LU90804B1 - Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards - Google Patents

Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards

Info

Publication number
LU90804B1
LU90804B1 LU90804A LU90804A LU90804B1 LU 90804 B1 LU90804 B1 LU 90804B1 LU 90804 A LU90804 A LU 90804A LU 90804 A LU90804 A LU 90804A LU 90804 B1 LU90804 B1 LU 90804B1
Authority
LU
Luxembourg
Prior art keywords
manufacturing
printed circuit
circuit boards
layer printed
composite foil
Prior art date
Application number
LU90804A
Other languages
English (en)
Inventor
Raymond Gales
Rene Lanners
Michel Streel
Original Assignee
Circuit Foil Luxembourg Trading Sarl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Luxembourg Trading Sarl filed Critical Circuit Foil Luxembourg Trading Sarl
Priority to LU90804A priority Critical patent/LU90804B1/fr
Priority to TW90121918A priority patent/TW575668B/zh
Priority to EP02762337A priority patent/EP1407062B1/fr
Priority to KR1020047000745A priority patent/KR100821017B1/ko
Priority to JP2003514981A priority patent/JP4129429B2/ja
Priority to DE2002607720 priority patent/DE60207720T2/de
Priority to CA 2454377 priority patent/CA2454377A1/fr
Priority to PCT/EP2002/007665 priority patent/WO2003008671A1/fr
Priority to US10/484,109 priority patent/US7049007B2/en
Priority to CNB028143264A priority patent/CN1276996C/zh
Priority to RU2004104946A priority patent/RU2287618C2/ru
Priority to MYPI20022651A priority patent/MY127482A/en
Application granted granted Critical
Publication of LU90804B1 publication Critical patent/LU90804B1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y10T428/12847—Cr-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12937—Co- or Ni-base component next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
LU90804A 2001-07-18 2001-07-18 Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards LU90804B1 (fr)

Priority Applications (12)

Application Number Priority Date Filing Date Title
LU90804A LU90804B1 (fr) 2001-07-18 2001-07-18 Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
TW90121918A TW575668B (en) 2001-07-18 2001-09-04 Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
KR1020047000745A KR100821017B1 (ko) 2001-07-18 2002-07-10 복합 포일 및 그의 제조 방법
JP2003514981A JP4129429B2 (ja) 2001-07-18 2002-07-10 複合フォイル及びその製造方法
EP02762337A EP1407062B1 (fr) 2001-07-18 2002-07-10 Pellicule composite et procede de fabrication
DE2002607720 DE60207720T2 (de) 2001-07-18 2002-07-10 Verbundfolie und herstellungsverfahren dafür
CA 2454377 CA2454377A1 (fr) 2001-07-18 2002-07-10 Pellicule composite et procede de fabrication
PCT/EP2002/007665 WO2003008671A1 (fr) 2001-07-18 2002-07-10 Pellicule composite et procede de fabrication
US10/484,109 US7049007B2 (en) 2001-07-18 2002-07-10 Composite foil and its manufacturing process
CNB028143264A CN1276996C (zh) 2001-07-18 2002-07-10 复合箔及其制造方法
RU2004104946A RU2287618C2 (ru) 2001-07-18 2002-07-10 Многослойная фольга и способ ее изготовления
MYPI20022651A MY127482A (en) 2001-07-18 2002-07-12 Composite foil and its manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LU90804A LU90804B1 (fr) 2001-07-18 2001-07-18 Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards

Publications (1)

Publication Number Publication Date
LU90804B1 true LU90804B1 (fr) 2003-01-20

Family

ID=19732005

Family Applications (1)

Application Number Title Priority Date Filing Date
LU90804A LU90804B1 (fr) 2001-07-18 2001-07-18 Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards

Country Status (12)

Country Link
US (1) US7049007B2 (fr)
EP (1) EP1407062B1 (fr)
JP (1) JP4129429B2 (fr)
KR (1) KR100821017B1 (fr)
CN (1) CN1276996C (fr)
CA (1) CA2454377A1 (fr)
DE (1) DE60207720T2 (fr)
LU (1) LU90804B1 (fr)
MY (1) MY127482A (fr)
RU (1) RU2287618C2 (fr)
TW (1) TW575668B (fr)
WO (1) WO2003008671A1 (fr)

