KR101100486B1 - 부상식 기판 반송 처리 장치 - Google Patents

부상식 기판 반송 처리 장치 Download PDF

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Publication number
KR101100486B1
KR101100486B1 KR1020060067297A KR20060067297A KR101100486B1 KR 101100486 B1 KR101100486 B1 KR 101100486B1 KR 1020060067297 A KR1020060067297 A KR 1020060067297A KR 20060067297 A KR20060067297 A KR 20060067297A KR 101100486 B1 KR101100486 B1 KR 101100486B1
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South Korea
Prior art keywords
substrate
floating
suction
gas
stage
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Expired - Fee Related
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KR1020060067297A
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English (en)
Korean (ko)
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KR20070011153A (ko
Inventor
츠요시 야마사키
토시후미 이나마스
켄야 시노자키
키미오 모토다
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도쿄엘렉트론가부시키가이샤
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Publication of KR20070011153A publication Critical patent/KR20070011153A/ko
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H10P72/0448—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H10P72/3314—
    • H10P72/36—
    • H10P72/78—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020060067297A 2005-07-19 2006-07-19 부상식 기판 반송 처리 장치 Expired - Fee Related KR101100486B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00208851 2005-07-19
JP2005208851A JP4553376B2 (ja) 2005-07-19 2005-07-19 浮上式基板搬送処理装置及び浮上式基板搬送処理方法

Publications (2)

Publication Number Publication Date
KR20070011153A KR20070011153A (ko) 2007-01-24
KR101100486B1 true KR101100486B1 (ko) 2011-12-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060067297A Expired - Fee Related KR101100486B1 (ko) 2005-07-19 2006-07-19 부상식 기판 반송 처리 장치

Country Status (4)

