KR100836540B1 - 도금재료와 그 제조방법, 이를 사용한 전기,전자부품 - Google Patents
도금재료와 그 제조방법, 이를 사용한 전기,전자부품 Download PDFInfo
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
도금층의 종류 | 도금욕의 조성 | 욕온도 (℃) | 전류밀도 (A/dm2) | |
종류 | 농도(g/L) | |||
Ni 층 | 술파민산니켈 붕산 | 500 30 | 60 | 5 |
Co 층 | 황산코발트 붕산 | 500 30 | 60 | 5 |
Ni-Co 층 | 황산니켈 황산코발트 붕산 | 200 200 30 | 60 | 5 |
Ni-P 층 | 키자이샤 제조의 나이코욕 | - | 90 | 무전해도금 |
Fe 층 | 황산제1철 염화제1철 염화암모늄 | 250 30 30 | 30 | 5 |
Cu 층 | 황산구리 황산 | 180 80 | 40 | 5 |
Cu-Zn 층 | 시안화구리칼륨 시안화아연칼륨 시안화칼륨 | 50 30 10 | 25 | 1 |
광택 Cu 층 | 아도텍쟈판샤 제조 카파라지드욕 | - | 25 | 5 |
광택 Sn 층 | 이시하라야쿠힌샤 FH50욕 | - | 30 | 5 |
Sn 층 | 이시하라야쿠힌샤 524M욕 | - | 30 | 5 |
광택 Sn-Bi 층 | 이시하라야쿠힌샤 0.5M욕 | - | 30 | 5 |
광택 Sn-Cu 층 | 이시하라야쿠힌샤 HTC욕 | - | 30 | 5 |
광택 Sn-Pb 층 | 이시하라야쿠힌샤 FH30욕 | - | 30 | 5 |
Ag 층 | 시안화은칼륨 시안화칼륨 | 5 60 | 20 | 2 |
Bi 층 | 메탄술폰산비스무스 메탄술폰산 | 50 150 | 20 | 5 |
In 층 | 황산인듐 황산나트륨 주석산나트륨 | 50 40 200 | 20 | 1 |
숫단자의 종류 | 암단자의 종류 | 결 과 | ||
삽입력(N) | 접촉저항(mΩ) | |||
실시예 25 실시예 26 실시예 27 비교예 10 비교예 11 | 실시예 3 의 것 실시예 3 의 것 실시예 3 의 것 실시예 3 의 것 실시예 3 의 것 | 실시예 3 의 것 실시예 5 의 것 실시예 12 의 것 비교예 5 의 것 비교예 6 의 것 | 5.3 5.5 5.6 5.8 6.2 | 1 0.9 0.9 3.5 2.3 |
실시예 28 실시예 29 실시예 30 비교예 12 비교예 13 | 실시예 5 의 것 실시예 5 의 것 실시예 5 의 것 실시예 5 의 것 실시예 5 의 것 | 실시예 3 의 것 실시예 5 의 것 실시예 12 의 것 비교예 5 의 것 비교예 6 의 것 | 5.9 6.0 6.2 6.3 6.6 | 0.9 0.6 0.6 4.2 3.7 |
실시예 31 실시예 32 실시예 33 비교예 14 비교예 15 | 실시예 12 의 것 실시예 12 의 것 실시예 12 의 것 실시예 12 의 것 실시예 12 의 것 | 실시예 3 의 것 실시예 5 의 것 실시예 12 의 것 비교예 5 의 것 비교예 6 의 것 | 6.2 6.3 6.5 7.4 6.9 | 1 0.5 0.6 3.2 2.9 |
비교예 16 비교예 17 비교예 18 비교예 19 비교예 20 | 비교예 5 의 것 비교예 5 의 것 비교예 5 의 것 비교예 5 의 것 비교예 5 의 것 | 실시예 3 의 것 실시예 5 의 것 실시예 12 의 것 비교예 5 의 것 비교예 6 의 것 | 6.5 6.7 6.8 6.9 7.2 | 8.4 5.3 5.1 〉10 〉10 |
비교예 21 비교예 22 비교예 23 비교예 24 비교예 25 | 비교예 6 의 것 비교예 6 의 것 비교예 6 의 것 비교예 6 의 것 비교예 6 의 것 | 실시예 3 의 것 실시예 5 의 것 실시예 12 의 것 비교예 5 의 것 비교예 6 의 것 | 7.1 7.1 7.3 7.3 7.6 | 7.4 4.2 3.5 〉10 〉10 |
Claims (13)
- (a) 주기율표 4족, 5족, 6족, 7족, 8족, 9족 또는 10족에 포함되는 어느 1 종의 금속 또는 상기 금속을 함유하는 합금으로 이루어지는 베이스 도금층과,(b) Cu 또는 Cu 합금으로 이루어지는 중간도금층과,(c) Sn 또는 Sn 합금으로 이루어지는 표면도금층이 이 순서대로 도전성 기재의 표면 위에 형성되어 이루어지는 도금층을 갖는 것을 특징으로 하는 도금재료.