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JP4187465B2 (ja) * 2002-05-29 2008-11-26 三井化学株式会社 極薄銅箔を用いたポリイミド銅張積層板及びその製造方法
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
WO2006105366A2 (fr) * 2005-03-30 2006-10-05 The Regents Of The University Of California Decoupe intelligente d'une feuille mince de ni poreux a partir d'une plaquette de si
JP4934409B2 (ja) * 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
CN1984527B (zh) * 2005-12-15 2010-12-01 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
JP4927503B2 (ja) 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
TWI367555B (en) * 2007-03-21 2012-07-01 Advanced Semiconductor Eng Conversion substrate for leadframe and the method for making the same
CN102203326A (zh) * 2008-09-05 2011-09-28 古河电气工业株式会社 带有载体的极薄铜箔以及贴铜层压板或印刷线路基板
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
US8329315B2 (en) * 2011-01-31 2012-12-11 Nan Ya Plastics Corporation Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method
US9090043B2 (en) 2011-08-03 2015-07-28 The Boeing Company Molybdenum composite hybrid laminates and methods
MY177387A (en) * 2012-03-01 2020-09-14 Mitsui Mining & Smelting Ltd Copper foil with attached carrier foil, method for manufacturing copper foil with attached carrier foil, and copper clad laminate board for laser beam drilling obtained by using copper foil with
WO2013192541A1 (fr) * 2012-06-21 2013-12-27 Gbc Metals, Llc Composite double face à base de minces feuilles métalliques pelables
KR101391811B1 (ko) 2012-08-17 2014-05-07 일진머티리얼즈 주식회사 캐리어박 부착 극박동박, 이를 채용한 동부착적층판 및 프린트 배선판
TWI524825B (zh) * 2012-10-29 2016-03-01 財團法人工業技術研究院 碳材導電膜的轉印方法
TWI486260B (zh) 2012-11-16 2015-06-01 Nanya Plastics Corp 具有黑色極薄銅箔之銅箔結構及其製造方法
CN103857178B (zh) * 2012-12-03 2017-07-04 南亚塑胶工业股份有限公司 具有黑色极薄铜箔的铜箔结构及其制造方法
JP5298252B1 (ja) * 2013-02-14 2013-09-25 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP5755371B2 (ja) * 2013-02-26 2015-07-29 古河電気工業株式会社 キャリア付き極薄銅箔、銅張積層板並びにコアレス基板
JP6236119B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
CN105002530A (zh) * 2015-08-10 2015-10-28 灵宝华鑫铜箔有限责任公司 一种提高铜箔高温防氧化性能的表面处理工艺
CN105666052B (zh) * 2016-01-22 2018-08-14 长沙众兴新材料科技有限公司 一种汽车冷凝器翅片用铝合金钎焊复合箔的制备方法
CN106696387A (zh) * 2016-11-24 2017-05-24 苏州华意铭铄激光科技有限公司 一种可回收耐用复合金属制品
CN114672855B (zh) * 2022-03-29 2023-09-26 电子科技大学 一种超薄铜箔的制备方法

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EP0960725A2 (fr) * 1998-05-29 1999-12-01 Mitsui Mining & Smelting Co., Ltd. Feuille composite enduite d'une résine, sa production et son utilisation
WO2000057680A1 (fr) * 1999-03-23 2000-09-28 Circuit Foil Luxembourg Trading S.À R.L. Procede de fabrication d'une carte de circuit imprime multicouches et feuille composite utilisee dans ce dernier
WO2001014135A1 (fr) * 1999-08-24 2001-03-01 Mitsui Mining & Smelting Co., Ltd. Feuille de cuivre electrolytique avec feuille de support et stratifie plaque cuivre utilisant cette feuille de cuivre electrolytique

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JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
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JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement

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Publication number Priority date Publication date Assignee Title
EP0960725A2 (fr) * 1998-05-29 1999-12-01 Mitsui Mining & Smelting Co., Ltd. Feuille composite enduite d'une résine, sa production et son utilisation
WO2000057680A1 (fr) * 1999-03-23 2000-09-28 Circuit Foil Luxembourg Trading S.À R.L. Procede de fabrication d'une carte de circuit imprime multicouches et feuille composite utilisee dans ce dernier
WO2001014135A1 (fr) * 1999-08-24 2001-03-01 Mitsui Mining & Smelting Co., Ltd. Feuille de cuivre electrolytique avec feuille de support et stratifie plaque cuivre utilisant cette feuille de cuivre electrolytique
EP1184165A1 (fr) * 1999-08-24 2002-03-06 Mitsui Mining & Smelting Co., Ltd. Feuille de cuivre electrolytique avec feuille de support et stratifie plaque cuivre utilisant cette feuille de cuivre electrolytique

Also Published As

Publication number Publication date
CN1529771A (zh) 2004-09-15
RU2287618C2 (ru) 2006-11-20
EP1407062A1 (fr) 2004-04-14
CN1276996C (zh) 2006-09-27
DE60207720D1 (de) 2006-01-05
RU2004104946A (ru) 2005-06-10
US7049007B2 (en) 2006-05-23
JP4129429B2 (ja) 2008-08-06
TW575668B (en) 2004-02-11
US20040209106A1 (en) 2004-10-21
DE60207720T2 (de) 2006-08-17
KR100821017B1 (ko) 2008-04-10
CA2454377A1 (fr) 2003-01-30
JP2004535515A (ja) 2004-11-25
KR20040022465A (ko) 2004-03-12
EP1407062B1 (fr) 2005-11-30
MY127482A (en) 2006-12-29
WO2003008671A1 (fr) 2003-01-30

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