KR102363106B1 - 테이프 첩부 장치 및 테이프 첩부 방법 - Google Patents

테이프 첩부 장치 및 테이프 첩부 방법 Download PDF

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KR102363106B1
KR102363106B1 KR1020150074055A KR20150074055A KR102363106B1 KR 102363106 B1 KR102363106 B1 KR 102363106B1 KR 1020150074055 A KR1020150074055 A KR 1020150074055A KR 20150074055 A KR20150074055 A KR 20150074055A KR 102363106 B1 KR102363106 B1 KR 102363106B1
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South Korea
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substrate
tape
masking tape
roller
periphery
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Korean (ko)
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KR20150137022A (ko
Inventor
겐야 이토
게이스케 우치야마
도미이치 마츠이
마히토 시부야
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
아이에스 엔지니어링 가부시키가이샤
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Publication of KR20150137022A publication Critical patent/KR20150137022A/ko
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    • H01L21/6836—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/06—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for folding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H01L21/6835—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/111—Plane geometry, contour
    • B65H2701/1111—Geometric shape
    • B65H2701/11112—Geometric shape disk

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
KR1020150074055A 2014-05-28 2015-05-27 테이프 첩부 장치 및 테이프 첩부 방법 Active KR102363106B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-110515 2014-05-28
JP2014110515A JP6340249B2 (ja) 2014-05-28 2014-05-28 テープ貼り付け装置およびテープ貼り付け方法

Publications (2)

Publication Number Publication Date
KR20150137022A KR20150137022A (ko) 2015-12-08
KR102363106B1 true KR102363106B1 (ko) 2022-02-15

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KR1020150074055A Active KR102363106B1 (ko) 2014-05-28 2015-05-27 테이프 첩부 장치 및 테이프 첩부 방법

Country Status (5)

Country Link
US (1) US9738483B2 (https=)
JP (1) JP6340249B2 (https=)
KR (1) KR102363106B1 (https=)
CN (1) CN105321851B (https=)
TW (1) TWI671849B (https=)

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CN105734494B (zh) * 2016-04-12 2018-12-25 京东方科技集团股份有限公司 一种蒸镀载板及蒸镀装置
BR102016008166B1 (pt) * 2016-04-13 2022-04-19 Tas Equipamentos Eireli Disposição construtiva aplicada em cabeçote para sistema de envidraçamento estrutural
JP6908464B2 (ja) * 2016-09-15 2021-07-28 株式会社荏原製作所 基板加工方法および基板加工装置
DE102016226058B4 (de) 2016-12-22 2019-01-17 Tesa Se Klebebandabroller mit Umlenkeinrichtung
JP6871812B2 (ja) * 2017-06-21 2021-05-12 リンテック株式会社 シート貼付装置および貼付方法
KR101952653B1 (ko) * 2017-12-13 2019-02-27 우림이엔지 주식회사 원통의 원주방향 테이핑 장치
JP6948286B2 (ja) * 2018-06-15 2021-10-13 豊臣機工株式会社 シール貼付装置
US11430677B2 (en) 2018-10-30 2022-08-30 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer taping apparatus and method
CN111377295A (zh) * 2018-12-27 2020-07-07 汉能移动能源控股集团有限公司 双面贴胶装置及双面贴胶方法
CN111702864B (zh) * 2020-06-17 2021-09-21 深圳市燕川光电有限公司 一种用于调整遮光胶带宽度的调节装置及模切机
CN111700736B (zh) * 2020-06-29 2022-01-07 中南大学湘雅医院 一种外科手术用医用压敏胶带盒
JP7618158B2 (ja) * 2020-08-07 2025-01-21 株式会社荏原製作所 テープ貼り付けシステム、テープ貼り付け方法、テープ剥がしシステム、およびテープ剥がし方法
CN112587408B (zh) * 2020-12-22 2023-09-15 安徽雨桐医疗科技有限公司 一种在灸头加热装置用安装板周边铺设隔热材料层的装置
KR102837607B1 (ko) * 2021-02-05 2025-07-22 주식회사 엘지에너지솔루션 이차전지용 테이프의 부착 방법
JP7788248B2 (ja) * 2021-09-30 2025-12-18 リンテック株式会社 シート貼付装置およびシート貼付方法
JP7386550B2 (ja) * 2021-10-27 2023-11-27 清川メッキ工業株式会社 無電解めっき用シリコンウェハの製造方法
JP2023096519A (ja) * 2021-12-27 2023-07-07 リンテック株式会社 環状接着シート形成装置および環状接着シート形成方法
JP2023096520A (ja) * 2021-12-27 2023-07-07 リンテック株式会社 環状接着シート形成装置および環状接着シート形成方法
JP7813152B2 (ja) * 2022-02-07 2026-02-12 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法および基板処理装置
JP7765326B2 (ja) * 2022-03-23 2025-11-06 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2023141064A (ja) * 2022-03-23 2023-10-05 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2023163815A (ja) * 2022-04-28 2023-11-10 リンテック株式会社 シート貼付装置およびシート貼付方法
CN114772367B (zh) * 2022-05-11 2023-11-21 青岛博锐智远减振科技有限公司 一种遮蔽胶带安装装置及其使用方法
JP2024029589A (ja) * 2022-08-22 2024-03-06 リンテック株式会社 シート貼付装置およびシート貼付方法
JP2024029590A (ja) * 2022-08-22 2024-03-06 リンテック株式会社 シート貼付方法およびシート貼付装置
JP2024047622A (ja) * 2022-09-27 2024-04-08 リンテック株式会社 被着体加工方法および被着体加工装置

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2012069782A (ja) * 2010-09-24 2012-04-05 Tokyo Electron Ltd 基板処理装置，基板処理方法，周縁テープ剥離装置，周縁テープ剥離方法

Also Published As

Publication number Publication date
CN105321851A (zh) 2016-02-10
TW201545271A (zh) 2015-12-01
CN105321851B (zh) 2019-07-30
JP6340249B2 (ja) 2018-06-06
US20160023861A1 (en) 2016-01-28
JP2015224300A (ja) 2015-12-14
TWI671849B (zh) 2019-09-11
KR20150137022A (ko) 2015-12-08
US9738483B2 (en) 2017-08-22

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