DE60016823D1 - Interlaminarer isolierender Klebstoff für mehrschichtige gedruckte Leiterplatte - Google Patents

Interlaminarer isolierender Klebstoff für mehrschichtige gedruckte Leiterplatte

Info

Publication number
DE60016823D1
DE60016823D1 DE60016823T DE60016823T DE60016823D1 DE 60016823 D1 DE60016823 D1 DE 60016823D1 DE 60016823 T DE60016823 T DE 60016823T DE 60016823 T DE60016823 T DE 60016823T DE 60016823 D1 DE60016823 D1 DE 60016823D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
multilayer printed
insulating adhesive
interlaminar insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60016823T
Other languages
English (en)
Other versions
DE60016823T2 (de
Inventor
Toshio Komiyatani
Masao Uesaka
Masataka Arai
Hitoshi Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Application granted granted Critical
Publication of DE60016823D1 publication Critical patent/DE60016823D1/de
Publication of DE60016823T2 publication Critical patent/DE60016823T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C09J181/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/936—Encapsulated chemical agent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31533—Of polythioether

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
DE60016823T 1999-03-11 2000-03-07 Interlaminarer isolierender Klebstoff für mehrschichtige gedruckte Leiterplatte Expired - Fee Related DE60016823T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6425199 1999-03-11
JP6425199 1999-03-11

Publications (2)

Publication Number Publication Date
DE60016823D1 true DE60016823D1 (de) 2005-01-27
DE60016823T2 DE60016823T2 (de) 2005-12-08

Family

ID=13252773

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60016823T Expired - Fee Related DE60016823T2 (de) 1999-03-11 2000-03-07 Interlaminarer isolierender Klebstoff für mehrschichtige gedruckte Leiterplatte

Country Status (7)

Country Link
US (1) US6447915B1 (de)
EP (1) EP1035760B1 (de)
KR (1) KR100632169B1 (de)
CN (1) CN1170908C (de)
DE (1) DE60016823T2 (de)
ES (1) ES2233232T3 (de)
TW (1) TW491016B (de)

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* Cited by examiner, † Cited by third party
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JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP3485513B2 (ja) * 2000-01-19 2004-01-13 沖電気工業株式会社 半導体装置の製造方法
KR100315158B1 (ko) * 2000-08-02 2001-11-26 윤덕용 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법
US6899437B2 (en) * 2002-10-02 2005-05-31 Gentax Corporation Environmentally improved rearview mirror assembly
US7370982B2 (en) * 2002-10-02 2008-05-13 Gentex Corporation Environmentally improved rearview mirror assemblies
JP3949676B2 (ja) * 2003-07-22 2007-07-25 三井金属鉱業株式会社 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法
TW200533692A (en) * 2003-11-06 2005-10-16 Showa Denko Kk Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof
JP5085125B2 (ja) * 2004-03-29 2012-11-28 住友ベークライト株式会社 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
JP4829766B2 (ja) * 2006-12-13 2011-12-07 横浜ゴム株式会社 繊維強化複合材料用エポキシ樹脂組成物
CN101928538B (zh) * 2010-08-30 2012-12-26 黑龙江省科学院石油化学研究院 含聚砜低聚物热固化环氧树脂胶粘剂及其制备方法
US9068040B2 (en) * 2010-10-12 2015-06-30 Hexcel Corporation Solvent resistant thermoplastic toughened epoxy
CN102796346A (zh) * 2011-06-01 2012-11-28 深圳光启高等理工研究院 改性环氧树脂和基于改性环氧树脂制备基材的方法
CN102898779B (zh) * 2011-06-01 2015-05-27 深圳光启高等理工研究院 复合材料和基于复合材料制备基材的方法
JP5682837B2 (ja) 2011-11-29 2015-03-11 三菱レイヨン株式会社 プリプレグ、繊維強化複合材料とその製造方法、エポキシ樹脂組成物
JP5766352B2 (ja) * 2012-06-15 2015-08-19 三菱電機株式会社 回転電機固定子コイル絶縁用液状熱硬化性樹脂組成物、それを用いた回転電機及びその製造方法
CN103724944A (zh) * 2013-12-31 2014-04-16 广东生益科技股份有限公司 一种无卤环氧树脂组合物及其用途
CN107113958B (zh) * 2014-08-05 2020-03-17 奥特斯奥地利科技与系统技术有限公司 中间材料的翘曲控制
US10886506B2 (en) * 2015-03-30 2021-01-05 Dai Nippon Printing Co., Ltd. Cell packaging material, method for manufacturing same, and cell
WO2017090629A1 (ja) * 2015-11-24 2017-06-01 日東シンコー株式会社 樹脂組成物および電気絶縁シート
CN108676533B (zh) * 2018-05-03 2021-05-11 广东生益科技股份有限公司 树脂组合物及其制作的涂树脂铜箔
CN113897163B (zh) * 2021-12-09 2022-03-11 武汉市三选科技有限公司 一种粘接剂、芯片键合膜及其制备方法
CN115109387B (zh) * 2022-07-11 2023-09-22 陕西生益科技有限公司 一种树脂组合物及其应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661559A (en) * 1983-05-20 1987-04-28 Union Carbide Corporation Impact resistant matrix resins for advanced composites
JPS60243113A (ja) 1984-05-17 1985-12-03 Sumitomo Chem Co Ltd 強靭性に優れたエポキシ樹脂組成物
KR920014611A (ko) 1991-01-22 1992-08-25 베르너 발데크 가요성 적층물 및 그의 제조방법
EP0498766A3 (en) 1991-02-04 1992-11-04 Ciba-Geigy Ag Modified polyarylenethers
GB2259812B (en) 1991-09-06 1996-04-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
DE4217509A1 (de) 1992-05-27 1993-12-02 Basf Ag Epoxidharzmischungen
DE69323129T2 (de) 1992-08-11 1999-08-19 Hexcel Corp. Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze
TW305860B (de) * 1994-03-15 1997-05-21 Toray Industries
JP3669663B2 (ja) 1997-07-18 2005-07-13 住友ベークライト株式会社 多層プリント配線板用層間絶縁接着剤
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法

Also Published As

Publication number Publication date
KR100632169B1 (ko) 2006-10-11
KR20000062822A (ko) 2000-10-25
CN1267696A (zh) 2000-09-27
US6447915B1 (en) 2002-09-10
CN1170908C (zh) 2004-10-13
EP1035760B1 (de) 2004-12-22
ES2233232T3 (es) 2005-06-16
DE60016823T2 (de) 2005-12-08
TW491016B (en) 2002-06-11
EP1035760A3 (de) 2001-12-12
EP1035760A2 (de) 2000-09-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee