MX2019006540A - Producto estañado y método para producir el mismo. - Google Patents

Producto estañado y método para producir el mismo.

Info

Publication number
MX2019006540A
MX2019006540A MX2019006540A MX2019006540A MX2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A MX 2019006540 A MX2019006540 A MX 2019006540A
Authority
MX
Mexico
Prior art keywords
layer
plating
plating material
production method
alloy
Prior art date
Application number
MX2019006540A
Other languages
English (en)
Inventor
Narieda Hiroto
Sonoda Yuta
DOI Tatsuhiro
TOMIYA Takao
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016236780A external-priority patent/JP6734185B2/ja
Priority claimed from JP2017221415A external-priority patent/JP6940380B2/ja
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Priority claimed from PCT/JP2017/041827 external-priority patent/WO2018105388A1/ja
Publication of MX2019006540A publication Critical patent/MX2019006540A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Se proporciona un producto estañado el cual tiene una capa de revestimiento de zinc sobre la superficie del mismo y la cual tiene buena resistencia a la corrosión y buena adhesión del revestimiento de zinc aún si la porción de conexión de una terminal del producto estañado a un cable eléctrico de aluminio o una aleación de aluminio no es procesada durante un ajuste a presión como estampado (o calafateado) cuando el producto estañado es usado como el material de la terminal la cual puede estar conectada al cable eléctrico por ajuste a presión y un método para producir el mismo. El producto estañado tiene: un material base 10 de cobre o una aleación de cobre; una capa que contiene estaño 12 formada sobre la superficie del material base 10, la capa que contiene estaño 12 tiene una capa de 10 aleación de cobre-estaño 121 y una capa de estaño 122 de estaño la cual es formada sobre la superficie de la capa de aleación de cobre-estaño 121 y la cual tiene un espesor no mayor de 5 µm; una capa de revestimiento de níquel 14 formada sobre la superficie de la capa que contiene estaño 12; y una capa de revestimiento de zinc 16 que sirve como la capa más externa formada sobre la superficie de la capa de revestimiento de níquel 14.
MX2019006540A 2016-12-06 2017-11-21 Producto estañado y método para producir el mismo. MX2019006540A (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016236780A JP6734185B2 (ja) 2016-12-06 2016-12-06 Ｓｎめっき材およびその製造方法
JP2017056366 2017-03-22
JP2017221415A JP6940380B2 (ja) 2017-03-22 2017-11-17 Ｓｎめっき材およびその製造方法
PCT/JP2017/041827 WO2018105388A1 (ja) 2016-12-06 2017-11-21 Ｓｎめっき材およびその製造方法

Publications (1)

Publication Number Publication Date
MX2019006540A true MX2019006540A (es) 2019-08-01

Family

ID=67145440

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019006540A MX2019006540A (es) 2016-12-06 2017-11-21 Producto estañado y método para producir el mismo.

Country Status (4)

Country Link
US (1) US10985485B2 (es)
CN (1) CN110036142B (es)
DE (1) DE112017005628B4 (es)
MX (1) MX2019006540A (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020137726A1 (ja) 2018-12-26 2020-07-02 三菱伸銅株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
JP6957568B2 (ja) * 2019-08-09 2021-11-02 株式会社オートネットワーク技術研究所 端子付き電線
JP6936836B2 (ja) 2019-08-09 2021-09-22 株式会社オートネットワーク技術研究所 端子付き電線
JP7226209B2 (ja) 2019-09-19 2023-02-21 株式会社オートネットワーク技術研究所 ピン端子、コネクタ、コネクタ付きワイヤーハーネス、及びコントロールユニット
CN116844754A (zh) * 2023-08-09 2023-10-03 嘉铝(上海)科技发展有限公司 一种线缆用镀锡铝合金导体材料及其制备方法、应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
TW575688B (en) * 2001-01-19 2004-02-11 Furukawa Electric Co Ltd Metal-plated material and method for preparation thereof, and electric and electronic parts using the same
JP4402132B2 (ja) * 2007-05-18 2010-01-20 日鉱金属株式会社 リフローＳｎめっき材及びそれを用いた電子部品
WO2009123157A1 (ja) * 2008-03-31 2009-10-08 古河電気工業株式会社 接続部品用金属材料およびその製造方法
JP5284526B1 (ja) 2011-10-04 2013-09-11 Ｊｘ日鉱日石金属株式会社 電子部品用金属材料及びその製造方法
JP5882723B2 (ja) 2011-12-26 2016-03-09 矢崎総業株式会社 端子
JP5789207B2 (ja) * 2012-03-07 2015-10-07 株式会社神戸製鋼所 嵌合型接続端子用Ｓｎ被覆層付き銅合金板及び嵌合型接続端子
TWI485930B (zh) * 2012-10-04 2015-05-21 Jx Nippon Mining & Metals Corp Metal material for electronic parts and manufacturing method thereof
JP2015053251A (ja) * 2013-02-24 2015-03-19 古河電気工業株式会社 端子の製造方法、端子、電線の終端接続構造体の製造方法、および電線の終端接続構造体
JP6221695B2 (ja) * 2013-03-25 2017-11-01 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材
JP2015110829A (ja) * 2013-10-30 2015-06-18 三菱マテリアル株式会社 錫めっき銅合金端子材
JP6445895B2 (ja) * 2014-03-04 2018-12-26 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
KR102113988B1 (ko) * 2014-08-25 2020-05-22 가부시키가이샤 고베 세이코쇼 내미세접동마모성이 우수한 접속 부품용 도전 재료
JP5897083B1 (ja) 2014-08-25 2016-03-30 株式会社神戸製鋼所 耐微摺動摩耗性に優れる接続部品用導電材料
JP6740635B2 (ja) * 2015-03-13 2020-08-19 三菱マテリアル株式会社 錫めっき付銅端子材及びその製造方法並びに電線端末部構造

Also Published As

Publication number Publication date
DE112017005628T5 (de) 2019-07-25
US10985485B2 (en) 2021-04-20
DE112017005628B4 (de) 2023-09-14
CN110036142A (zh) 2019-07-19
CN110036142B (zh) 2021-04-20
US20200076103A1 (en) 2020-03-05

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