- 제 1 항에 있어서,상기 도금 재료는, 상기 베이스 도금층이 Ni, Co 또는 Fe 중 어느 1 종의 금속, 또는 상기 금속을 함유하는 합금으로 이루어지는 것을 특징으로 하는 도금재료.
- 제 1 항 또는 제 2 항에 있어서,상기 도금 재료는, 상기 Sn 합금이 Ag, Bi, Cu, In, Pb 및 Sb 의 군에서 선택되는 적어도 1 종을 함유하는 것을 특징으로 하는 도금재료.
- 제 1 항 또는 제 2 항에 있어서,상기 도금 재료의 상기 베이스 도금층의 두께가 0.05∼2㎛ 이고, 또한 상기 중간도금층의 두께가 0.01∼1㎛ 인 것을 특징으로 하는 도금재료.
- 제 1 항 또는 제 2 항에 있어서,상기 도금 재료의 상기 표면도금층의 두께가 상기 중간도금층의 두께의 1.9배 이상의 두께로 되어 있는 것을 특징으로 하는 도금재료.
- 제 1 항 또는 제 2 항에 있어서,상기 도금 재료의 상기 표면도금층이 리플로우 처리된 층인 것을 특징으로 하는 도금재료.
- 제 1 항 또는 제 2 항에 있어서,상기 도금 재료의 상기 도전성 기재가 Cu 또는 Cu 합금으로 이루어진 것을 특징으로 하는 도금재료.
- 제 5 항에 있어서,상기 도금 재료의 상기 중간도금층의 두께가 0.05∼0.49㎛ 인 것을 특징으로 하는 도금재료.
- 제 8 항에 있어서,상기 도금 재료의 상기 표면도금층의 두께가 1㎛ 이하인 것을 특징으로 하는 도금재료.
- (a) 주기율표 4족, 5족, 6족, 7족, 8족, 9족 또는 10족에 포함되는 어느 1 종의 금속 또는 상기 금속을 함유하는 합금으로 이루어지는 베이스 도금층과,(b) Cu 또는 Cu 합금으로 이루어지는 중간도금층과,(c) Sn 또는 Sn 합금으로 이루어지는 표면도금층을 이 순서대로 도전성 기재의 표면 위에 형성하여 이루어지는 도금층을 갖는 것을 특징으로 하는 도금재료의 제조방법.
- 제 10 항에 있어서,상기 중간도금층 위에 Sn 도금층 또는 Sn 합금 도금층, 및 Ag, Bi, Cu, In, Pb 및 Sb 의 군에서 선택되는 적어도 1 종으로 이루어지는 도금층을 이 순서대로 형성하고, 이어서 리플로우 처리 또는 열확산 처리를 수행하는 것을 특징으로 하는 도금재료의 제조방법.
- 제 1 항 또는 제 2 항에 기재된 도금재료를 구비한 것을 특징으로 하는 전기ㆍ전자부품.
- 제 12 항에 있어서,상기 전기ㆍ전자부품은 끼워맞춤형 커넥터 또는 접촉자인 것을 특징으로 하는 전기ㆍ전자부품.
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JP (2) | JP2008223143A (ko) |
KR (1) | KR100836540B1 (ko) |
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US20050037229A1 (en) * | 2001-01-19 | 2005-02-17 | Hitoshi Tanaka | Plated material, method of producing same, and electrical / electronic part using same |
DE10245343A1 (de) * | 2002-09-27 | 2004-04-08 | Robert Bosch Gmbh | Elektrischer Kontakt |
JP2004259530A (ja) * | 2003-02-25 | 2004-09-16 | Shinko Electric Ind Co Ltd | 外部接触端子を有する半導体装置及びその使用方法 |
JP3795898B2 (ja) * | 2003-06-20 | 2006-07-12 | アルプス電気株式会社 | 接続装置 |
JP3958719B2 (ja) * | 2003-06-30 | 2007-08-15 | 大同メタル工業株式会社 | 摺動部材 |
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WO2002057511A1 (fr) | 2002-07-25 |
JP2010144252A (ja) | 2010-07-01 |
EP1352993A1 (en) | 2003-10-15 |
US6770383B2 (en) | 2004-08-03 |
CN1318647C (zh) | 2007-05-30 |
CN1455829A (zh) | 2003-11-12 |
JP2008223143A (ja) | 2008-09-25 |
US20030091855A1 (en) | 2003-05-15 |
EP1352993B1 (en) | 2011-05-11 |
TW575688B (en) | 2004-02-11 |
KR20020092390A (ko) | 2002-12-11 |
EP1352993A4 (en) | 2006-06-07 |
EP2045362A1 (en) | 2009-04-08 |
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