社 | 配線基板、および配線基板を製造する方法 |
TWI690607B (zh) * | 2018-06-15 | 2020-04-11 | 南亞塑膠工業股份有限公司 | 多孔性超薄銅箔的製造方法及集電板 |
WO2020105535A1 (ja) | 2018-11-20 | 2020-05-28 | 三井金属鉱業株式会社 | 積層体 |
CN110798986A (zh) * | 2018-12-10 | 2020-02-14 | 广州方邦电子股份有限公司 | 一种带载体的金属箔 |
CN111286736A (zh) * | 2018-12-10 | 2020-06-16 | 广州方邦电子股份有限公司 | 一种带载体的金属箔的制备方法 |
US11639557B2 (en) | 2019-02-28 | 2023-05-02 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
JP2021014623A (ja) * | 2019-07-12 | 2021-02-12 | パナソニックIpマネジメント株式会社 | 金属基材付薄膜金属箔、金属張透明基材材料、透視型電極用積層板、及び透視型電極素材 |
TWI725518B (zh) * | 2019-08-22 | 2021-04-21 | 聚鼎科技股份有限公司 | 導熱基板 |
CN111005041B (zh) * | 2019-12-30 | 2021-10-26 | 中国科学院青海盐湖研究所 | 一种复合多层结构多孔铜箔及其制备方法与系统 |
EP3950211B1 (en) * | 2020-08-03 | 2024-05-15 | Toyota Jidosha Kabushiki Kaisha | Method of manufacturing a metal member |
CN112226790B (zh) * | 2020-10-19 | 2022-04-22 | 九江德福科技股份有限公司 | 一种超薄高强度电子铜箔的生产方法 |
CN114007343B (zh) * | 2021-10-22 | 2024-05-17 | 深圳明阳电路科技股份有限公司 | 一种印刷电路板电厚金、印刷电路板及其制造方法 |
TW202410319A (zh) * | 2022-08-26 | 2024-03-01 | 日商Mgc電子科技股份有限公司 | 積層體、及無芯基板之製造方法 |
LU503243B1 (en) * | 2022-12-22 | 2024-06-25 | Circuit Foil Luxembourg | Method for producing a composite copper foil and composite copper foil obtained therewith |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
JPS5720347A (en) | 1980-07-14 | 1982-02-02 | Nippon Denkai Kk | Synthetic foil for printed wiring and its manufacture |
EP0208177A3 (en) * | 1985-07-05 | 1988-09-14 | Yates Industries, Inc. | Ultrathin copper foil and process for producing such foil |
JPS62292067A (ja) * | 1986-06-12 | 1987-12-18 | Mitsubishi Electric Corp | 画像入力装置 |
JPH0818401B2 (ja) | 1989-05-17 | 1996-02-28 | 福田金属箔粉工業株式会社 | 複合箔とその製法 |
US5071520A (en) * | 1989-10-30 | 1991-12-10 | Olin Corporation | Method of treating metal foil to improve peel strength |
JP2717911B2 (ja) * | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
JP3559598B2 (ja) | 1994-12-26 | 2004-09-02 | 日立化成工業株式会社 | 印刷配線板用金属箔とその製造法並びにこの金属箔を用いた配線板の製造法 |
JP3612594B2 (ja) | 1998-05-29 | 2005-01-19 | 三井金属鉱業株式会社 | 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法 |
JP3800807B2 (ja) * | 1998-06-10 | 2006-07-26 | ブラザー工業株式会社 | インクジェット記録装置 |
JP2000269637A (ja) * | 1999-03-18 | 2000-09-29 | Furukawa Circuit Foil Kk | 高密度超微細配線板用銅箔 |
JP4329953B2 (ja) | 1999-05-19 | 2009-09-09 | 古河電気工業株式会社 | 高密度超微細配線板用銅箔 |
US6346335B1 (en) * | 2000-03-10 | 2002-02-12 | Olin Corporation | Copper foil composite including a release layer |
US6447929B1 (en) * | 2000-08-29 | 2002-09-10 | Gould Electronics Inc. | Thin copper on usable carrier and method of forming same |
JP4018577B2 (ja) * | 2003-03-27 | 2007-12-05 | キヤノン株式会社 | インクジェット記録ヘッドカートリッジ |
-
2001
- 2001-09-17 US US10/380,900 patent/US7026059B2/en not_active Expired - Fee Related
- 2001-09-21 TW TW90123289A patent/TWI276708B/zh not_active IP Right Cessation
- 2001-09-21 KR KR1020037003948A patent/KR100562956B1/ko active IP Right Grant
- 2001-09-21 EP EP20010970176 patent/EP1331088A1/en not_active Withdrawn
- 2001-09-21 CN CN018161502A patent/CN1466517B/zh not_active Expired - Lifetime
- 2001-09-21 JP JP2002528488A patent/JP4072431B2/ja not_active Expired - Lifetime
- 2001-09-21 MY MYPI20014433A patent/MY146636A/en unknown
