CN102452197B - 附载箔铜箔及其制造方法 - Google Patents
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 239000011889 copper foil Substances 0.000 title claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 239000010935 stainless steel Substances 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims description 15
- 238000011112 process operation Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 8
- 229960001484 edetic acid Drugs 0.000 claims description 8
- 239000008139 complexing agent Substances 0.000 claims description 7
- 238000006701 autoxidation reaction Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910001431 copper ion Inorganic materials 0.000 claims description 5
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims description 5
- 235000011180 diphosphates Nutrition 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000010936 titanium Substances 0.000 abstract description 8
- 229910052719 titanium Inorganic materials 0.000 abstract description 8
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 7
- 239000011888 foil Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 32
- 238000012545 processing Methods 0.000 description 10
- 239000010949 copper Substances 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 230000002269 spontaneous effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/20—Electrolytic after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
- Y10T428/12514—One component Cu-based
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12583—Component contains compound of adjacent metal
- Y10T428/1259—Oxide
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
- Y10T428/12958—Next to Fe-base component
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Abstract
本申请涉及附载箔铜箔及其制造方法。本发明之一实施例,提供一种附载箔铜箔之制造方法,包括:提供载箔,该载箔包含具有表面氧化层之不锈钢、钛、铝、镍或其合金;以及形成铜箔于该载箔上,以制得该附载箔铜箔。
Description
【技术领域】
本发明系有关于一种附载箔铜箔,特别是有关于一种无分离层处理之附载箔铜箔及其制造方法。
【背景技术】
随着电子产品轻薄化、可携化及高功能化的发展,HDI作业能力已变成电子产业的必要且重要性日增的制程技术。其中,尤以IC构装用载板及COF用材对于细线路的要求为最高。传统上,电子产业的线路制作,主要都是采用减去制程法,即是将铜积层板上的铜箔,经由蚀刻作业移除多余的材料后,便可形成所需要的线路图形。由于受到铜箔侧蚀(蚀刻因子)的限制,当减去制程法为了配合线路细线化的发展,所用铜箔的厚度近数年来由35μm,历经18、12,持续降低至目前的8μm时,除了造成制程作业的困难度大增外,并已对线路细线化的进一步发展造成了重大的限制。
目前,国内两兆双星产业之一的LCD产业所需要的上游COF原料,LCD业界皆是采用进口的8μm厚度的溅镀制程产品为原料。至于以Casting制程为主的国内FCCL产业,则因为受制于Casting的高温制程所导致铜箔晶粒粗大化,致使其厚度同样是8μm的铜箔产品,却只能局限在线宽/线距(L/S)≥30/30μm的应用,完全无法满足LCD产业的现况需求。进口的溅镀制程产品,因为价格高、性能不佳,例如针孔多、抗撕强度低且不稳定,除了对国内LCD产业的价格竞争力造成短期不利影响外;长期而言,产业链的不完整,恐也会对国内LCD产业的整体未来发展造成重大的冲击,因此,亟需加以改善。除了溅镀制程外,其他细线路解决方案,虽然尚有厚铜微蚀刻减薄法及超薄铜箔(附载箔铜箔)法,但亦因分别受到制程厚度控制不易及高温(≥300℃)压合作业后,载箔无法撕离的困难,目前也皆为LCD产业所排除。