Country Link
US (1) US7905195B2 (enExample)
JP (1) JP4553376B2 (enExample)
KR (1) KR101100486B1 (enExample)
TW (2) TWI438857B (enExample)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007105455A1 (ja) * 2006-02-28 2007-09-20 Ulvac, Inc. ステージ装置
CN101410761A (zh) * 2006-06-14 2009-04-15 日本精工株式会社 曝光装置
JP5047545B2 (ja) * 2006-06-30 2012-10-10 株式会社妙徳 浮上搬送ユニット
JP4652351B2 (ja) * 2007-02-02 2011-03-16 大日本印刷株式会社 基板支持装置、基板支持方法
JP4743716B2 (ja) * 2007-03-06 2011-08-10 東京エレクトロン株式会社 基板処理装置
JP5188759B2 (ja) * 2007-08-07 2013-04-24 東京応化工業株式会社 塗布装置及び塗布方法
JP2009043829A (ja) * 2007-08-07 2009-02-26 Tokyo Ohka Kogyo Co Ltd 塗布装置及び塗布方法
JP4982292B2 (ja) * 2007-08-07 2012-07-25 東京応化工業株式会社 塗布装置及び塗布方法
JP4942589B2 (ja) * 2007-08-30 2012-05-30 東京応化工業株式会社 塗布装置及び塗布方法
JP4384686B2 (ja) * 2007-09-25 2009-12-16 東京エレクトロン株式会社 常圧乾燥装置及び基板処理装置及び基板処理方法
JP4991495B2 (ja) * 2007-11-26 2012-08-01 東京エレクトロン株式会社 検査用保持部材及び検査用保持部材の製造方法
JP5029486B2 (ja) * 2008-05-13 2012-09-19 東京エレクトロン株式会社 塗布装置、塗布方法及び記憶媒体
JP5012651B2 (ja) 2008-05-14 2012-08-29 東京エレクトロン株式会社 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP4857312B2 (ja) * 2008-07-16 2012-01-18 シャープ株式会社 基板搬送装置
JP4972618B2 (ja) * 2008-08-05 2012-07-11 シャープ株式会社 基板搬送装置
JP2010037082A (ja) * 2008-08-07 2010-02-18 Sharp Corp 基板搬送装置および基板搬送方法
KR101296659B1 (ko) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 세정 장치
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
JP5573849B2 (ja) * 2009-08-20 2014-08-20 株式会社ニコン 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
KR101069600B1 (ko) 2009-09-01 2011-10-05 주식회사 케이씨텍 부상식 기판 코터 장치 및 그 코팅 방법
WO2012119034A2 (en) * 2011-03-02 2012-09-07 Game Changers, Llc Method and apparatus for a dynamic air cushion transport system
JP4919115B2 (ja) * 2009-09-24 2012-04-18 横河電機株式会社 放射線検査装置
KR101158267B1 (ko) * 2009-10-26 2012-06-19 주식회사 나래나노텍 기판 부상 유닛에 사용되는 부상 플레이트, 및 이를 구비한 기판 부상 유닛, 기판 이송 장치 및 코팅 장치
KR101141146B1 (ko) * 2009-12-30 2012-05-02 주식회사 케이씨텍 기판 반송 방법
KR101099555B1 (ko) * 2010-01-12 2011-12-28 세메스 주식회사 기판 처리 장치
US20110239231A1 (en) * 2010-03-23 2011-09-29 International Business Machines Corporation Migrating electronic document version contents and version metadata as a collection with a single operation
JP5465595B2 (ja) * 2010-05-10 2014-04-09 オイレス工業株式会社 非接触搬送装置
EP2388808A1 (de) * 2010-05-20 2011-11-23 Westfälische Wilhelms-Universität Münster Berührungsloses Transportsystem
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
KR20140004113A (ko) * 2010-12-24 2014-01-10 오일레스고교 가부시키가이샤 상승류 형성체 및 이 상승류 형성체를 이용한 비접촉 반송장치
JP5663297B2 (ja) * 2010-12-27 2015-02-04 東京応化工業株式会社 塗布装置
CN102543662B (zh) * 2010-12-30 2016-02-03 上海微电子装备有限公司 热盘及应用其的硅片加热系统
KR20140031180A (ko) * 2011-01-14 2014-03-12 오일레스고교 가부시키가이샤 비접촉 반송장치
US9136155B2 (en) * 2011-11-17 2015-09-15 Lam Research Ag Method and device for processing wafer shaped articles
KR101312364B1 (ko) * 2011-12-22 2013-09-27 주식회사 나래나노텍 기판 착탈 장치 및 방법, 및 이를 구비한 코팅 장치 및 방법
JP5912642B2 (ja) * 2012-02-20 2016-04-27 日本電気硝子株式会社 ガラス板の搬送装置及びその搬送方法
TWI527747B (zh) * 2012-02-28 2016-04-01 炭研軸封精工股份有限公司 非接觸吸著盤
KR101423822B1 (ko) * 2012-06-28 2014-07-28 세메스 주식회사 웨이퍼 이송을 위한 비접촉 척
JP5987528B2 (ja) * 2012-07-30 2016-09-07 株式会社タンケンシールセーコウ 浮上装置
US9387993B2 (en) * 2012-10-30 2016-07-12 Nissan Motor Co., Ltd. Conveyor apparatus
JP2014218342A (ja) * 2013-05-09 2014-11-20 オイレス工業株式会社 支持用エアプレートおよびその気体流抵抗器
JP6226419B2 (ja) * 2013-08-22 2017-11-08 オイレス工業株式会社 浮上搬送装置
JP6339341B2 (ja) * 2013-10-11 2018-06-06 平田機工株式会社 処理システム及び処理方法
JP6270114B2 (ja) * 2013-11-20 2018-01-31 東レエンジニアリング株式会社 基板浮上装置
CN106232867B (zh) * 2014-04-18 2019-01-08 株式会社尼康 膜形成设备、基板处理设备和装置制造方法
KR102059313B1 (ko) * 2014-04-30 2019-12-24 카티바, 인크. 가스 쿠션 장비 및 기판 코팅 기술
US10332770B2 (en) * 2014-09-24 2019-06-25 Sandisk Technologies Llc Wafer transfer system
JP6949455B2 (ja) 2014-12-24 2021-10-13 株式会社タンケンシールセーコウ 非接触搬送装置、および非接触吸着盤
JP6712411B2 (ja) * 2015-03-30 2020-06-24 株式会社ニコン 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法
KR102584657B1 (ko) * 2015-03-31 2023-10-04 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 노광 방법
JP6215281B2 (ja) * 2015-10-27 2017-10-18 株式会社日本製鋼所 被処理体搬送装置、半導体製造装置および被処理体搬送方法
JP6651392B2 (ja) * 2016-03-22 2020-02-19 東レエンジニアリング株式会社 基板浮上搬送装置
KR101690189B1 (ko) * 2016-03-23 2016-12-27 (주) 세명유리 거울 유리의 엣지 자동 방수코팅 장치
FR3049941B1 (fr) * 2016-04-06 2018-04-13 Saint- Gobain Glass France Dispositif de convoyage et de maintien pour feuille de verre notamment dans une installation de lavage
US9633878B1 (en) * 2016-04-21 2017-04-25 Texas Instuments Incorporated Conveyor apparatus and method for transporting leadframe
WO2017221229A1 (en) * 2016-06-21 2017-12-28 Core Flow Ltd. Noncontact support platform with edge lifting
US10179707B2 (en) * 2016-06-30 2019-01-15 Ace Machinary Co., Ltd. Transfer apparatus
CN113485074A (zh) * 2016-07-01 2021-10-08 Asml荷兰有限公司 用于工作台系统的载物台
JP6854605B2 (ja) * 2016-08-29 2021-04-07 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
JP6910518B2 (ja) * 2016-08-29 2021-07-28 株式会社日本製鋼所 レーザ照射装置
JP6917691B2 (ja) * 2016-10-04 2021-08-11 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
JP6819373B2 (ja) * 2017-03-10 2021-01-27 株式会社Ihi 浮上装置及びテンション検出装置
US9889995B1 (en) * 2017-03-15 2018-02-13 Core Flow Ltd. Noncontact support platform with blockage detection
JP6983578B2 (ja) * 2017-08-25 2021-12-17 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
WO2019186402A1 (en) * 2018-03-28 2019-10-03 Biemme Elettrica Di Bertola Massimo Device for coating, in particular painting, the main surfaces of rigid panels with liquid products
JP7034817B2 (ja) * 2018-04-19 2022-03-14 株式会社日本製鋼所 レーザ処理装置及び半導体装置の製造方法
JP7110005B2 (ja) * 2018-06-20 2022-08-01 キヤノン株式会社 基板回転装置、基板回転方法、リソグラフィ装置、および物品製造方法
CN109633939B (zh) * 2018-12-27 2024-04-16 苏州精濑光电有限公司 一种lcd检测设备
US20200266092A1 (en) * 2019-02-19 2020-08-20 Corning Incorporated Apparatuses and methods for non-contact holding and measurement of thin substrates
CN110404717A (zh) * 2019-06-14 2019-11-05 上海维誉自动化设备有限公司 一种自动喷涂线
JP7299790B2 (ja) * 2019-08-05 2023-06-28 東レエンジニアリング株式会社 基板浮上搬送装置及び基板浮上搬送装置の基板位置補正方法
JP7336955B2 (ja) * 2019-10-10 2023-09-01 東京エレクトロン株式会社 基板処理システム、及び基板処理方法
KR102268617B1 (ko) * 2019-10-16 2021-06-23 세메스 주식회사 기판 처리 장치
CN113130368B (zh) * 2021-04-13 2024-09-24 南京中安半导体设备有限责任公司 气浮卡盘及晶圆几何参数测量装置
JP7095166B2 (ja) * 2020-08-21 2022-07-04 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
IT202100013085A1 (it) * 2021-05-20 2022-11-20 Cefla Soc Cooperativa Apparato e metodo per la verniciatura a rullo di pannelli, preferibilmente pannelli fotovoltaici
KR102894220B1 (ko) * 2024-05-21 2025-12-03 (주)트리엔 기판 부상 시스템