- 2001-09-21 WO PCT/JP2001/008220 patent/WO2002024444A1/ja active IP Right Grant
-
2005
- 2005-07-13 US US11/180,181 patent/US7175920B2/en not_active Expired - Fee Related
- 2005-07-21 JP JP2005210826A patent/JP4728723B2/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100700321B1 (ko) * | 2005-11-07 | 2007-03-29 | 삼성전기주식회사 | 미세한 표면 조도가 형성된 기판 및 그 제조 방법 |
KR20140024951A (ko) * | 2011-08-31 | 2014-03-03 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 캐리어가 부착된 구리박 |
WO2015102322A1 (ko) * | 2013-12-30 | 2015-07-09 | 일진머티리얼즈 주식회사 | 동박, 이를 포함하는 전기부품 및 전지 |
Also Published As
Publication number | Publication date |
---|---|
CN1466517A (zh) | 2004-01-07 |
JP4072431B2 (ja) | 2008-04-09 |
TWI276708B (en) | 2007-03-21 |
JP4728723B2 (ja) | 2011-07-20 |
WO2002024444A1 (fr) | 2002-03-28 |
US20040038049A1 (en) | 2004-02-26 |
US7026059B2 (en) | 2006-04-11 |
EP1331088A1 (en) | 2003-07-30 |
US20050249927A1 (en) | 2005-11-10 |
KR100562956B1 (ko) | 2006-03-22 |
JP2006022406A (ja) | 2006-01-26 |
US7175920B2 (en) | 2007-02-13 |
JPWO2002024444A1 (ja) | 2004-01-29 |
MY146636A (en) | 2012-09-14 |
CN1466517B (zh) | 2012-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100562956B1 (ko) | 고밀도 초미세 배선판용 동박 | |
KR101056691B1 (ko) | 케리어 부착 극박(極薄) 동박(銅薄), 그 제조방법 및케리어 부착 극박 동박을 이용한 프린트 배선기판 | |
JP3180101B2 (ja) | 複合箔、銅張り積層体、プリント配線板および多層プリント配線板、ならびに複合箔の製造方法 | |
JP6403969B2 (ja) | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 | |
JP4129429B2 (ja) | 複合フォイル及びその製造方法 | |
KR100859614B1 (ko) | 복합 구리박 및 그 제조방법 | |
JP2004169181A (ja) | キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板 | |
JP2000269637A (ja) | 高密度超微細配線板用銅箔 | |
TWI641294B (zh) | Carrier copper foil, printed wiring board, laminated body, electronic device, and printed wiring board manufacturing method | |
KR102118245B1 (ko) | 복합 금속박 및 그 복합 금속박을 사용한 구리 피복 적층판 그리고 그 구리 피복 적층판의 제조 방법 | |
JP2007314855A (ja) | キャリア付き極薄銅箔、銅張積層板及びプリント配線基板 | |
JP6247829B2 (ja) | キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 | |
JP3735485B2 (ja) | 樹脂フィルム付き銅箔、およびそれを用いた樹脂付き銅箔 | |
JP2017088971A (ja) | キャリア付銅箔、キャリア付銅箔の製造方法、積層体、プリント配線板の製造方法及び電子機器の製造方法 | |
JP4748519B2 (ja) | キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板 | |
JP2014208484A (ja) | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 | |
JP2014208909A (ja) | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 | |
JP2014208481A (ja) | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 | |
JP3559598B2 (ja) | 印刷配線板用金属箔とその製造法並びにこの金属箔を用いた配線板の製造法 | |
JPH05206599A (ja) | 印刷配線板用金属箔とその製造法並びにこの金属箔を用いた配線板の製造法 | |
JP6570430B2 (ja) | キャリア付銅箔の製造方法、プリント配線板の製造方法及び電子機器の製造方法 | |
JP2017133105A (ja) | キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 | |
JP2000190420A (ja) | 新規な複合箔およびその製造方法、銅張り積層板 | |
JP2014208482A (ja) | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130227 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140220 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150224 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20160219 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20170221 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180302 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190305 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20200302 Year of fee payment: 15 |