综上所述,在国内LCD产业链的完整性及FCCL产业的未来发展考虑下,如何经由国内FCCL业界既有制程设备的应用,以完成COF需求物料的自足供应,实有其必要性及急迫性。
【发明内容】
本发明之一实施例,提供一种附载箔铜箔,其具有两层式结构,包括:载箔,包含不锈钢、钛、铝、镍或其合金,且具有表面氧化层;以及铜箔,形成于该载箔上,其中该附载箔铜箔经高温加工作业后,该载箔与该铜箔仍具有可分离之特性。
本发明提供之另一实施例中,该载箔系包括含有镍成分的200或300系列沃斯田系不锈钢。该载箔的十点平均粗糙度(Rz)小于或等于1.0微米。该载箔的中心线平均粗糙度(Ra)系小于或等于0.35微米。
本发明之又一实施例中,该表面氧化层为该载箔在大气环境下所自然氧化形成者。该表面氧化层的厚度小于或等于100纳米。
该铜箔的厚度介于0.01~12微米。
本发明之一实施例,提供一种附载箔铜箔的制造方法,包括:提供载箔,该载箔包含具有表面氧化层的不锈钢、钛、铝、镍或其合金;以及形成铜箔于该载箔上,以制得该附载箔铜箔,其中该附载箔铜箔经高温加工作业后,该载箔与该铜箔仍具有可分离之特性。
该表面氧化层为该载箔在大气环境下所自然氧化形成者。该铜箔以电镀制程形成于该载箔上。该电镀制程使用电镀液。该电镀液包括可与铜离子形成络合物的络合剂。该络合剂包括焦磷酸盐、柠檬酸盐或乙二胺四乙酸(EDTA)。
该附载箔铜箔在分离温度即使高达摄氏360~400度时,载箔与铜箔间仍可维持良好的撕离特性(撕离强度值小于150克/厘米)。
本发明藉由在空气中可经由自发性氧化作用,形成具有导电性氧化物薄膜层的金属材料,例如钛、不锈钢、锆、铬、铝、镍或其合金,在适当表面状态下,例如粗糙度(Rz≤1.0μm,Ra≤0.2μm)、氧化层厚度(≤100nm)及适当铜箔电镀液及作业条件(例如添加可与铜离子形成络合物的络合剂,例如焦磷酸盐、柠檬酸盐或EDTA)搭配下,直接在未经分离层处理的载箔表面上进行镀铜作业后,便可完成结构上仅有二层(即铜箔层及载箔层)且经高温作业后,例如于PI-Casting(≥360℃,1小时)或退火制程(≥400℃,2小时)后,铜箔层及载箔层间仍具有良好可剥离性(例如撕离强度小于150克/厘米)的附载箔铜箔。又剥离后的金属载箔,依材质不同,在自然大气环境下,仅须经适当时间静置,表面氧化层自行修补完成后,即可再行重复作为载箔使用。
本发明制作的附载箔铜箔,由于结合了良好的耐高温作业性能及铜箔厚度的变动能力,因此,对于需要细线化的各式印刷电路板材(例如硬板PCB、软板FPCB及IC构装用载板)而言,皆可适用。
为让本发明之上述目的、特征及优点能更明显易懂,下文特举一较佳实施例,作详细说明如下。
【具体实施方式】
本发明之一实施例,提供一种附载箔铜箔,其具有两层式结构,包括:载箔,包含不锈钢、钛、铝、镍或其合金,且具有表面氧化层,以及铜箔,形成于载箔上。本发明附载箔铜箔经高温加工作业后,载箔与铜箔仍具有可分离之特性,尤其当经过摄氏400度、时间2小时之高温加工作业程序后,载箔与铜箔依旧具有良好的可分离特性。
上述载箔可包括例如含有镍成分的200或300系列沃斯田不锈钢。上述载箔的十点平均粗糙度(Rz)可小于或等于1.0微米,而其中心线平均粗糙度(Ra)可小于或等于0.35微米。上述载箔的厚度介于0.018~0.2毫米。
上述表面氧化层例如为载箔在大气环境下所自然氧化形成者。上述氧化层的厚度可小于或等于100纳米。
上述铜箔的厚度介于0.01~12微米。
本发明之一实施例,提供一种附载箔铜箔的制造方法,包括:提供载箔,其包含具有表面氧化层的不锈钢、钛、铝、镍或其合金,以及形成铜箔于载箔上,以制得附载箔铜箔。本发明附载箔铜箔经摄氏400度、2小时之高温加工作业后,载箔与铜箔仍具有可分离之特性。
上述十点平均粗糙度(Rz)小于或等于1.0微米,中心线平均粗糙度(Ra)小于或等于0.35微米,厚度介于0.018~0.2毫米的载箔可藉由压延制程获得。
上述表面氧化层例如为载箔在大气环境下所自然氧化形成者。上述铜箔可藉由电镀制程形成于载箔上。上述电镀制程可使用电镀液,其可包括可与铜离子形成络合物的络合剂,例如焦磷酸盐、柠檬酸盐或乙二胺四乙酸(EDTA)。
本发明附载箔铜箔在分离温度即使高达摄氏360~400度时,载箔与铜箔间仍可维持良好的撕离特性(例如撕离强度值小于150克/厘米)。
在本申请中,以克/厘米为单位的撕离强度是指,每厘米宽的贴合材料进行撕离时所需的力(以克计)。
本发明藉由在空气中可经由自发性氧化作用,形成具有导电性氧化物薄膜层的金属材料,例如钛、不锈钢、锆、铬、铝、镍或其合金,在适当表面状态下,例如粗糙度(Rz≤1.0μm,Ra≤0.2μm)、氧化层厚度(≤100nm)及适当铜箔电镀液及作业条件(例如添加可与铜离子形成络合物的络合剂,例如焦磷酸盐、柠檬酸盐或EDTA)搭配下,直接在未经分离层处理的载箔表面上进行镀铜作业后,便可完成结构上仅有二层(即铜箔层及载箔层)且经高温作业后,例如于PI-Casting(≥360℃,1小时)或退火制程(≥400℃,2小时)后,铜箔层及载箔层间仍具有良好可剥离性(例如撕离强度小于150克/厘米)的附载箔铜箔。又剥离后的金属载箔,依材质不同,在自然大气环境下,仅须经适当时间静置,表面氧化层自行修补完成后,即可再行重复作为载箔使用。
