TW201612363A - Cyanide-free electroplating baths for white bronze based on copper (I) ions - Google Patents

Cyanide-free electroplating baths for white bronze based on copper (I) ions

Info

Publication number
TW201612363A
TW201612363A TW104131420A TW104131420A TW201612363A TW 201612363 A TW201612363 A TW 201612363A TW 104131420 A TW104131420 A TW 104131420A TW 104131420 A TW104131420 A TW 104131420A TW 201612363 A TW201612363 A TW 201612363A
Authority
TW
Taiwan
Prior art keywords
copper
ions
cyanide
electroplating baths
white bronze
Prior art date
Application number
TW104131420A
Other languages
Chinese (zh)
Other versions
TWI609102B (en
Inventor
Adolphe Foyet
Jonas Guebey
Margit Clauss
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW201612363A publication Critical patent/TW201612363A/en
Application granted granted Critical
Publication of TWI609102B publication Critical patent/TWI609102B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Copper alloy electroplating baths include one or more sources of copper (I) ions and one or more sources of tin ions to electroplate copper/tin alloys of mirror bright white bronze. The copper alloys may also include one or more sources of silver ions to electroplate ternary alloys of bright white bronze containing copper/tin/silver. The copper alloy electroplating baths are cyanide-free.
TW104131420A 2014-09-30 2015-09-23 Cyanide-free electroplating baths for white bronze based on copper (i) ions TWI609102B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/503,389 US20160298249A1 (en) 2014-09-30 2014-09-30 Cyanide-free electroplating baths for white bronze based on copper (i) ions

Publications (2)

Publication Number Publication Date
TW201612363A true TW201612363A (en) 2016-04-01
TWI609102B TWI609102B (en) 2017-12-21

Family

ID=54145685

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131420A TWI609102B (en) 2014-09-30 2015-09-23 Cyanide-free electroplating baths for white bronze based on copper (i) ions

Country Status (6)

Country Link
US (1) US20160298249A1 (en)
EP (1) EP3002350B1 (en)
JP (1) JP6062010B2 (en)
KR (1) KR101712960B1 (en)
CN (1) CN105463528B (en)
TW (1) TWI609102B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9984895B1 (en) * 2017-01-31 2018-05-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten
CN110678583B (en) * 2017-06-01 2022-09-30 巴斯夫欧洲公司 Tin alloy electroplating compositions containing leveling agents
CN108166029A (en) * 2017-12-28 2018-06-15 广东达志环保科技股份有限公司 Without cyamelide copper and tin electroplate liquid and electro-plating method
DE102018126174B3 (en) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermally stable silver alloy layers, methods of deposition and use
CN110117803B (en) * 2019-05-14 2020-10-23 广州超邦化工有限公司 Potassium chloride cyanide-free cadmium titanium alloy plating solution, preparation method and electroplating process thereof
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
KR102539397B1 (en) * 2020-11-24 2023-06-02 주식회사 호진플라텍 Electroplating solution of tin-silver alloy for wafer bumps with improved distribution deviation of silver content in plating films
WO2023285604A1 (en) 2021-07-15 2023-01-19 Seolfor Aktiebolag Electroplating compositions and methods for preparing the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234387A (en) * 2000-02-17 2001-08-31 Yuken Industry Co Ltd Agent and method for preventing generation of whisker in electrotinning
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
DE50106133D1 (en) * 2000-09-20 2005-06-09 Schloetter Fa Dr Ing Max ELECTROLYTE AND METHOD OF DEPOSITING TIN COPPER ALLOY LAYERS
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
JP5642928B2 (en) * 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Bronze electroplating
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
DE102011008836B4 (en) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Electrolyte and method for depositing copper-tin alloy layers
EP2565297A3 (en) * 2011-08-30 2013-04-24 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
CN102605394B (en) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 Cyanogen-free acidic cupronickel-tin plating solution
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method

Also Published As

Publication number Publication date
KR20160038805A (en) 2016-04-07
EP3002350B1 (en) 2017-11-22
JP2016074979A (en) 2016-05-12
US20160298249A1 (en) 2016-10-13
TWI609102B (en) 2017-12-21
EP3002350A1 (en) 2016-04-06
JP6062010B2 (en) 2017-01-18
KR101712960B1 (en) 2017-03-08
CN105463528A (en) 2016-04-06
CN105463528B (en) 2017-12-08

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