MY190168A - Method of manufacturing tin-plated copper terminal material - Google Patents

Method of manufacturing tin-plated copper terminal material

Info

Publication number
MY190168A
MY190168A MYPI2018702110A MYPI2018702110A MY190168A MY 190168 A MY190168 A MY 190168A MY PI2018702110 A MYPI2018702110 A MY PI2018702110A MY PI2018702110 A MYPI2018702110 A MY PI2018702110A MY 190168 A MY190168 A MY 190168A
Authority
MY
Malaysia
Prior art keywords
tin
zinc
copper
layer
nickel alloy
Prior art date
Application number
MYPI2018702110A
Inventor
Kenji Kubota
Yoshie Tarutani
Kiyotaka Nakaya
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016150740A external-priority patent/JP6226037B2/en
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of MY190168A publication Critical patent/MY190168A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A method of manufacturing tin-plated copper terminal material (1) as a terminal (10) crimped to a terminal end of an electric wire (12) made of an aluminum wire material, using a base member (2) of copper or copper alloy in which galvanic corrosion is not easy to occur and an adhesiveness of a tin layer is excellent, the method includes: a zinc-nickel alloy layer forming step forming a zinc-nickel alloy layer (4) having a nickel content of 5 mass% to 50 mass% inclusive and a thickness of 0.1 ?m to 5.0 ?m inclusive on a base member made of copper or copper alloy; and a tin-plating step forming a tin layer (5) by tin plating on the zinc-nickel alloy layer; more preferably, following the tin-plating step, the method includes a diffusion treatment step diffusing zinc from the zinc-nickel alloy layer to the tin layer by maintaining at 40?C to 160?C inclusive for 30 minutes or longer.
MYPI2018702110A 2015-12-15 2016-12-14 Method of manufacturing tin-plated copper terminal material MY190168A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015244311 2015-12-15
JP2016150740A JP6226037B2 (en) 2015-12-15 2016-07-29 Manufacturing method of copper terminal material with tin plating
PCT/JP2016/087137 WO2017104682A1 (en) 2015-12-15 2016-12-14 Method for manufacturing tin-plated copper terminal material

Publications (1)

Publication Number Publication Date
MY190168A true MY190168A (en) 2022-03-31

Family

ID=59056761

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018702110A MY190168A (en) 2015-12-15 2016-12-14 Method of manufacturing tin-plated copper terminal material

Country Status (2)

Country Link
MY (1) MY190168A (en)
WO (1) WO2017104682A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10858750B2 (en) * 2017-07-28 2020-12-08 Mitsubishi Materials Corporation Tin-plated copper terminal material, terminal and electric wire terminal-end structure
JP6489257B1 (en) * 2018-03-14 2019-03-27 日立金属株式会社 Tin-plated copper wire, method of manufacturing the same, insulated wire, cable

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0841681A (en) * 1994-07-25 1996-02-13 Kobe Steel Ltd Production of nickel-zinc alloy-plated steel sheet
JP3953169B2 (en) * 1997-12-26 2007-08-08 株式会社神戸製鋼所 Manufacturing method of plating material for mating type connection terminal
JP2000144482A (en) * 1998-09-11 2000-05-26 Nippon Mining & Metals Co Ltd Metallic material
JP2000169996A (en) * 1998-09-28 2000-06-20 Nippon Mining & Metals Co Ltd Metallic material
JP4043834B2 (en) * 2002-05-02 2008-02-06 古河電気工業株式会社 Plating material, manufacturing method thereof, and electric / electronic parts using the same
JP2013227630A (en) * 2012-04-26 2013-11-07 Autonetworks Technologies Ltd Plated terminal for connector
JP2014164927A (en) * 2013-02-23 2014-09-08 Furukawa Electric Co Ltd:The Crimp terminal and connection structure

Also Published As

Publication number Publication date
WO2017104682A1 (en) 2017-06-22

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