本发明制作的附载箔铜箔,由于结合了良好的耐高温作业性能及铜箔厚度的变动能力,因此,对于需要细线化的各式印刷电路板材(例如硬板PCB、软板FPCB及IC构装用载板)而言,皆可适用。
【实施例1】
本发明附载箔铜箔的物性测试
取3种表面可进行自发性氧化的金属箔(钛、不锈钢304、铝),经适当表面脱脂清洗作业后,先于焦磷酸铜碱性镀液(条件:焦磷酸铜~40g/L,焦磷酸钾~290g/L,十二烷基磺酸钠~0.05g/L,45℃,Dk-1Amp/dm2)中进行1μm铜箔打底作业,之后,续以酸性硫酸铜镀液(条件:H2SO4~80g/L,Cu++~40g/L,Cl-~36ppm,50℃,Dk-4Amp/dm2)进行7μm铜箔的电镀作业。所得铜箔总厚度为8μm。此无分离层附载箔电解铜箔经各项特性测试后所得结果列如表一所示。
表一
*1:在氢气环境及升降温条件(RT→38min→400℃→2hr→400℃→自然降温→RT)下
*2:PI厚度为25μm
*3:---为未测试
由表一所示物性可知,本发明附载箔铜箔在省略传统分离层的情况下,仍具有良好撕离强度(10~40g/cm)及耐400℃,2小时以上的高温作业能力,不仅可克服国内FCCL产业Casting制程无法应用至COF产品的困境,且日后亦有进一步应用至半加成制程产品的空间,对于国内LCD产业链完整性及FCCL产业的产业竞争能力,当可提供重大助益。此外,除上述优良物性外,本发明载箔于撕离作业完成后,仍具有良好回收性,有效改善了附载箔铜箔一向以来价格昂贵的问题。
【实施例2】
不锈钢304载箔表面粗糙度对撕离强度的影响
取不同表面粗糙度的不锈钢304,先于焦磷酸铜碱性镀液(条件:焦磷酸铜~40g/L,焦磷酸钾~290g/L,十二烷基磺酸钠~0.05g/L,45℃)中进行1μm铜箔打底作业,之后,续以酸性硫酸铜镀液(条件:H2SO4~80g/L,Cu++~40g/L,Cl-~36ppm,环境温度)进行7μm铜箔的电镀作业。所得铜箔总厚度为8μm。此无分离层附载箔电解铜箔经400℃,2小时氢气环境下的退火作业后,其撕离强度测试结果列如表二所示。
表二
虽然本发明已以较佳实施例揭露如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明之精神和范围内,当可作更动与润饰,因此本发明的保护范围当视所附权利要求所界定者为准。
Claims (14)
1.一种附载箔铜箔,其具有两层式结构,包括:
载箔,包括含有镍成分的200或300系列沃斯田系(Austenitic)不锈钢,且具有表面氧化层,为含有镍成分的200或300系列沃斯田系不锈钢氧化层;以及
铜箔,形成于该载箔上,其中该附载箔铜箔经高温加工作业后,该载箔与该铜箔仍具有可分离之特性。
2.如权利要求1所述的附载箔铜箔,其中该高温加工作业系为摄氏400度,时间2小时之作业程序。
3.如权利要求1所述的附载箔铜箔,其中该铜箔系以电镀制程形成于该载箔上。
4.如权利要求1所述的附载箔铜箔,其中该表面氧化层是该载箔在大气环境下所自然氧化形成的。
5.如权利要求1所述的附载箔铜箔,其中该载箔的十点平均粗糙度(Rz)小于或等于1.0微米。
6.如权利要求1所述的附载箔铜箔,其中该载箔的中心线平均粗糙度(Ra)小于或等于0.35微米。
7.如权利要求1所述的附载箔铜箔,其中该表面氧化层的厚度小于或等于100纳米。
8.如权利要求1所述的附载箔铜箔,其中该铜箔的厚度为0.01~12微米。
9.一种附载箔铜箔的制造方法,包括:
提供载箔,该载箔包含具有表面氧化层的含有镍成分的200或300系列沃斯田系(Austenitic)不锈钢,其中表面氧化层为含有镍成分的200或300系列沃斯田系不锈钢氧化层,系为该载箔在大气环境下所自然氧化形成者;以及
形成铜箔于该载箔上,以制得该附载箔铜箔,其中该附载箔铜箔经高温加工作业后,该载箔与该铜箔仍具有可分离之特性。
10.如权利要求9所述的附载箔铜箔的制造方法,其中该铜箔系以电镀制程形成于该载箔上。
11.如权利要求10所述的附载箔铜箔的制造方法,其中该电镀制程系使用电镀液。
12.如权利要求11所述的附载箔铜箔的制造方法,其中该电镀液系包括可与铜离子形成络合物的络合剂。
13.如权利要求12所述的附载箔铜箔的制造方法,其中该络合剂包括焦磷酸盐、柠檬酸盐或乙二胺四乙酸(EDTA)。
14.如权利要求9所述的附载箔铜箔的制造方法,其中该附载箔铜箔经摄氏400度、2小时之高温加工作业后,该载箔与该铜箔的撕离强度小于150克/厘米。
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Also Published As
Publication number | Publication date |
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TWI487617B (zh) | 2015-06-11 |
US20120097544A1 (en) | 2012-04-26 |
US8808873B2 (en) | 2014-08-19 |
TW201217156A (en) | 2012-05-01 |
CN102452197A (zh) | 2012-05-16 |
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