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004262608A (ja) 2003-03-03 2004-09-24 Orbotech Ltd 空気浮上装置
JP2004273574A (ja) * 2003-03-05 2004-09-30 Wakomu Denso:Kk 基板浮上装置および同方法
JP2004345744A (ja) 2003-05-20 2004-12-09 Hitachi Zosen Corp 空気浮上装置および空気浮上式搬送装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2054357T3 (es) * 1989-05-08 1994-08-01 Philips Nv Aparato y metodo para tratar substratos planos bajo una presion reducida.
ATE171306T1 (de) * 1993-02-08 1998-10-15 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige gegenstände
JP3245813B2 (ja) 1996-11-27 2002-01-15 東京エレクトロン株式会社 塗布膜形成装置
JP2000128346A (ja) * 1998-08-20 2000-05-09 Matsushita Electric Ind Co Ltd 浮揚装置、浮揚搬送装置および熱処理装置
JP2000072251A (ja) * 1998-08-31 2000-03-07 Watanabe Shoko:Kk 浮上搬送装置および浮上搬送システム
JP2000159342A (ja) * 1998-11-20 2000-06-13 Daiichi Shisetsu Kogyo Kk 板状部材の搬送装置
JP4789399B2 (ja) * 2003-05-01 2011-10-12 オリンパス株式会社 浮上ユニット
JP4398786B2 (ja) 2003-07-23 2010-01-13 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4426276B2 (ja) * 2003-10-06 2010-03-03 住友重機械工業株式会社 搬送装置、塗布システム、及び検査システム
JP4305918B2 (ja) 2004-01-30 2009-07-29 東京エレクトロン株式会社 浮上式基板搬送処理装置
WO2005081283A2 (en) * 2004-02-13 2005-09-01 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
US7604439B2 (en) * 2004-04-14 2009-10-20 Coreflow Scientific Solutions Ltd. Non-contact support platforms for distance adjustment
JP4554397B2 (ja) * 2005-02-23 2010-09-29 東京エレクトロン株式会社 ステージ装置および塗布処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004262608A (ja) 2003-03-03 2004-09-24 Orbotech Ltd 空気浮上装置
JP2004273574A (ja) * 2003-03-05 2004-09-30 Wakomu Denso:Kk 基板浮上装置および同方法
JP2004345744A (ja) 2003-05-20 2004-12-09 Hitachi Zosen Corp 空気浮上装置および空気浮上式搬送装置

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